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WO2001024281A1 - Optoelectronic component that comprises a reflector and method for producing said component - Google Patents

Optoelectronic component that comprises a reflector and method for producing said component Download PDF

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Publication number
WO2001024281A1
WO2001024281A1 PCT/DE2000/003448 DE0003448W WO0124281A1 WO 2001024281 A1 WO2001024281 A1 WO 2001024281A1 DE 0003448 W DE0003448 W DE 0003448W WO 0124281 A1 WO0124281 A1 WO 0124281A1
Authority
WO
WIPO (PCT)
Prior art keywords
leadframe
reflector
section
optoelectronic component
optoelectronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2000/003448
Other languages
German (de)
French (fr)
Inventor
Günter Waitl
Georg Borner
Rolf Hänggi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of WO2001024281A1 publication Critical patent/WO2001024281A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/407—Optical elements or arrangements indirectly associated with the devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H10W72/536—
    • H10W72/5363—
    • H10W90/756—

Definitions

  • the invention relates to an optoelectronic component, in particular a surface-mountable optoelectronic component, according to the preamble of claim 1, a method for producing such a component according to the preamble of claim 8 and a method for producing a leadframe (also called lead frame or lead strip) for an optoelectronic component.
  • a leadframe also called lead frame or lead strip
  • SMT Surface mounting technology
  • the component has a preformed housing body in which a central recess is formed. At the bottom of the recess there is an optically active semiconductor element, and the walls of the recess form reflector surfaces. To protect the active element from environmental influences, the recess is cast with a resin.
  • pre-housed components Such components, which have a preformed housing body, are also referred to in the art as “pre-housed” components.
  • thermomechanical shafts of the component components leadframe, housing body, semiconductor element and casting compound and to coordinate them with one another.
  • the reflector is realized by a trough-like shape of a lead frame section.
  • the light-emitting element is mounted on the bottom of the trough-like lead frame.
  • the component has a preformed housing base body which is molded onto the leadframe before the transmitter and / or receiver chip is mounted.
  • LED designs are described in EP 0 400 176 and in DE 4242 842 in which the inner surfaces of a recess in a basic housing body are designed as reflector surfaces.
  • JP-10242526 describes an LED design which does not have a lead frame, but rather a conductor track substrate on which the Conductor tracks are separated and the LED chip is mounted on one of these. There is also a reflector ring on the substrate that surrounds the chip.
  • the production of such LED designs is associated with increased outlay in comparison with production processes using lead frame strips, as are common in semiconductor technology. Adequate resistance to damaging environmental influences and adequate heat dissipation from the chip are also not readily achievable with such designs.
  • the invention has for its object to provide an optoelectronic component, in particular a pre-housed, surface-mountable optoelectronic component of the type mentioned at the outset with good optical radiation characteristics and a long service life.
  • pre-housed is to be understood to mean that the leadframe is provided with a basic housing body, preferably overmolded, before the transmitter and / or receiver element is installed.
  • This basic housing body is preferably made of plastic.
  • the invention aims to provide a method with which an optoelectronic component with the mentioned properties can be achieved.
  • the metallic reflector can be manufactured as a separate part and attached to the leadframe by soldering or welding.
  • a particularly preferred embodiment of the invention is characterized in that the reflector is designed as an integral reflector section of the lead frame.
  • the level of the assembly section is preferably at the level or above the leadframe level.
  • this is preferably a circumferential collar produced by shaping, in particular drawing press forming. Due to the closed collar shape in the circumferential direction, a high reflector quality can be achieved.
  • Another advantageous measure is characterized in that the outer circumference of the reflector widens with increasing distance from the leadframe plane.
  • the resulting undercut increases the anchoring strength of the sealing compound in the housing recess.
  • the invention brings significant advantages in the case of component designs in which the casting compound comprises at least two different casting materials. By using different potting materials, mechanical stresses acting on the transmitter / receiver can be reduced and, moreover, the course of the refractive index in the potting compound can be specifically set and / or luminescence converter materials can be introduced into the potting compound in a defined manner.
  • a reflector section on a leadframe for an optoelectronic component is particularly preferably produced by means of compression molding as a collar which runs at least partially around the mounting section of the leadframe for the optoelectronic transmitter and / or receiver.
  • FIG. 1A and 1B show a pre-housed optoelectronic SMT component in a perspective representation and in a sectional representation according to the prior art
  • FIG. 2 shows a perspective illustration of a lead frame with a housing body attached to it according to an exemplary embodiment of the invention
  • FIG. 3 shows a schematic longitudinal section through a lead frame in the region of the reflector section
  • Fig. 4 shows a first modification of that shown in Fig. 3
  • Fig. 5 shows a further modification of the structure shown in Fig. 3.
  • FIGS. 1A and 1B show a known SMT component as described in the article by Frank Möllmer et al. is described.
  • the component comprises a lead frame 1, to which a housing 2 is molded by injection molding.
  • a light-emitting semiconductor chip 4 is mounted on the leadframe 1 in a recess 3 of the housing and is electrically contacted there.
  • a potting 5 made of epoxy resin covers the semiconductor chip 4 for protection against environmental influences.
  • FIG. 2 shows a perspective view of an as yet unfinished optoelectronic SMT component according to the invention.
  • a housing body 12 is anchored to a pre-punched, metallic leadframe frame 10, only a section of which is shown in FIG. 2, by extrusion-coating with a high-temperature-resistant thermoplastic.
  • the housing body 12 has a central recess 13.
  • a leadframe 11 bordered by longitudinal slots 17, which is formed from a first leadframe tongue 11a and a second leadframe tongue 11b. Ends of the leadframe tongues 11a, 11b pointing towards one another are exposed in the recess 13 and are spaced apart from one another to ensure electrical separation.
  • the raised reflector section 15 can be manufactured by a drawing press process.
  • the leadframe frame 10 is placed on a base before the housing body 12 is attached and fixed from above by means of a ring sleeve.
  • the ring cuff has an annular hole of, for example, cylindrical shape.
  • a mandrel with an outer diameter that is reduced compared to the ring hole is brought down centrally on the leadframe tongue 11a.
  • the application of pressure causes the leadframe tongue 11a to be displaced in the area below the press mandrel.
  • the displaced material escapes into the annular gap between the press mandrel and the annular sleeve and thereby forms the collar-shaped reflector section 15.
  • the shape of the reflector section 15 is determined by the design of the press mandrel and the ring sleeve. In order to achieve a reflector with a directed light emission characteristic, the mandrel can have a conical outer shape.
  • a light-emitting semiconductor element 14 is inserted into the housing recess 13 in a next step.
  • the semiconductor element 14 is fixed on a mounting section (reflector base) 16 of the leadframe tongue 11a which is bordered by the reflector section 15 and is in electrically conductive connection with the latter.
  • a bond wire 18 is connected to the upper side of the semiconductor element 14, which at its other end (not shown) is electrically connected to the other leadframe tongue 11b
  • the recess 13 is then filled with a transparent, hardenable casting compound 19 which surrounds the semiconductor element 14 in a form-fitting manner.
  • the modification shown in FIG. 4 differs from the arrangement shown in FIG. 3 in that the outer circumference of the reflector section 15 'widens with increasing height above the tongue section 11a. Another difference is that two different potting materials 19a and 19b are used for the potting compound 19. The semiconductor element 14 is here surrounded by the potting material 19b, which fills the reflector section 15 '.
  • potting materials 19a, 19b By using different potting materials 19a, 19b, better thermomechanical stress relief of the semiconductor element 14 can be achieved, whereby the risk of the semiconductor element 14 becoming detached from the mounting section 16 is further reduced. Furthermore, there is the possibility of generating a refractive index gradient in the light path, o by a better optical adaptation (from the refractive index of the semiconductor element to the refractive index of air).
  • one or both potting materials 19a, 19b can also be partially transparent resins which are mixed with suitable luminescence converter materials (possibly different concentrations, distributions, material compositions, etc.).
  • FIG. 5 A further modification of the arrangement shown in FIG. 3 is shown in FIG. 5.
  • the mounting section 16 ' is designed to be elevated in relation to the plane of the leadframe tongue 11a.
  • the leadframe frame 10 is cut along the section lines 20 shown in dash-dotted lines in FIG. 2 and the outer ends of the leadframe tongues 11a, 11b are bent downward around the housing body 12 to form bottom-side contact areas according to FIG. 1B.
  • the reflector section (15, 15 ') on the leadframe is particularly preferably by means of extrusion molding as at least partially around the assembly section of the leadframe for the optoelectronic see transmitter and / or receiver manufactured surrounding collar.

