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WO2003030272A3 - Procede d'encapsulation de dispositifs electroniques - Google Patents

Procede d'encapsulation de dispositifs electroniques Download PDF

Info

Publication number
WO2003030272A3
WO2003030272A3 PCT/EP2002/010963 EP0210963W WO03030272A3 WO 2003030272 A3 WO2003030272 A3 WO 2003030272A3 EP 0210963 W EP0210963 W EP 0210963W WO 03030272 A3 WO03030272 A3 WO 03030272A3
Authority
WO
WIPO (PCT)
Prior art keywords
sealing
encapsulation
dam
cap
oled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2002/010963
Other languages
English (en)
Other versions
WO2003030272A2 (fr
Inventor
Ewald Karl Michael Guenther
Soo Jin Chua
Mark Dai Joong Auch
Lim Shuang Fang
Bee Ling Low
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Institute of Materials Research and Engineering
Original Assignee
Osram Opto Semiconductors GmbH
Institute of Materials Research and Engineering
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/968,167 external-priority patent/US8344360B2/en
Application filed by Osram Opto Semiconductors GmbH, Institute of Materials Research and Engineering filed Critical Osram Opto Semiconductors GmbH
Priority to EP02772353A priority Critical patent/EP1430550A2/fr
Priority to JP2003533357A priority patent/JP2005505114A/ja
Publication of WO2003030272A2 publication Critical patent/WO2003030272A2/fr
Publication of WO2003030272A3 publication Critical patent/WO2003030272A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

Landscapes

  • Electroluminescent Light Sources (AREA)
  • Sealing Material Composition (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

L'invention concerne un boîtier pour un dispositif à diode électroluminescente organique (OLED). Ce boîtier comprend un barrage de scellement qui entoure la région cellulaire du dispositif à diode électroluminescente organique afin de supporter un capuchon. Des particules d'espacement sont situées de façon aléatoire dans la région cellulaire afin d'éviter que le capuchon n'entre en contact avec les composants actifs et de protéger ainsi ces derniers contre des dégâts éventuels. Le barrage de scellement forme, entre le bord du capuchon et le barrage, une région de scellement dans laquelle un adhésif est appliqué afin de sceller le dispositif à diode électroluminescente organique. L'avantage d'utiliser un barrage de scellement réside dans le fait qu'il permet d'obtenir des dispositifs à diode électroluminescente organique présentant des largeurs de scellement réduites.
PCT/EP2002/010963 1999-12-17 2002-09-30 Procede d'encapsulation de dispositifs electroniques Ceased WO2003030272A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP02772353A EP1430550A2 (fr) 1999-12-17 2002-09-30 Procede d'encapsulation de dispositifs electroniques
JP2003533357A JP2005505114A (ja) 1999-12-17 2002-09-30 電子装置のカプセル化のための方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/968,167 US8344360B2 (en) 1999-12-17 1999-12-17 Organic electronic devices with an encapsulation
US09/968,167 2001-09-28

Publications (2)

Publication Number Publication Date
WO2003030272A2 WO2003030272A2 (fr) 2003-04-10
WO2003030272A3 true WO2003030272A3 (fr) 2003-07-17

Family

ID=25513845

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2002/010963 Ceased WO2003030272A2 (fr) 1999-12-17 2002-09-30 Procede d'encapsulation de dispositifs electroniques

Country Status (5)

Country Link
EP (1) EP1430550A2 (fr)
JP (2) JP2005505114A (fr)
CN (1) CN100530755C (fr)
TW (1) TWI222839B (fr)
WO (1) WO2003030272A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11075357B2 (en) 2012-03-16 2021-07-27 Universal Display Corporation Edge barrier film for electronic devices

