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WO2002036273A8 - Catalyst solutions useful in activating substrates for subsequent plating - Google Patents

Catalyst solutions useful in activating substrates for subsequent plating

Info

Publication number
WO2002036273A8
WO2002036273A8 PCT/US2001/030655 US0130655W WO0236273A8 WO 2002036273 A8 WO2002036273 A8 WO 2002036273A8 US 0130655 W US0130655 W US 0130655W WO 0236273 A8 WO0236273 A8 WO 0236273A8
Authority
WO
WIPO (PCT)
Prior art keywords
subsequent plating
catalyst solutions
solutions useful
activator
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2001/030655
Other languages
French (fr)
Other versions
WO2002036273A1 (en
Inventor
Ronald Redline
Mark Wojtaszek
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
MacDermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MacDermid Inc filed Critical MacDermid Inc
Priority to AU2001294928A priority Critical patent/AU2001294928A1/en
Publication of WO2002036273A1 publication Critical patent/WO2002036273A1/en
Publication of WO2002036273A8 publication Critical patent/WO2002036273A8/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J23/00—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
    • B01J23/38—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals
    • B01J23/54—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals combined with metals, oxides or hydroxides provided for in groups B01J23/02 - B01J23/36
    • B01J23/66—Silver or gold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J35/00—Catalysts, in general, characterised by their form or physical properties
    • B01J35/20—Catalysts, in general, characterised by their form or physical properties characterised by their non-solid state
    • B01J35/23—Catalysts, in general, characterised by their form or physical properties characterised by their non-solid state in a colloidal state
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemically Coating (AREA)
  • Catalysts (AREA)

Abstract

An improved colloidal activator is disclosed which is useful in preparing substrates for plating. The activator comprises a source of gold, a source of tin and an organic sulfonic acid. The colloidal activator may also include colloid stabilizers. A method for preparing and a process for using the activator are also disclosed.
PCT/US2001/030655 2000-11-06 2001-10-01 Catalyst solutions useful in activating substrates for subsequent plating Ceased WO2002036273A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2001294928A AU2001294928A1 (en) 2000-11-06 2001-10-01 Catalyst solutions useful in activating substrates for subsequent plating

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US70713400A 2000-11-06 2000-11-06
US09/707,134 2000-11-06

Publications (2)

Publication Number Publication Date
WO2002036273A1 WO2002036273A1 (en) 2002-05-10
WO2002036273A8 true WO2002036273A8 (en) 2002-06-06

Family

ID=24840486

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/030655 Ceased WO2002036273A1 (en) 2000-11-06 2001-10-01 Catalyst solutions useful in activating substrates for subsequent plating

Country Status (2)

Country Link
AU (1) AU2001294928A1 (en)
WO (1) WO2002036273A1 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3011920A (en) * 1959-06-08 1961-12-05 Shipley Co Method of electroless deposition on a substrate and catalyst solution therefor
US3672938A (en) * 1969-02-20 1972-06-27 Kollmorgen Corp Novel precious metal sensitizing solutions
US4004051A (en) * 1974-02-15 1977-01-18 Crown City Plating Company Aqueous noble metal suspensions for one stage activation of nonconductors for electroless plating
IT1107840B (en) * 1978-07-25 1985-12-02 Alfachimici Spa CATALYTIC SOLUTION FOR ANELECTRIC METAL DEPOSITION
US4762560A (en) * 1982-09-27 1988-08-09 Learonal, Inc. Copper colloid and method of activating insulating surfaces for subsequent electroplating

Also Published As

Publication number Publication date
AU2001294928A1 (en) 2002-05-15
WO2002036273A1 (en) 2002-05-10

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