DE102007005630B4 - Sensor chip module and method for producing a sensor chip module - Google Patents

Abstract

A sensor chip module, comprising: a sensor chip (3), a semiconductor chip (5), a flexible chip carrier (1, 11, 100) having a common surface on which the sensor chip (3) and the semiconductor chip (5) are mounted Module housing (2, 6, 2, 106), which defines a mounting plane of the sensor chip module and a sensor chip receiving sensor chip cavity housing (2) and a semiconductor chip (5) receiving semiconductor chip housing (6, 106), wherein the Chip carrier (1, 11, 100) is bent in the region between the two housings in such a way that an active surface of the sensor chip (3) relative to the mounting plane of the sensor chip module is inclined and a side wall (6a, 106) of the semiconductor chip housing (6, 106) closes an opening of the sensor chip cavity housing (2).

Description

The invention relates to modules containing a sensor chip and to a method for their production.

Semiconductor sensor modules are known in the art whose functionality depends on the orientation of the semiconductor sensor chip with respect to the three spatial directions. Examples include sensors or transmitters with directional radiation. These include optical sensors and transmitters and, for example, motion sensors (for example acceleration sensors) which, due to the design, detect movements in the different spatial directions with different response characteristics depending on the orientation of the sensor in the room.

Sensor chips are typically installed planar in a semiconductor housing, wherein the active surface of the sensor chip is parallel to the mounting plane of the semiconductor package on an application board. If a different orientation of the sensor chip relative to the application board is to be achieved, the sensor chip module is usually mounted on a small auxiliary circuit board, which is then mounted in the desired orientation (e.g., perpendicular) on the application board. This is associated with a relatively high installation costs.

The publication US 6 035 712 A relates to a method for manufacturing an acceleration sensor. In this method, a sensor chip is applied to a leadframe in a first step, which is made of a carrier element and multiple leads. By bending the carrier element of the sensor chip is brought into a vertical position and then completely shed with a potting compound. The DE 10 2004 019 428 A1 shows a semiconductor device with a cavity housing, wherein a sensor chip and a Signalauswertungschip are arranged on the same support in the cavity housing. The EP 0 557 917 A1 shows a module in which acceleration sensors are arranged in a small space and perpendicular to the transmitter.

It is an object of the present invention to provide an improved sensor chip module that is simpler to manufacture and assemble.

Against this background, a sensor chip module is provided, which comprises a sensor chip, a semiconductor chip and a flexible chip carrier, on which the sensor chip and the semiconductor chip are applied. Furthermore, the sensor chip module comprises a module housing, which defines a mounting plane of the sensor chip module and a sensor chip receiving sensor chip cavity housing and a semiconductor chip receiving semiconductor chip housing, wherein the chip carrier is bent in such a way that an active surface of the sensor chip is inclined relative to the mounting plane of the sensor chip module and a wall of the semiconductor chip housing closes an opening of the sensor chip cavity housing.

• 1 schematische Schnittdarstellungen eines herkömmlichen Sensorchip-Moduls in unterschiedlichen Prozess-Schritten der Fertigung;
• 2 ein Flussdiagramm zur Erläuterung des Fertigungsablaufs des Sensorchip-Moduls gemäß 1;
• 3 bis 7 schematische Schnittdarstellungen von Ausführungsbeispielen des erfindungsgemäßen Sensorchip-Moduls in unterschiedlichen Prozess-Schritten der Fertigung;
• 8 und 9 weitere Ausführungsbeispiele vom erfindungsgemäßen Sensorchip-Modul in schematischen Schnittdarstellungen;
• 10 eine schematische Grundrissdarstellung der Sensorchip-Module gemäß den 3 bis 9; und
• 11 schematische Schnittdarstellungen eines weiteren Ausführungsbeispiels in unterschiedlichen Prozess-Schritten der Fertigung.

Embodiments of the invention are explained in more detail below by way of example with reference to the drawing. In this show:

• 1 schematic sectional views of a conventional sensor chip module in different process steps of manufacturing;
• 2 a flowchart for explaining the manufacturing process of the sensor chip module according to 1 ;
• 3 to 7 schematic sectional views of embodiments of the sensor chip module according to the invention in different process steps of manufacturing;
• 8th and 9 further embodiments of the sensor chip module according to the invention in schematic sectional views;
• 10 a schematic plan view of the sensor chip modules according to the 3 to 9 ; and
• 11 schematic sectional views of another embodiment in different process steps of manufacturing.

