AU2001294928A1 - Catalyst solutions useful in activating substrates for subsequent plating - Google Patents
Catalyst solutions useful in activating substrates for subsequent platingInfo
- Publication number
- AU2001294928A1 AU2001294928A1 AU2001294928A AU9492801A AU2001294928A1 AU 2001294928 A1 AU2001294928 A1 AU 2001294928A1 AU 2001294928 A AU2001294928 A AU 2001294928A AU 9492801 A AU9492801 A AU 9492801A AU 2001294928 A1 AU2001294928 A1 AU 2001294928A1
- Authority
- AU
- Australia
- Prior art keywords
- subsequent plating
- catalyst solutions
- solutions useful
- activating substrates
- activating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J35/00—Catalysts, in general, characterised by their form or physical properties
- B01J35/20—Catalysts, in general, characterised by their form or physical properties characterised by their non-solid state
- B01J35/23—Catalysts, in general, characterised by their form or physical properties characterised by their non-solid state in a colloidal state
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J23/00—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
- B01J23/38—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals
- B01J23/54—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals combined with metals, oxides or hydroxides provided for in groups B01J23/02 - B01J23/36
- B01J23/66—Silver or gold
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemically Coating (AREA)
- Catalysts (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US70713400A | 2000-11-06 | 2000-11-06 | |
| US09707134 | 2000-11-06 | ||
| PCT/US2001/030655 WO2002036273A1 (en) | 2000-11-06 | 2001-10-01 | Catalyst solutions useful in activating substrates for subsequent plating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001294928A1 true AU2001294928A1 (en) | 2002-05-15 |
Family
ID=24840486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001294928A Abandoned AU2001294928A1 (en) | 2000-11-06 | 2001-10-01 | Catalyst solutions useful in activating substrates for subsequent plating |
Country Status (2)
| Country | Link |
|---|---|
| AU (1) | AU2001294928A1 (en) |
| WO (1) | WO2002036273A1 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3011920A (en) * | 1959-06-08 | 1961-12-05 | Shipley Co | Method of electroless deposition on a substrate and catalyst solution therefor |
| US3672938A (en) * | 1969-02-20 | 1972-06-27 | Kollmorgen Corp | Novel precious metal sensitizing solutions |
| US4004051A (en) * | 1974-02-15 | 1977-01-18 | Crown City Plating Company | Aqueous noble metal suspensions for one stage activation of nonconductors for electroless plating |
| IT1107840B (en) * | 1978-07-25 | 1985-12-02 | Alfachimici Spa | CATALYTIC SOLUTION FOR ANELECTRIC METAL DEPOSITION |
| US4762560A (en) * | 1982-09-27 | 1988-08-09 | Learonal, Inc. | Copper colloid and method of activating insulating surfaces for subsequent electroplating |
-
2001
- 2001-10-01 AU AU2001294928A patent/AU2001294928A1/en not_active Abandoned
- 2001-10-01 WO PCT/US2001/030655 patent/WO2002036273A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2002036273A8 (en) | 2002-06-06 |
| WO2002036273A1 (en) | 2002-05-10 |
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