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WO2002069365A3 - Cuve de traitement avec rotation de pièces à usiner micro-électroniques - Google Patents

Cuve de traitement avec rotation de pièces à usiner micro-électroniques Download PDF

Info

Publication number
WO2002069365A3
WO2002069365A3 PCT/US2002/005158 US0205158W WO02069365A3 WO 2002069365 A3 WO2002069365 A3 WO 2002069365A3 US 0205158 W US0205158 W US 0205158W WO 02069365 A3 WO02069365 A3 WO 02069365A3
Authority
WO
WIPO (PCT)
Prior art keywords
microelectronic workpieces
vessel
processing
rotatable fixture
processing microelectronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2002/005158
Other languages
English (en)
Other versions
WO2002069365A2 (fr
Inventor
Dana R Scranton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semitool Inc
Original Assignee
Semitool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semitool Inc filed Critical Semitool Inc
Priority to AU2002244101A priority Critical patent/AU2002244101A1/en
Publication of WO2002069365A2 publication Critical patent/WO2002069365A2/fr
Publication of WO2002069365A3 publication Critical patent/WO2002069365A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

L'invention concerne une machine de traitement destinée à traiter des pièces à usiner micro-électroniques dans un environnement en phase vapeur comprenant une cuve de traitement conçue de manière à contenir une ou plusieurs pièces à usiner micro-électroniques dans un agencement rotatif. Un moteur d'entraînement est couplé à l'agencement rotatif afin de le faire tourner durant le traitement. Un système d'introduction de gaz introduit un gaz dans la cuve de traitement en vue de traiter les pièces à usiner micro-électroniques. La machine de traitement peut être utilisée pour nettoyer, décaper ou ébarber les pièces à usiner micro-électroniques.
PCT/US2002/005158 2001-02-27 2002-02-21 Cuve de traitement avec rotation de pièces à usiner micro-électroniques Ceased WO2002069365A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002244101A AU2002244101A1 (en) 2001-02-27 2002-02-21 Vessel for processing microelectronic workpieces

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US79577601A 2001-02-27 2001-02-27
US09/795,776 2001-02-27

Publications (2)

Publication Number Publication Date
WO2002069365A2 WO2002069365A2 (fr) 2002-09-06
WO2002069365A3 true WO2002069365A3 (fr) 2002-12-19

Family

ID=25166412

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/005158 Ceased WO2002069365A2 (fr) 2001-02-27 2002-02-21 Cuve de traitement avec rotation de pièces à usiner micro-électroniques

Country Status (2)

Country Link
AU (1) AU2002244101A1 (fr)
WO (1) WO2002069365A2 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4403567A (en) * 1980-08-21 1983-09-13 Commonwealth Scientific Corporation Workpiece holder
US5672212A (en) * 1994-07-01 1997-09-30 Texas Instruments Incorporated Rotational megasonic cleaner/etcher for wafers
EP0805483A1 (fr) * 1995-10-17 1997-11-05 Asm Japan K.K. Appareil de traitement de semi-conducteurs
WO1999036588A1 (fr) * 1998-01-15 1999-07-22 Torrex Equipment Corporation Procede et dispositif pour procede ameliore de depot chimique en phase vapeur comprenant des injecteurs de gaz reglables a regulation de temperature

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4403567A (en) * 1980-08-21 1983-09-13 Commonwealth Scientific Corporation Workpiece holder
US5672212A (en) * 1994-07-01 1997-09-30 Texas Instruments Incorporated Rotational megasonic cleaner/etcher for wafers
EP0805483A1 (fr) * 1995-10-17 1997-11-05 Asm Japan K.K. Appareil de traitement de semi-conducteurs
WO1999036588A1 (fr) * 1998-01-15 1999-07-22 Torrex Equipment Corporation Procede et dispositif pour procede ameliore de depot chimique en phase vapeur comprenant des injecteurs de gaz reglables a regulation de temperature

Also Published As

Publication number Publication date
WO2002069365A2 (fr) 2002-09-06
AU2002244101A1 (en) 2002-09-12

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