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WO2003016810A1 - Procede et dispositif pour eviter la formation d'un film gazeux dans une zone d'evaporation d'un systeme de refroidissement a deux phases - Google Patents

Procede et dispositif pour eviter la formation d'un film gazeux dans une zone d'evaporation d'un systeme de refroidissement a deux phases Download PDF

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Publication number
WO2003016810A1
WO2003016810A1 PCT/DE2002/002606 DE0202606W WO03016810A1 WO 2003016810 A1 WO2003016810 A1 WO 2003016810A1 DE 0202606 W DE0202606 W DE 0202606W WO 03016810 A1 WO03016810 A1 WO 03016810A1
Authority
WO
WIPO (PCT)
Prior art keywords
evaporator
cooling system
phase cooling
gas film
zone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2002/002606
Other languages
German (de)
English (en)
Inventor
Eric Baudelot
Dieter Metzner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of WO2003016810A1 publication Critical patent/WO2003016810A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/16—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying an electrostatic field to the body of the heat-exchange medium
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F28F13/10—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by imparting a pulsating motion to the flow, e.g. by sonic vibration

Definitions

  • the invention relates to a method for avoiding a gas film in an evaporator zone of a two-phase cooling system and to an apparatus for performing the method.
  • a two-phase cooling system heat is removed by evaporating a working fluid.
  • Such two-phase cooling systems generally consist of an evaporator and condenser zone for introducing and removing heat into and out of this system.
  • the heat of vaporization of a working fluid usually hydrocarbons with fluorine and / or chlorine components, which is in contact with a surface to be cooled, is used to absorb the heat to be dissipated.
  • the resulting amount of gas is in the form of bubbles due to buoyancy and / or flows of liquid from the
  • the evaporation process is one of the main restrictions, since at high power densities there is a risk of drying out, ie a gas film is formed which prevents further liquid from coming into contact with the surface to be cooled. Film boiling occurs above a quantity of heat to be dissipated of 10 to 20 W / cm 2 . In contrast, in today's power electronics applications, a heat of up to 300 W / cm 2 . For this reason, measures to spread heat are currently essential before the heat can be transferred to the cooling medium. The most common example is the copper base plate for power modules, where an area spread factor of typically 5 to 10 is achieved. With increasing packing density and total area of the silicon chips one reaches the limits of the metallic heat conduction, ie it is at most possible to keep the resulting temperature gradients within limits with a high expenditure of material.
  • a heat pipe which is divided into two channels by means of a profiled sheet, namely a steam channel and a liquid channel.
  • a diaphragm is arranged in the fluid channel, the so-called artery, which takes up part of the cross-sectional area of this channel.
  • a cage is arranged in the downstream direction, which consists of a wire mesh.
  • the total flow of this medium is divided into two partial flows, one of which continues to flow freely in its original direction of flow, while the other is sharply deflected behind the orifice and thus gets into the cage.
  • This second sub-stream also contains practically all vapor or gas bubbles that are contained in the incoming liquid.
  • Bubble traps of this type can also be installed at several points in the artery. If the heat pipe consists of several partial elements, for example, it is advantageous to arrange it at the beginning of each partial element. In addition, such a bubble trap can also be arranged at the inlet of the evaporator. With this heat pipe, a completely automatic shutdown of existing gas or vapor bubbles is reached without having to interrupt the operation.
  • a disadvantage of this device is that there must always be a flow direction of the working fluid so that the so-called bubble traps can be placed correctly in the fluid channel.
  • the installation of this device is always associated with a constructive intervention in the heat pipe.
  • the invention is based on the object of specifying a method and a device for avoiding a gas film in an evaporator zone of a two-phase cooling system which is inexpensive and inexpensive.
  • the working fluid of the two-phase cooling system is enriched with floating particles in such a way that a suspension is formed. These floating particles create a movement on the surface of the evaporator to be cooled with the resulting vapor bubbles in such a way that a continuous gas film can no longer form. This eliminates the risk of dehydration with little effort and at low cost.
  • permanent magnetic particles are used as particles, these can be set in motion with the aid of electromagnetic vibrations which are coupled into the evaporator zone in such a way that no coherent gas film can form on the surface of the evaporator to be cooled.
