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WO2004084303A2 - Flip-chip arrangment on a substrate carrier - Google Patents

Flip-chip arrangment on a substrate carrier Download PDF

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Publication number
WO2004084303A2
WO2004084303A2 PCT/DE2004/000504 DE2004000504W WO2004084303A2 WO 2004084303 A2 WO2004084303 A2 WO 2004084303A2 DE 2004000504 W DE2004000504 W DE 2004000504W WO 2004084303 A2 WO2004084303 A2 WO 2004084303A2
Authority
WO
WIPO (PCT)
Prior art keywords
chip
contact elements
substrate
substrate carrier
arrangement according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2004/000504
Other languages
German (de)
French (fr)
Other versions
WO2004084303A3 (en
Inventor
Erik Heinemann
Frank PÜSCHNER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Publication of WO2004084303A2 publication Critical patent/WO2004084303A2/en
Publication of WO2004084303A3 publication Critical patent/WO2004084303A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H10W72/20—
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • H10W70/66—
    • H10W70/699—
    • H10W72/30—
    • H10W74/012—
    • H10W74/15—
    • H10W72/072—
    • H10W72/073—
    • H10W72/251—
    • H10W72/5522—
    • H10W72/856—
    • H10W72/884—
    • H10W74/00—
    • H10W90/724—
    • H10W90/734—
    • H10W90/754—

