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TWI334366B - - Google Patents

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Publication number
TWI334366B
TWI334366B TW094106915A TW94106915A TWI334366B TW I334366 B TWI334366 B TW I334366B TW 094106915 A TW094106915 A TW 094106915A TW 94106915 A TW94106915 A TW 94106915A TW I334366 B TWI334366 B TW I334366B
Authority
TW
Taiwan
Prior art keywords
solder
bga
ball
bumps
free
Prior art date
Application number
TW094106915A
Other languages
English (en)
Chinese (zh)
Other versions
TW200603932A (en
Inventor
Daisuke Souma
Takahiro Roppongi
Hiromi Kawamata
Hiroshi Okada
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of TW200603932A publication Critical patent/TW200603932A/zh
Application granted granted Critical
Publication of TWI334366B publication Critical patent/TWI334366B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H05K3/346—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
TW094106915A 2004-03-19 2005-03-08 Lead free solder fall TW200603932A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004079348 2004-03-19

Publications (2)

Publication Number Publication Date
TW200603932A TW200603932A (en) 2006-02-01
TWI334366B true TWI334366B (fr) 2010-12-11

Family

ID=34993512

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094106915A TW200603932A (en) 2004-03-19 2005-03-08 Lead free solder fall

Country Status (3)

Country Link
JP (1) JP4392020B2 (fr)
TW (1) TW200603932A (fr)
WO (1) WO2005089999A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5071802B2 (ja) * 2008-04-08 2012-11-14 日立金属株式会社 はんだボール、はんだ層及びはんだバンプ
JP2011031253A (ja) * 2009-07-30 2011-02-17 Eishin Kogyo Kk 無鉛ハンダ合金
KR101283580B1 (ko) 2011-12-14 2013-07-05 엠케이전자 주식회사 주석계 솔더 볼 및 이를 포함하는 반도체 패키지
US8865062B2 (en) * 2012-08-08 2014-10-21 Senju Metal Industry Co., Ltd. High-temperature lead-free solder alloy
US9764430B2 (en) * 2014-02-24 2017-09-19 Koki Company Limited Lead-free solder alloy, solder material and joined structure
JP6579253B1 (ja) * 2018-11-09 2019-09-25 千住金属工業株式会社 ハンダボール、ハンダ継手および接合方法
CN115464299A (zh) * 2021-10-21 2022-12-13 上海华庆焊材技术股份有限公司 一种降低焊接空洞的预成型无铅焊片及其制备方法和应用

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3684811B2 (ja) * 1998-01-28 2005-08-17 株式会社村田製作所 半田および半田付け物品
JP3753168B2 (ja) * 1999-08-20 2006-03-08 千住金属工業株式会社 微小チップ部品接合用ソルダペースト

Also Published As

Publication number Publication date
TW200603932A (en) 2006-02-01
JPWO2005089999A1 (ja) 2008-01-31
WO2005089999A1 (fr) 2005-09-29
JP4392020B2 (ja) 2009-12-24

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