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WO2004068533A3 - Verfahren zur herstellung einer elektronischen baugruppe - Google Patents

Verfahren zur herstellung einer elektronischen baugruppe Download PDF

Info

Publication number
WO2004068533A3
WO2004068533A3 PCT/DE2004/000063 DE2004000063W WO2004068533A3 WO 2004068533 A3 WO2004068533 A3 WO 2004068533A3 DE 2004000063 W DE2004000063 W DE 2004000063W WO 2004068533 A3 WO2004068533 A3 WO 2004068533A3
Authority
WO
WIPO (PCT)
Prior art keywords
producing
electronic module
conductor structure
circuit board
strip conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2004/000063
Other languages
English (en)
French (fr)
Other versions
WO2004068533A2 (de
Inventor
Udo Wozar
Heinz Helmut
Sybill Koenig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aumovio Microelectronic GmbH
Original Assignee
Conti Temic Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic GmbH filed Critical Conti Temic Microelectronic GmbH
Priority to DE112004000039T priority Critical patent/DE112004000039D2/de
Publication of WO2004068533A2 publication Critical patent/WO2004068533A2/de
Publication of WO2004068533A3 publication Critical patent/WO2004068533A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/092—Particle beam, e.g. using an electron beam or an ion beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

Die Erfindung betrifft eine Verfahren zur Herstellung einer elektronischen Baugruppe (1) mit einer eine Leiterbahnstruktur (22) aufweisenden Leiterplatte (2) und mit einer eine Leiterbahnstruktur (32) aufweisenden Leiterfolie (3). Um den Verbindungsprozess zu vereinfachen, wird mindestens eine die Leiterbahnstruktur (22) der Leiterplatte (2) und die Leiterbahnstruktur (32) der Leiterfolie (3) kontaktierende Kontaktstelle (24) durch Löten mittels eines Bearbeitungsstrahls (6) durch die Leiterplatte (2) hindurch erzeugt.
PCT/DE2004/000063 2003-01-24 2004-01-17 Verfahren zur herstellung einer elektronischen baugruppe Ceased WO2004068533A2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE112004000039T DE112004000039D2 (de) 2003-01-24 2004-01-17 Verfahren zur Herstellung einer elektronischen Baugruppe

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10302923.0 2003-01-24
DE2003102923 DE10302923A1 (de) 2003-01-24 2003-01-24 Elektronische Baugruppen

Publications (2)

Publication Number Publication Date
WO2004068533A2 WO2004068533A2 (de) 2004-08-12
WO2004068533A3 true WO2004068533A3 (de) 2004-10-07

Family

ID=32602944

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2004/000063 Ceased WO2004068533A2 (de) 2003-01-24 2004-01-17 Verfahren zur herstellung einer elektronischen baugruppe

Country Status (2)

Country Link
DE (2) DE10302923A1 (de)
WO (1) WO2004068533A2 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006053312A1 (de) * 2006-11-13 2008-06-19 Robert Bosch Gmbh Elektronische Schaltungsanordnung mit mindestens einer flexiblen gedruckten Schaltung und Verfahren zu deren Verbindung mit einer zweiten Schaltung

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19832062A1 (de) * 1998-07-16 2000-01-27 Siemens Ag Steuergerät für ein Kraftfahrzeug
US6284998B1 (en) * 1998-06-12 2001-09-04 Visteon Global Technologies, Inc. Method for laser soldering a three dimensional component
EP1164661A2 (de) * 2000-06-13 2001-12-19 Yazaki Corporation Verbindungsstruktur für eine flache Schaltungseinheit
EP1256408A1 (de) * 2001-03-28 2002-11-13 Visteon Global Technologies, Inc. Lötenverfahren für Verbindung von Flexleiterplatten mit einem Diodelaser
DE10224266A1 (de) * 2002-05-31 2003-12-11 Conti Temic Microelectronic Elektronische Baugruppe

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3500411C2 (de) * 1985-01-08 1994-03-31 Siemens Ag Verfahren zum Lötverbinden der Leiterbahnen einer flexiblen gedruckten Leitung oder Schaltung mit den Anschlußflächen einer Leiterplatte
JPH09139559A (ja) * 1995-11-13 1997-05-27 Minolta Co Ltd 回路基板の接続構造
US6093894A (en) * 1997-05-06 2000-07-25 International Business Machines Corporation Multiconductor bonded connection assembly with direct thermal compression bonding through a base layer

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6284998B1 (en) * 1998-06-12 2001-09-04 Visteon Global Technologies, Inc. Method for laser soldering a three dimensional component
DE19832062A1 (de) * 1998-07-16 2000-01-27 Siemens Ag Steuergerät für ein Kraftfahrzeug
EP1164661A2 (de) * 2000-06-13 2001-12-19 Yazaki Corporation Verbindungsstruktur für eine flache Schaltungseinheit
EP1256408A1 (de) * 2001-03-28 2002-11-13 Visteon Global Technologies, Inc. Lötenverfahren für Verbindung von Flexleiterplatten mit einem Diodelaser
DE10224266A1 (de) * 2002-05-31 2003-12-11 Conti Temic Microelectronic Elektronische Baugruppe

Also Published As

Publication number Publication date
DE10302923A1 (de) 2004-07-29
WO2004068533A2 (de) 2004-08-12
DE112004000039D2 (de) 2005-06-30

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