Definitions

  • the invention relates to an arrangement with a substrate carrier and a chip attached thereon.
  • FIG. 2 shows an exemplary embodiment of a substrate carrier with a chip attached thereon, for example for telephone cards or chip cards (smart cards) for security applications.
  • a chip is glued to a substrate carrier by means of an adhesive.
  • On the opposite side of the substrate carrier there are external contacts which can be connected, for example, to a chip card reader.
  • the substrate has openings at the location of these external contacts, so that the external contacts are connected to wires which lead to the contact points on the top of the chip ,
  • these wires are usually covered with a gold layer or formed directly from gold.
  • the substrate carrier with the chip thereon is then inserted into a chip card in such a way that the chip is protected. Bonding methods are available for the intimate connection of the gold wires to the external contacts or the chip contacts. For this purpose, the gold wire and the contact point are heated locally, which leads to an intimate electrical connection between the gold wire and
  • Contact point leads In order to protect the gold wires from tearing when the chip card is mechanically loaded, they are usually additionally embedded in a resin. However, the high processing temperatures of such contacting require a temperature-stable substrate or a temperature-stable chip and therefore cause a higher space and cost.
  • the object of the present invention is to provide an arrangement without the disadvantages mentioned.
  • the arrangement also has a chip provided with contact points, which is connected to the substrate carrier such that its side provided with contact points faces the surface of the substrate carrier provided with the chip contact elements and is electrically connected to the chip contact elements.
  • the thickness of the chip is larger than the thickness of the substrate.
  • the thickness of the chip is always greater than the sum of the thicknesses of the substrate of the external contact elements and the chip contact elements.
  • the substrate carrier itself is advantageously formed from a thin plastic.
  • An alternative embodiment is the formation of the substrate carrier by paper. This ensures the highest possible reliability in mechanical, dynamic bending processes.
  • An advantageous embodiment of the contact is the formation of the contact elements by a gold-nickel-copper metallization layer in which gold forms the uppermost partial layer.
  • the object according to the invention can advantageously be connected to a data card with a card body which has a recess.
  • FIG. 1 shows an exemplary embodiment of the invention
  • Figure 2 shows a known embodiment.
  • the substrate carrier S which has two surfaces 01 and 02. Furthermore, the substrate contains through holes D, so that the holes
  • the substrate S has external contact elements AK which consist of a metal layer.
  • the substrate carrier contains chip contact elements CK, which are electrically connected through the through holes D to the external contact elements AK.
  • the bushings D are completely filled with a metal that is also part of the metal layer.
  • External contact elements AK, the substrate layer and the contact elements CK together have a thickness Dl in the order of 100 ⁇ m.
  • the substrate carrier S which uses a plastic such as PEN, PET, PI or SR4 as the base material, has a layer thickness of approximately 75 ⁇ m. Alternatively, this substrate carrier can also be realized using paper or another flexible material.
  • the contact layers AK and CK are made up of a three-component metallization layer. Two approximately 10 ⁇ m thick copper metallization layers are connected to the two surfaces of the substrate and directly to one another via the through holes D. An approx. 2 ⁇ m thick nickel layer is applied to each copper layer. To protect against oxidation, a thin gold layer is applied to these contacts, which is typically 0.05 ⁇ m or a flash layer. In addition to this embodiment variant, however, other metal layers and alloys can also be used, for example palladium.
  • the thickness By varying the thickness, increased stability of the substrate carrier can be achieved if necessary.
  • the metals are deposited galvanically. Through this
  • Preparation with metal layers of very small thickness is a flexible substrate carrier with great reliability in mechanical, dynamic bending processes.
  • the arrangement also has a chip IC, the contacts of which are connected to the chip contact elements CK via the B ps B.
  • the side of the chip IC provided with the contact points is that side provided with the chip contact elements CK
  • Surface 02 of the substrate carrier S faces and thus forms a flip chip.
  • the bumps B are raised contacting parts which consist of metal which has a different degree of hardness compared to the chip contact elements CK.
  • the chip contact element CK can be made of a softer material than the bumps B.
  • An adhesive G is provided for attaching the chip IC to the substrate S.
  • This can be, for example, a resin or a soft plastic. It makes sense to arrange the adhesive around the chip contact elements CK in order on the one hand to protect the electrical contact between the chip IC and the chip contact element CK and on the other hand to connect the chip IC to the substrate.
  • the contact surfaces can be coated with conductive silver or a similar substance beforehand.
  • the thickness D2 of the so-called flip chip IC in this arrangement is significantly greater than the thickness D1 of the sum of the substrate S, and of the contact elements CK and AK. As a result, the reliability of the arrangement is given even with mechanical static loading. Through the direct contact of the chip IC with the chip contact elements CK and Eliminating the need for additional contact wires means that overall thinner modules can be manufactured without having to accept a lower load capacity.
  • a data carrier card which has a card body with a recess and the substrate carrier arrangement according to the invention.
  • the substrate carrier is arranged in the recess such that the chip placed on it extends into the recess.
  • a thinner data carrier card can be implemented overall.
  • the invention is not limited to the arrangement with a data carrier card. The main idea is rather the arrangement between a carrier and a chip located thereon, which is arranged such that its contacts are on the side facing the carrier and the chip always has a greater thickness than the carrier.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

An arrangement with a substrate carrier (S) comprising a first surface (O1) on which outer contact elements (AK) are disposed, a second opposite surface (O2) on which chip contact elements are disposed, whereby the contact elements of the two surfaces are electrically interconnected (D) through the substrate (S), and a chip (IC), whereby the side (K) which is provided with contact points (B) faces the second surface and is electrically connected to the chip contact elements (CK) and whereby the thickness (D2) of the chip is greater than the thickness of the substrate (S). The contact points (B) of the chip (IC) are made of a metal which has a different degree of hardness than that of the chip contact elements (CK).

Description

Beschreibung description

Flip-Chip Anordnung auf einem SubstratträgerFlip-chip arrangement on a substrate carrier

Die Erfindung betrifft eine Anordnung mit einem Substratträger und einem darauf angebrachten Chip.The invention relates to an arrangement with a substrate carrier and a chip attached thereon.