In the following, conventional modules are described with a semiconductor sensor chip whose active surface is inclined with respect to the mounting plane of the module, that is not parallel. In this case, the semiconductor sensor chip can be of very different types. For example, it may contain electromechanical or electro-optical functional elements in the region of its active surface. It can be realized in the form of a direction-dependent sensor chip. A sensor chip can be embodied as a so-called MEMS (micro-electro-mechanical system), ie microelectronic mechanical system, in which case micromechanical movable structures such as, for example, bridges, membranes or tongue structures can be provided. Such sensor chips may in particular be motion sensors which may be designed as acceleration sensors (which detect accelerations in different spatial directions) or rotation sensors. Such sensors are also referred to as gyrosensors, roll-over sensors, impact sensors, intertial sensors, etc., and are used, for example, in the automotive industry for signal acquisition in ESP (Electronic Stability Program). Systems, ABS (anti-lock braking systems), airbags and the like used.

Semiconductor sensor modules, in which such functional elements are embedded, usually comprise electronic circuits which serve to control the functional elements. Such electronic circuits may be implemented either on the functional element forming semiconductor sensor chip or on a separate semiconductor chip integrated into the module. For example, in the case of a motion sensor, the deflection of a movable microfunction element can be read piezoresistively or capacitively and further processed in such electronic circuits. The separate semiconductor chip may, for example, be embodied as an ASIC (Application Specific Integrated Circuit) and, e.g. have radio frequency (RF) functionality for wireless signal routing.

The 1 and 2 relate manufacturing steps for the production of such a conventional sensor chip module (eg motion sensor). The starting point for the production is, for example, a flat, unbent metal leadframe which, as usual in the art, is referred to below as the leadframe 1 is referred to, see step S1 the 2 , The surface plane of the leadframe 1 is parallel to the later mounting level of the sensor chip module.

Such a leadframe 1 For example, by punching or etching from a thin metal layer (the thickness of the metal layer may be, for example, in the range of 0.1 mm to several millimeters) of a metal strip can be generated. Leadframes are also referred to as lead frames or punched grids and serve both as a chip carrier and for the realization of the supply lines (legs) for the external contacting of the sensor chip module. Due to the high reliability of modules with leads, leadframe-based modules are widely used in the automotive industry.

In a next step S2 becomes a hollow housing 2 to the leadframe 1 appropriate. In the following, the terms "hollow housing" and "cavity housing" are assumed to be synonymous. The hollow housing 2 is typically prior to mounting the sensor chip by plastic encapsulation of the leadframe 1 manufactured. After encapsulating the leadframe 1 is the plastic hollow housing 2 stuck with the leadframe 1 connected.

In a next step S3 becomes a sensor chip 3 in the hollow housing 2 used on the leadframe 1 mounted and with connection elements 1a of the leadframe 1 electrically connected. The mounting of the sensor chip 3 on the leadframe 1 can be done for example by gluing or soldering. According to 1 can the electrical contact of the sensor chip 3 over bonding wires 4 which are different from the active surface of the sensor chip 3 to the connection elements 1a extend. Another possibility is to make electrical contact with the sensor chip 3 to use the flip-chip technology, in which the active surface of the sensor chip 3 the leadframe 1 is facing and the electrical contact between the sensor chip 3 and the connection elements 1a of the leadframe 1 via solder elements (solder bumps) is realized (step S3 ).

After mounting and contacting the sensor chip 3 to the leadframe 1 can the sensor chip 3 for reasons of reliability in the hollow housing 2 with a soft gel (eg silicone gel) to be poured (in the 1 and 2 not shown).

Later, a Umbiegeschritt, in which the hollow housing 2 opposite the leadframe 1 is folded so that the sensor chip 3 in one opposite the connection elements 1a of the leadframe 1 tilted position arrives. In particular, as in 1 shown a 90 ° tilt, making the active surface of the sensor chip 3 , which was originally parallel to the leadframe plane, is now perpendicular to this plane (step S4 ).

