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WO2003017365B1 - Dispositifs de transfert thermique - Google Patents

Dispositifs de transfert thermique

Info

Publication number
WO2003017365B1
WO2003017365B1 PCT/US2001/025769 US0125769W WO03017365B1 WO 2003017365 B1 WO2003017365 B1 WO 2003017365B1 US 0125769 W US0125769 W US 0125769W WO 03017365 B1 WO03017365 B1 WO 03017365B1
Authority
WO
WIPO (PCT)
Prior art keywords
thermal transfer
transfer device
housing
carbon fibers
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2001/025769
Other languages
English (en)
Other versions
WO2003017365A2 (fr
WO2003017365A3 (fr
Inventor
James Patrick Flint
Nancy F Dean
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Priority to AU2001285013A priority Critical patent/AU2001285013A1/en
Priority to PCT/US2001/025769 priority patent/WO2003017365A2/fr
Priority to TW090125549A priority patent/TW502102B/zh
Publication of WO2003017365A2 publication Critical patent/WO2003017365A2/fr
Publication of WO2003017365A3 publication Critical patent/WO2003017365A3/fr
Anticipated expiration legal-status Critical
Publication of WO2003017365B1 publication Critical patent/WO2003017365B1/fr
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/06—Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

L'invention porte sur un dispositif de transfert thermique comportant un boîtier comportant au moins une partie de chambre isolée de l'atmosphère, et remplie d'un fluide de travail. Le boîtier peut être fait d'une composition comprenant une matrice à base de polymère dans laquelle est dispersée une charge thermoconductrice qui confère au boîtier une conductivité thermique d'au moins environ 10 W/mK. Le dispositif peur comporter une mèche de fibres tissées de carbone.
PCT/US2001/025769 2001-08-17 2001-08-17 Dispositifs de transfert thermique Ceased WO2003017365A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AU2001285013A AU2001285013A1 (en) 2001-08-17 2001-08-17 Thermal transfer devices using heat pipes
PCT/US2001/025769 WO2003017365A2 (fr) 2001-08-17 2001-08-17 Dispositifs de transfert thermique
TW090125549A TW502102B (en) 2001-08-17 2001-10-16 Thermal transfer devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2001/025769 WO2003017365A2 (fr) 2001-08-17 2001-08-17 Dispositifs de transfert thermique

Publications (3)

Publication Number Publication Date
WO2003017365A2 WO2003017365A2 (fr) 2003-02-27
WO2003017365A3 WO2003017365A3 (fr) 2003-09-04
WO2003017365B1 true WO2003017365B1 (fr) 2004-04-22

Family

ID=21742783

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/025769 Ceased WO2003017365A2 (fr) 2001-08-17 2001-08-17 Dispositifs de transfert thermique

Country Status (3)

Country Link
AU (1) AU2001285013A1 (fr)
TW (1) TW502102B (fr)
WO (1) WO2003017365A2 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7027304B2 (en) * 2001-02-15 2006-04-11 Integral Technologies, Inc. Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials
US7591302B1 (en) 2003-07-23 2009-09-22 Cooligy Inc. Pump and fan control concepts in a cooling system
FR2860368B1 (fr) * 2003-09-25 2007-07-27 Omwave Sas Appareil central de gestion de fonctions audio, video, et pc
US7913719B2 (en) 2006-01-30 2011-03-29 Cooligy Inc. Tape-wrapped multilayer tubing and methods for making the same
US8157001B2 (en) 2006-03-30 2012-04-17 Cooligy Inc. Integrated liquid to air conduction module
TW200912621A (en) 2007-08-07 2009-03-16 Cooligy Inc Method and apparatus for providing a supplemental cooling to server racks
US20090225514A1 (en) 2008-03-10 2009-09-10 Adrian Correa Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
US9297571B1 (en) 2008-03-10 2016-03-29 Liebert Corporation Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
TWI548852B (zh) * 2012-01-19 2016-09-11 建準電機工業股份有限公司 導熱塑膠所製成的散熱裝置與其製造方法
CN103292629A (zh) * 2012-03-01 2013-09-11 欧司朗股份有限公司 热管及其制造方法
EP2713132A1 (fr) * 2012-09-26 2014-04-02 Alcatel Lucent Appareil de transfert de chaleur par évaporation
CN106793670A (zh) * 2015-11-24 2017-05-31 吴江市旭威电子科技有限公司 电子元件散热装置
EP4114159A1 (fr) * 2021-06-29 2023-01-04 Siemens Aktiengesellschaft Dispositif de dissipation thermique des composants microélectroniques disposés dans un boîtier électronique

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1986004982A1 (fr) * 1985-02-21 1986-08-28 Fujikura Ltd. Conduite thermique
JPS63254755A (ja) * 1987-04-10 1988-10-21 Mitsubishi Electric Corp 電子素子体の冷却装置の製造方法
JPH06102870B2 (ja) * 1987-06-16 1994-12-14 竹本油脂株式会社 炭素繊維用サイジング剤
US5076352A (en) * 1991-02-08 1991-12-31 Thermacore, Inc. High permeability heat pipe wick structure
JP2001523892A (ja) * 1997-11-13 2001-11-27 ビーピー・アモコ・コーポレーション 熱管理デバイス

Also Published As

Publication number Publication date
TW502102B (en) 2002-09-11
WO2003017365A2 (fr) 2003-02-27
AU2001285013A1 (en) 2003-03-03
WO2003017365A3 (fr) 2003-09-04

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