Die steigende Zahl an Anwendungen von Chipkarten erfordern eine zunehmende mechanische Belastbarkeit der Substratträger mit den darauf angebrachten Chips. Ein bekanntesThe increasing number of applications of chip cards require an increasing mechanical strength of the substrate carrier with the chips attached to it. A well known

Ausführungsbeispiel eines Substratträgers mit darauf angebrachtem Chip, beispielsweise für Telefonkarten oder Chipkarten (Smartcards) für Sicherheitsanwendungen zeigt Figur 2. Dort ist ein Chip auf einem Substratträger mittels eines Klebers festgeklebt. Auf der gegenüberliegenden Seite des Substratträgers befinden sich Außenkontakte, die beispielsweise mit einem Chipkartenleser "verbunden werden können. Das Substrat weist Öffnungen an der Stelle dieser Außenkontakte auf, so daß die Außenkontakte mit Drähten verbunden sind, die zu den Kontaktstellen an der Oberseite des Chips führen.FIG. 2 shows an exemplary embodiment of a substrate carrier with a chip attached thereon, for example for telephone cards or chip cards (smart cards) for security applications. There, a chip is glued to a substrate carrier by means of an adhesive. On the opposite side of the substrate carrier there are external contacts which can be connected, for example, to a chip card reader. The substrate has openings at the location of these external contacts, so that the external contacts are connected to wires which lead to the contact points on the top of the chip ,

Zum Schutz gegen Oxidation sind diese Drähte meist mit einer Goldschicht überzogen oder direkt aus Gold gebildet. Der Substratträger mit dem darauf befindlichen Chip wird dann in eine Chipkarte so eingesetzt, daß der Chip geschützt ist. Zur innigen Verbindung der Golddrähte mit den Außenkontakten bzw. den Chipkontakten bieten sich Bondverfahren an. Dazu wird der Golddraht sowie die Kontaktstelle lokal erhitzt, was zu einer innigen elektrischen Verbindung zwischen Golddraht undTo protect against oxidation, these wires are usually covered with a gold layer or formed directly from gold. The substrate carrier with the chip thereon is then inserted into a chip card in such a way that the chip is protected. Bonding methods are available for the intimate connection of the gold wires to the external contacts or the chip contacts. For this purpose, the gold wire and the contact point are heated locally, which leads to an intimate electrical connection between the gold wire and

Kontaktstelle führt . Um die Golddrähte bei einer mechanischen Belastung der Chipkarte vor dem Abreißen zu schützen, werden diese meist zusätzlich in ein Harz eingebettet. Die hohen Verarbeitungstemperaturen einer solchen Kontaktierung benötigen jedoch ein temperaturstabiles Substrat bzw. einen temperaturstabilen Chip und verursachen demnach einen höheren Platz- und Kostenaufwand.Contact point leads. In order to protect the gold wires from tearing when the chip card is mechanically loaded, they are usually additionally embedded in a resin. However, the high processing temperatures of such contacting require a temperature-stable substrate or a temperature-stable chip and therefore cause a higher space and cost.

Die Aufgabe der vorliegenden Erfindung besteht darin, eine Anordnung ohne die genannten Nachteile vorzusehen.The object of the present invention is to provide an arrangement without the disadvantages mentioned.

Diese Aufgabe wird mit den Merkmalen des Patentanspruchs 1 gelöst. Dazu ist eine Anordnung aus einem Substratträger mit zwei gegenüberliegenden Oberflächen vorgesehen. Die eine Oberfläche weist Außenkontaktelemente auf, die durch das Substrat mit Chipkontakt-elementen auf der gegenüberliegenden Oberfläche elektrisch und mechanisch verbunden sind. DieThis object is achieved with the features of patent claim 1. For this purpose, an arrangement of a substrate carrier with two opposite surfaces is provided. One surface has external contact elements which are electrically and mechanically connected to chip contact elements on the opposite surface by the substrate. The

