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WO2003019679A1 - Light emitting device using led - Google Patents

Light emitting device using led Download PDF

Info

Publication number
WO2003019679A1
WO2003019679A1 PCT/JP2002/008697 JP0208697W WO03019679A1 WO 2003019679 A1 WO2003019679 A1 WO 2003019679A1 JP 0208697 W JP0208697 W JP 0208697W WO 03019679 A1 WO03019679 A1 WO 03019679A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal plate
led chip
light emitting
led
projection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2002/008697
Other languages
English (en)
French (fr)
Inventor
Takuma Hashimoto
Masaru Sugimoto
Hideyoshi Kimura
Eiji Shiohama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26621159&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2003019679(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to US10/466,114 priority Critical patent/US6930332B2/en
Priority to EP02762899A priority patent/EP1439584B1/en
Priority to HK04101926.3A priority patent/HK1059148B/xx
Publication of WO2003019679A1 publication Critical patent/WO2003019679A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
PCT/JP2002/008697 2001-08-28 2002-08-28 Light emitting device using led Ceased WO2003019679A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US10/466,114 US6930332B2 (en) 2001-08-28 2002-08-28 Light emitting device using LED
EP02762899A EP1439584B1 (en) 2001-08-28 2002-08-28 Light emitting device using led
HK04101926.3A HK1059148B (en) 2001-08-28 2002-08-28 Light emitting device using led

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2001-258680 2001-08-28
JP2001258680 2001-08-28
JP2001-340832 2001-11-06
JP2001340832A JP4045781B2 (ja) 2001-08-28 2001-11-06 発光装置

Publications (1)

Publication Number Publication Date
WO2003019679A1 true WO2003019679A1 (en) 2003-03-06

Family

ID=26621159

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/008697 Ceased WO2003019679A1 (en) 2001-08-28 2002-08-28 Light emitting device using led

Country Status (6)

Country Link
US (1) US6930332B2 (ja)
EP (1) EP1439584B1 (ja)
JP (1) JP4045781B2 (ja)
CN (1) CN1220285C (ja)
TW (1) TW556364B (ja)
WO (1) WO2003019679A1 (ja)

Cited By (11)

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WO2005048358A1 (de) * 2003-11-07 2005-05-26 Tridonic Optoelectronics Gmbh Leuchtdioden-anordnung mit wärmeabführender platine
WO2005099323A2 (de) 2004-04-07 2005-10-20 P.M.C. Projekt Management Consult Gmbh Leuchtdiodenanordnung und verfahren zum herstellen einer leuchtdiodenanordnung
CN1293524C (zh) * 2004-09-16 2007-01-03 新灯源科技有限公司 具高效率散热结构的发光装置
US7253447B2 (en) 2003-02-28 2007-08-07 Citizen Electronics Co., Ltd. Light emitting element and light emitting device with the light emitting element and method for manufacturing the light emitting element
CN100382345C (zh) * 2004-01-05 2008-04-16 株式会社东芝 光半导体装置
EP1521313A3 (en) * 2003-10-03 2010-12-29 Philips Lumileds Lighting Company LLC Integrated reflector cup for a light emitting device mount
DE102004044149B4 (de) * 2003-10-09 2011-02-17 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Hochleistungs-Leuchtdiodenvorrichtung
US8070316B2 (en) 2005-12-22 2011-12-06 Panasonic Electric Works Co., Ltd. Lighting apparatus with LEDs
US8975646B2 (en) 2004-05-31 2015-03-10 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor component and housing base for such a component
WO2022260174A1 (ja) * 2021-06-11 2022-12-15 シチズン電子株式会社 発光装置

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EP1439584B1 (en) 2012-01-18
CN1466782A (zh) 2004-01-07
JP4045781B2 (ja) 2008-02-13
TW556364B (en) 2003-10-01
EP1439584A4 (en) 2006-07-19
EP1439584A1 (en) 2004-07-21
US20040065894A1 (en) 2004-04-08
JP2003152225A (ja) 2003-05-23

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