The mounting of the sensor chip module on an application board (not shown), for example, a printed circuit board made of epoxy resin or another metallized pad, via the connection elements 1a , As a result of the preceding lead frame bending step is achieved that unlike a conventional, "horizontal" mounting of the sensor chip module to the application board, the sensor chip inclined relative to the plane of the application board (not shown) is aligned. The mounting level of the sensor chip module in 1 is through the lower housing wall 2a (ie the base surface or the bottom of the sensor chip module during the assembly process on the application board) and thus by the connecting elements running parallel thereto 1a of the leadframe 1 specified. The desired vertical placement of the application board with the sensor chip module thus remains guaranteed.

By bending the leadframe 1 for reorientation of the hollow housing 2 opposite the connection elements 1a of the leadframe 1 is achieved that when fitting an application board, the sensor chip 3 is automatically mounted in a position on the application board, in which its active surface and the example, micromechanically formed functional elements not parallel to the mounting plane of the sensor chip module.

3 shows representations of a manufacturing process of a sensor chip module according to the invention, which is a hollow housing 2 with a sensor chip contained therein 3 and a semiconductor chip 5 in a semiconductor chip package 6 includes. The same reference numerals as in the 1 are used to designate identical or functionally similar parts.

The starting point of the production process is again a flat, unbent leadframe 1 consisting of eg several sections 1a . 1b . 1c and 1d , The section 1b serves as a chip carrier for the sensor chip 3 and the section 1c serves as a chip carrier for the semiconductor chip 5 , How out 3 the section leads to this 1d from the semiconductor chip package 6 and puts it at the finished sensor chip module (lower illustration in 3 ) after a bending step, a lead (lead) dar. The connecting element for the sensor chip 3 realizing section 1a leads, as already in 1 shown, also from the module (more precisely: from the hollow housing 2 of the module) and can also be used for external connection purposes.

• Zunächst wird der ebene Leadframe 1 mit den oben genannten Leadframe-Abschnitten 1a, 1b, 1c, 1d gefertigt. Gemäß einem ersten möglichen Verfahrensablauf wird der Halbleiterchip 5 auf den Leadframe 1 montiert (z.B. geklebt oder gelötet) und elektrisch ankontaktiert. Die elektrische Ankontaktierung kann z.B. über Bonddrähte 7 erfolgen, die Anschlussflächen 8 an der aktiven Oberfläche des Halbleiterchips 5 mit den Anschlusselementen 1a und 1d des Leadframes 1 verbinden. Andere Montage- und Kontaktierungstechniken, z.B. die Flip-Chip-Technik, sind ebenfalls möglich.

The production of in 3 shown sensor chip module is as follows:

• First, the flat leadframe 1 with the above leadframe sections 1a . 1b . 1c . 1d manufactured. According to a first possible method sequence, the semiconductor chip 5 on the leadframe 1 mounted (eg glued or soldered) and electrically contacted. The electrical Ankontaktierung can eg via bonding wires 7 done, the pads 8th on the active surface of the semiconductor chip 5 with the connection elements 1a and 1d of the leadframe 1 connect. Other assembly and contacting techniques, such as flip-chip technology, are also possible.

After that, the leadframe becomes 1 with the semiconductor chip mounted and contacted thereon 5 placed in an injection mold, which two cavities for the production of the hollow housing 2 and the semiconductor chip package 6 having. The two housings 2 and 6 are therefore preferably in one step to the lead frame 1 molded. After the injection process, the semiconductor chip 5 completely housed.

Alternatively, it is also possible to use the semiconductor chip 5 only after the encapsulation of the leadframe 1 to the leadframe 1 to assemble and electrically contact. In this case, the semiconductor chip package 6 also a hollow housing (comparable to the hollow housing 2 ) into which the semiconductor chip 5 is subsequently introduced. This variant with two SMD (Surface Mounted Device) mountable housings 2 . 6 will be explained later 6 explained.

As the semiconductor chip 5 typically contains no sensors, but as a driver chip or evaluation chip for the sensor chip 3 is the semiconductor chip 5 usually insensitive to mechanical tension and can therefore according to the first production variant with a plastic full housing 6 to be overmoulded.

Subsequently, as based on 1 already explained, the sensor chip 3 in the hollow housing 2 used.

The finished sensor chip module after performing the Umbiegeschrittes is in the bottom of the 3 recognizable. When Umbiegeschritt is from the hollow housing 2 of the sensor chip 3 outgoing section 1a of the leadframe 1 bent in three places, reducing the active surface of the sensor chip 3 opposite to the level of the section 1a inclined (here by 90 °) becomes. The section remains 1a except for his in the hollow housing 2 standing still in the same plane as the leadframe sections 1c and 1d that is, in the plane that the leadframe 1 in its planar assembly with the semiconductor chip 5 and the sensor chip 3 and at the same time represents the mounting plane of the finished sensor chip module.