Anordnung weist ferner einen mit Kontaktstellen versehenen Chip auf, der so mit dem Substratträger verbunden ist, daß dessen mit Kontaktstellen versehene Seite der mit den Chipkontaktelementen versehenen Oberfläche des Substratträgers zugewandt und mit den Chipkontaktelementen elektrisch verbunden ist. Die Dicke des Chips ist dabei größer als die Dicke des Substrats. Dadurch ist eine hohe mechanische Stabilität gegenüber statischen Biegungen erreichbar. Durch den direkten Kontakt zwischen Chip und den Chipkontaktelementen ohne zusätzliche Drahtverbindungen wird der Platzbedarf deutlich reduziert.The arrangement also has a chip provided with contact points, which is connected to the substrate carrier such that its side provided with contact points faces the surface of the substrate carrier provided with the chip contact elements and is electrically connected to the chip contact elements. The thickness of the chip is larger than the thickness of the substrate. As a result, high mechanical stability against static bends can be achieved. The direct contact between the chip and the chip contact elements without additional wire connections significantly reduces the space requirement.

Weitere vorteilhafte Ausgestaltungen der Erfindung sind Gegenstand der Unteransprüche .Further advantageous embodiments of the invention are the subject of the dependent claims.

In einer Weiterentwicklung der Erfindung ist die Dicke des Chips immer größer als die Summe der Dicken des Substrats der Außenkontaktelemente und der Chipkontaktelemente. Der Substratträger selbst ist vorteilhaft aus einem dünnen Kunststoff gebildet. Eine alternative Ausgestaltungsform ist die Ausbildung des Substratträgers durch Papier. Dadurch ist eine höchstmögliche Zuverlässigkeit in mechanisch, dynamischen Biegeprozessen gewährleistet.In a further development of the invention, the thickness of the chip is always greater than the sum of the thicknesses of the substrate of the external contact elements and the chip contact elements. The The substrate carrier itself is advantageously formed from a thin plastic. An alternative embodiment is the formation of the substrate carrier by paper. This ensures the highest possible reliability in mechanical, dynamic bending processes.

Eine vorteilhafte Ausgestaltung der Kontaktierung ist die Ausbildung der Kontaktelemente durch eine Gold-Nickel-Kupfer- Metallisierungsschicht, in der Gold die jeweils oberste Teilschicht bildet.An advantageous embodiment of the contact is the formation of the contact elements by a gold-nickel-copper metallization layer in which gold forms the uppermost partial layer.

Der erfindungsgemäße Gegenstand läßt sich vorteilhaft mit einem Kartenkörper, der eine Aussparung aufweist, zu einer Datenträgerkarte verbinden.The object according to the invention can advantageously be connected to a data card with a card body which has a recess.

Im folgenden wird die Erfindung unter Bezugnahme auf eine Zeichnung im Detail erläutert. Es zeigen:The invention is explained in detail below with reference to a drawing. Show it:

Figur 1 ein Ausführungsbeispiel der Erfindung,FIG. 1 shows an exemplary embodiment of the invention,

Figur 2 ein bekanntes Ausführungsbeispiel.Figure 2 shows a known embodiment.

In Figur 1 ist ein Substratträger S dargestellt, der zwei Oberflächen 01 und 02 aufweist. Des weiteren enthält das Substrat durchführende Löcher D, so daß die Löcher das1 shows a substrate carrier S which has two surfaces 01 and 02. Furthermore, the substrate contains through holes D, so that the holes