  • electromagnetic vibrations are coupled in here instead of mechanical vibrations.
  • At least one converter is required in each case, which generates an electromechanical or an electromagnetic vibration.
  • These converters are attached to the outside of the evaporator of the two-phase cooling system, with no structural intervention in the evaporator being necessary. Since these converters are installed outside the evaporator, existing two-phase cooling systems, in which the risk of drying out has increased, can be retrofitted. Since commercially available ultrasound transducers can be used in particular for the electromechanical transducer, this device for carrying out the method is not only inexpensive but also very inexpensive.
  • FIG. 1 shows a first embodiment of the device for
  • FIG. 3 shows the use of the device according to FIG. 1 in a flat heat pipe, in which
  • FIG. 4 illustrates the use of the device according to FIG. 1 in a sieve bath vessel. 1 shows only one evaporator 2 of a thermosiphon for clarity.
  • a thermosiphon cooling system has an evaporator, a condenser and two tubes 4 and 6.
  • the tube 4 connects the evaporator 2 on the steam side to the condenser, which in turn is connected to the evaporator 2 by means of the tube 6 on the liquid side.
  • a surface 8 of the evaporator 2 has a power semiconductor module 10 which contains a plurality of chips 12.
  • the copper base plate 14, a heat-insulating layer 16 and the module housing 18 are also shown.
  • the power loss generated by the power semiconductor module 10 is to be dissipated with the evaporator 2 of the thermosiphon cooling system.
  • the heat of vaporization of a working liquid 20 which is in contact with the surface 8 to be cooled is used to absorb the heat to be removed.
  • the resulting amount of gas is removed in the form of gas bubbles 22 from the liquid-filled evaporator 2.
  • the evaporator zone If in the area of the surface 8 to be cooled, which is also referred to as the evaporator zone, there are so many gas bubbles 22 at high power densities that cover this surface 8 to be cooled, no further liquid can come into contact with the surface 8 to be cooled. That is, this surface 8 to be cooled is covered with a gas film, which creates the risk of drying out.
  • At least one electromechanical oscillation in the ultrasonic frequency range is coupled into the evaporator zone of the evaporator 2.
  • at least one electromechanical transducer 24 is attached to the evaporator 2 in such a way that the coupled-in electromechanical vibrations sets the liquid in the evaporator zone in such a way that, despite the formation of large bubbles, no coherent gas film can form.
  • an electromechanical converter 24 an ultra sound converter used, which is glued to the outside of the evaporator 2.
  • FIG. 2 shows a second embodiment of the device for carrying out the method according to the invention, likewise in a thermosiphon cooling system. 1 to 4, the same parts are provided with the same reference numerals.
  • the working fluid 20 of the thermosiphon cooling system is enriched with permanent magnetic particles 26 in such a way that a suspension is formed. Ferrite particles, for example, are used as permanent magnetic particles 26.
  • the electromechanical transducer 24 has been replaced by a transducer 28 for generating a time-varying magnetic field. This time-varying magnetic field acts on the permanent magnetic particles 26 in such a way that they are set in motion. These movements are illustrated by arrows on the particles 26.
  • the time-varying movements of the particles 26 in the evaporation zone ensure that no coherent gas film can form even when there are increased bubbles.
  • FIG. 4 illustrates the use of the device according to FIG. 1 in a boiling bath vessel 32.
  • the power semiconductor modules 10 to be cooled are arranged together with cooling sockets 34 in a clamping assembly in the working fluid 20.
  • the gas bubbles 22 form at these cooling sockets 34. So that the cooling sockets 34 are not each covered with a coherent gas film, they are each provided with an electromechanical converter 24.
  • the liquid in the evaporator zone of the cooling box 34 is kept in motion in such a way that no coherent gas films can form.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un procédé visant à éviter la formation d'un film gazeux dans une zone d'évaporation d'un système de refroidissement à deux phases, ainsi qu'un dispositif pour réaliser ce procédé. Selon l'invention, des vibrations mécaniques de la zone de fréquence de l'ultrason sont envoyées dans cette zone d'évaporation, qui est ainsi protégée de la dessiccation à peu de frais.
PCT/DE2002/002606 2001-07-27 2002-07-17 Procede et dispositif pour eviter la formation d'un film gazeux dans une zone d'evaporation d'un systeme de refroidissement a deux phases Ceased WO2003016810A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10136711.2 2001-07-27
DE2001136711 DE10136711A1 (de) 2001-07-27 2001-07-27 Verfahren und Vorrichtung zur Vermeidung eines Gasfilms in einer Verdampferzone eines Zweiphasen-Kühlsystems

