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WO2003017365B1 - Thermal transfer devices using heat pipes - Google Patents

Thermal transfer devices using heat pipes

Info

Publication number
WO2003017365B1
WO2003017365B1 PCT/US2001/025769 US0125769W WO03017365B1 WO 2003017365 B1 WO2003017365 B1 WO 2003017365B1 US 0125769 W US0125769 W US 0125769W WO 03017365 B1 WO03017365 B1 WO 03017365B1
Authority
WO
WIPO (PCT)
Prior art keywords
thermal transfer
transfer device
housing
carbon fibers
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2001/025769
Other languages
French (fr)
Other versions
WO2003017365A2 (en
WO2003017365A3 (en
Inventor
James Patrick Flint
Nancy F Dean
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Priority to AU2001285013A priority Critical patent/AU2001285013A1/en
Priority to PCT/US2001/025769 priority patent/WO2003017365A2/en
Priority to TW090125549A priority patent/TW502102B/en
Publication of WO2003017365A2 publication Critical patent/WO2003017365A2/en
Publication of WO2003017365A3 publication Critical patent/WO2003017365A3/en
Anticipated expiration legal-status Critical
Publication of WO2003017365B1 publication Critical patent/WO2003017365B1/en
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/06—Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The invention includes a thermal transfer device. The device includes a housing which defines at least part of chamber sealed from the atmosphere, and a working fluid contained within the chamber. The housing can be formed of a composition which includes a polymer base matrix having a thermally conductive filler material dispersed therein. The housing can have a thermal conductivity of at least about 10 W/mK. The device can include a wick comprising woven carbon fibers.

Claims

AMENDED CLAIMS[received by the International Bureau on 23 April 2003 (23.04.2003); original claims 1-42 replaced by amended claims 1-18 (4 pages)]
1. A thermal transfer device, comprising a housing, said housing being formed of a composition which includes a polymer base matrix having thermally conductive filler material dispersed therein, the housing defining at least a portion of a chamber, the chamber being sealed from the atmosphere; a wick within the chamber; and a working fluid contained within the chamber.
2. The thermal transfer device of claim 1 wherein the wick comprises carbon fibers.
3. The thermal transfer device of claim 1 wherein the wick comprises a fabric of carbon fibers.
4. The thermal transfer device of claim 1 wherein said composition has a thermal conductivity of at least about 10W/mK.
The thermal transfer device of claim 1 wherein the housing composition polymer base matrix comprises polypropylene, and wherein the thermally conductive filler material comprises carbon fibers.
6. The thermal transfer device of claim 1 wherein the housing composition polymer base matrix comprises polyphenylene sulfide, and wherein the thermally conductive filler material comprises carbon fibers.
7. The thermal transfer device of claim 1 wherein the housing composition polymer base matrix comprises liquid crystal polymer, and wherein the thermally conductive filler material comprises carbon fibers.
8. The thermal transfer device of claim 1 further comprising a plurality of cooling fins in unitary construction with at least a portion of the housing.
The thermal transfer device of claim 1 wherein the housing defines substantially all of the chamber, wherein an entirety of the housing comprises a unitary construction, and further comprising a plurality of cooling fins in unitary construction with the housing.
10. A thermal transfer device, comprising a housing, the housing defining at least a portion of a chamber which is sealed from the atmosphere, the housing comprising a metal matrix composite material having a coefficient of thermal expansion of less than about 12 ppm/°C; a working fluid contained within the chamber; and a wick within the housing chamber.
11. The thermal transfer device of claim 10 wherein the metal matrix composite comprises a coefficient of thermal expansion of less than about 10 ppm/°C.
12. The thermal transfer device of claim 10 wherein the metal matrix composite comprises copper and carbon.
13. The thermal transfer device of claim 10 wherein the metal matrix composite comprises copper and tungsten.
14. The thermal transfer device of claim 10 wherein the metal matrix composite comprises copper and silicon carbide.
15. The thermal transfer device of claim 10 wherein the metal matrix composite comprises aluminum and silicon carbide.
16. The thermal transfer device of claim 10 wherein the wick comprises woven carbon fibers.
21
17. The thermal transfer device of claim 10 wherein the wick comprises woven carbon fibers, and wherein the carbon fibers are pitch carbon fibers.
18. The thermal transfer device of claim 10 wherein the wick comprises woven carbon fibers, and wherein the carbon fibers are polyacrylonitrile carbon fibers.
22
PCT/US2001/025769 2001-08-17 2001-08-17 Thermal transfer devices using heat pipes Ceased WO2003017365A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AU2001285013A AU2001285013A1 (en) 2001-08-17 2001-08-17 Thermal transfer devices using heat pipes
PCT/US2001/025769 WO2003017365A2 (en) 2001-08-17 2001-08-17 Thermal transfer devices using heat pipes
TW090125549A TW502102B (en) 2001-08-17 2001-10-16 Thermal transfer devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2001/025769 WO2003017365A2 (en) 2001-08-17 2001-08-17 Thermal transfer devices using heat pipes

