WO2005067066A1 - Led照明光源 - Google Patents
Led照明光源 Download PDFInfo
- Publication number
- WO2005067066A1 WO2005067066A1 PCT/JP2004/019088 JP2004019088W WO2005067066A1 WO 2005067066 A1 WO2005067066 A1 WO 2005067066A1 JP 2004019088 W JP2004019088 W JP 2004019088W WO 2005067066 A1 WO2005067066 A1 WO 2005067066A1
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- WO
- WIPO (PCT)
- Prior art keywords
- led
- light source
- surface region
- illumination light
- translucent member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/853—Encapsulations characterised by their shape
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- H10W72/01515—
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- H10W72/075—
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- H10W72/07554—
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- H10W72/547—
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- H10W74/00—
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- H10W90/756—
Definitions
- the present invention relates to an LED illumination light source, and particularly to an LED illumination light source that can be suitably used as a white light source for general illumination.
- a light-emitting diode element (hereinafter, referred to as an “LED element”) is a semiconductor element that is small, efficient, and emits bright colors, and has an excellent monochromatic peak.
- a red LED element, a green LED element, and a blue LED element may be arranged close to each other to perform diffusion color mixing.
- each LED element has an excellent monochromatic peak, there is a problem that color unevenness easily occurs. In other words, if the light emission from each LED element is not uniform and color mixing is not successful, white light emission with color unevenness occurs.
- Patent Documents 1 and 2 a technique for obtaining white light emission by combining a blue LED element and a yellow phosphor has been developed (for example, Patent Documents 1 and 2).
- white light emission is obtained by light emission from a blue LED element and light emission from a yellow phosphor that emits yellow when excited by the light emission.
- white light emission is obtained by using only one type of LED element, so that the problem of color unevenness that occurs when white light emission is obtained by bringing a plurality of types of LED elements close to each other can be solved.
- the shell-type LED illumination light source disclosed in Patent Document 2 has a configuration as shown in FIG. That is, the shell-type LED illumination light source 200 shown in FIG. 1 includes an LED element 121, a shell-type transparent container 127 covering the LED element 121, and lead frames 122a and 122b for supplying current to the LED element 121.
- a cup-shaped reflector 123 for reflecting the light emitted from the LED element 121 in the direction of arrow D is provided on the mount portion of the frame 122b on which the LED element 121 is mounted.
- the LED element 121 is sealed by a first resin part 124 in which a fluorescent substance 126 is dispersed, and the first resin part 124 is formed by a second resin part. Covered by part 125.
- Patent Document 1 JP-A-10-242513
- Patent Document 2 Japanese Patent No. 2998696
- LED illumination light sources have become widely used not only for backlights of image display devices and headlights of vehicles, but also for general illumination.
- recent research and development of white LED devices has made it possible to obtain sufficient luminous flux.
- “Glare” refers to a state in which there is a light source or a reflective object with high brightness in the visual field, and when light from these objects enters the eyes, the object becomes difficult to see or is dazzling and uncomfortable.
- LED illumination light sources that use light emitted from LED elements have strong directivity, so when irradiating work objects such as desks, it is rare for light to enter the eyes of surrounding people directly. It is expected that this is unlikely to occur.
- the user has a higher degree of directivity, compared to a case where weakly directional light such as a fluorescent lamp enters the user's eyes. It is expected that glare will be more likely to be felt depending on the light source.
- the present invention has been made in view of such points, and a main object thereof is to provide an LED illumination light source capable of suppressing glare. Means for solving the problem
- An LED illumination light source includes an LED chip, a reflecting member having a reflecting surface that reflects at least a part of the light emitted by the LED chip, and a translucent member that covers the LED chip.
- An LED illumination light source comprising: a top surface area located above the LED chip; and a side face area located below the top face area, wherein the side surface of the translucent member includes: At least a portion of the region has a lower transmittance than the transmittance of the upper surface region.
- the translucent member also covers at least the reflection surface of the reflection member.