As in the lowest illustration in 3 recognizable, the hollow housing 2 closed at the Umbiegeschritt ("capped") by the opening of the hollow housing 2 through a side wall 6a of the semiconductor chip package 6 is covered. The reorientation of the sensor chip 3 and closing the hollow housing 2 can thus be done in an elegant way in the same step. The sensor chip housing 2 and the semiconductor chip package 6 are then firmly joined together, for example, by gluing, welding or latching and typically connected together inseparably.

In a further step, the leadframe sections 1d bent so that they form legs of the sensor chip module. The legs of the sensor chip module are used as external contacts for the electrical contacting of the sensor chip module on an application board (not shown). Again 3 can be seen, that can from the housings 2 and 6 constructed sensor chip module in a conventional manner with parallel to the mounting plane extending leadframe sections 1a . 1d and parallel to the mounting plane aligned semiconductor chip 5 mounted on the application board, with the sensor chip 3 perpendicular (or at a different angle of inclination than 90 °) relative to the mounting plane of the sensor chip module (ie the base or bottom surface of the sensor chip module based on the placement process on the application board) is aligned. One advantage is that the reorientation of the sensor chip 3 takes place in the sensor chip module housing (package) and the sensor chip module housing can be mounted in a conventional manner on the application board. In other words, eliminates additional measures (eg, the mounting of the sensor chip module housing on an auxiliary circuit board, which is mounted perpendicular to the application board), as required in known solutions.

4 shows an embodiment, which differs from the in 3 illustrated embodiment characterized in that the semiconductor chip package 6 bevelled wall surfaces 6a and 6b has, and that free end surfaces 2c of the hollow housing 2 are also realized as corresponding inclined surfaces. The bevel of the side wall surfaces 6a . 6b facilitate the encapsulation of the leadframe especially when using thermosets as plastic material 1 because they facilitate as Entungsungsschrägen opening the injection mold after curing of the plastic.

In addition, shows 4 that the hollow case 2 can be dimensioned so that the bottom-side housing 2a from the bottom of the semiconductor chip package 6 is vertically spaced. This allows the outside of the hollow housing 2 extending section 1a of the leadframe 1 with a U-shaped bend 8th which can be used as an external contact when fitting an application board with the sensor chip module. If no deflection 8th is provided, the at the in 4 illustrated embodiment existing spacing of the housing 2a from the application board (not shown) cause no accidental electrical connection between the running on the outside of the housing portion 1a of the leadframe 1 and electrical structures may arise on the application board.

5 shows a further embodiment, which differs from the in 4 illustrated embodiment essentially only differs in that here also the side walls 2a . 2 B of the hollow housing 2 are equipped with Entformungsschrägen to facilitate the removal of the injection molding of the injection mold.

6 shows a further embodiment, in which also the semiconductor chip housing as a hollow housing 106 is trained. In this case, the semiconductor chip 5 As already mentioned after the injection molding step (in which both hollow housing 2 and 106 produced at the same time) to the leadframe 1 mounted and electrically contacted. Furthermore, there is the possibility, even the semiconductor chip 5 in a potting compound 9 , For example, a gel, to embed, different from the material of the hollow housing 106 can be. This is advantageous, as far as the semiconductor chip 5 or its electrical contact (eg the bonding wires 7 ) are sensitive to tension or the forces occurring during the injection molding process.

After embedding the semiconductor chip 5 in the potting compound 9 becomes the hollow housing 106 through a lid 106a locked. The closure of the hollow housing 2 with the sensor chip contained therein 3 again takes place by the Umbiegeschritt. 6 further clarifies the possibility of the sensor chip 3 To achieve a low-stress attachment ("low stress the attach") in a load-absorbing potting compound 10 (Eg gel, especially silicone gel) accommodate. This possibility arises in all embodiments in which the sensor chip 2 in a hollow housing 2 is used. Furthermore, the embodiments explained in the preceding figures with the features of in 6 be shown module combined.

