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WO2003050860A1 - Dispositif de traitement de substrat - Google Patents

Dispositif de traitement de substrat Download PDF

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Publication number
WO2003050860A1
WO2003050860A1 PCT/JP2001/010962 JP0110962W WO03050860A1 WO 2003050860 A1 WO2003050860 A1 WO 2003050860A1 JP 0110962 W JP0110962 W JP 0110962W WO 03050860 A1 WO03050860 A1 WO 03050860A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
scraper
processing apparatus
etching
processing section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2001/010962
Other languages
English (en)
Japanese (ja)
Inventor
Hitoshi Tauchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Precision Products Co Ltd
Original Assignee
Sumitomo Precision Products Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Precision Products Co Ltd filed Critical Sumitomo Precision Products Co Ltd
Priority to PCT/JP2001/010962 priority Critical patent/WO2003050860A1/fr
Publication of WO2003050860A1 publication Critical patent/WO2003050860A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H10P72/0414—

Definitions

  • the present invention relates to a horizontal transfer type substrate processing apparatus suitably used for manufacturing a glass substrate for a liquid crystal display device.
  • a glass substrate used in a liquid crystal display device is manufactured by repeatedly performing chemical treatment such as etching and separation on the surface of a glass substrate as a material.
  • the substrate processing apparatus is roughly classified into a dry type and a batch type, and the batch type is divided into a batch type and a single wafer type. Furthermore, the single wafer type is subdivided into a stationary rotation type and a horizontal conveyance type by roller conveyance or the like.
  • the horizontal transfer type has a basic structure that supplies a processing liquid to the surface of the substrate while transporting the substrate in the horizontal direction. Due to its high efficiency, etching processing and separation Used for processing
  • a substrate In a horizontal transfer type substrate processing apparatus used for an etching process, a substrate generally passes through a receiving section, a liquid avoiding section, an etching section, a washing section, and a draining section in order.
  • a large number of spray nozzles arranged in a matrix form above the substrate transfer line, and an etching liquid is jetted out in a shower form, and the substrate passes through the shower, so that the etching liquid is spread over the entire upper surface of the substrate. Supplied.
  • this shower treatment the upper surface of the substrate is selectively etched except for the portion where the masking material is applied.
  • the substrate after the etching process is subjected to a double-sided cleaning process using a pure water shower in the water washing unit, and is sent to the draining unit.
  • a pure water shower in the water washing unit In the draining section, moisture adhering to both surfaces of the substrate is removed by, for example, an air knife.
  • liquid removal has been used to forcibly remove the etchant adhering to both surfaces of the substrate at the exit of the etching section. It is regarded as important because it is more efficient than.
  • draining with an air knife is effective for removing the etchant on the upper surface, but is not suitable for removing the etchant attached to the lower surface by surface tension. That is, at the exit of the etching unit, the slit nozzle for the air knife is arranged at right angles to the substrate traveling direction due to space limitations.
  • the upper and lower slit nozzles are arranged sideways in plan view in the draining section (drying section) following the washing section.
  • the draining of the liquid with an air knife at the outlet of the etching unit is usually performed only on the upper surface of the substrate, and the etching liquid adhering to the lower surface is usually left untouched. For this reason, the amount of the etchant brought into the washing section from the etching section is not usually reduced as expected.
  • An object of the present invention is to provide a substrate processing method capable of efficiently removing a chemical solution adhering to the lower surface of a substrate without causing tilt of the substrate and stably without causing scattering. To provide a processing device. Disclosure of the invention
  • the substrate processing apparatus of the present invention is a horizontal transport type substrate processing apparatus that transports a substrate in a horizontal direction and sequentially passes the substrate to a chemical processing section and a washing processing section.
  • a non-contact type scraper is provided at the exit portion of the substrate, facing the lower surface of the substrate at a small distance over substantially the entire width.
  • the scraper contacts only the chemical adhering to the lower surface of the substrate and removes the chemical statically without scattering as the substrate advances. Is done. If the lower surface of the substrate contacts the scraper, there is a risk of flaws and cracks.
  • the scraper be combined with an upstream air knife or substrate support roller. That is, by providing a slit nozzle that blows the liquid for draining in a thin film shape over substantially the entire width of the upper surface of the substrate on the upstream side of the scraper, it is possible to efficiently remove the chemical liquid placed on the upper surface of the substrate. Become.
  • This slit nozzle is preferably arranged at right angles to the traveling direction of the substrate from the viewpoint of space saving.
  • a large-sized and thin-walled substrate which is easily bent can also have a tip end. And the situation where the rear end contacts the scraper can be avoided.
  • the present invention is particularly effective for a substrate processing apparatus of a type in which a chemical liquid easily accumulates on the lower surface of a substrate and in which the substrate is transported in a horizontal posture in a horizontal direction. However, the substrate is transported in a horizontal direction by tilting the substrate to the side. Applicable to any type of substrate processing equipment
  • FIG. 1 is a schematic side view of a substrate processing apparatus showing an embodiment of the present invention
  • FIG. 2 is a side view of a main part of the substrate processing apparatus
  • FIG. 3 is a plan view of a main part of the substrate processing apparatus.
  • the substrate processing apparatus of the present embodiment is an etching apparatus used for manufacturing a glass substrate for a liquid crystal display.
  • the substrate processing apparatus includes a receiving unit 20, a liquid avoiding unit 30, an etching unit 40, a washing unit 50, and a draining unit 60 arranged in order in the transport direction of the substrate 10. It has.
  • Each part is equipped with a number of transfer ports 21, 31, 41, 51, 61 that support the substrate 10 horizontally and transfer it in the horizontal direction.
  • the liquid avoiding part 30 provided between the receiving part 20 and the etching part 40 is a buffer (buffer part) for preventing the etching liquid from entering the receiving part 20 from the etching part 40.