- the semiconductor device further includes a wavelength converter that covers the LED chip, wherein the wavelength converter converts light emitted from the LED chip into light having a longer wavelength than the light. And a resin that disperses the phosphor, and is covered by the translucent member.
- At least a part of the side surface region of the light transmitting member is more transparent than the upper surface region by performing a surface treatment on the light transmitting member. It is formed so that the rate becomes low.
- the transmittance of at least a part of the side surface region of the translucent member is substantially zero.
- At least a part of the side surface region of the translucent member exists in a region near an angle of 45 degrees from an optical axis passing through the LED chip.
- the translucent member includes a substantially hemispherical or shell-shaped portion, and the upper surface region of the translucent member includes an optical axis passing through the LED chip. It is an area within 15 degrees from.
- the upper surface region of the translucent member has a substantially planar shape.
- the entire side surface region of the translucent member has a transmittance lower than that of the above-described upper surface region.
- at least one of the upper surface region and the reflection surface in the light transmitting member has a diffusion surface.
- a gap exists between a side surface of the wavelength conversion unit and a reflection surface of the reflection member, and the gap is filled with the light-transmitting member.
- Another LED illumination light source includes a substrate, an LED group including a plurality of LED chips two-dimensionally arranged on the substrate, and light emitted from each LED chip.
- An LED illumination light source comprising: a reflecting member having a plurality of reflecting surfaces for reflecting at least a part of the plurality of light-transmitting members; and a plurality of light-transmitting members each covering each LED chip.
- at least the surface of the translucent member located at the outermost periphery of the LED group includes an upper surface region located above the corresponding LED chip and a side surface region located below the upper surface region. At least a part of the side surface region has a transmittance lower than that of the upper surface region.
- the plurality of translucent members are mutually connected on a surface of the reflective member.
- the LED illumination light source of the present invention at least a part of the side surface area of the translucent member covering the LED chip has a transmittance lower than that of the upper surface area of the translucent member. As a result, it is possible to control the emission of light from the side area that causes glare. As a result, in the LED illumination light source of the present invention, the occurrence of glare is effectively suppressed.
- FIG. 1 is a cross-sectional view schematically showing a configuration of a conventional bullet-type LED illumination light source.
- FIG. 2 is a cross-sectional view schematically showing a configuration of an LED illumination light source 100 according to an embodiment of the present invention.
- FIG. 3 is a perspective view schematically showing a configuration of an LED illumination light source 100 according to the embodiment of the present invention.
- FIG. 4 is a cross-sectional view schematically showing a configuration of an LED illumination light source 100 according to an embodiment of the present invention.
- FIG. 5 is a perspective view schematically showing a configuration of a card-type LED illumination light source 100 according to an embodiment of the present invention.
- FIG. 6 is a cross-sectional view schematically showing a configuration of an LED illumination light source 100 according to an embodiment of the present invention.
- FIG. 7 is a cross-sectional view schematically showing a configuration of an LED illumination light source 100 according to an embodiment of the present invention.
- FIG. 8 is a cross-sectional view schematically showing a configuration of an LED illumination light source 100 according to an embodiment of the present invention.
- FIG. 9 is a cross-sectional view schematically showing a configuration of an LED illumination light source 100 according to an embodiment of the present invention.
- FIG. 10 is a diagram showing a relationship between an illumination light source, an observer, and an object to be illuminated when the observer works while observing a work surface.
- FIG. 11 is a cross-sectional view schematically showing a configuration of an LED illumination light source 100 according to an embodiment of the present invention.
- FIG. 12 is a cross-sectional view schematically showing a configuration of an LED illumination light source 100 according to an embodiment of the present invention.
- FIG. 13 is a cross-sectional view schematically showing a configuration of an LED illumination light source 100 according to an embodiment of the present invention.
- FIG. 14 is a perspective view schematically showing a configuration of an LED illumination light source 100 according to an embodiment of the present invention.
- FIG. 15 is a cross-sectional view schematically illustrating a configuration of an LED illumination light source 100 according to an embodiment of the present invention.