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  • Led Device Packages (AREA)

Abstract

The invention relates to a surface-mountable optoelectronic component that comprises a leadframe (11; 11a, 11b) on which the body of a housing (12) is mounted. The body of the housing (12) is provided with one recess (13) which accommodates an optoelectronic transceiver that is mounted on a mounting section (16) of the leadframe (11, 11a). Said transceiver is covered by a transparent pourable sealing compound. A metallic reflector (15) surrounds the transceiver and extends beyond the plane of the leadframe.

Description

Beschreibungdescription

Optoelektronisches Bauelement mit Reflektor und Verfahren zur Herstellung desselbenOptoelectronic component with reflector and method for producing the same

Die Erfindung betrifft ein optoelektronisches Bauelement, insbesondere ein oberflächenmontierbares optoelektronisches Bauelement, nach dem Oberbegriff des Anspruchs 1, ein Verfahren zur Herstellung eines derartigen Bauelements nach dem Oberbegriff des Anspruchs 8 und ein Verfahren zur Herstellung eines Leadframes (auch Leiterrahmen oder Leiterband genannt) für ein optoelektronisches Bauelement.The invention relates to an optoelectronic component, in particular a surface-mountable optoelectronic component, according to the preamble of claim 1, a method for producing such a component according to the preamble of claim 8 and a method for producing a leadframe (also called lead frame or lead strip) for an optoelectronic component.

Derzeit löst die Oberflächenmontagetechnik (SMT) zunehmend die Bestückung von Leiterbahnträgern mit bedrahteten Bauelementen ab. Auch im Bereich der optoelektronischen Bauelemente setzen sich mehr und mehr SMT-Komponenten durch.Surface mounting technology (SMT) is currently increasingly replacing the mounting of conductor track carriers with wired components. SMT components are also becoming increasingly popular in the field of optoelectronic components.