7 shows the manufacturing steps of a sensor chip module using a pre-bent leadframe 11 , The pre-bent leadframe 11 assign the sections 11a . 11b . 11c . 11d on that the sections 1a . 1b . 1c . 1d in the previous ones 3 to 6 correspond. The from the hollow housing 2 for the sensor chip 3 outstanding leadframe section 11a is with a U-shaped bend 18a provided, and from the semiconductor chip housing 6 protruding end portion 11d also has such a U-shaped deflection 18b on. This causes the deflection 18a that part of the leadframe section 11a that extends along the housing wall 2a of the hollow housing 2 extends from the housing wall 2a something stands out and can be used as a little bit for mounting the sensor chip module on the application board (not shown). The outside of the housing wall 2a can be flush with the bottom of the semiconductor chip housing 6 run. The bends 18b also realizes a contact leg of the finished sensor chip module, see below figure in 7 ,

8th shows in the representations a to f further implementation options for the sensor chip module. It becomes clear that the hollow case 2 for the sensor chip 3 both unfilled (a to d) and may be filled with a gel (e and f). As already mentioned, the semiconductor chip package 6 either as a full housing (a to d) or as Hollow housing (e and f) be executed. In the illustrations b and c has the hollow housing 2 facing side wall 6a of the semiconductor chip package 6 a peg-shaped projection which, in the opening of the hollow housing 2 engages and thereby a mechanically stable plug connection of the hollow housing 2 on the semiconductor chip package 6 allows. It is in the representations b and c the 8th the housing wall 2a vertically spaced from the mounting plane through the bottom of the semiconductor chip package 6 is defined.

In the 8th Housing variants shown have no draft angles and are therefore more suitable for the use of thermoplastics as housing material. Suitable thermoplastics are liquid crystalline polymers, also referred to as LC (liquid crystal) polymers.

9 shows representations a to f of sensor chip modules, which Entungsungsschrägen to the semiconductor chip package 6 and partly also the sensor chip housing 2 respectively. These housing variants are particularly suitable for the use of thermosets - such as epoxy resin - as a housing material. As constructive peculiarities, the embodiments shown in the illustrations c and d have in the upper region of the semiconductor chip housing 6 a stepped recess 13 in which the side wall 2c of the sensor chip housing 2 engages, whereby the mounting stability can be improved. Furthermore, the representation d of 9 that a wall 2d of the sensor chip hollow housing 2 a supernatant 2e may, which for supporting the sensor chip hollow housing 2 on the application board (not shown) eg to secure the gap between the wall 2a and the application board can be used. It should be noted that a variety of other embodiments of combinations of in the 3 to 9 shown features.

10 shows a basic view (footprint) of the in the 3 to 9 illustrated sensor chip modules. The from the leadframe sections 1d or. 11d formed connecting legs 18b may extend along the free outer circumference (three sides) of the semiconductor chip package 6 extend. The from the leadframe section 1a or. 11a resulting conductor elements extend from the semiconductor chip package 6 in the sensor chip hollow housing 2 and run below the housing wall 2a , You can eg in the form of bends 18a be realized as connection legs. As already on the basis of 3 to 9 explains, in some variants, the leadframe section 1a . 11a but not a location that must be electrically contacted with corresponding mating contact pads on the application board. For example, in the illustrations c the 8th and e the 9 the sections 1a . 11a not needed as contact pads.

Another aspect concerns the use of a flexible chip carrier instead of the leadframe 1 . 11 , A flexible chip carrier may be formed as a multi-layered structure with at least one plastic layer (for example polyimide) and an overlying metallization layer. The plastic layer may, for example, be about 100 μm thick, and the thickness of the metallization layer may be, for example, in the range of 5 to 20 μm. Structures with multiple metallization layers are also possible. Flexible chip carriers are also known by the terms flexible substrates ("flex substrate") or flexible printed circuit boards.

11 shows an example of the in 4 Embodiment shown representations of a manufacturing process of a sensor chip module with a flexible chip carrier 100 instead of a leadframe 1 , All sensor chip modules according to the embodiments already described can be used in an analogous manner with a flexible chip carrier 100 instead of the leadframe 1 . 11 be equipped.

The flexible chip carrier 100 has a metallization layer 101 on top of a plastic backing 102 is applied. The metallization layer 101 is structured to form conductor paths. For structuring the metallization layer 101 For example, photolithographic processes can be used.

To the flexible chip carrier 100 becomes the sensor chip hollow housing 2 and the semiconductor chip package 6 appropriate. This can be done in the manner already described by injection molding in an injection mold. In this case, the flexible chip carrier 100 in the injection mold so abut walls of the two injection molding cavities that it is injected behind and not encapsulated. This leaves the plastic carrier layer 102 also in the field of housing 2 . 6 exposed on the back.