- FIG. 16 is a perspective view schematically showing one mode when the LED illumination light source 100 is used as a downlight.
- FIG. 17 is a perspective view schematically showing one mode when the LED illumination light source 100 is used as a downlight.
- FIG. 18 is a perspective view schematically showing one mode when the LED illumination light source 100 is used as a downlight.
- FIG. 19 is a perspective view schematically showing a configuration of an LED illumination light source 110 according to an embodiment of the present invention.
- FIG. 20 is a perspective view schematically showing a configuration of an LED illumination light source 120 according to the embodiment of the present invention.
- FIG. 2 is a cross-sectional view schematically showing a configuration of the LED illumination light source 100 according to the present embodiment
- FIG. 3 is a perspective view thereof.
- the LED illumination light source 100 includes an LED chip 10, a phosphor resin portion 12 covering the LED chip 10,
- the phosphor resin portion 12 is composed of a phosphor that converts light emitted from the LED chip 10 into light having a wavelength longer than the wavelength of the light, and a resin that disperses the phosphor. .
- the translucent member 20 has a role of blocking (sealing) the phosphor resin portion 12 from the atmosphere.
- the translucent member 20 of the present embodiment is formed from an epoxy resin.
- the translucent member 20 of the present embodiment has a function of a lens that condenses light emitted from the LED chip 10 in addition to a function of sealing the phosphor resin portion 12 and blocking the phosphor resin portion 12 from the atmosphere. You.
- the surface of the translucent member 20 includes an upper surface region 22 located above the LED chip 10 and a side surface region 24 located below the upper surface region 22. At least a part of the side surface region 24 of the light transmitting member 20 functions as a portion having a transmittance lower than that of the upper surface region 22 (low transmittance portion 26). Due to the presence of such a low transmittance portion 26, the light transmitting member
- the intensity of the light transmitted through the side region 24 of the 20 is lower than the intensity of the light transmitted through the upper region 22.
- the LED illumination light source 100 When the LED illumination light source 100 is used as a downlight, light emitted from the upper surface region 22 of the translucent member 20 exclusively illuminates the lower target (illuminated object). On the other hand, light emitted from the side surface region 24 of the translucent member 20 easily enters the eyes of the surrounding people directly. Light emitted from such side regions 24 tends to cause unpleasant glare In the 1S LED illumination light source 100, the light intensity of the side area 24 which has a great influence on the generation of the unpleasant glare is reduced.
- the translucent member 20 is formed so as to include a substantially hemispherical or shell-shaped part.
- the entire optical member 20 has a substantially hemispherical shape.
- the low transmittance portion 26 of the translucent member 20 extends in a belt shape so as to go around the side surface region 24.
- the area of the low transmittance portion 26 occupies 30% or more of the area of the side surface region 24.
- Substantially all or all of the side region 24 may function as the low transmittance portion 26.
- the upper end of the low transmittance portion 26 is in contact with the upper surface region 22, but a part of the side surface region 24 may exist between the upper end of the low transmittance portion 26 and the upper surface region 22. .
- the low transmittance portion 26 is formed, for example, by performing a surface treatment on the side surface region 24 of the translucent member 20.
- the surface treatment may be sandblasting, deposition of a predetermined substance, embossing, chemical polishing, or the like.
- the transmittance of the low transmittance portion 26 can be made lower than the transmittance of the upper surface region 22.
- the transmittance of the low transmittance portion 26 can be set to, for example, 10% or less of the transmittance of the upper surface region 22.
- the transmittance of the low transmittance portion 26 can be set to an arbitrary value such that the amount (luminance, luminous flux, and the like) relating to light transmitted through the low transmittance portion 26 is smaller than a predetermined value.
- the formation of the low transmittance portion 26 can be performed by a method other than the surface treatment of the light transmitting member 20.
- a dispersing material for example, silica, MgO, or the like
- the concentration of the dispersing material is changed depending on the region, thereby forming the low transmittance portion 26 having a lower transmittance than the upper surface region 22 It is possible to do.
