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WO2002028589A1 - Procede et dispositif pour appliquer des fragments de materiau sur une piece d'usinage - Google Patents

Procede et dispositif pour appliquer des fragments de materiau sur une piece d'usinage Download PDF

Info

Publication number
WO2002028589A1
WO2002028589A1 PCT/EP2001/011421 EP0111421W WO0228589A1 WO 2002028589 A1 WO2002028589 A1 WO 2002028589A1 EP 0111421 W EP0111421 W EP 0111421W WO 0228589 A1 WO0228589 A1 WO 0228589A1
Authority
WO
WIPO (PCT)
Prior art keywords
capillaries
station
pieces
capillary
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2001/011421
Other languages
German (de)
English (en)
Inventor
Elke Zakel
Paul Kasulke
Oliver Uebel
Lars Titerle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pac Tech Packaging Technologies GmbH
Original Assignee
Pac Tech Packaging Technologies GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pac Tech Packaging Technologies GmbH filed Critical Pac Tech Packaging Technologies GmbH
Priority to US10/398,787 priority Critical patent/US7021517B2/en
Priority to DE50115447T priority patent/DE50115447D1/de
Priority to EP01972089A priority patent/EP1326729B1/fr
Publication of WO2002028589A1 publication Critical patent/WO2002028589A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H10P72/0446—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • H10W70/093—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns

Definitions

  • the invention relates to a method and a device for applying pieces of material to a
  • Pieces of material for the purposes of the present invention can be pieces of any material which are in solid or liquid form. This can be solderable
  • Act materials such as gold, copper, tin, glass or plastic, which are present in particular as micro material pieces in the form of solder balls, glass balls or plastic balls. It can also be ceramic pieces and components, such as Miniature circuits, SMD components or the like.
  • DE 195 41 996 describes a device for the individual application of solder balls from a solder ball reservoir with an application device and a separating device, in which the separating device is designed as a circular conveying device.
  • the circular conveyor By moving the circular conveyor intermittently, solder balls are conveyed from the reservoir to a capillary and by means of compressed air to the end of the capillary, which at this time is close to a connection point on the workpiece. The solder ball is melted by laser energy and flows onto the connection point.
  • the object of the invention is to improve the known device in such a way that it works faster and is therefore also suitable for series production.
  • the basic principle ip of the invention is several
  • the capillaries Arrange the capillary on a single circular conveyor.
  • the capillaries are preferably arranged in the pattern of the solder points. A large number of soldering points can then be set with a single clock.
  • a more universal device is obtained in that the capillaries are aligned along a line and means are provided which ensure that only selected capillaries receive solder balls. Every capillary can be controlled individually with regard to the soldering process, which is done either by assigning a separate laser to each capillary or by successively feeding a laser to the selected capillaries via beam deflection devices.
  • the individual capitals are arranged in a grid dimension that is usual for series production, so that a whole line of soldering points can always be set with one cycle.
  • Figure 1 is a schematic cross section of the device according to the invention. and FIG. 2 shows a schematic top view of the device according to the invention.
  • a workpiece 1 can be seen, which is clamped on a machine table 2.
  • the device has a large number of capillaries
  • each capillary can be assigned its own laser 9. However, it is also possible to provide a single laser source and to use beam deflection devices such as a "beam splitter", then direct the beams to the individual capillaries.
  • the supply of solder balls 6 to the individual capillaries 4 is carried out in cycles by a circular conveyor device 10, which has a circular disk 11 with a large number of holes 12, which are each arranged in concentric circles on a center beam, the distance between the concentric circles 24 to 28 in FIG. 2 corresponding to the aforementioned grid dimension, ie the distance between the individual capillaries.
  • the circular disk 11 is rotatably mounted between two disks 13 and 15 and can be rotated via a shaft 16 and a motor 17.
  • the upper disc 13 also has a large number of holes in the area of a filling station
  • solder balls 6 temporarily stored in the rotatable circular disk 11 are then conveyed to the capillaries 4, where they fall through holes in the lower disk 15 through the bore 5 to the tip of the capillary and there to the corresponding soldering point 3.
  • the latter movement can be achieved by Compressed air is supported, which is passed from a compressed air generator 21 via a pipeline 22 into the bore 5 and specifically into a section above the upper circular disk 13.
  • a compressed air generator 21 is passed from a compressed air generator 21 via a pipeline 22 into the bore 5 and specifically into a section above the upper circular disk 13.
  • Shielding gas can be used.
  • only one compressed air generator 21 is shown in FIG. 1.
  • each capillary has a connection 22 to the pressure generator 21.
  • the device can convey any number of solder balls to a corresponding number of soldering points per work cycle.
  • the capillaries are expediently aligned from the outset in the same way as the individual solder joints on the Workpiece arranged.
  • the device becomes more universal if the capillaries are arranged in grid dimensions and can be individually loaded with solder balls and controlled individually. This takes place after the invention by a suction station 19 which is arranged in the conveying path between the filling station 18 and the soldering station 4 '. There you can selectively go through individual tracks or. Circular paths 24, 25, 26, 27 or 28, the solder ball 6 present in the respective opening 12 are suctioned off and, if necessary. be transported back to the filling station, as by the line
  • All processes are controlled by a central control unit, that is to say the cyclical rotation of the circular conveyor device 10, the selective suction of individual solder balls at the suction station 19, the activation of the compressed air generator 21 and the activation of the laser 9.
  • a large number of holes 12, 14 are provided in the disks 11, 13.
  • the circular disk 11 is then only moved by the angle ⁇ per work cycle.
  • this presupposes that a corresponding number of cycles of the corresponding solder ball is suctioned off at the suction station 19 before the corresponding hole has reached the soldering station 4 '.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Laser Beam Processing (AREA)

