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WO2004003991A3 - Elektronisches bauteil mit einer gehäusepackung - Google Patents

Elektronisches bauteil mit einer gehäusepackung Download PDF

Info

Publication number
WO2004003991A3
WO2004003991A3 PCT/DE2003/002119 DE0302119W WO2004003991A3 WO 2004003991 A3 WO2004003991 A3 WO 2004003991A3 DE 0302119 W DE0302119 W DE 0302119W WO 2004003991 A3 WO2004003991 A3 WO 2004003991A3
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
contacts
housing packaging
cone
pointed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2003/002119
Other languages
English (en)
French (fr)
Other versions
WO2004003991A2 (de
Inventor
Rainer Steiner
Horst Theuss
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Priority to US10/519,215 priority Critical patent/US7319598B2/en
Priority to EP03761433A priority patent/EP1518267A2/de
Publication of WO2004003991A2 publication Critical patent/WO2004003991A2/de
Publication of WO2004003991A3 publication Critical patent/WO2004003991A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H10W72/20—
    • H10W72/30—
    • H10W74/01—
    • H10W74/012—
    • H10W74/014—
    • H10W74/117—
    • H10W74/121—
    • H10W74/15—
    • H10W76/153—
    • H10W90/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H10W70/681—
    • H10W72/0198—
    • H10W72/073—
    • H10W72/251—
    • H10W72/856—
    • H10W72/90—
    • H10W72/9415—
    • H10W74/00—
    • H10W90/724—
    • H10W90/734—

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

Die Erfindung betrifft ein elektronisches Bauteil mit einer Gehäusepackung (2) aus mehreren Kunststofflagen (3) mit mindestens einer vergrabenen Leiterbahnlage (4) und mit mindestens einem Halbleiterchip (5), der auf einer Aussenseite (6) verteilte spitzkegelige Aussenkontakte (7) aufweist. Die spitzkegeligen Aussenkontakte (7) durchdringen eine der Kunststofflagen (3) und bilden Durchkontakte zu der vergrabenen Leiterbahnlage (4). Ferner betrifft die Erfindung ein Verfahren zur Herstellung eines derartigen elektronischen Bauteils (1).
PCT/DE2003/002119 2002-06-26 2003-06-25 Elektronisches bauteil mit einer gehäusepackung Ceased WO2004003991A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/519,215 US7319598B2 (en) 2002-06-26 2003-06-25 Electronic component with a housing package
EP03761433A EP1518267A2 (de) 2002-06-26 2003-06-25 Elektronisches bauteil mit einer gehäusepackung

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10228593.4 2002-06-26
DE10228593A DE10228593A1 (de) 2002-06-26 2002-06-26 Elektronisches Bauteil mit einer Gehäusepackung

Publications (2)

Publication Number Publication Date
WO2004003991A2 WO2004003991A2 (de) 2004-01-08
WO2004003991A3 true WO2004003991A3 (de) 2004-04-01

Family

ID=29723476

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2003/002119 Ceased WO2004003991A2 (de) 2002-06-26 2003-06-25 Elektronisches bauteil mit einer gehäusepackung

Country Status (4)