- the LED chip 10 of the present embodiment is a bare chip LED, and is arranged on the substrate 30.
- the phosphor resin portion 12 covering the LED chip 10 and the translucent member 20 covering the phosphor resin portion 12 are also arranged on the substrate 30.
- the electrodes on the LED chip 10 are in contact with terminals (not shown) formed on the surface of the substrate 30 by flip-chip mounting, and the chip back surface of the LED chip 10 is covered with the phosphor resin portion 12.
- the LED chip 10 is an LED element that emits light having a peak wavelength in the visible range of wavelengths from 380 nm to 780 nm.
- the phosphor dispersed in the phosphor resin portion 12 emits light having a peak wavelength different from the peak wavelength of the LED chip 10 within a visible range of wavelength 380 ⁇ to 780 nm.
- the LED chip 10 of the present embodiment is a blue LED element that emits blue light.
- the phosphor contained in the phosphor resin portion 12 is a yellow phosphor that converts blue light into yellow light. By mixing the blue light emitted from the LED chip 10 with the yellow light emitted from the phosphor, white illumination light is formed.
- the LED chip 10 is typically an LED chip made of a gallium nitride (GaN) -based material, and emits light having a wavelength of 460 nm, for example.
- the phosphor is (Y ′ Sm) (A to Ga) ⁇ : Ce, (Y Gd
- the phosphor resin portion 12 in the present embodiment has a substantially columnar shape (see Fig. 3).
- the diameter of the phosphor resin section 12 can be set to, for example, about 0.7 mm to about 0.9 mm.
- the size of the translucent member 20 can be set to, for example, a height of 11 mm and a diameter of 2-7 mm.
- a reflector having a reflecting surface for reflecting light emitted from the LED chip 10 is provided around the translucent member 20, but in FIGS. 2 and 3, for simplicity, , Are omitted.
- FIG. 4 is a cross-sectional view showing a configuration example of a reflection plate 40 having a reflection surface 42.
- a reflector 40 having a reflective surface 42 is disposed on the substrate 30.
- the reflecting plate 40 has an opening 44 for accommodating the phosphor resin portion 12 covering the LED chip 10.
- the lateral force defining the opening 44 functions as the reflecting surface 42 that reflects the light emitted from the LED chip 10.
- the reflection plate 40 is formed of a metal such as aluminum, copper, stainless steel, iron, or an alloy thereof, but may be formed of a resin.
- the translucent member 20 is provided in the opening 44 of the reflection plate 40 so as to cover the phosphor resin portion 12.
- a translucent member 20 is suitably formed by, for example, a resin mold.
- the light transmissive member 20 is positioned above the upper surface of the reflector 40.
- the portion to be placed has a substantially hemispherical shape.
- the substantially hemispherical portion includes an upper surface region 22 and a side surface region 24, and a low transmittance portion 26 is formed on at least a part of the side surface region 24.
- a part of the translucent member 20 extends thinly in the lateral direction along the upper surface of the reflection plate 40.
- the portion of the translucent member 20 that fills the inside of the opening 44 of the reflection plate 40 is in contact with the surface of the phosphor resin portion 12 and the reflection surface 42.
- the substrate 30 includes a base substrate 32 and a wiring layer 34 formed on the base substrate 32.
- the base substrate 32 is, for example, a metal substrate
- the wiring layer 34 includes a wiring pattern 36 formed on a composite layer made of an inorganic filler and a resin.
- the reason why the metal substrate is used for the base substrate 32 and the composite layer is used for the wiring layer 34 is to improve the heat dissipation from the LED chip 10.
- the wiring layer 34 is a multilayer wiring board, and the uppermost wiring pattern 36 is mounted with an LED chip 10 S flip chip.
- an underfill stress relieving layer
- an underfill stress relieving layer
- the side surface of the phosphor resin portion 12 and the reflection surface 42 of the reflection plate 40 are separated. Due to such separation, the shape of the phosphor resin portion 12 can be freely designed without being restricted by the shape of the reflection surface 42 of the reflection plate 40, and as a result, an effect of reducing color unevenness can be obtained. be able to.