The flip-over step for aligning the sensor chip housing 2 is due to the flexibility of the flexible chip carrier 100 allows.

In the plastic carrier layer 102 are at appropriate locations via holes 103 provided that in a manner not shown either already on the not back-injected flexible chip carrier 100 or during any later time in the manufacturing process (eg at one of the in the 11 represented products) are introduced. The via holes 103 become with via metallizations 104 filled, the outer contact surfaces for mounting the sensor chip module on an application board (not shown) form. The module base facing the application board is here characterized by the flexible chip carrier extending in the mounting plane 100 educated. It is advantageous that the position of external contact surfaces is freely selectable over the entire module base due to the possibility of signal distribution through the structured metallization layer. Other possible features of a flexible chip carrier 100 used sensor chip modules are analogous to the 3 to 10 ,

Claims (14)

Sensor chip module comprising: a sensor chip (3), a semiconductor chip (5), a flexible chip carrier (1, 11, 100) having a common surface on which the sensor chip (3) and the semiconductor chip (5) are mounted, a module housing (2, 6, 2, 106), which defines a mounting plane of the sensor chip module and a sensor chip receiving sensor chip cavity housing (2) and a semiconductor chip (5) receiving semiconductor chip housing (6, 106), wherein the chip carrier (1, 11, 100) is bent in the region between the two housings in such a way that an active surface of the sensor chip (3) is inclined relative to the mounting plane of the sensor chip module and has a side wall (6a, 106) of the semiconductor chip. Housing (6, 106) closes an opening of the sensor chip cavity housing (2). Sensor chip module after Claim 1 wherein the chip carrier (1, 11, 100) is a metallic ladder frame carrier (1, 11). Sensor chip module after Claim 1 wherein the chip carrier (100) is a flexible plastic carrier (102) with metallized conductors (101). Sensor chip module according to one of the preceding claims, wherein the active surface of the sensor chip (3) extends substantially perpendicular to the mounting plane of the sensor chip module. Sensor chip module according to one of the preceding claims, wherein the sensor chip cavity housing (2) with a potting compound (10) is filled. Sensor chip module according to one of the preceding claims, wherein the semiconductor chip housing (6) is a plastic injection-molded housing (6) realized by encapsulation of the semiconductor chip (5). Sensor chip module according to one of the preceding claims, wherein the chip carrier (1, 11, 100) along an outer wall (2a) of the sensor chip cavity housing (2). Sensor chip module according to one of the preceding claims, wherein the chip carrier (1, 11, 100) in the region of the outer wall (2a) of the sensor chip cavity housing (2) forms a Außenkontaktierungsabschnitt (1a, 8, 18a, 104). Sensor chip module according to one of the preceding claims, wherein the sensor chip (3) is a motion sensor. Sensor chip module according to one of the preceding claims, wherein the semiconductor chip (5) has a signal evaluation circuit for signal evaluation of sensor signals and / or a driver circuit for driving the sensor chip (3) and / or a logic circuit. Sensor chip module according to one of the preceding claims, wherein the sensor chip is an optical chip. A method of manufacturing a sensor chip module, comprising: Providing a flexible chip carrier (1, 11, 100), Producing a sensor chip cavity housing (2) with sensor chip (3) accommodated therein, which is mounted on a surface of the chip carrier (1, 11, 100), and producing a semiconductor chip housing (6, 106) with semiconductor chip accommodated therein (5 ) mounted on the same surface of the chip carrier (1, 11, 100), the semiconductor chip package (6, 106) defining a mounting plane, and thereafter Bending the chip carrier (1, 11, 100) in the area between the two housings such that an active surface of the sensor chip (3) is inclined with respect to the mounting plane of the sensor chip module and a side wall (6a, 106) of the semiconductor chip housing ( 6, 106) closes an opening of the sensor chip cavity housing (2). Method according to Claim 12 in which first the sensor chip cavity housing (2) is attached to the chip carrier (1, 11, 100) and then the sensor chip (3) is applied to the chip carrier (1, 11, 100). Method according to Claim 13 , wherein the sensor chip cavity housing (2) after the application of the sensor chip (3) on the chip carrier (1, 11, 100) with a potting compound (10) is cast.

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