Abstract

L'invention concerne un dispositif permettant d'appliquer des fragments de matériau sur une pièce d'usinage, qui comprend une pluralité de capillaires qui acheminent dans chaque cas en un cycle de travail un fragment de matériau (6) jusqu'à un poste de travail (3) où ils sont placés. Un poste de remplissage remplit un transporteur circulaire avec un nombre de fragments de matériau (6) correspondant aux capillaires (4). Sur le parcours de transport entre le poste de remplissage (18) et le poste d'usinage (4'), il est prévu un poste de prélèvement (19) qui prélève de manière sélective des fragments de matériau (6) individuels.
PCT/EP2001/011421 2000-10-06 2001-10-02 Procede et dispositif pour appliquer des fragments de materiau sur une piece d'usinage Ceased WO2002028589A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US10/398,787 US7021517B2 (en) 2000-10-06 2001-10-02 Method and device for applying pieces of material to a workpiece
DE50115447T DE50115447D1 (de) 2000-10-06 2001-10-02 Vorrichtung zur applikation von materialstücken auf ein werkstück
EP01972089A EP1326729B1 (fr) 2000-10-06 2001-10-02 Dispositif pour appliquer des fragments de materiau sur une piece d'usinage

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10049583 2000-10-06
DE10049583.4 2000-10-06

Publications (1)

Publication Number Publication Date
WO2002028589A1 true WO2002028589A1 (fr) 2002-04-11

Family

ID=7658917

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2001/011421 Ceased WO2002028589A1 (fr) 2000-10-06 2001-10-02 Procede et dispositif pour appliquer des fragments de materiau sur une piece d'usinage

Country Status (4)

Country Link
US (1) US7021517B2 (fr)
EP (1) EP1326729B1 (fr)
DE (1) DE50115447D1 (fr)
WO (1) WO2002028589A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130256281A1 (en) * 2012-03-30 2013-10-03 Tatsumi Tsuchiya Solder-jet nozzle, laser-soldering tool, and method, for lasersoldering head-connection pads of a head-stack assembly for a hard-disk drive
US9227260B2 (en) * 2013-02-14 2016-01-05 HGST Netherlands B.V. High-speed transportation mechanism for micro solder balls
US10730128B2 (en) 2016-01-20 2020-08-04 Western Digital Technologies, Inc. Reliable transportation mechanism for micro solder balls
JP6800768B2 (ja) * 2017-02-01 2020-12-16 株式会社日立製作所 半田付け装置
KR102174928B1 (ko) * 2019-02-01 2020-11-05 레이저쎌 주식회사 멀티 빔 레이저 디본딩 장치 및 방법
US11247285B1 (en) 2020-04-03 2022-02-15 Seagate Technology Llc Fluidization of agglomerated solder microspheres
CN118180531B (zh) * 2024-05-14 2024-08-06 湖南健坤精密科技有限公司 具有压平矫正功能的激光锡球焊接机及矫正方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5964162A (ja) * 1982-10-05 1984-04-12 Senjiyu Kinzoku Kogyo Kk はんだ付け方法およびその装置
JPH07202400A (ja) * 1993-12-30 1995-08-04 Sony Corp 球体供給方法及びその装置
JPH0870174A (ja) * 1994-08-30 1996-03-12 Matsushita Electric Ind Co Ltd 半田ボールの移載装置
DE19541996A1 (de) * 1995-11-10 1997-05-15 David Finn Vorrichtung zur Applikation von Verbindungsmaterialdepots
JP2000294681A (ja) * 1999-04-07 2000-10-20 Rohm Co Ltd Ｂｇａ型電子部品製造装置における半田ボール整列供給機構

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4320055A1 (de) * 1993-06-17 1994-12-22 Ghassem Dipl Ing Azdasht Belötungsvorrichtung
US6427903B1 (en) * 1997-02-06 2002-08-06 Speedline Technologies, Inc. Solder ball placement apparatus
US6119919A (en) * 1997-06-13 2000-09-19 Pac Tech - Packaging Technologies Gmbh Method and device for repairing defective soldered joints
US6003753A (en) * 1997-07-14 1999-12-21 Motorola, Inc. Air-blow solder ball loading system for micro ball grid arrays
US6386433B1 (en) * 1999-08-24 2002-05-14 Kulicke & Soffa Investments, Inc. Solder ball delivery and reflow apparatus and method
US6336581B1 (en) * 2000-06-19 2002-01-08 International Business Machines Corporation Solder ball connection device and capillary tube thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5964162A (ja) * 1982-10-05 1984-04-12 Senjiyu Kinzoku Kogyo Kk はんだ付け方法およびその装置
JPH07202400A (ja) * 1993-12-30 1995-08-04 Sony Corp 球体供給方法及びその装置
JPH0870174A (ja) * 1994-08-30 1996-03-12 Matsushita Electric Ind Co Ltd 半田ボールの移載装置
DE19541996A1 (de) * 1995-11-10 1997-05-15 David Finn Vorrichtung zur Applikation von Verbindungsmaterialdepots
JP2000294681A (ja) * 1999-04-07 2000-10-20 Rohm Co Ltd Ｂｇａ型電子部品製造装置における半田ボール整列供給機構

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 008, no. 170 (M - 315) 7 August 1984 (1984-08-07) *
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 11 26 December 1995 (1995-12-26) *
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 07 31 July 1996 (1996-07-31) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 13 5 February 2001 (2001-02-05) *

Also Published As

Publication number Publication date
EP1326729A1 (fr) 2003-07-16
US20040011852A1 (en) 2004-01-22
US7021517B2 (en) 2006-04-04
DE50115447D1 (de) 2010-06-02
EP1326729B1 (fr) 2010-04-21

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