- the LED illumination light source in which the side surface of the phosphor resin portion 12 is separated from the reflection surface 42 of the reflection plate 40 is disclosed in U.S. Patent Application Publication No. US2004 / 0100192A1, and the entirety thereof is incorporated herein.
- the phosphor resin portion 12 has a “substantially cylindrical shape”
- the “substantially cylindrical shape” in the present specification is not limited to a structure in which a cross section parallel to the main surface of the substrate is a perfect circle. Includes structures whose cross section is polygonal with six or more vertices. If the polygon has six or more vertices, it can be identified as a "cylinder" because it has substantial axial symmetry.
- the ultrasonic chip may rotate the LED chip 10 in a plane parallel to the main surface of the substrate.
- the phosphor resin portion 12 has a triangular or quadrangular prism shape
- the light distribution characteristics are likely to be affected by the arrangement relationship between the LED chip 10 and the phosphor resin portion 12.
- the fluorescent resin portion 12 has a substantially columnar shape
- the orientation of the LED chip 12 and the rotation of the LED chip 12 in a plane parallel to the main surface of the substrate will not affect the mutual arrangement of the fluorescent resin portion 12 and the LED chip 12. Does not significantly change, and the alignment characteristics are hardly affected.
- FIGS. 3 to 4 each show a single LED chip 12.
- the LED light source 100 may include a plurality of LED chips 10.
- the structure shown in FIG. 4 may be arranged as one unit and arranged two-dimensionally (for example, in rows and columns).
- FIG. 5 shows an example of a card-type LED illumination light source 100 including a plurality of two-dimensionally arranged LED chips (LED groups or LED clusters).
- the substrate 30 is provided with a plurality of translucent members 20 each covering each LED chip (not shown). Since the low transmittance portion 26 is formed in the side surface region 24 in the substantially hemispherical portion of the translucent member 20, the card-type LED illumination light source 100 has a glare suppressing function.
- the force of forming the low transmittance portion 26 in the side surface region 24 of the corresponding light-transmitting member 20 according to all the LED chips arranged on the substrate is the present invention. It is not limited to the case.
- the sag suppression effect can be obtained by providing the low transmittance portion 26 at least in the side surface region 24 of the translucent member located at the outermost periphery of the LED group.
- a power supply terminal 38 that is electrically connected to the wiring pattern 36 and supplies power to the LED chip 10 is provided on the surface of the card-type LED illumination light source 100.
- a connector (not shown) into which the LED illumination light source 100 can be detachably inserted and a lighting circuit (not shown) are electrically connected, and a guard type L is connected to the connector.
- ED lighting source 100 should be used.
- the luminance of the LED illumination light source 100 is set to be less than 24000 cd / m 2 around an angle of 65 degrees with respect to a vertical direction (normal direction of the substrate 30) hanging from the center of the LED illumination light source 100.
- the low transmittance portion 26 be formed on the translucent member 20 so as to be preferably 5300 cdZm 2 or less (more preferably 2400 cd / m 2 or less). 24000cd / m 2
- the following can satisfy the condition of G2 in G classification. And, by setting it to 530 Ocd / m 2 or less and 2400 cd / m 2 or less, the conditions of G1 and GO in the G classification can be satisfied, respectively.
- the G classification is based on the luminance control method in the evaluation method for discomfort glare of indoor lighting, and is simplified based on the CIE glare safety guard system, based on the results of Japan. It is a glare classification.
- GO and G1 are lighting fixtures whose glare is sufficiently limited by a louver prism panel, etc.
- G2 is a lamp that cannot be seen when the lighting fixture is viewed from the horizontal direction like a bottom-opening lighting fixture. Lighting equipment with reduced glare.
- G3 is a lighting fixture with exposed lamps that does not limit glare.
- a low transmittance portion 26 can be formed in substantially all or all of the side surface region 24 in the hemisphere portion).