  • a cleaning unit 42 for supplying an etching liquid, which is a chemical liquid, from above onto the upper surface of the substrate 10 is positioned above the transport line of the substrate 10. It is provided in.
  • a slit nozzle 43 for blowing air in a thin film over the entire width of the upper surface of the substrate 10 is provided above the substrate transfer line.
  • the slit nozzle 43 is a horizontal nozzle for an air knife that removes an etchant remaining on the upper surface of the substrate 10, and has an etching portion disposed at a right angle to the traveling direction of the substrate 10 from the viewpoint of space saving.
  • the outlet of 40 also covers the entire width on the lower surface of the board 10.
  • the draining scrapers 44 oppose each other, and are provided immediately adjacent to the outlet downstream of the slit nozzle 43. As shown in FIGS. 2 and 3, the scraper 44 is located slightly below the substrate transfer line (pass line), so that it does not contact the lower surface of the substrate 10 and has surface tension on the lower surface. The adhering etchant is removed.
  • the installation level of the scraper 44 is set so that the tip thereof contacts the etching liquid adhering to the lower surface of the substrate 10 but does not contact the lower surface. Removes the etchant adhering to the lower surface without contact with the lower surface of the substrate 10 as the substrate 10 progresses.
  • a plurality of substrate supporting rollers 45 are provided upstream of the scraper 44. It is provided close to par 44.
  • the plurality of substrate support rollers 45 are free rollers that are sufficiently smaller in diameter than the transport rollers 41, and are substantially at the same level as the substrate transport line slightly higher than the scraper 44, and are more sufficient than the transport rollers 41 in the substrate width direction. Are arranged at a small pitch.
  • Each of the substrate supporting rollers 45 is rotatably mounted on a side of a column 47 mounted on the base 46 at a predetermined interval, and the scraper 44 is disposed downstream of the base 46. O fixed on the side surface via spacers 4 o
  • the water washing section 50 has a first shower unit 52 for spraying pure water from above on the upper surface of the substrate 10 in a shower shape, and a second shower unit for spraying pure water from below onto the lower surface of the substrate 10.
  • the shower unit 53 is provided between the transfer lines for the substrate 10 with a strong force.
  • the draining unit 60 is a drying unit that removes moisture from both surfaces of the substrate 10 that has been washed.
  • the draining section 60 is provided with a pair of upper and lower slit nozzles 62, 63 arranged so as to sandwich the transport line of the substrate 10 from above and below.
  • the upper slit nozzle 62 is an air nozzle for an air knife that removes a water film from the upper surface of the cleaned substrate 10 by spraying a thin film over the entire width of the upper surface of the substrate 10.
  • the lower slit nozzle 63 is an air knife nozzle for an air knife that removes a water film from the cleaned lower surface of the substrate 10 by blowing air over the entire width of the lower surface of the substrate 10 in a thin film shape.
  • the upper and lower slit nozzles 62, 63 are inclined to the upstream side in the transport direction of the substrate 10 in a side view, and to the side in a plan view, for the purpose of, for example, increasing the efficiency of removing a water film. .
  • the substrate 10 passes through the receiving portion 20, the liquid avoiding portion 30, the etching portion 40, the rinsing portion 50, and the draining portion 60 in a horizontal posture in order. Then, the upper surface of the substrate 10 is subjected to an etching process, and the upper and lower surfaces are cleaned and then dried.
  • the upper surface of the substrate 10 is subjected to an etching process by passing the substrate 10 through the shower of the etching solution ejected from the shower unit 42.
  • the air blown out from the slit nozzle 43 disposed downstream of the shower unit 42 causes the upper surface of the substrate 10 not to dry.
  • the etchant remaining on the upper surface is removed.
  • the etching process ends.
  • the substrate 10 continuously passes over the scraper 44 arranged downstream of the slit nozzle 43.
  • the tip of the scraper 44 does not come into contact with the lower surface of the substrate 10, but comes into contact with the etching solution attached to the lower surface.
  • the etchant adhering to the lower surface of the substrate 10 flows down along the scraper 44 and is removed from the lower surface.
  • the scraper 44 is disposed between the front and rear transport rollers 41, 41. If the substrate 10 is large and thin and easily bent, the tip of the substrate 10 is bent downward between the transport rollers 41 and 41 before and after sandwiching the scraper 44, so-called a nose descent.
  • a substrate support opening 45 is arranged at the same level as the substrate transfer line immediately upstream of the scraper 44. For this reason, the leading end of the substrate 10 is guided by the substrate supporting rollers 45 and passes above without contacting the scraper 44. Similarly, even when the rear end portion of the substrate 10 bends downward by its own weight, the substrate 10 is guided by the substrate support rollers 45 and passes over the scraper 44 without contacting the scraper 44. In this manner, the etchant adhering to the lower surface of the front end portion and the rear end portion of the easily bent substrate 10 is efficiently removed by the non-contact type scraper 44 similarly to the other portions. In the removal by the scraper 44, unlike the removal by the air knife, the etching solution does not scatter at the time of removal, and there is no possibility that the etching solution adheres to the upper surface of the substrate 10 again.
  • the distance from the substrate transfer line to the tip of the scraper 44 is preferably 0.5 to 1.5 mm. If this distance is too small, there is a risk that the tip of the scraper 44 may come into contact with the lower surface of the substrate 10. On the other hand, if it is too large, it becomes difficult for the scraper 44 to come into contact with the chemical solution adhering to the lower surface of the substrate 10, and the efficiency of removing the chemical solution decreases.
  • the substrate processing apparatus of the present invention provides the non-contact type scraper that is opposed to the lower surface of the substrate at a small distance over substantially the entire width at the outlet portion of the chemical solution processing section.
  • the chemical solution adhering to the substrate can be efficiently removed without depending on the inclination of the substrate.
  • the chemical solution is taken out from the chemical processing section to the subsequent washing section while maintaining excellent throughput.
  • the amount can be significantly reduced, and the efficiency of recovering the chemical in the chemical processing section can be improved, and the contamination of the etching liquid in the water washing section can be prevented.