Substrat vollständing durchbohren. Auf der ersten Oberfläche 01 weist das Substrat S Außenkontaktelemente AK auf, die aus einer Metallschicht bestehen. Auf der zweiten Oberfläche 02 enthält der Substratträger Chipkontaktelemente CK, die durch die Durchführungslöcher D mit den Außenkontaktelementen AK elektrisch verbunden sind. Die Durchführungslδcher D sind hierbei vollständig mit einem Metall aufgefüllt, daß auch Bestandteil der Metallschicht ist. Außenkontaktelemente AK, die Substratschicht sowie die Kontaktelemente CK besitzen zusammen eine Dicke Dl in der Größenordnung 100 μm. Der Substratträger S, der als Basismaterial einen Kunststoff beispielsweise PEN, PET, PI oder SR4 verwendet, besitzt eine Schichtdicke von ca. 75 μm. Alternativ läßt sich dieser Substratträger auch durch Papier oder ein anderes biegsames Material realisieren.Drill through the substrate completely. On the first surface 01, the substrate S has external contact elements AK which consist of a metal layer. On the second surface 02, the substrate carrier contains chip contact elements CK, which are electrically connected through the through holes D to the external contact elements AK. The bushings D are completely filled with a metal that is also part of the metal layer. External contact elements AK, the substrate layer and the contact elements CK together have a thickness Dl in the order of 100 μm. The substrate carrier S, which uses a plastic such as PEN, PET, PI or SR4 as the base material, has a layer thickness of approximately 75 μm. Alternatively, this substrate carrier can also be realized using paper or another flexible material.

Die Kontaktschichten AK und CK sind aus einer dreikomponentigen Metallisierungsschicht aufgebaut. Zwei ca. 10 μm dicke Kupfer-Metallisierungsschichten sind mit den beiden Oberflächen des Substrats sowie direkt miteinander über die Durchführungslöcher D verbunden. Auf jede Kupferschicht wird eine ca. 2 μm dicke Nickelschicht aufgebracht. Zum Schutz vor Oxydation ist auf diesen Kontakten eine dünne Goldschicht aufgebracht, die typischerweise 0,05 μm bzw. als Flash-Schicht ausgebildet ist. Neben dieser AusfuhrungsVariante sind jedoch auch andere Metallschichten und auch Legierungen verwendbar, beispielsweise Palladium.The contact layers AK and CK are made up of a three-component metallization layer. Two approximately 10 μm thick copper metallization layers are connected to the two surfaces of the substrate and directly to one another via the through holes D. An approx. 2 μm thick nickel layer is applied to each copper layer. To protect against oxidation, a thin gold layer is applied to these contacts, which is typically 0.05 μm or a flash layer. In addition to this embodiment variant, however, other metal layers and alloys can also be used, for example palladium.

Durch Variation der Dicke läßt sich gegebenenfalls eine erhöhte Stabilität des Substratträgers erreichen. Die Abscheidung der Metalle erfolgt galvanisch. Durch dieseBy varying the thickness, increased stability of the substrate carrier can be achieved if necessary. The metals are deposited galvanically. Through this

Präparierung mit Metallschichten sehr geringer Dicke ist ein flexibler Substratträger mit großer Zuverlässigkeit in mechanisch, dynamischen Biegeprozessen realisiert.Preparation with metal layers of very small thickness is a flexible substrate carrier with great reliability in mechanical, dynamic bending processes.

Die Anordnung weist ferner einen Chip IC auf, dessen Kontakte mit den Chipkontaktelementen CK über die Bu ps B verbunden ist. Dazu ist die mit den Kontaktstellen versehene Seite des Chips IC der mit den Chipkontaktelementen CK versehenen Oberfläche 02 des Substratträgers S zugewandt und bildet somit einen Flip-Chip. Die Bumps B sind erhöhte Kontaktierungssteilen, die aus Metall bestehen, das einen unterschiedlichen Härtegrad gegenüber den Chipkontaktelemente CK aufweist. Beispielsweise kann das Chipkontaktelement CK aus einem weicheren Material als die Bumps B bestehen. Durch Ausübung eines Drucks beim Kontaktieren des Chips IC mit den Chipkontaktelementen CK werden somit die Bumps B leicht in die Chipkontaktelemente CK gedrückt . Dadurch ist ein inniger elektrischer Kontakt erreicht. Natürlich ist es ebenso möglich, für die Bumbs B und die Chipkontaktelemente CK die gleichen Metalle zu verwenden. Eine weitere alternative Ausgestaltung ist die Verwendung elektrischer Klebeverbindungen, wie Leitsilber, um die Kontaktierung zu verstärken.The arrangement also has a chip IC, the contacts of which are connected to the chip contact elements CK via the B ps B. For this purpose, the side of the chip IC provided with the contact points is that side provided with the chip contact elements CK Surface 02 of the substrate carrier S faces and thus forms a flip chip. The bumps B are raised contacting parts which consist of metal which has a different degree of hardness compared to the chip contact elements CK. For example, the chip contact element CK can be made of a softer material than the bumps B. By exerting a pressure when contacting the chip IC with the chip contact elements CK, the bumps B are thus easily pressed into the chip contact elements CK. This creates an intimate electrical contact. Of course, it is also possible to use the same metals for the bumbs B and the chip contact elements CK. Another alternative embodiment is the use of electrical adhesive connections, such as conductive silver, in order to strengthen the contact.