Country Link
US (1) US7319598B2 (de)
EP (1) EP1518267A2 (de)
DE (1) DE10228593A1 (de)
WO (1) WO2004003991A2 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004043663B4 (de) 2004-09-07 2006-06-08 Infineon Technologies Ag Halbleitersensorbauteil mit Hohlraumgehäuse und Sensorchip und Verfahren zur Herstellung eines Halbleitersensorbauteils mit Hohlraumgehäuse und Sensorchip
US20060211233A1 (en) * 2005-03-21 2006-09-21 Skyworks Solutions, Inc. Method for fabricating a wafer level package having through wafer vias for external package connectivity and related structure
US7576426B2 (en) * 2005-04-01 2009-08-18 Skyworks Solutions, Inc. Wafer level package including a device wafer integrated with a passive component
US8120173B2 (en) * 2005-05-03 2012-02-21 Lockheed Martin Corporation Thin embedded active IC circuit integration techniques for flexible and rigid circuits
DE102006025960B4 (de) * 2006-06-02 2011-04-07 Infineon Technologies Ag Verfahren zur Herstellung einer integrierten Halbleitereinrichtung
DE102006030581B3 (de) 2006-07-03 2008-02-21 Infineon Technologies Ag Verfahren zum Herstellen eines Bauelements
US7635606B2 (en) * 2006-08-02 2009-12-22 Skyworks Solutions, Inc. Wafer level package with cavities for active devices
US7445959B2 (en) * 2006-08-25 2008-11-04 Infineon Technologies Ag Sensor module and method of manufacturing same
US20080217708A1 (en) * 2007-03-09 2008-09-11 Skyworks Solutions, Inc. Integrated passive cap in a system-in-package
US20090115047A1 (en) * 2007-10-10 2009-05-07 Tessera, Inc. Robust multi-layer wiring elements and assemblies with embedded microelectronic elements
KR20150068495A (ko) 2007-11-30 2015-06-19 스카이워크스 솔루션즈, 인코포레이티드 플립 칩 실장을 이용하는 웨이퍼 레벨 패키징
US8900931B2 (en) * 2007-12-26 2014-12-02 Skyworks Solutions, Inc. In-situ cavity integrated circuit package
DE102008030842A1 (de) * 2008-06-30 2010-01-28 Epcos Ag Integriertes Modul mit intrinsischem Isolationsbereich und Herstellungsverfahren
US8390083B2 (en) 2009-09-04 2013-03-05 Analog Devices, Inc. System with recessed sensing or processing elements
DE102010018499A1 (de) * 2010-04-22 2011-10-27 Schweizer Electronic Ag Leiterplatte mit Hohlraum
WO2012051340A1 (en) 2010-10-12 2012-04-19 Analog Devices, Inc. Microphone package with embedded asic
US8823186B2 (en) * 2010-12-27 2014-09-02 Shin-Etsu Chemical Co., Ltd. Fiber-containing resin substrate, sealed substrate having semiconductor device mounted thereon, sealed wafer having semiconductor device formed thereon, a semiconductor apparatus, and method for manufacturing semiconductor apparatus
US9324586B2 (en) 2011-08-17 2016-04-26 Infineon Technologies Ag Chip-packaging module for a chip and a method for forming a chip-packaging module
US9422094B2 (en) 2011-11-15 2016-08-23 Skullcandy, Inc. Packaging for headphones, packaged headphones, and related methods
TWI527505B (zh) 2013-01-10 2016-03-21 元太科技工業股份有限公司 電路基板結構及其製造方法
US9847462B2 (en) 2013-10-29 2017-12-19 Point Engineering Co., Ltd. Array substrate for mounting chip and method for manufacturing the same
US9666558B2 (en) 2015-06-29 2017-05-30 Point Engineering Co., Ltd. Substrate for mounting a chip and chip package using the substrate
US10529666B2 (en) * 2016-11-29 2020-01-07 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor structure and manufacturing method thereof
WO2022067569A1 (zh) * 2020-09-29 2022-04-07 华为技术有限公司 信号传输装置及电子设备

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0920058A2 (de) * 1997-11-25 1999-06-02 Matsushita Electric Industrial Co., Ltd. Modul mit Einbaukomponente und seine Herstellung
EP1041624A1 (de) * 1999-04-02 2000-10-04 Interuniversitair Microelektronica Centrum Vzw Transfermethode ultra-dünner Substrate und Anwendung zur Herstellung von Mehrlagen-Dünnschichtstrukturen
EP1069616A2 (de) * 1999-07-12 2001-01-17 Sony Chemicals Corporation Flexible Mehrlagenleiterplatte
JP2001044226A (ja) * 1999-07-27 2001-02-16 Mitsubishi Electric Corp 半導体装置の製造方法および半導体装置
US6204089B1 (en) * 1999-05-14 2001-03-20 Industrial Technology Research Institute Method for forming flip chip package utilizing cone shaped bumps
EP1111674A2 (de) * 1999-12-20 2001-06-27 Matsushita Electric Industrial Co., Ltd. Modul mit eingebauter Schaltungskomponente, Funkgerät und seine Herstellung
CN1424756A (zh) * 2001-12-13 2003-06-18 松下电器产业株式会社 金属布线基板和半导体装置及其制造方法