Publications (1)

Publication Number Publication Date
WO2003016810A1 true WO2003016810A1 (fr) 2003-02-27

Family

ID=7693348

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2002/002606 Ceased WO2003016810A1 (fr) 2001-07-27 2002-07-17 Procede et dispositif pour eviter la formation d'un film gazeux dans une zone d'evaporation d'un systeme de refroidissement a deux phases

Country Status (2)

Country Link
DE (1) DE10136711A1 (fr)
WO (1) WO2003016810A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112050676A (zh) * 2020-09-14 2020-12-08 西安交通大学 一种内置超声波发生器的相变储能强化装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006058629B3 (de) * 2006-12-13 2008-07-10 Schuler Pressen Gmbh & Co. Kg Kühlanordnung für einen Kondensator
DE102007040031A1 (de) * 2007-08-24 2009-02-26 Hans-Joachim Robionek Wärmetauscher und Verfahren zur Übertragung thermischer Energie von einem ersten Medium auf ein zweites oder weitere Medien
EP4386303A1 (fr) * 2022-12-16 2024-06-19 Eaton Intelligent Power Limited Refroidissement bases sur des vibrations elliptiques ultrasonores

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1566709A (en) * 1975-12-11 1980-05-08 Curwen & Newberry Ltd Heat exchange or transfer elements
JPS57142485A (en) * 1981-02-28 1982-09-03 Furukawa Electric Co Ltd:The Manufacture of heat pipe
JPH04338241A (ja) * 1991-05-15 1992-11-25 Tlv Co Ltd 加熱冷却装置
DE4240082C1 (de) 1992-11-28 1994-04-21 Erno Raumfahrttechnik Gmbh Wärmerohr
DE4425014A1 (de) * 1994-07-15 1996-01-18 Ruhrgas Ag Verfahren und Vorrichtung zur Erzeugung von Gleichstrom mittels einer mangetischen Suspension
JPH08189788A (ja) * 1994-12-29 1996-07-23 Ichiro Takahashi 磁性流体振動型熱拡散方法及び装置
US5953930A (en) 1998-03-31 1999-09-21 International Business Machines Corporation Evaporator for use in an extended air cooling system for electronic components
WO1999060709A1 (fr) 1998-05-18 1999-11-25 Telefonaktiebolaget Lm Ericsson (Publ) Procede et appareil de refroidissement de composants electroniques generateurs de chaleur de stations de base radio

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1566709A (en) * 1975-12-11 1980-05-08 Curwen & Newberry Ltd Heat exchange or transfer elements
JPS57142485A (en) * 1981-02-28 1982-09-03 Furukawa Electric Co Ltd:The Manufacture of heat pipe
JPH04338241A (ja) * 1991-05-15 1992-11-25 Tlv Co Ltd 加熱冷却装置
DE4240082C1 (de) 1992-11-28 1994-04-21 Erno Raumfahrttechnik Gmbh Wärmerohr
DE4425014A1 (de) * 1994-07-15 1996-01-18 Ruhrgas Ag Verfahren und Vorrichtung zur Erzeugung von Gleichstrom mittels einer mangetischen Suspension
JPH08189788A (ja) * 1994-12-29 1996-07-23 Ichiro Takahashi 磁性流体振動型熱拡散方法及び装置
US5953930A (en) 1998-03-31 1999-09-21 International Business Machines Corporation Evaporator for use in an extended air cooling system for electronic components
WO1999060709A1 (fr) 1998-05-18 1999-11-25 Telefonaktiebolaget Lm Ericsson (Publ) Procede et appareil de refroidissement de composants electroniques generateurs de chaleur de stations de base radio

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Section Ch Week 199302, Derwent World Patents Index; Class J08, AN 1993-012104, XP002221489 *
PATENT ABSTRACTS OF JAPAN vol. 0061, no. 246 (M - 176) 4 December 1982 (1982-12-04) *
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 11 29 November 1996 (1996-11-29) *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112050676A (zh) * 2020-09-14 2020-12-08 西安交通大学 一种内置超声波发生器的相变储能强化装置
CN112050676B (zh) * 2020-09-14 2022-02-18 西安交通大学 一种内置超声波发生器的相变储能强化装置

Also Published As

Publication number Publication date
DE10136711A1 (de) 2003-02-13

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