AU3144899A - Method and device for treating wafers presenting components during thinning of the wafer and separation of the components - Google Patents

Method and device for treating wafers presenting components during thinning of the wafer and separation of the components

Info

Publication number: AU3144899A
Authority: AU; Australia
Prior art keywords: components; wafer; separation; presenting; during thinning
Prior art date: 1998-03-14
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Abandoned

Application number

AU31448/99A

Inventor

Michael Stromberg

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Individual

Original Assignee

Individual

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1998-03-14

Filing date

1999-03-11

Publication date

1999-10-11

1998-03-14 Priority claimed from DE19811115A external-priority patent/DE19811115A1/en

1999-03-11 Application filed by Individual filed Critical Individual

1999-10-11 Publication of AU3144899A publication Critical patent/AU3144899A/en

Status Abandoned legal-status Critical Current

Classifications

- H10P72/74—
- H10P54/00—
- H10P72/7402—
- H10P72/7416—
- H10P72/7422—

AU31448/99A 1998-03-14 1999-03-11 Method and device for treating wafers presenting components during thinning of the wafer and separation of the components Abandoned AU3144899A (en)

Applications Claiming Priority (5)

Application Number	Priority Date	Filing Date	Title
DE19811115A DE19811115A1 (en)	1998-03-14	1998-03-14	Treating and processing wafers during thickness reduction and sawing
DE19811115		1998-03-14
DE19812120		1998-03-19
DE19812120		1998-03-19
PCT/EP1999/001602 WO1999048137A2 (en)	1998-03-14	1999-03-11	Method and device for treating wafers presenting components during thinning of the wafer and separation of the components

Publications (1)

Publication Number	Publication Date
AU3144899A true AU3144899A (en)	1999-10-11

Family

ID=26044623

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AU31448/99A Abandoned AU3144899A (en)	1998-03-14	1999-03-11	Method and device for treating wafers presenting components during thinning of the wafer and separation of the components

Country Status (3)

Country	Link
AU (1)	AU3144899A (en)
DE (1)	DE19980448D2 (en)
WO (1)	WO1999048137A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE19921230B4 (en) *	1999-05-07	2009-04-02	Giesecke & Devrient Gmbh	Method for handling thinned chips for insertion in chip cards
JP2003151924A (en) *	2001-08-28	2003-05-23	Tokyo Seimitsu Co Ltd	Dicing method and dicing apparatus
EP1677346B1 (en) *	2001-10-01	2011-12-14	Electro Scientific Industries, Inc.	Machining substrates, particularly semiconductor wafers
PT1568071T (en)	2002-11-29	2019-06-17	Fraunhofer Ges Forschung	TABLE WITH SEPARATION LAYER AND SUPPORT LAYER AND ITS MANUFACTURING PROCESS
FR2878076B1 (en) *	2004-11-17	2007-02-23	St Microelectronics Sa	SLIMMING A SEMICONDUCTOR WAFER
CN101894763B (en) *	2009-05-19	2011-09-07	中芯国际集成电路制造(上海)有限公司	Chip assembling method
DE102011100608B4 (en)	2011-03-03	2024-03-28	OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung	Suspension for protecting a semiconductor material and method for producing a semiconductor body
US10186458B2 (en) *	2012-07-05	2019-01-22	Infineon Technologies Ag	Component and method of manufacturing a component using an ultrathin carrier

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5268065A (en) *	1992-12-21	1993-12-07	Motorola, Inc.	Method for thinning a semiconductor wafer
US5641416A (en) *	1995-10-25	1997-06-24	Micron Display Technology, Inc.	Method for particulate-free energy beam cutting of a wafer of die assemblies

1999
- 1999-03-11 WO PCT/EP1999/001602 patent/WO1999048137A2/en not_active Ceased
- 1999-03-11 DE DE19980448T patent/DE19980448D2/en not_active Ceased
- 1999-03-11 AU AU31448/99A patent/AU3144899A/en not_active Abandoned

Also Published As

Publication number	Publication date
DE19980448D2 (en)	2004-12-09
WO1999048137A2 (en)	1999-09-23
WO1999048137A3 (en)	1999-11-04

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Legal Events

Date	Code	Title	Description
2000-04-20	MK6	Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase