WO2003030221A3 - Verfahren zur herstellung eines halbleiterbauelements auf der basis eines nitrid-verbindungshalbleiters - Google Patents
Verfahren zur herstellung eines halbleiterbauelements auf der basis eines nitrid-verbindungshalbleiters Download PDFInfo
- Publication number
- WO2003030221A3 WO2003030221A3 PCT/DE2002/003667 DE0203667W WO03030221A3 WO 2003030221 A3 WO2003030221 A3 WO 2003030221A3 DE 0203667 W DE0203667 W DE 0203667W WO 03030221 A3 WO03030221 A3 WO 03030221A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- nitride compound
- production
- compound semiconductor
- based semiconductor
- semiconductor component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/223—Buried stripe structure
- H01S5/2231—Buried stripe structure with inner confining structure only between the active layer and the upper electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2054—Methods of obtaining the confinement
- H01S5/2081—Methods of obtaining the confinement using special etching techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
- H01S5/32341—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP02781114A EP1430519A2 (de) | 2001-09-27 | 2002-09-27 | Verfahren zur herstellung eines halbleiterbauelements auf der basis eines nitrid-verbindungshalbleiters |
| JP2003533322A JP2005505133A (ja) | 2001-09-27 | 2002-09-27 | 窒化物−化合物半導体をベースとする半導体デバイスの製造方法 |
| US10/813,530 US20040185599A1 (en) | 2001-09-27 | 2004-03-29 | Method for fabricating a semiconductor component based on a nitride compound semiconductor |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10147791.0 | 2001-09-27 | ||
| DE10147791A DE10147791A1 (de) | 2001-09-27 | 2001-09-27 | Verfahren zur Herstellung eines Halbleiterbauelements auf der Basis eines Nitrid-Verbindungshalbleiters |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US10/813,530 Continuation US20040185599A1 (en) | 2001-09-27 | 2004-03-29 | Method for fabricating a semiconductor component based on a nitride compound semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2003030221A2 WO2003030221A2 (de) | 2003-04-10 |
| WO2003030221A3 true WO2003030221A3 (de) | 2003-11-06 |
Family
ID=7700570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/DE2002/003667 Ceased WO2003030221A2 (de) | 2001-09-27 | 2002-09-27 | Verfahren zur herstellung eines halbleiterbauelements auf der basis eines nitrid-verbindungshalbleiters |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20040185599A1 (de) |
| EP (1) | EP1430519A2 (de) |
| JP (1) | JP2005505133A (de) |
| DE (1) | DE10147791A1 (de) |
| TW (1) | TW589682B (de) |
| WO (1) | WO2003030221A2 (de) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10312214B4 (de) * | 2003-03-19 | 2008-11-20 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen von mindestens einer Mesa- oder Stegstruktur oder von mindestens einem elektrisch gepumpten Bereich in einer Schicht oder Schichtenfolge |
| DE102004037868A1 (de) * | 2004-04-30 | 2005-11-24 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes und/oder -empfangendes Halbleiterbauelement und Verfahren zur strukturierten Aufbringung eines Kontakts auf einen Halbleiterkörper |
| DE102010024079B4 (de) | 2010-06-17 | 2025-08-28 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip |
| JP6158468B2 (ja) * | 2011-11-08 | 2017-07-05 | 富士電機株式会社 | 半導体装置の故障位置解析方法及び装置 |
| DE102012111512B4 (de) * | 2012-11-28 | 2021-11-04 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterstreifenlaser |
| DE102013207258A1 (de) | 2013-04-22 | 2014-10-23 | Osram Opto Semiconductors Gmbh | Halbleiterlaser |
| DE102014101896A1 (de) * | 2014-02-14 | 2015-08-20 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils sowie optoelektronisches Halbleiterbauteil |
| DE102016125857B4 (de) | 2016-12-29 | 2022-05-05 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterlaserdiode |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0542479A1 (de) * | 1991-11-15 | 1993-05-19 | AT&T Corp. | Verfahren zur Herstellung eines Halbleiterlasers |
| EP0665579A1 (de) * | 1994-01-03 | 1995-08-02 | AT&T Corp. | Verfahren zur Herstellung eines Mehrschichtgitters mit geringerer Höhe |
| US5804839A (en) * | 1995-12-28 | 1998-09-08 | Sharp Kabushiki Kaisha | III-V nitride compound semiconductor device and method for fabricating the same |