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US3691289A (en) * 1970-10-22 1972-09-12 Minnesota Mining & Mfg Packaging of semiconductor devices
US5306670A (en) * 1993-02-09 1994-04-26 Texas Instruments Incorporated Multi-chip integrated circuit module and method for fabrication thereof
JPH08124950A (ja) 1994-10-26 1996-05-17 Toshiba Corp 半導体装置の製造方法
JPH08125344A (ja) 1994-10-26 1996-05-17 Toshiba Corp 印刷配線板の製造方法
JPH08181175A (ja) 1994-12-22 1996-07-12 Toshiba Corp ワイヤボンディング方法
JP3600295B2 (ja) 1995-01-23 2004-12-15 京セラケミカル株式会社 印刷配線板の製造方法
US5874780A (en) * 1995-07-27 1999-02-23 Nec Corporation Method of mounting a semiconductor device to a substrate and a mounted structure
JP3654982B2 (ja) * 1995-12-13 2005-06-02 株式会社東芝 多層印刷配線板の製造方法
JP3514361B2 (ja) * 1998-02-27 2004-03-31 Ｔｄｋ株式会社 チップ素子及びチップ素子の製造方法
CA2328975A1 (en) * 1998-04-27 1999-11-04 Ciba Specialty Chemicals Holding Inc. Process for the preparation of uv protective coatings by plasma-enhanced deposition
JP4447143B2 (ja) * 2000-10-11 2010-04-07 新光電気工業株式会社 半導体装置及びその製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0920058A2 (de) * 1997-11-25 1999-06-02 Matsushita Electric Industrial Co., Ltd. Modul mit Einbaukomponente und seine Herstellung
EP1041624A1 (de) * 1999-04-02 2000-10-04 Interuniversitair Microelektronica Centrum Vzw Transfermethode ultra-dünner Substrate und Anwendung zur Herstellung von Mehrlagen-Dünnschichtstrukturen
US6204089B1 (en) * 1999-05-14 2001-03-20 Industrial Technology Research Institute Method for forming flip chip package utilizing cone shaped bumps
EP1069616A2 (de) * 1999-07-12 2001-01-17 Sony Chemicals Corporation Flexible Mehrlagenleiterplatte
JP2001044226A (ja) * 1999-07-27 2001-02-16 Mitsubishi Electric Corp 半導体装置の製造方法および半導体装置
US6544814B1 (en) * 1999-07-27 2003-04-08 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing a packaged semiconductor device, and a semiconductor device manufactured thereby
EP1111674A2 (de) * 1999-12-20 2001-06-27 Matsushita Electric Industrial Co., Ltd. Modul mit eingebauter Schaltungskomponente, Funkgerät und seine Herstellung
CN1424756A (zh) * 2001-12-13 2003-06-18 松下电器产业株式会社 金属布线基板和半导体装置及其制造方法
US20030127725A1 (en) * 2001-12-13 2003-07-10 Matsushita Electric Industrial Co., Ltd. Metal wiring board, semiconductor device, and method for manufacturing the same

Also Published As

Publication number Publication date
EP1518267A2 (de) 2005-03-30
US7319598B2 (en) 2008-01-15
WO2004003991A2 (de) 2004-01-08
US20060126313A1 (en) 2006-06-15
DE10228593A1 (de) 2004-01-15

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