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)

Abstract

L'invention concerne un dispositif de traitement de substrat du type à transfert horizontal, dans lequel des substrats sont transportés dans la direction horizontale afin qu'ils passent à travers une section de traitement chimique liquide et une partie de traitement à rideau d'eau. Le liquide chimique adhérant à la surface inférieure d'un substrat est supprimé de façon stable et efficace sans avoir recours à une inclinaison du substrat et sans produire d'éclaboussures. A cet effet, la partie de sortie de la section de traitement chimique liquide est pourvue d'un racloir du type sans contact (44) opposé à la surface inférieure du substrat et séparé de celle-ci, sensiblement sur toute la largeur, par une distance très faible. Une pluralité de rouleaux (45) de support de substrat disposés transversalement par rapport au substrat sont disposés en amont du racloir (44) et à proximité de ce dernier. La disposition du rouleau (45) de support de substrat permet d'éviter une situation dans laquelle l'extrémité avant ou arrière du substrat, qui est facilement flexible, de grande taille et à paroi minces, viendrait en contact avec le racloir (44).
PCT/JP2001/010962 2001-12-13 2001-12-13 Dispositif de traitement de substrat Ceased WO2003050860A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2001/010962 WO2003050860A1 (fr) 2001-12-13 2001-12-13 Dispositif de traitement de substrat

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2001/010962 WO2003050860A1 (fr) 2001-12-13 2001-12-13 Dispositif de traitement de substrat

Publications (1)

Publication Number Publication Date
WO2003050860A1 true WO2003050860A1 (fr) 2003-06-19

Family

ID=11738037

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2001/010962 Ceased WO2003050860A1 (fr) 2001-12-13 2001-12-13 Dispositif de traitement de substrat

Country Status (1)

Country Link
WO (1) WO2003050860A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023199760A1 (fr) * 2022-04-12 2023-10-19 日本電気硝子株式会社 Dispositif et procédé de fabrication d'article en verre

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09326342A (ja) * 1996-04-01 1997-12-16 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH11145109A (ja) * 1997-11-07 1999-05-28 Dainippon Screen Mfg Co Ltd 基板処理装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09326342A (ja) * 1996-04-01 1997-12-16 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH11145109A (ja) * 1997-11-07 1999-05-28 Dainippon Screen Mfg Co Ltd 基板処理装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023199760A1 (fr) * 2022-04-12 2023-10-19 日本電気硝子株式会社 Dispositif et procédé de fabrication d'article en verre

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