| US6008539A (en) * | 1995-06-16 | 1999-12-28 | Toyoda Gosei Co., Ltd. | Electrodes for p-type group III nitride compound semiconductors |
| JP2000091696A (ja) * | 1998-09-14 | 2000-03-31 | Sanyo Electric Co Ltd | 半導体素子、半導体発光素子およびその製造方法 |
| US6078064A (en) * | 1998-05-04 | 2000-06-20 | Epistar Co. | Indium gallium nitride light emitting diode |
| EP1052705A1 (de) * | 1999-05-10 | 2000-11-15 | Pioneer Corporation | Verfahren zur Herstellung einer Halbleitervorrichtung aus einer Nitridverbindung der Gruppe III |
| US6291839B1 (en) * | 1998-09-11 | 2001-09-18 | Lulileds Lighting, U.S. Llc | Light emitting device having a finely-patterned reflective contact |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63164484A (ja) * | 1986-12-26 | 1988-07-07 | Sharp Corp | 半導体レ−ザ素子 |
| DE4107006A1 (de) * | 1991-03-05 | 1992-09-10 | Siemens Ag | Verfahren zum anisotropen trockenaetzen von aluminium bzw. aluminiumlegierungen enthaltenden leiterbahnebenen in integrierten halbleiterschaltungen |
| US5838029A (en) * | 1994-08-22 | 1998-11-17 | Rohm Co., Ltd. | GaN-type light emitting device formed on a silicon substrate |
| US6083841A (en) * | 1997-05-15 | 2000-07-04 | Rohm Co., Ltd. | Method of etching gallium-nitride based compound semiconductor layer and method of manufacturing semiconductor light emitting device utilizing the same |
| JP3462720B2 (ja) * | 1997-07-16 | 2003-11-05 | 三洋電機株式会社 | n型窒化物半導体の電極及び前記電極を有する半導体素子並びにその製造方法 |
| EP1090418B1 (de) * | 1998-05-26 | 2008-07-09 | Infineon Technologies AG | Verfahren zur herstellung von schottky-dioden |
| JP2000133783A (ja) * | 1998-10-23 | 2000-05-12 | Hitachi Ltd | 半導体集積回路装置の製造方法および半導体集積回路装置 |
| JP3781246B2 (ja) * | 1998-12-22 | 2006-05-31 | パイオニア株式会社 | 半導体レーザ及びその製造方法 |
| KR100316721B1 (ko) * | 2000-01-29 | 2001-12-12 | 윤종용 | 실리사이드막을 구비한 반도체소자의 제조방법 |
| JP2002016034A (ja) * | 2000-06-30 | 2002-01-18 | Mitsubishi Electric Corp | 半導体装置の製造方法、及び半導体装置 |
| JP2002075965A (ja) * | 2000-08-25 | 2002-03-15 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体素子 |
| US6379985B1 (en) * | 2001-08-01 | 2002-04-30 | Xerox Corporation | Methods for cleaving facets in III-V nitrides grown on c-face sapphire substrates |
-
2001
- 2001-09-27 DE DE10147791A patent/DE10147791A1/de not_active Withdrawn
-
2002
- 2002-09-19 TW TW091121444A patent/TW589682B/zh not_active IP Right Cessation
- 2002-09-27 EP EP02781114A patent/EP1430519A2/de not_active Withdrawn
- 2002-09-27 JP JP2003533322A patent/JP2005505133A/ja active Pending
- 2002-09-27 WO PCT/DE2002/003667 patent/WO2003030221A2/de not_active Ceased
-
2004
- 2004-03-29 US US10/813,530 patent/US20040185599A1/en not_active Abandoned
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0542479A1 (de) * | 1991-11-15 | 1993-05-19 | AT&T Corp. | Verfahren zur Herstellung eines Halbleiterlasers |
| EP0665579A1 (de) * | 1994-01-03 | 1995-08-02 | AT&T Corp. | Verfahren zur Herstellung eines Mehrschichtgitters mit geringerer Höhe |
| US6008539A (en) * | 1995-06-16 | 1999-12-28 | Toyoda Gosei Co., Ltd. | Electrodes for p-type group III nitride compound semiconductors |
| US5804839A (en) * | 1995-12-28 | 1998-09-08 | Sharp Kabushiki Kaisha | III-V nitride compound semiconductor device and method for fabricating the same |
| US6078064A (en) * | 1998-05-04 | 2000-06-20 | Epistar Co. | Indium gallium nitride light emitting diode |
| US6291839B1 (en) * | 1998-09-11 | 2001-09-18 | Lulileds Lighting, U.S. Llc | Light emitting device having a finely-patterned reflective contact |
| JP2000091696A (ja) * | 1998-09-14 | 2000-03-31 | Sanyo Electric Co Ltd | 半導体素子、半導体発光素子およびその製造方法 |
| EP1052705A1 (de) * | 1999-05-10 | 2000-11-15 | Pioneer Corporation | Verfahren zur Herstellung einer Halbleitervorrichtung aus einer Nitridverbindung der Gruppe III |
Non-Patent Citations (1)
| Title |
|---|
| PATENT ABSTRACTS OF JAPAN vol. 2000, no. 06 22 September 2000 (2000-09-22) * |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005505133A (ja) | 2005-02-17 |
| DE10147791A1 (de) | 2003-04-10 |
| TW589682B (en) | 2004-06-01 |
| US20040185599A1 (en) | 2004-09-23 |
| WO2003030221A2 (de) | 2003-04-10 |
| EP1430519A2 (de) | 2004-06-23 |
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