- FIG. 7 shows an example in which a low transmittance portion 26 is also formed in a portion of the translucent member 20 extending along the upper surface of the reflection plate 40.
- FIG. 8 shows an example in which a prism panel functioning as the low transmittance section 26 is provided.
- the prism panel Since the prism panel causes light scattering, it has a sparkling effect. This produces an effect of improving brightness.
- the observer when the observer is away from the illumination light source, glare is less likely to occur because the brightness is low.
- the brightness is high, but if the observer does not turn his face to the ceiling, direct light will rarely enter the observer's eyes. Therefore, by suppressing the light emitted at an angle within the predetermined range, it is possible to effectively suppress the glare without significantly reducing the total amount of light.
- FIG. 9 shows a radiation angle ⁇ ⁇ ⁇ ⁇ in the LED illumination light source 100 of the present embodiment.
- the direction in which the arrow 50 extends in the figure is the direction that becomes the optical axis passing through the LED chip 10, and the emission angle ⁇ is 0. Angle.
- the arrow 50 is a direction indicating directly below the LED illumination light source 100 when the LED illumination light source 100 is irradiated from directly below the top surface.
- FIG. 10 a description will be given of a case in which the LED illumination light source is radiated from directly above the top surface and the observer observes the work surface to perform work.
- the height hi from the observer's eye 52 to the desk top surface 51 is assumed to be 30 cm, and the work surface 54 is observed at an angle of 45 ° from the vertical plane.
- the form of the LED illumination light source is a table stand
- the height h2 from the desk top surface 51 is about 50 cm
- the emission angle LED of the LED illumination light source reaching the eye 52 of the observer is 56 °.
- the viewing angle of the observer's eye 52 on the upper side of the eyeball is a maximum of 100 ° from the center of the viewpoint.
- the height h4 at which the LED light source can be recognized while working is 51 cm from the desk surface 51 cm, and the radiation angle 35 is 35 °. In other words, during the work, there is no need to worry about the dray especially for the illumination light source more than 72 cm from the desk surface 51.
- a mask light-shielding portion
- the low transmittance portion 26 functioning as a mask can be formed by, for example, a resin (for example, an epoxy resin) mixed with a pigment that mainly absorbs blue light.
- a diffusion surface 27 may be formed on at least a part of the upper surface region 22 as shown in FIG.
- the upper surface region 22 may be made milky, or the upper surface region 22 may be provided with a prism panel.
- the light transmittance of the upper surface region 22 may be set low so that the luminance of the upper surface region 22 is reduced to, for example, 10,000 cd / m 2 or less.
- the reflecting surface 42 of the reflecting plate 40 may be formed from a diffusing surface.
- the upper surface area 22 specifies the position of the upper surface area 22 in the case of a roughly hemispherical portion where the force is substantially directed toward the front when viewed from above the substrate 30 or a shell-shaped portion where it is difficult to identify the front surface. It can be difficult to do. In such a case, a region where the transmissive member seat radiation angle ⁇ is within 15 ° may be defined as the upper surface region 22.
- FIG. 13 is a cross-sectional view of the LED illumination light source 100 according to the present embodiment
- FIG. 14 is a perspective view of the LED illumination light source 100.
- the cross section of the translucent member 20 in a plane parallel to a plane perpendicular to the main surface of the substrate 30 has a substantially trapezoidal shape.
- a part of the side surface region 24 of the translucent member 20 functions as the low transmittance portion 26, but as shown in FIG. It may be made to function as. Further, a diffusion surface may be formed in the upper surface region 22.
- FIGS. 16, 17 and 18 When the LED illumination light source 100 in each of the above embodiments is used as a downlight, for example, the forms shown in FIGS. 16, 17 and 18 can be adopted.
- the LED illumination light source 100 in this example is a card-type LED illumination light source
- FIG. 16 shows an example of the configuration of a table lamp
- FIG. 17 shows an example of a configuration that can be replaced with a straight tube fluorescent lamp
- FIG. 18 shows an example of a configuration that can be replaced with a round tube fluorescent lamp.