Aus dem den nächstliegenden Stand der Technik repräsentieren- den Artikel "SIEMENS SMT-TOPLED für die Oberflächenmontage" ,From the article representing the closest state of the art "SIEMENS SMT-TOPLED for surface mounting",

Frank Möllmer und Günter aitl, SIEMENS Components 29 (1991), Heft 4, Seiten 147-149, ist eine für die Oberflächenmontage vorgesehene lichtemittierende Diode (LED) bekannt. Das Bauelement weist einen vorgeformten Gehäusekörper auf, in dem eine zentrale Ausnehmung gebildet ist. Am Boden der Ausnehmung befindet sich ein optisch aktives Halbleiterelement, und die Wände der Ausnehmung bilden Reflektorflächen. Zum Schutz des aktiven Elements vor Umwelteinflüssen ist die Ausnehmung mit einem Gießharz vergossen.Frank Möllmer and Günter aitl, SIEMENS Components 29 (1991), No. 4, pages 147-149, have disclosed a light-emitting diode (LED) intended for surface mounting. The component has a preformed housing body in which a central recess is formed. At the bottom of the recess there is an optically active semiconductor element, and the walls of the recess form reflector surfaces. To protect the active element from environmental influences, the recess is cast with a resin.

Derartige, einen vorgeformten Gehäusekörper aufweisende Bauelemente werden in der Technik auch als "vorgehäuste" Bauelemente bezeichnet.Such components, which have a preformed housing body, are also referred to in the art as “pre-housed” components.

Im praktischen Betrieb sind derartige Bauelemente häufig hohen thermischen und mechanischen Beanspruchungen ausgesetzt. Beispielsweise muß das Bauelement in der Automobiltechnik Temperaturwechseln zwischen -55°C und +100°C sowie Vibrationsbeanspruchungen bis zu 40 g standhalten können. Hierfür ist es erforderlich, die thermomechanisehen Schäften der Bauteilkomponenten Leadframe, Gehäusekörper, Halbleiterelement und Vergußmasse zu berücksichtigen und aufeinander abzustimmen.In practical operation, such components are often exposed to high thermal and mechanical stresses. For example, the component in automotive engineering Can withstand temperature changes between -55 ° C and + 100 ° C as well as vibrations up to 40 g. For this it is necessary to take into account the thermomechanical shafts of the component components leadframe, housing body, semiconductor element and casting compound and to coordinate them with one another.

Aus der DE 195 36 454 AI ist eine LED-Bauform bekannt, deren Reflektor durch eine muldenartige Ausformung eines Leadframe- abschnitts realisiert ist. Das lichtemittierende Element ist am Boden der muldenartigen Leadframeausformung montiert. Das Bauelement weist einen vorgeformten Gehäusegrundkörper auf, der vor der Montage des Sender- und/oder Empfängerchips an das Leadframe angeformt wird.From DE 195 36 454 AI an LED design is known, the reflector is realized by a trough-like shape of a lead frame section. The light-emitting element is mounted on the bottom of the trough-like lead frame. The component has a preformed housing base body which is molded onto the leadframe before the transmitter and / or receiver chip is mounted.

Weitere optoelektronische Bauelemente mit einem als Vertiefung des Leadframes ausgebildeten Reflektor sind in den U.S.Patentschriften 3,820,237 und 4,255,688 beschrieben. Diese Bauformen weisen keinen Gehäusegrundkörper auf, sondern werden in einem abschließenden Herstellungsschritt mit einer integralen Epoxidharz-Verkapselung versehen.Further optoelectronic components with a reflector designed as a recess in the leadframe are described in U.S. Patents 3,820,237 and 4,255,688. These designs do not have a basic body, but are provided with an integral epoxy encapsulation in a final manufacturing step.

In der U. S . -Patentschrift 3,914,786 ist eine lichtemittierende Diode beschrieben, deren Reflektor durch hochgeklappte randseitige Laschen des Leadframes realisiert ist, welche um das lichtemittierende Element herum angeordnet sind. Das Gehäuse der LED ist durch einen integralen Epoxidharz-Vergußkörper realisiert, welcher nach der Montage des lichtemittierenden Elements geformt wird.In the U.S. -Patentschrift 3,914,786 describes a light-emitting diode whose reflector is realized by folded-up edge-side tabs of the lead frame, which are arranged around the light-emitting element. The housing of the LED is realized by an integral epoxy resin potting body, which is molded after the light-emitting element has been installed.

In der EP 0 400 176 sowie in der DE 4242 842 sind LED-Bauformen beschrieben, bei denen die Innenflächen einer Ausnehmung eines Gehäusegrundkörpers als Reflektorflächen ausgebildet sind.LED designs are described in EP 0 400 176 and in DE 4242 842 in which the inner surfaces of a recess in a basic housing body are designed as reflector surfaces.

Die JP-10242526 beschreibt eine LED-Bauform, die kein Leadframe, sondern ein Leiterbahn-Substrat aufweist, auf dem die Leiterbahnen abgeschieden werden und auf einer von diesen der LED-Chip montiert wird. Auf dem Substrat befindet sich weiterhin ein Reflektorring, der den Chip umschließt. Die Herstellung derartiger LED-Bauformen ist gegenüber Herstellverfahren mit Leiterrahmenbändern, wie sie in der Halbleitertechnik üblich sind, mit erhöhtem Aufwand verbunden. Auch eine hinreichende Resistenz gegen schädigende Umwelteinflüsse und eine hinreichende Wärmeableitung vom Chip ist mit derartigen Bauformen nicht ohne Weiteres erzielbar.JP-10242526 describes an LED design which does not have a lead frame, but rather a conductor track substrate on which the Conductor tracks are separated and the LED chip is mounted on one of these. There is also a reflector ring on the substrate that surrounds the chip. The production of such LED designs is associated with increased outlay in comparison with production processes using lead frame strips, as are common in semiconductor technology. Adequate resistance to damaging environmental influences and adequate heat dissipation from the chip are also not readily achievable with such designs.