Zur Befestigung des Chips IC auf dem Substrat S ist ein Klebstoff G vorgesehen. Dieser kann beispielsweise ein Harz oder auch ein weicher Kunststoff sein. Es ist sinnvoll, den Klebstoff um die Chipkontaktelemente CK herum anzuordnen, um einerseits den elektrischen Kontakt zwischen Chip IC und Chipkontaktelement CK zu schützen und andererseits den Chip IC mit dem Substrat zu verbinden. Zur Erhöhung der Kontaktierungsfestigkeit können die Kontaktflächen wieder vorher mit Leitsilber oder einer ähnlichen Substanz bestrichen werden.An adhesive G is provided for attaching the chip IC to the substrate S. This can be, for example, a resin or a soft plastic. It makes sense to arrange the adhesive around the chip contact elements CK in order on the one hand to protect the electrical contact between the chip IC and the chip contact element CK and on the other hand to connect the chip IC to the substrate. To increase the contact strength, the contact surfaces can be coated with conductive silver or a similar substance beforehand.

Die Dicke D2 des in dieser Anordnung sogenannten Flip-Chips IC ist deutlich größer als die Dicke Dl der Summe des Substrats S, sowie der Kontaktelemente CK und AK. Dadurch ist auch bei einer mechanischen statischen Belastung die Zuverlässigkeit der Anordnung gegeben. Durch den direkten Kontakt des Chips IC mit den Chipkontaktelementen CK und den Verzicht auf zusätzliche Kontaktdrähte sind dadurch insgesamt dünnere Module fertigbar, ohne eine geringere Belastbarkeit in Kauf nehmen zu müssen.The thickness D2 of the so-called flip chip IC in this arrangement is significantly greater than the thickness D1 of the sum of the substrate S, and of the contact elements CK and AK. As a result, the reliability of the arrangement is given even with mechanical static loading. Through the direct contact of the chip IC with the chip contact elements CK and Eliminating the need for additional contact wires means that overall thinner modules can be manufactured without having to accept a lower load capacity.

Dadurch ist beispielsweise eine Datenträgerkarte herstellbar, die einen Kartenkörper mit einer Aussparung aufweist sowie die erfindungsgemäße Substratträgeranordnung. Der Substratträger ist dabei so in der Aussparung angeordnet, daß der auf ihm plazierte Chip in die Aussparung hinein reicht. Dadurch ist insgesamt eine dünnere Datenträgerkarte realisierbar. Dem ist hinzuzufügen, daß die Erfindung nicht auf die Anordnung mit einer Datenträgerkarte beschränkt ist. Kerngedanke ist vielmehr die Anordnung zwischen einem Träger und einem darauf befindlichen Chip, der so angeordnet ist, daß sich seine Kontakte auf der dem Träger zugewandten Seite befinden und wobei der Chip dabei immer eine größere Dicke als der Träger besitzt. This makes it possible, for example, to produce a data carrier card which has a card body with a recess and the substrate carrier arrangement according to the invention. The substrate carrier is arranged in the recess such that the chip placed on it extends into the recess. As a result, a thinner data carrier card can be implemented overall. It should be added that the invention is not limited to the arrangement with a data carrier card. The main idea is rather the arrangement between a carrier and a chip located thereon, which is arranged such that its contacts are on the side facing the carrier and the chip always has a greater thickness than the carrier.