- the card-type LED illumination light source 100 is inserted and set in the receiving portion 64 provided in the main body portion 60, and is turned on.
- the card is inserted through a slot 65 provided in the main body 60.
- the LED light source 100 is set and is ready to be lit.
- the main unit 60 is connected to a commercial power supply and has a built-in lighting circuit. Since the card-type LED illumination light source 100 has a glare suppressing function, glare can be suppressed even in the embodiments shown in FIGS. 16, 17, and 18.
- each LED illumination light source 100 in each of the above-described embodiments includes the reflector 40, the effects of the present invention can be obtained even when the reflector 40 is not provided.
- FIG. 19 shows a configuration of a shell-type LED light source 110 including the lead frames 62a and 62b.
- the LED chip 10 is covered with a phosphor resin (not shown) and a translucent member 20.
- the upper surface region 22 of the translucent member 20 has a curved surface shape defining a shell shape.
- At least a part of the side surface region 24 of the translucent member 20 is formed with a low transmittance portion 26.
- the LED chip 10 is mounted on one lead frame 62b side and is connected to the other lead frame 62a by bonding wires 72. As in the present embodiment, even when the reflector is provided and the mirror is provided, the occurrence of glare can be suppressed.
- FIG. 20 shows a chip type LED light source 120.
- the LED chip 10 shown in FIG. 20 has a surface mounting type electrode structure, and is mounted on the substrate 30 on which the wiring pattern 70 is formed.
- the LED chip 10 has electrode terminals on the front surface side and the back surface side of the substrate, and one of them is connected to a part of the wiring pattern 70 directly or via solder or the like.
- the other of the substrate front side terminal and the substrate rear side of the LED chip 10 is connected to another part of the wiring pattern 70 by a bonding wire 72.
- the translucent member 20 is formed so as to cover the LED chip 10 and the phosphor resin portion (not shown), and at least a part of the side surface region 24 of the translucent member 20 has low transparency. Since the rate portion 26 is formed, the occurrence of glare can be suppressed.
- an LED illumination light source with reduced glare can be provided, which can contribute to the spread of LED illumination light sources for general illumination.
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Abstract
Description
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Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/585,456 US7791274B2 (en) | 2004-01-07 | 2004-12-21 | LED lamp |
| JP2005516831A JP3897806B2 (ja) | 2004-01-07 | 2004-12-21 | Led照明光源 |
| US12/836,219 US8405307B2 (en) | 2004-01-07 | 2010-07-14 | LED lamp |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004001635 | 2004-01-07 | ||
| JP2004-001635 | 2004-01-07 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US10/585,456 A-371-Of-International US7791274B2 (en) | 2004-01-07 | 2004-12-21 | LED lamp |
| US12/836,219 Continuation US8405307B2 (en) | 2004-01-07 | 2010-07-14 | LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2005067066A1 true WO2005067066A1 (ja) | 2005-07-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2004/019088 Ceased WO2005067066A1 (ja) | 2004-01-07 | 2004-12-21 | Led照明光源 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US7791274B2 (ja) |
| JP (1) | JP3897806B2 (ja) |
| CN (1) | CN100470855C (ja) |
| WO (1) | WO2005067066A1 (ja) |
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| US8558446B2 (en) | 2005-02-18 | 2013-10-15 | Nichia Corporation | Light emitting device provided with lens for controlling light distribution characteristic |
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| US10847688B2 (en) | 2014-12-26 | 2020-11-24 | Nichia Corporation | Light emitting device |
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Also Published As
| Publication number | Publication date |
|---|---|
| US7791274B2 (en) | 2010-09-07 |
| US20110006673A1 (en) | 2011-01-13 |
| JP3897806B2 (ja) | 2007-03-28 |
| CN100470855C (zh) | 2009-03-18 |
| US20090135581A1 (en) | 2009-05-28 |
| US8405307B2 (en) | 2013-03-26 |
| JPWO2005067066A1 (ja) | 2007-12-20 |
| CN1922740A (zh) | 2007-02-28 |
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