Der Erfindung liegt die Aufgabe zugrunde, ein optoelektronisches Bauelement, insbesondere ein vorgehäustes , oberflächen- montierbares optoelektronisches Bauelement der eingangs genannten Art mit guter optischer Abstrahlcharakteristik und einer hohen Lebensdauer zu schaffen.The invention has for its object to provide an optoelectronic component, in particular a pre-housed, surface-mountable optoelectronic component of the type mentioned at the outset with good optical radiation characteristics and a long service life.

Unter "vorgehäust" ist hierbei zu verstehen, dass das Leadframe vor Montage des Sender- und/oder Empfängerelements mit einem Grundgehäusekörper versehen, bevorzugt umspritzt wird. Dieser Grundgehäusekörper besteht vorzugsweise aus Kunststoff.In this context, “pre-housed” is to be understood to mean that the leadframe is provided with a basic housing body, preferably overmolded, before the transmitter and / or receiver element is installed. This basic housing body is preferably made of plastic.

Ferner zielt die Erfindung darauf ab, ein Verfahren anzugeben, mit dem ein optoelektronisches Bauelement mit den ge- nannten Eigenschaften erzielt werden kann.Furthermore, the invention aims to provide a method with which an optoelectronic component with the mentioned properties can be achieved.

Die der Erfindung zugrundeliegende Aufgabenstellung wird durch ein optoelektronisches Bauelement mit den Merkmalen des Anspruches 1 und durch ein Verfahren mit den Merkmalen des Anspruches 8 gelöst. Ein Verfahren zum Herstellen eines Leadframes für ein erfindungsgemäßes optoelektronisches Bauelement ist Gegenstand des Patentanspruches 11.The problem underlying the invention is solved by an optoelectronic component with the features of claim 1 and by a method with the features of claim 8. A method for producing a leadframe for an optoelectronic component according to the invention is the subject of patent claim 11.

Bevorzugte Weiterbildungen und Ausführungsformen sind Gegen- stand der Patentansprüche 2 bis 7, 9 und 10. Durch die Verwendung eines metallischen Reflektors weist das Bauelement eine gute Abstrahlcharakteristik auf. Allerdings stellte sich bei Versuchen, die im Rahmen der Erfindung durchgeführt wurden, heraus, daß die Lebensdauer des vorge- hausten Bauelements empfindlich von der Lage des Reflektors abhängig ist. Nur mit einem Reflektor, der über die Lead- frame-Ebene hinausragt, werden vorgehäuste Bauelemente mit guter thermischer Langzeitstabilität, d.h. langer Lebensdauer, erreichbar. Bei bezüglich der Leadframe-Ebene vertieft ausgebildeten Reflektoren traten indessen signifikant häufiger und frühzeitiger mechanische Schädigungen, wie beispielsweise ein Ablösen der optoelektronischen Sender- bzw. Empfängerchips von dem Leadframe, auf.Preferred developments and embodiments are the subject of claims 2 to 7, 9 and 10. By using a metallic reflector, the component has good radiation characteristics. However, it was found in tests that were carried out within the scope of the invention that the service life of the preheated component is sensitive to the position of the reflector. Pre-housed components with good long-term thermal stability, ie long service life, can only be achieved with a reflector that extends beyond the lead frame level. In the case of reflectors which were designed to be recessed with respect to the leadframe level, however, mechanical damage, such as detachment of the optoelectronic transmitter or receiver chips from the leadframe, occurred significantly more frequently and at an early stage.

Grundsätzlich kann der metallische Reflektor als separates Teil gefertigt und durch Auflöten oder Aufschweißen auf dem Leadframe angebracht werden. Eine besonders bevorzugte Ausgestaltung der Erfindung kennzeichnet sich jedoch dadurch, daß der Reflektor als integraler Reflektorabschnitt des Leadfra- mes ausgebildet ist.In principle, the metallic reflector can be manufactured as a separate part and attached to the leadframe by soldering or welding. A particularly preferred embodiment of the invention, however, is characterized in that the reflector is designed as an integral reflector section of the lead frame.

Vorzugsweise liegt die Ebene des Montageabschnitts auf Höhe oder oberhalb der Leadframe-Ebene .The level of the assembly section is preferably at the level or above the leadframe level.

Im Falle eines Leadframe-integralen Reflektorabschnitts ist dieser vorzugsweise ein durch Umformen, insbesondere Zieh- preßumformen, hergestellter umlaufender Kragen. Durch die in Umfangsrichtung geschlossene Kragenform kann eine hohe Reflektorqualität erreicht werden.In the case of a leadframe-integral reflector section, this is preferably a circumferential collar produced by shaping, in particular drawing press forming. Due to the closed collar shape in the circumferential direction, a high reflector quality can be achieved.

Eine weitere vorteilhafte Maßnahme kennzeichnet sich dadurch, daß sich der Außenumfang des Reflektors mit zunehmendem Abstand von der Leadframe-Ebene erweitert. Der dadurch entstehende Hinterschnitt erhöht die Verankerungsfestigkeit der Vergußmasse in der Gehäuseausnehmung . Deutliche Vorteile bringt die Erfindung bei Bauelementausführungen, bei denen die Vergußmasse wenigstens zwei unterschiedliche Vergußmaterialien umfaßt. Durch Verwendung unterschiedlicher Vergußmaterialien können auf den Sender/Empfän- ger einwirkende mechanische Spannungen vermindert werden und darüber hinaus der Verlauf des Brechungsindex in der Vergußmasse gezielt eingestellt und/oder Lumineszenz-Konverterstoffe definiert in die Vergußmasse eingebracht werden.Another advantageous measure is characterized in that the outer circumference of the reflector widens with increasing distance from the leadframe plane. The resulting undercut increases the anchoring strength of the sealing compound in the housing recess. The invention brings significant advantages in the case of component designs in which the casting compound comprises at least two different casting materials. By using different potting materials, mechanical stresses acting on the transmitter / receiver can be reduced and, moreover, the course of the refractive index in the potting compound can be specifically set and / or luminescence converter materials can be introduced into the potting compound in a defined manner.