Bezugszeichenliste :Reference symbol list:

(IC) :Chip(IC): chip

(CK) : Chipkontaktelemente (W) : Draht(CK): chip contact elements (W): wire

(G) : Klebemittel (S) : Substratträger (AK) :Außenkontaktelemente (B) : Bump (Dl) :Dicke des Substratträgers (D2) :Dicke des Chips (01,02) : Oberflächen (D) : Durchführungen (K) : Kontaktseite (G): Adhesive (S): Substrate carrier (AK): External contact elements (B): Bump (Dl): Thickness of the substrate carrier (D2): Thickness of the chip (01.02): Surfaces (D): Feedthroughs (K): Contact

Claims

Patentansprüche claims 1. Anordnung mit einem Substratträger (S) mit einer ersten Oberfläche (01) , auf der Außenkontaktelemente (AK) angebracht sind, einer zweiten gegenüberliegenden Oberfläche (02) , auf der Chipkontaktelemente (CK) angebracht sind, wobei die Kontaktelemente beider Oberflächen durch das Substrat (S) hindurch miteinander elektrisch verbunden sind (D) , und mit einem Chip (IC) , dessen mit Kontaktstellen (ß) versehene Seite (K) der zweiten Oberfläche zugewandt ist und mit den1. Arrangement with a substrate carrier (S) with a first surface (01) on the external contact elements (AK) are attached, a second opposite surface (02) on the chip contact elements (CK) are attached, the contact elements of both surfaces by the Substrate (S) are electrically connected to each other (D), and to a chip (IC), the side (K) of which is provided with contact points (.beta.) Facing the second surface and with the Chipkontaktelementen (CK) elektrisch verbunden ist, wobei dieChip contact elements (CK) is electrically connected, the Dicke (D2) des Chips größer als die Dicke des Substrats (S) ist, d a d u r c h g e k e n n z e i c h n e t , d a ß die Kontaktstellen (B) des Chips (IC) aus einem Metall ausgebildet sind, das einen zu den Chipkontaktelementen (CK) unterschiedlichen Härtegrad aufweist.Thickness (D2) of the chip is greater than the thickness of the substrate (S), so that the contact points (B) of the chip (IC) are made of a metal that has a different degree of hardness than the chip contact elements (CK). 2. Anordnung nach Anspruch 1 , d a d u r c h g e k e n n z e i c h n e t , d a ß die Dicke (D2) des Chip (IC) größer ist als die Summe der Dicken (Dl) aus Substrat (S) , den Außenkontaktelementen (AK) und den Chipkontaktelemente (CK) .2. Arrangement according to claim 1, d a d u r c h g e k e n n z e i c h n e t, that the thickness (D2) of the chip (IC) is greater than the sum of the thicknesses (Dl) of substrate (S), the external contact elements (AK) and the chip contact elements (CK). 3. Anordnung nach Anspruch 1 oder 2, d a d u r c h g e k e n n z e i c h n e t , d a ß der Substratträger (S) aus einem Kunststoff gebildet ist.3. Arrangement according to claim 1 or 2, d a d u r c h g e k e n n z e i c h n e t, d a ß the substrate carrier (S) is formed from a plastic. 4. Anordnung nach Anspruch 1 oder 2 , d a d u r c h g e k e n n z e i c h n e t , d a ß der Substratträger (S) aus Papier gebildet ist.4. Arrangement according to claim 1 or 2, d a d u r c h g e k e n n z e i c h n e t, d a ß the substrate carrier (S) is made of paper. 5. Anordnung nach einem der vorherigen Ansprüche, d a d u r c h g e k e n n z e i c h n e t , d a ß die Zwischenräume zwischen den Chipkontaktelementen (CK) und dem Chip (IC) mit einem elastischen Klebstoff (G) aufgefüllt sind, der den Chip (IC) mit dem Substratträger (S) innig verbindet .5. Arrangement according to one of the preceding claims, characterized in that the interstices between the chip contact elements (CK) and the chip (IC) are filled with an elastic adhesive (G) which intimately connects the chip (IC) to the substrate carrier (S). 6. Anordnung nach einem der Ansprüche 1 bis 5, d a d u r c h g e k e n n z e i c h n e t , d a ß die Kontaktstellen (B) des Chips (IC) mit einem elektrisch leitfähigen Klebstoff ausgebildet sind.6. Arrangement according to one of claims 1 to 5, d a d u r c h g e k e n n z e i c h n e t, that the contact points (B) of the chip (IC) are formed with an electrically conductive adhesive. 7. Anordnung nach einem der Ansprüche 1 bis 6, d a d u r c h g e k e n n z e i c h n e t , d a ß die Kontaktelemente aus einer Gold-Nickel-Kupfer Metallisierungsschicht ausgebildet sind, wobei Gold jeweils die oberste Teilschicht bildet.7. Arrangement according to one of claims 1 to 6, that the contact elements are formed from a gold-nickel-copper metallization layer, gold forming the uppermost partial layer. 8. Anordnung nach einem der Ansprüche 1 bis 7, g e k e n n z e i c h n e t d u r c h einen Kartenkörper, der eine Aussparung aufweist, in die der Substratträger so eingebracht ist, daß der Chip in die Aussparung hinein ragt. 8. Arrangement according to one of claims 1 to 7, g e k e n n z e i c h n e t d u r c h a card body having a recess into which the substrate carrier is introduced so that the chip protrudes into the recess.
PCT/DE2004/000504 2003-03-18 2004-03-12 Flip-chip arrangment on a substrate carrier Ceased WO2004084303A2 (en)