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1240808B1 (fr) 1999-12-17 2003-05-21 Osram Opto Semiconductors GmbH Encapsulation d'une del organique
US7394153B2 (en) 1999-12-17 2008-07-01 Osram Opto Semiconductors Gmbh Encapsulation of electronic devices
TWI222839B (en) * 1999-12-17 2004-10-21 Osram Opto Semiconductors Gmbh Method for encapsulation of electronic devices
US7184202B2 (en) * 2004-09-27 2007-02-27 Idc, Llc Method and system for packaging a MEMS device
DE102004049955B4 (de) * 2004-10-13 2008-12-04 Schott Ag Verfahren zur Herstellung eines optischen Bauelements, insbesondere einer OLED
KR100796618B1 (ko) 2007-01-04 2008-01-22 삼성에스디아이 주식회사 유기전계발광표시장치 및 그의 제조방법
KR100924137B1 (ko) 2008-01-31 2009-10-29 삼성모바일디스플레이주식회사 유기전계발광표시장치 및 그의 제조방법
KR101589754B1 (ko) * 2009-10-13 2016-01-28 엘지디스플레이 주식회사 유기전계발광표시장치와 이의 제조방법
CN101859880B (zh) * 2010-05-06 2012-10-03 友达光电股份有限公司 电致发光显示装置及其制备方法
KR20120138307A (ko) 2011-06-14 2012-12-26 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
CN104505469B (zh) * 2015-01-04 2017-04-05 京东方科技集团股份有限公司 一种有机发光二极管显示基板及其封装方法
TWI569370B (zh) * 2015-02-25 2017-02-01 群創光電股份有限公司 顯示裝置及其製造方法
CN105990373B (zh) * 2015-02-25 2019-04-12 群创光电股份有限公司 显示装置及其制造方法
CN110112323B (zh) * 2019-06-14 2022-05-13 京东方科技集团股份有限公司 一种oled封装结构、封装方法及显示器件
CN112037656B (zh) 2020-09-11 2022-06-21 京东方科技集团股份有限公司 一种显示装置和显示装置的绑定检测方法
US20240407229A1 (en) * 2021-12-20 2024-12-05 Sharp Display Technology Corporation Display device
CN117202726B (zh) * 2023-09-13 2024-10-01 绵阳惠科光电科技有限公司 显示面板及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000069002A1 (fr) * 1999-05-11 2000-11-16 The Dow Chemical Company Dispositif electroluminescent ou a cellules photoelectriques, a conditionnement protecteur
WO2001045140A2 (fr) * 1999-12-17 2001-06-21 Osram Opto Semiconductors Gmbh Encapsulation d'une del organique
WO2001044866A1 (fr) * 1999-12-17 2001-06-21 Osram Opto Semiconductors Gmbh Dispositif perfectionne a diodes electroluminescentes
WO2002021557A1 (fr) * 2000-09-06 2002-03-14 Osram Opto Semiconductors Gmbh Encapsulation pour dispositifs a diode electroluminescente organique

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61234161A (ja) * 1985-04-10 1986-10-18 Matsushita Electric Ind Co Ltd 密着型イメ−ジセンサ
JPS62188092U (fr) * 1986-05-21 1987-11-30
JP4114895B2 (ja) * 1998-07-08 2008-07-09 Ｔｄｋ株式会社 有機ｅｌ表示装置
JP2000040586A (ja) * 1998-07-21 2000-02-08 Tdk Corp 有機ｅｌ素子モジュール
JP4246830B2 (ja) * 1999-01-14 2009-04-02 Ｔｄｋ株式会社 有機ｅｌ素子
TWI222839B (en) * 1999-12-17 2004-10-21 Osram Opto Semiconductors Gmbh Method for encapsulation of electronic devices
EP1242849B1 (fr) * 1999-12-17 2007-02-21 Osram Opto Semiconductors GmbH Encapsulation perfectionnee de dispositif a d.e.l. organique

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000069002A1 (fr) * 1999-05-11 2000-11-16 The Dow Chemical Company Dispositif electroluminescent ou a cellules photoelectriques, a conditionnement protecteur
WO2001045140A2 (fr) * 1999-12-17 2001-06-21 Osram Opto Semiconductors Gmbh Encapsulation d'une del organique
WO2001044866A1 (fr) * 1999-12-17 2001-06-21 Osram Opto Semiconductors Gmbh Dispositif perfectionne a diodes electroluminescentes
WO2002021557A1 (fr) * 2000-09-06 2002-03-14 Osram Opto Semiconductors Gmbh Encapsulation pour dispositifs a diode electroluminescente organique

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11075357B2 (en) 2012-03-16 2021-07-27 Universal Display Corporation Edge barrier film for electronic devices

Also Published As

Publication number Publication date
WO2003030272A2 (fr) 2003-04-10
TWI222839B (en) 2004-10-21
CN1557028A (zh) 2004-12-22
JP2010027624A (ja) 2010-02-04
CN100530755C (zh) 2009-08-19
JP2005505114A (ja) 2005-02-17
EP1430550A2 (fr) 2004-06-23

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