Besonders bevorzugt wird ein Reflektorabschnitt an einem Leadframe für ein optoelektronisches Bauelement, mittels Ziehpreßumformen als zumindest teilweise um den Montageabschnitt des Leadframes für den optoelektronischen Sender und/oder Empfänger umlaufender Kragen hergestellt.A reflector section on a leadframe for an optoelectronic component is particularly preferably produced by means of compression molding as a collar which runs at least partially around the mounting section of the leadframe for the optoelectronic transmitter and / or receiver.

Weitere vorteilhafte Ausgestaltungen der Erfindung sind in den Unteransprüchen angegeben.Further advantageous embodiments of the invention are specified in the subclaims.

Die Erfindung wird nachfolgend anhand eines Ausführungsbei- spiels unter Bezugnahme auf die Zeichnung näher erläutert; in dieser zeigt:The invention is explained in more detail below on the basis of an exemplary embodiment with reference to the drawing; in this shows:

Fig. 1A und 1B ein vorgehäustes optoelektronisches SMT-Bau- element in perspektivischer Darstellung und in Schnittdarstellung nach dem Stand der Technik;1A and 1B show a pre-housed optoelectronic SMT component in a perspective representation and in a sectional representation according to the prior art;

Fig. 2 eine perspektivische Darstellung eines Leadframes mit daran angebrachtem Gehäusekörper gemäß einem Ausführungsbeispiel der Erfindung;FIG. 2 shows a perspective illustration of a lead frame with a housing body attached to it according to an exemplary embodiment of the invention; FIG.

Fig. 3 eine schematische Längsschnittdarstellung durch ein Leadframe im Bereich des Reflektorabschnitts ;3 shows a schematic longitudinal section through a lead frame in the region of the reflector section;

Fig. 4 eine erste Abwandlung der in Fig. 3 gezeigtenFig. 4 shows a first modification of that shown in Fig. 3

Struktur; und Fig. 5 eine weitere Abwandlung der in Fig. 3 gezeigten Struktur.Structure; and Fig. 5 shows a further modification of the structure shown in Fig. 3.

Die Figuren 1A und 1B zeigen ein bekanntes SMT-Bauelement , wie es in dem eingangs genannten Artikel von Frank Möllmer et al . beschrieben ist. Das Bauelement umfaßt ein Leadframe 1, an welches durch Umspritzen ein Gehäuse 2 angeformt ist. In einer Ausnehmung 3 des Gehäuses ist ein lichtemittierender Halbleiter-Chip 4 auf das Leadframe 1 montiert und dort elek- trisch kontaktiert. Ein Verguß 5 aus Epoxidharz deckt den Halbleiter-Chip 4 zum Schutz gegen Umwelteinflüsse ab.FIGS. 1A and 1B show a known SMT component as described in the article by Frank Möllmer et al. is described. The component comprises a lead frame 1, to which a housing 2 is molded by injection molding. A light-emitting semiconductor chip 4 is mounted on the leadframe 1 in a recess 3 of the housing and is electrically contacted there. A potting 5 made of epoxy resin covers the semiconductor chip 4 for protection against environmental influences.

Fig. 2 zeigt in perspektivischer Darstellung ein noch nicht fertiggestelltes optoelektronisches SMT-Bauelement nach der Erfindung. An einem vorgestanzten, metallischen Leadframe- rahmen 10, von welchem in Fig. 2 lediglich ein Ausschnitt dargestellt ist, ist durch Umspritzen mit einem hochtempera- turfesten Thermoplast ein Gehäusekörper 12 verankert. Der Gehäusekörper 12 weist eine zentrale Ausnehmung 13 auf . In dem Leadframerahmen 10 ist ein von Längsschlitzen 17 berandetes Leadframe 11 vorgesehen, das aus einer ersten Leadframezunge 11a und einer zweiten Leadframezunge 11b gebildet ist. Zueinander hinweisende Enden der Leadframezungen 11a, 11b liegen in der Ausnehmung 13 frei und sind zur Gewährleistung einer elektrischen Trennung voneinander beabstandet.2 shows a perspective view of an as yet unfinished optoelectronic SMT component according to the invention. A housing body 12 is anchored to a pre-punched, metallic leadframe frame 10, only a section of which is shown in FIG. 2, by extrusion-coating with a high-temperature-resistant thermoplastic. The housing body 12 has a central recess 13. Provided in the leadframe frame 10 is a leadframe 11 bordered by longitudinal slots 17, which is formed from a first leadframe tongue 11a and a second leadframe tongue 11b. Ends of the leadframe tongues 11a, 11b pointing towards one another are exposed in the recess 13 and are spaced apart from one another to ensure electrical separation.

An dem freien Ende der Leadframezunge 11a ist ein über die Ebene der Leadframezunge 11a hervorstehender Reflektorabschnitt 15 ausgebildet.At the free end of the leadframe tongue 11a, a reflector section 15 protruding beyond the plane of the leadframe tongue 11a is formed.