Applications Claiming Priority (2)

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DE10311965.5 2003-03-18
DE10311965A DE10311965A1 (en) 2003-03-18 2003-03-18 Flip-chip arrangement on a substrate carrier

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WO2004084303A3 WO2004084303A3 (en) 2004-12-23

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EP3062266B1 (en) * 2013-10-22 2020-10-14 Toppan Printing Co., Ltd. Ic module, ic card, and ic module substrate

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JPH07302858A (en) * 1994-04-28 1995-11-14 Toshiba Corp Semiconductor package
JPH0863567A (en) * 1994-08-19 1996-03-08 Citizen Watch Co Ltd Ic card module
FR2736452B1 (en) * 1995-07-05 1997-09-19 Solaic Sa METHOD FOR MANUFACTURING A SMART CARD COMPRISING A FIBROUS MATERIAL BODY, AND INTELLIGENT CARD THUS OBTAINED
FR2740935B1 (en) * 1995-11-03 1997-12-05 Schlumberger Ind Sa METHOD FOR MANUFACTURING AN ASSEMBLY OF ELECTRONIC MODULES FOR ELECTRONIC MEMORY CARDS
EP0905657B1 (en) * 1997-09-23 2003-05-28 STMicroelectronics S.r.l. Currency note comprising an integrated circuit
FR2773642B1 (en) * 1998-01-13 2000-03-03 Schlumberger Ind Sa METHOD FOR CONNECTING PLOTS OF A COMPONENT WITH INTEGRATED CIRCUITS TO CONNECTING RANGES OF A PLASTIC SUBSTRATE BY MEANS OF PROTUBERANCES
EP1256982A1 (en) * 2001-05-11 2002-11-13 Valtronic S.A. Electronic Module and its Assembling Process
DE10139395A1 (en) * 2001-08-10 2003-03-06 Infineon Technologies Ag Contacting of semiconductor chips in chip cards
DE10145752B4 (en) * 2001-09-17 2004-09-02 Infineon Technologies Ag Non-conductive, ribbon or sheet substrate on which a plurality of carrier elements are formed

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