Publications (3)

Publication Number Publication Date
WO2003017365A2 WO2003017365A2 (en) 2003-02-27
WO2003017365A3 WO2003017365A3 (en) 2003-09-04
WO2003017365B1 true WO2003017365B1 (en) 2004-04-22

Family

ID=21742783

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/025769 Ceased WO2003017365A2 (en) 2001-08-17 2001-08-17 Thermal transfer devices using heat pipes

Country Status (3)

Country Link
AU (1) AU2001285013A1 (en)
TW (1) TW502102B (en)
WO (1) WO2003017365A2 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7027304B2 (en) * 2001-02-15 2006-04-11 Integral Technologies, Inc. Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials
US7591302B1 (en) 2003-07-23 2009-09-22 Cooligy Inc. Pump and fan control concepts in a cooling system
FR2860368B1 (en) * 2003-09-25 2007-07-27 Omwave Sas CENTRAL AUDIO, VIDEO, AND PC FUNCTION MANAGEMENT APPARATUS
US7913719B2 (en) 2006-01-30 2011-03-29 Cooligy Inc. Tape-wrapped multilayer tubing and methods for making the same
US8157001B2 (en) 2006-03-30 2012-04-17 Cooligy Inc. Integrated liquid to air conduction module
TW200912621A (en) 2007-08-07 2009-03-16 Cooligy Inc Method and apparatus for providing a supplemental cooling to server racks
US20090225514A1 (en) 2008-03-10 2009-09-10 Adrian Correa Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
US9297571B1 (en) 2008-03-10 2016-03-29 Liebert Corporation Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
TWI548852B (en) * 2012-01-19 2016-09-11 建準電機工業股份有限公司 Heat transfer device made of conductive plastic and manufacturing method thereof
CN103292629A (en) * 2012-03-01 2013-09-11 欧司朗股份有限公司 Heat pipe and manufacturing method thereof
EP2713132A1 (en) * 2012-09-26 2014-04-02 Alcatel Lucent A vapor-based heat transfer apparatus
CN106793670A (en) * 2015-11-24 2017-05-31 吴江市旭威电子科技有限公司 Heat radiator of electronic element
EP4114159A1 (en) * 2021-06-29 2023-01-04 Siemens Aktiengesellschaft Device for heat dissipation from microelectronic components arranged in an electronics enclosure

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1986004982A1 (en) * 1985-02-21 1986-08-28 Fujikura Ltd. Heat pipe
JPS63254755A (en) * 1987-04-10 1988-10-21 Mitsubishi Electric Corp Method for manufacturing a cooling device for an electronic element body
JPH06102870B2 (en) * 1987-06-16 1994-12-14 竹本油脂株式会社 Sizing agent for carbon fiber
US5076352A (en) * 1991-02-08 1991-12-31 Thermacore, Inc. High permeability heat pipe wick structure
JP2001523892A (en) * 1997-11-13 2001-11-27 ビーピー・アモコ・コーポレーション Thermal management device

Also Published As

Publication number Publication date
TW502102B (en) 2002-09-11
WO2003017365A2 (en) 2003-02-27
AU2001285013A1 (en) 2003-03-03
WO2003017365A3 (en) 2003-09-04

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