Der erhabene Reflektorabschnitt 15 kann durch ein Ziehpreßverfahren gefertigt werden.The raised reflector section 15 can be manufactured by a drawing press process.

Hierfür wird der Leadframerahmen 10 vor dem Anbringen des Ge- häusekörpers 12 auf eine Unterlage gelegt und von oben mittels einer Ringmanschette fixiert. Die Ringmanschette weist ein Ringloch von beispielsweise zylindrischer Formgebung auf. Nun wird unter hoher Druckanwendung ein Preßdorn mit einem gegenüber dem Ringloch reduzierten Außendurchmesser im Ringloch zentrisch auf die Leadframezunge 11a niedergebracht. Die Druckanwendung bewirkt eine Materialverdrängung der Leadfra- mezunge 11a im Bereich unterhalb des Preßdorns . Das verdrängte Material entweicht in den Ringspalt zwischen dem Preßdorn und der Ringmanschette und bildet dabei den kragen- förmigen Reflektorabschnitt 15.For this purpose, the leadframe frame 10 is placed on a base before the housing body 12 is attached and fixed from above by means of a ring sleeve. The ring cuff has an annular hole of, for example, cylindrical shape. Now, under high pressure, a mandrel with an outer diameter that is reduced compared to the ring hole is brought down centrally on the leadframe tongue 11a. The application of pressure causes the leadframe tongue 11a to be displaced in the area below the press mandrel. The displaced material escapes into the annular gap between the press mandrel and the annular sleeve and thereby forms the collar-shaped reflector section 15.

Die Formgebung des Reflektorabschnitts 15 wird durch die Gestaltung des Preßdorns und der Ringmanschette bestimmt. Zur Erzielung eines Reflektors mit einer gerichteten Licht-Abstrahlcharakteristik kann der Preßdorn eine konische Außenform haben.The shape of the reflector section 15 is determined by the design of the press mandrel and the ring sleeve. In order to achieve a reflector with a directed light emission characteristic, the mandrel can have a conical outer shape.

Nach dem bereits beschriebenen Anbringen des Gehäusekörpers 12 an dem Leadframerahmen 10 wird in einem nächsten Schritt ein lichtemittierendes Halbleiterelement 14 in die Gehäuse- ausnehmung 13 eingesetzt. Das Halbleiterelement 14 wird auf einem von dem Reflektorabschnitt 15 berandeten Montageabschnitt (Reflektorboden) 16 der Leadframezunge 11a fixiert und steht mit diesem in elektrisch leitender Verbindung. An die Oberseite des Halbleiterelements 14 wird ein Bonddraht 18 ankontaktiert , welcher an seinem anderen Ende (nicht darge- stellt) mit der anderen Leadframezunge 11b in elektrischerAfter the housing body 12 has already been attached to the leadframe frame 10, a light-emitting semiconductor element 14 is inserted into the housing recess 13 in a next step. The semiconductor element 14 is fixed on a mounting section (reflector base) 16 of the leadframe tongue 11a which is bordered by the reflector section 15 and is in electrically conductive connection with the latter. A bond wire 18 is connected to the upper side of the semiconductor element 14, which at its other end (not shown) is electrically connected to the other leadframe tongue 11b

Verbindung steht.Connection is established.

Anschließend wird die Ausnehmung 13 mit einer transparenten, aushärtbaren Vergußmasse 19 befüllt, welche das Halbleiter- element 14 formschlüssig umgibt.The recess 13 is then filled with a transparent, hardenable casting compound 19 which surrounds the semiconductor element 14 in a form-fitting manner.

Die in Fig. 4 gezeigte Abwandlung unterscheidet sich von der in Fig. 3 dargestellten Anordnung dadurch, daß sich der Außenumfang des Reflektorabschnitts 15 ' mit zunehmender Höhe über dem Zungenabschnitt 11a erweitert. Ein weiterer Unterschied besteht darin, daß zwei unterschiedliche Vergußmaterialien 19a und 19b für die Vergußmasse 19 verwendet werden. Das Halbleiterelement 14 ist hier von dem Vergußmaterial 19b umgeben, welches den Reflektorabschnitt 15' befüllt.The modification shown in FIG. 4 differs from the arrangement shown in FIG. 3 in that the outer circumference of the reflector section 15 'widens with increasing height above the tongue section 11a. Another difference is that two different potting materials 19a and 19b are used for the potting compound 19. The semiconductor element 14 is here surrounded by the potting material 19b, which fills the reflector section 15 '.

Durch die Verwendung verschiedener Vergußmaterialien 19a, 19b kann eine bessere thermomechanische Spannungsentlastung des Halbleiterelements 14 erreicht werden, wodurch die Gefahr eines Lösens des Halbleiterelements 14 von dem Montageabschnitt 16 weiter reduziert wird. Ferner ergibt sich die Möglichkeit, einen Brechungsindex-Gradienten im Lichtweg zu erzeugen, o- durch eine bessere optische Anpassung (von dem Brechungsindex des Halbleiterelements zu dem Brechungsindex von Luft) ermöglicht wird. Jeweils eines oder beide Vergußmaterialien 19a, 19b können ferner teiltransparente Harze sein, welche mit geeigneten Lumineszenz-Konverterstoffen (gegebenenfalls unter- schiedlicher Konzentrationen, Verteilungen, stofflicher Zusammensetzungen, usw.) versetzt sind.By using different potting materials 19a, 19b, better thermomechanical stress relief of the semiconductor element 14 can be achieved, whereby the risk of the semiconductor element 14 becoming detached from the mounting section 16 is further reduced. Furthermore, there is the possibility of generating a refractive index gradient in the light path, o by a better optical adaptation (from the refractive index of the semiconductor element to the refractive index of air). In each case one or both potting materials 19a, 19b can also be partially transparent resins which are mixed with suitable luminescence converter materials (possibly different concentrations, distributions, material compositions, etc.).

