[go: up one dir, main page]

WO2003008140A3 - Apparatus for processing a workpiece - Google Patents

Apparatus for processing a workpiece Download PDF

Info

Publication number
WO2003008140A3
WO2003008140A3 PCT/US2002/023297 US0223297W WO03008140A3 WO 2003008140 A3 WO2003008140 A3 WO 2003008140A3 US 0223297 W US0223297 W US 0223297W WO 03008140 A3 WO03008140 A3 WO 03008140A3
Authority
WO
WIPO (PCT)
Prior art keywords
workpiece
head
liquid
processing
rotors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2002/023297
Other languages
French (fr)
Other versions
WO2003008140A2 (en
Inventor
Steven L Peace
Paul Z Wirth
Erik Lund
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semitool Inc
Original Assignee
Semitool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/907,552 external-priority patent/US6492284B2/en
Priority claimed from US09/907,522 external-priority patent/US6680253B2/en
Application filed by Semitool Inc filed Critical Semitool Inc
Priority to AU2002322587A priority Critical patent/AU2002322587A1/en
Publication of WO2003008140A2 publication Critical patent/WO2003008140A2/en
Publication of WO2003008140A3 publication Critical patent/WO2003008140A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

A system (100) for processing a workpiece (55) includes a base (300) having a bowl (780) or recess for holding a liquid. A process reactor or head (200) holds a workpiece (55) between an upper rotor (110) and a lower rotor (112). A head lifter (400) lowers the head (200) holding the workpiece (55) into contact with the liquid. The head (200) spins the workpiece (55) during and after contact with the liquid. The upper (110) and lower (112) rotors have side openings (842) for loading and unloading a workpiece (55) into the head (200). The rotors (110 & 112) are axially moveable to align the side opening (842).
PCT/US2002/023297 2001-07-16 2002-07-10 Apparatus for processing a workpiece Ceased WO2003008140A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002322587A AU2002322587A1 (en) 2001-07-16 2002-07-10 Apparatus for processing a workpiece

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US09/907,552 US6492284B2 (en) 1999-01-22 2001-07-16 Reactor for processing a workpiece using sonic energy
US09/907,522 US6680253B2 (en) 1999-01-22 2001-07-16 Apparatus for processing a workpiece
US09/907,522 2001-07-16
US09/907,552 2001-07-16

Publications (2)

Publication Number Publication Date
WO2003008140A2 WO2003008140A2 (en) 2003-01-30
WO2003008140A3 true WO2003008140A3 (en) 2003-11-06

Family

ID=27129490

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/023297 Ceased WO2003008140A2 (en) 2001-07-16 2002-07-10 Apparatus for processing a workpiece

Country Status (3)

Country Link
AU (1) AU2002322587A1 (en)
TW (1) TW559571B (en)
WO (1) WO2003008140A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8500968B2 (en) * 2010-08-13 2013-08-06 Applied Materials, Inc. Deplating contacts in an electrochemical plating apparatus

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3727620A (en) * 1970-03-18 1973-04-17 Fluoroware Of California Inc Rinsing and drying device
US4132567A (en) * 1977-10-13 1979-01-02 Fsi Corporation Apparatus for and method of cleaning and removing static charges from substrates
JPS59208831A (en) * 1983-05-13 1984-11-27 Hitachi Tokyo Electronics Co Ltd Coating device
US4750505A (en) * 1985-04-26 1988-06-14 Dainippon Screen Mfg. Co., Ltd. Apparatus for processing wafers and the like
JPS63185029A (en) * 1987-01-28 1988-07-30 Hitachi Ltd Wafer processing equipment
US4903717A (en) * 1987-11-09 1990-02-27 Sez Semiconductor-Equipment Zubehoer Fuer die Halbleiterfertigung Gesellschaft m.b.H Support for slice-shaped articles and device for etching silicon wafers with such a support
US5168886A (en) * 1988-05-25 1992-12-08 Semitool, Inc. Single wafer processor
US5222310A (en) * 1990-05-18 1993-06-29 Semitool, Inc. Single wafer processor with a frame
US5591262A (en) * 1994-03-24 1997-01-07 Tazmo Co., Ltd. Rotary chemical treater having stationary cleaning fluid nozzle

