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WO2003005435A1 - Substrate treating device and substrate treating method, substrate flattening method - Google Patents

Substrate treating device and substrate treating method, substrate flattening method Download PDF

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Publication number
WO2003005435A1
WO2003005435A1 PCT/JP2002/006737 JP0206737W WO03005435A1 WO 2003005435 A1 WO2003005435 A1 WO 2003005435A1 JP 0206737 W JP0206737 W JP 0206737W WO 03005435 A1 WO03005435 A1 WO 03005435A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
hydrogen
treating
substrate treating
untreated substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2002/006737
Other languages
English (en)
French (fr)
Inventor
Tadahiro Ohmi
Shigetoshi Sugawa
Masaki Hirayama
Tetsuya Goto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to EP02743801A priority Critical patent/EP1403913B1/en
Priority to US10/363,640 priority patent/US20040007177A1/en
Priority to JP2003511302A priority patent/JPWO2003005435A1/ja
Publication of WO2003005435A1 publication Critical patent/WO2003005435A1/ja
Anticipated expiration legal-status Critical
Priority to US12/045,321 priority patent/US20080220592A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H10P95/94—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/3003—Hydrogenation or deuterisation, e.g. using atomic hydrogen from a plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0312—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes
    • H10D30/0314—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes of lateral top-gate TFTs comprising only a single gate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0321—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6758—Thin-film transistors [TFT] characterised by the insulating substrates
    • H10P72/0431—
    • H10P72/0434—
    • H10P72/0436—
    • H10P95/90—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01—Manufacture or treatment
    • H10D86/021—Manufacture or treatment of multiple TFTs
    • H10D86/0221—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Recrystallisation Techniques (AREA)
  • Catalysts (AREA)
  • Thin Film Transistor (AREA)
  • Chemical Vapour Deposition (AREA)
PCT/JP2002/006737 2001-07-05 2002-07-03 Substrate treating device and substrate treating method, substrate flattening method Ceased WO2003005435A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP02743801A EP1403913B1 (en) 2001-07-05 2002-07-03 Substrate treating device and substrate treating method
US10/363,640 US20040007177A1 (en) 2001-07-05 2002-07-03 Substrate treating device and substrate treating method, substrate flattening method
JP2003511302A JPWO2003005435A1 (ja) 2001-07-05 2002-07-03 基板処理装置および基板処理方法、基板平坦化方法
US12/045,321 US20080220592A1 (en) 2001-07-05 2008-03-10 Substrate processing apparatus, substrate processing method, and substrate planarization method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-205171 2001-07-05
JP2001205171 2001-07-05

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/045,321 Division US20080220592A1 (en) 2001-07-05 2008-03-10 Substrate processing apparatus, substrate processing method, and substrate planarization method

Publications (1)

Publication Number Publication Date
WO2003005435A1 true WO2003005435A1 (en) 2003-01-16

Family

ID=19041535

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/006737 Ceased WO2003005435A1 (en) 2001-07-05 2002-07-03 Substrate treating device and substrate treating method, substrate flattening method

Country Status (6)

Country Link
US (2) US20040007177A1 (ja)
EP (1) EP1403913B1 (ja)
JP (1) JPWO2003005435A1 (ja)
CN (1) CN100524652C (ja)
TW (1) TW561560B (ja)
WO (1) WO2003005435A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011086971A1 (ja) * 2010-01-12 2011-07-21 株式会社 アルバック 半導体装置の製造方法、及び成膜装置

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US7192486B2 (en) * 2002-08-15 2007-03-20 Applied Materials, Inc. Clog-resistant gas delivery system
TW200524018A (en) * 2003-11-20 2005-07-16 Ulvac Inc Method of cleaning surface of semiconductor substrate, method of manufacturing film, method of manufacturing semiconductor device and semiconductor device
CN100533272C (zh) * 2004-04-07 2009-08-26 茂德科技股份有限公司 旋涂材料层的平坦化方法及光致抗蚀剂层的制造方法
CN101263589B (zh) * 2005-09-13 2010-08-25 大见忠弘 半导体装置的制造方法及半导体制造装置
KR101046902B1 (ko) * 2005-11-08 2011-07-06 도쿄엘렉트론가부시키가이샤 샤워 플레이트 및 샤워 플레이트를 사용한 플라즈마 처리장치
JP2009104916A (ja) * 2007-10-24 2009-05-14 Canon Inc 電子放出素子、電子源、画像表示装置および電子放出素子の製造方法
CN101620991B (zh) * 2008-07-02 2011-08-17 中芯国际集成电路制造(上海)有限公司 Tft快闪存储单元的原子层沉积外延硅生长
US8524562B2 (en) 2008-09-16 2013-09-03 Imec Method for reducing Fermi-Level-Pinning in a non-silicon channel MOS device
US20110185969A1 (en) * 2009-08-21 2011-08-04 Varian Semiconductor Equipment Associates, Inc. Dual heating for precise wafer temperature control
WO2018091888A1 (en) * 2016-11-15 2018-05-24 Oxford University Innovation Limited Method and apparatus for applying atomic hydrogen to an object

Citations (10)

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Publication number Priority date Publication date Assignee Title
JPS6340314A (ja) * 1986-08-05 1988-02-20 Hiroshima Univ 触媒ｃｖｄ法による薄膜の製造法とその装置
JPH05801A (ja) * 1991-06-19 1993-01-08 Matsushita Electric Ind Co Ltd 原子状水素供給器
EP0614216A1 (en) * 1991-11-22 1994-09-07 OHMI, Tadahiro Apparatus for forming oxide film, heat treatment apparatus, semiconductor device, manufacturing method therefor
JPH06338491A (ja) * 1993-05-28 1994-12-06 Kyocera Corp 触媒ｃｖｄ装置
JPH07235534A (ja) * 1994-02-24 1995-09-05 Toshiba Ceramics Co Ltd シリコンウェーハの製造方法
JPH10340857A (ja) * 1997-06-10 1998-12-22 Mitsubishi Electric Corp 半導体装置の製造方法及び半導体製造装置
JP2000031109A (ja) * 1998-07-08 2000-01-28 Tadahiro Omi 乾燥方法
JP2000216165A (ja) * 1999-01-21 2000-08-04 Fujitsu Ltd 半導体装置の製造方法
JP2001049437A (ja) * 1999-08-05 2001-02-20 Anelva Corp 発熱体ｃｖｄ装置及び付着膜の除去方法
JP2001131741A (ja) * 1999-10-29 2001-05-15 Sony Corp 触媒スパッタリングによる薄膜形成方法及び薄膜形成装置並びに半導体装置の製造方法

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DE3914065A1 (de) * 1989-04-28 1990-10-31 Leybold Ag Vorrichtung zur durchfuehrung von plasma-aetzverfahren
JPH05141871A (ja) * 1991-11-22 1993-06-08 Tadahiro Omi 熱処理装置
JPH0669515A (ja) * 1992-08-19 1994-03-11 Fujitsu Ltd 半導体記憶装置
KR0183533B1 (ko) * 1997-03-03 1999-04-15 재단법인한국화학연구소 글로우 플러그용 세라믹 발열체
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JPS6340314A (ja) * 1986-08-05 1988-02-20 Hiroshima Univ 触媒ｃｖｄ法による薄膜の製造法とその装置
JPH05801A (ja) * 1991-06-19 1993-01-08 Matsushita Electric Ind Co Ltd 原子状水素供給器
EP0614216A1 (en) * 1991-11-22 1994-09-07 OHMI, Tadahiro Apparatus for forming oxide film, heat treatment apparatus, semiconductor device, manufacturing method therefor
JPH06338491A (ja) * 1993-05-28 1994-12-06 Kyocera Corp 触媒ｃｖｄ装置
JPH07235534A (ja) * 1994-02-24 1995-09-05 Toshiba Ceramics Co Ltd シリコンウェーハの製造方法
JPH10340857A (ja) * 1997-06-10 1998-12-22 Mitsubishi Electric Corp 半導体装置の製造方法及び半導体製造装置
JP2000031109A (ja) * 1998-07-08 2000-01-28 Tadahiro Omi 乾燥方法
JP2000216165A (ja) * 1999-01-21 2000-08-04 Fujitsu Ltd 半導体装置の製造方法
JP2001049437A (ja) * 1999-08-05 2001-02-20 Anelva Corp 発熱体ｃｖｄ装置及び付着膜の除去方法
JP2001131741A (ja) * 1999-10-29 2001-05-15 Sony Corp 触媒スパッタリングによる薄膜形成方法及び薄膜形成装置並びに半導体装置の製造方法

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Title
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AKIRA HEYA ET AL.: "Low-temperature crystallization of amorphous silicon using atomic hydrogen generated by catalytic reaction on heated tungsten", APPL. PHYS. LETT., vol. 74, no. 15, 12 April 1999 (1999-04-12), pages 2143 - 2145, XP002956400 *
See also references of EP1403913A4 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011086971A1 (ja) * 2010-01-12 2011-07-21 株式会社 アルバック 半導体装置の製造方法、及び成膜装置
JP5379246B2 (ja) * 2010-01-12 2013-12-25 株式会社アルバック 半導体装置の製造方法、及び成膜装置

Also Published As

Publication number Publication date
CN1478296A (zh) 2004-02-25
US20040007177A1 (en) 2004-01-15
US20080220592A1 (en) 2008-09-11
TW561560B (en) 2003-11-11
EP1403913A1 (en) 2004-03-31
JPWO2003005435A1 (ja) 2004-10-28
EP1403913B1 (en) 2008-04-23
EP1403913A4 (en) 2006-02-08
CN100524652C (zh) 2009-08-05

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