Eine weitere Abwandlung der in Fig. 3 gezeigten Anordnung ist in Fig. 5 dargestellt. Der Montageabschnitt 16' ist hier er- höht gegenüber der Ebene der Leadframezunge 11a ausgebildet.A further modification of the arrangement shown in FIG. 3 is shown in FIG. 5. The mounting section 16 'is designed to be elevated in relation to the plane of the leadframe tongue 11a.

Sämtlichen in den Fig. 3, 4 und 5 gezeigten Varianten ist gemeinsam, daß der Reflektorabschnitt 15, 15' als ein freistehender, über die Leadframe-Ebene hinausragender Leadframeab- schnitt realisiert ist, und daß sich der Montageabschnitt 16, 16' in der Leadframe-Ebene oder oberhalb derselben erstreckt.All of the variants shown in FIGS. 3, 4 and 5 have in common that the reflector section 15, 15 'is realized as a free-standing lead frame section which projects beyond the lead frame level, and that the mounting section 16, 16' is located in the lead frame - Level or above it.

In einem weiteren Verfahrensschritt wird der Leadframerahmen 10 entlang der in Fig. 2 strichpunktiert eingezeichneten Schnittlinien 20 aufgetrennt und die äußeren Enden der Lead- framezungen 11a, 11b werden zur Ausbildung bodenseitiger Kontaktflächen gemäß Fig. 1B nach unten um den Gehäusekörper 12 herumgebogen .In a further method step, the leadframe frame 10 is cut along the section lines 20 shown in dash-dotted lines in FIG. 2 and the outer ends of the leadframe tongues 11a, 11b are bent downward around the housing body 12 to form bottom-side contact areas according to FIG. 1B.

Besonders bevorzugt wird der Reflektorabschnitt (15, 15') am Leadframe mittels Ziehpreßumformen als zumindest teilweise um den Montageabschnitt des Leadframes für den optoelektroni- sehen Sender und/oder Empfänger umlaufender Kragen hergestellt. The reflector section (15, 15 ') on the leadframe is particularly preferably by means of extrusion molding as at least partially around the assembly section of the leadframe for the optoelectronic see transmitter and / or receiver manufactured surrounding collar.

Claims

Patentansprüche claims 1. Optoelektronisches Bauelement,1. optoelectronic component, - mit einem eine Leadframe-Ebene definierenden metallischen Leadframe (11; 11a, 11b),with a metallic leadframe (11; 11a, 11b) defining a leadframe level, - mit einem optoelektronischen Sender und/oder Empfänger- With an optoelectronic transmitter and / or receiver (14), welcher auf einem Montageabschnitt (16, 16') des Leiterframes (11; 11a, 11b) montiert ist, mit einem Gehäusekörper (12), welcher eine Ausnehmung (13) aufweist, in welcher der optoelektronische Sender und/oder Empfänger (14) angeordnet ist, mit einer transparenten Vergußmasse (19), welche den Sender und/oder Empfänger (14) abdeckt,(14), which is mounted on a mounting section (16, 16 ') of the conductor frame (11; 11a, 11b), with a housing body (12) which has a recess (13) in which the optoelectronic transmitter and / or receiver (14) is arranged, with a transparent casting compound (19), which covers the transmitter and / or receiver (14), - mit einem metallischen Reflektor (15, 15'), der den Sender und/oder Empfänger (14) umgibt, und der über die Leadframe-Ebene hinausragt d a d u r c h g e k e n n z e i c h n e t, daß der Reflektor als am Leadframe (11; 11a, 11b) ausgebildeter Reflektorabschnitt (15, 15') in Form eines inner- halb der Ausnehmung zumindest teilweise um den Sender und/oder Empfänger (14) umlaufenden Kragens realisiert ist .- With a metallic reflector (15, 15 ') which surrounds the transmitter and / or receiver (14) and which projects beyond the leadframe level, characterized in that the reflector is designed as a reflector section (11; 11a, 11b) on the leadframe (11; 15, 15 ') in the form of a collar which at least partially surrounds the transmitter and / or receiver (14) within the recess. 2. Optoelektronisches Bauelement nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t,2. Optoelectronic component according to claim 1, d a d u r c h g e k e n n z e i c h n e t, - daß der Reflektor als im Leadframe (11; 11a, 11b) integral ausgebildeter Reflektorabschnitt (15, 15') realisiert ist.- That the reflector is realized as an integrally formed reflector section (15, 15 ') in the lead frame (11; 11a, 11b). 3. Optoelektronisches Bauelement nach Anspruch 1 oder 2, d a d u r c h g e k e n n z e i c h n e t,3. Optoelectronic component according to claim 1 or 2, d a d u r c h g e k e n n z e i c h n e t, - daß die Ebene des Montageabschnitts (16, 16') auf Höhe oder oberhalb der Leadframe-Ebene liegt.- That the level of the assembly section (16, 16 ') is at the level or above the leadframe level. 4. Optoelektronisches Bauelement nach Anspruch 2 oder 3, d a d u r c h g e k e n n z e i c h n e t, - daß der Reflektorabschnitt (15, 15') ein durch Umformen, insbesondere Ziehpreßumformen hergestellter umlaufender Kragen ist.4. Optoelectronic component according to claim 2 or 3, characterized in - That the reflector section (15, 15 ') is a circumferential collar made by forming, in particular drawing press forming. 5. Optoelektronisches Bauelement nach einem der vorhergehenden Ansprüche, d a d u r c h g e k e n n z e i c h n e t,5. Optoelectronic component according to one of the preceding claims, d a d u r c h g e k e n n z e i c h n e t, - daß sich der Außenumfang des Reflektors (15, 15') mit zunehmendem Abstand von der Leadframe-Ebene erweitert.- That the outer circumference of the reflector (15, 15 ') widens with increasing distance from the lead frame level. 6. Optoelektronisches Bauelement nach einem der vorhergehenden Ansprüche, d a d u r c h g e k e n n z e i c h n e t,6. Optoelectronic component according to one of the preceding claims, d a d u r c h g e k e n n z e i c h n e t, - daß die Vergußmasse (19) wenigstens zwei unterschiedliche Vergußmaterialien (19a, 19b) umfaßt.- That the potting compound (19) comprises at least two different potting materials (19a, 19b). 7. Optoelektronisches Bauelement nach Anspruch 5 , d a d u r c h g e k e n n z e i c h n e t,7. The optoelectronic component as claimed in claim 5, d a d u r c h g e k e n n z e i c h n e t, - daß sich ein erstes Vergußmaterial (19b) in dem Reflektor (15, 15') befindet und ein zweites Vergußmaterial (19a) das erste Vergußmaterial (19b) abdeckt.- That there is a first potting material (19b) in the reflector (15, 15 ') and a second potting material (19a) covers the first potting material (19b). 8. Verfahren zur Herstellung eines optoelektronischen Bauelements, mit den Schritten: - Anbringen eines Gehäusekörpers (12) mit einer Ausnehmung8. A method for producing an optoelectronic component, comprising the steps: - attaching a housing body (12) with a recess (13) an einem eine Leadframe-Ebene definierenden metallischen Leadframe (11; 11a, 11b);(13) on a metallic leadframe (11; 11a, 11b) defining a leadframe plane; - Anbringen eines optoelektronischen Senders und/oder Empfängers (14) auf einem in der Ausnehmung (13) liegenden Monta- geabschnitt (16, 16') des Leadframes (11; 11a, 11b);- Attaching an optoelectronic transmitter and / or receiver (14) to an assembly section (16, 16 ') of the lead frame (11; 11a, 11b) lying in the recess (13); - Befüllen der Ausnehmung (13) mit einer transparenten Vergußmasse (19) ; d a d u r c h g e k e n n z e i c h n e t,- Filling the recess (13) with a transparent potting compound (19); characterized, - daß vor dem Anbringen des Gehäusekörpers (12) an dem Lead- frame (11; 11a, 11b) ein über die Leadframe-Ebene hinausragender metallischer Reflektor (15, 15') in Form eines um den Montageabschnitt (16, 16') umlaufenden Kragens ausge- bildet wird, der sich später innerhalb der Ausnehmung (13) befindet .- That before attaching the housing body (12) to the lead frame (11; 11a, 11b) a metallic reflector (15, 15 ') projecting beyond the leadframe level in the form of a circumferential around the mounting section (16, 16') Collar is formed, which is later within the recess (13). 9. Verfahren nach Anspruch 8 , d a d u r c h g e k e n n z e i c h n e t,9. The method according to claim 8, d a d u r c h g e k e n n z e i c h n e t, - daß der Reflektor als integraler Reflektorabschnitte (15, 15') des Leadframes (11; 11a, 11b) mittels eines Umformverfahrens, insbesondere eines kalten Ziehpreßumformverfah- rens , realisiert wird.- That the reflector as an integral reflector sections (15, 15 ') of the leadframe (11; 11a, 11b) is realized by means of a forming process, in particular a cold drawing press forming process. 10. Verfahren nach Anspruch 8 oder 9, d a d u r c h g e k e n n z e i c h n e t,10. The method according to claim 8 or 9, d a d u r c h g e k e n n z e i c h n e t, - daß beim Befüllungsschritt mindestens zwei unterschiedliche Vergußmaterialien (19a, 19b) verwendet werden.- That at least two different potting materials (19a, 19b) are used in the filling step. 11. Verfahren zum Herstellen eines Leadframes (11; 11a, 11b) mit mindestens einem integral ausgebildeten Reflektorabschnitt (15, 15') für ein optoelektronisches Bauelement, d a d u r c h g e k e n n z e i c h n e t, daß am Leadframe mittels Ziehpreßumformen ein zumindest teilweise um einen Montageabschnitt für einen optoelektronischen Sender und/oder Empfänger umlaufender Kragen hergestellt wird, der den Reflektorabschnitt (15, 15') darstellt. 11. A method for producing a leadframe (11; 11a, 11b) with at least one integrally formed reflector section (15, 15 ') for an optoelectronic component, characterized in that on the leadframe by means of drawing press forming an at least partially around a mounting section for an optoelectronic transmitter and / or receiver circumferential collar is produced, which represents the reflector section (15, 15 ').
PCT/DE2000/003448 1999-09-30 2000-09-29 Optoelectronic component that comprises a reflector and method for producing said component Ceased WO2001024281A1 (en)

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DE19947044A1 (en) 2001-05-17
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