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3727620A (en) * 1970-03-18 1973-04-17 Fluoroware Of California Inc Rinsing and drying device
US4132567A (en) * 1977-10-13 1979-01-02 Fsi Corporation Apparatus for and method of cleaning and removing static charges from substrates
JPS59208831A (en) * 1983-05-13 1984-11-27 Hitachi Tokyo Electronics Co Ltd Coating device
US4750505A (en) * 1985-04-26 1988-06-14 Dainippon Screen Mfg. Co., Ltd. Apparatus for processing wafers and the like
JPS63185029A (en) * 1987-01-28 1988-07-30 Hitachi Ltd Wafer processing equipment
US4903717A (en) * 1987-11-09 1990-02-27 Sez Semiconductor-Equipment Zubehoer Fuer die Halbleiterfertigung Gesellschaft m.b.H Support for slice-shaped articles and device for etching silicon wafers with such a support
US5168886A (en) * 1988-05-25 1992-12-08 Semitool, Inc. Single wafer processor
US5222310A (en) * 1990-05-18 1993-06-29 Semitool, Inc. Single wafer processor with a frame
US5445172A (en) * 1990-05-18 1995-08-29 Semitool, Inc. Wafer holder with flexibly mounted gripping fingers
US5591262A (en) * 1994-03-24 1997-01-07 Tazmo Co., Ltd. Rotary chemical treater having stationary cleaning fluid nozzle

Also Published As

Publication number Publication date
WO2003008140A2 (en) 2003-01-30
AU2002322587A1 (en) 2003-03-03
TW559571B (en) 2003-11-01

Similar Documents

Publication Publication Date Title
WO1999025904A8 (en) Electric potential shaping apparatus for holding a semiconductor wafer during electroplating
TW430919B (en) Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
EP0869542A3 (en) Cleaning and drying apparatus, wafer processing system and wafer processing method
WO2000003419A3 (en) Wafer cleaning apparatus
EP1197988A3 (en) Multiple wafer lift apparatus and method therefor
EP1618988A3 (en) Method for chamfering wafers
AU2281800A (en) Method and grinding machine for controlling the process during rough grinding ofa workpiece
SG98382A1 (en) Device and process for liquid treatment of wafer-shaped articles
DE69934668D1 (en) FLOOR CHAMBER FOR TWO WAFERS FOR A WATER PROCESSING DEVICE AND LOADING AND DISCHARGING METHOD THEREFOR
AU5212090A (en) Apparatus for grinding semiconductor wafer
ATE491223T1 (en) REACTOR FOR PROCESSING SEMICONDUCTOR DISCS
MY123280A (en) Method and apparatus for securely holding a substrate during dicing.
EP1386365A4 (en) Method an apparatus for the operation of a cell stack assembly during subfreezing temperatures
CA2228552A1 (en) Wafer processing apparatus and method, wafer convey robot, semiconductor substrate fabrication method, and semiconductor fabrication apparatus
EP0675528A3 (en) Method for rinsing wafers and rinsing apparatus.
AU6613000A (en) Apparatus and method for texture analysis on semiconductor wafers
AU2002232884A1 (en) Method and apparatus for monitoring a semiconductor wafer during a spin drying operation
AU2476197A (en) Liquid ejection head and apparatus, and manufacturing method for liquid ejection head
AU4779600A (en) Container for holder exposure apparatus, device manufacturing method, and device manufacturing apparatus
CA2019859A1 (en) Method for aligning, lifting, and tilting a container relative to a vertical opening
AU2002306973A1 (en) Method and apparatus for avoiding particle accumulation during an electrochemical process
WO2002062500A3 (en) Method and forming machine for deforming a hollow workpiece
WO2003008140A3 (en) Apparatus for processing a workpiece
SG68018A1 (en) Process for treating a polished semiconductor wafer immediately after the semiconductor wafer has been polished
AU3144899A (en) Method and device for treating wafers presenting components during thinning of the wafer and separation of the components

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SI SK SL TJ TM TN TR TT TZ UA UG US UZ VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LU MC NL PT SE SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP