WO2000003478A1 - High-frequency power amplifier module - Google Patents
High-frequency power amplifier module Download PDFInfo
- Publication number
- WO2000003478A1 WO2000003478A1 PCT/JP1998/003069 JP9803069W WO0003478A1 WO 2000003478 A1 WO2000003478 A1 WO 2000003478A1 JP 9803069 W JP9803069 W JP 9803069W WO 0003478 A1 WO0003478 A1 WO 0003478A1
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- WIPO (PCT)
- Prior art keywords
- frequency
- frequency power
- power amplifier
- circuit
- amplifier module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/72—Gated amplifiers, i.e. amplifiers which are rendered operative or inoperative by means of a control signal
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/189—High-frequency amplifiers, e.g. radio frequency amplifiers
- H03F3/19—High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only
- H03F3/193—High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only with field-effect devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
- H03F3/21—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only
- H03F3/211—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only using a combination of several amplifiers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/306—Indexing scheme relating to amplifiers the loading circuit of an amplifying stage being a parallel resonance circuit
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/309—Indexing scheme relating to amplifiers the loading circuit of an amplifying stage being a series resonance circuit
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/39—Different band amplifiers are coupled in parallel to broadband the whole amplifying circuit
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/429—Two or more amplifiers or one amplifier with filters for different frequency bands are coupled in parallel at the input or output
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/451—Indexing scheme relating to amplifiers the amplifier being a radio frequency amplifier
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/005—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges
- H04B1/0053—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/02—Transmitters
- H04B1/04—Circuits
- H04B1/0458—Arrangements for matching and coupling between power amplifier and antenna or between amplifying stages
Definitions
- the present invention relates to a high-frequency power amplifier module that amplifies a high-frequency signal, and particularly to a high-frequency power amplifier module that can be suitably used for a dual-band wireless device capable of transmitting and receiving two band frequencies.
- the GSM Global System for Mobile Co-unicat ions
- the GSM communication system using the 0.9 GHz band frequency will be available to subscribers in the near future. It is expected that the system capacity will be exceeded. For this reason, the system is similar, for example, by adopting GMSK (Gaussian-filtered Minimum Shift Keying) with the same modulation scheme as the GSM communication scheme, such as a DCS (Digital Cellular System) using a frequency band around 1.8 GHz.
- GMSK Gausian-filtered Minimum Shift Keying
- DCS Digital Cellular System
- GSM system and DC S 1800 system are almost the same except for the frequency. Therefore, only the high-frequency part such as the power amplifier module is compatible with the dual band so that the G SM / DC S 1800 can be shared. Mobile phones can be configured.
- FIG. 7 shows a schematic configuration of a mobile communication device studied prior to the present invention.
- reference numerals 13 and 13 demultiplexer, 14 is a dual-band transmitting / receiving antenna
- 15 is a first high-frequency power amplifier module (RF power module)
- 16 is a second RF power module
- 17 is a broadband amplifier (WAMP)
- 18 is a radio signal processing circuit (RF SPU)
- 19 is a system control unit (CNTU) composed of a central processing unit (CPU)
- 20 is an operation panel ( ⁇ P)
- 21 Is a handset consisting of a speaker (3?) ⁇ microphone (MIC).
- Vcc is the power supply voltage.
- the communication methods that can be switched and used are the GSM method and the DCS 1800 method.
- the radio signal processing circuit section 18 includes a modulation / demodulation processing section, a transmission / reception IF (intermediate frequency) section, a frequency conversion section (up / down converter), and the like.
- the GSM system in the 0.9 GHz band is used. It is configured to generate and output the radio signal (f1 or f2) of the 1.8 GHz band DCS 1800 system, whichever is set.
- These two types of wireless transmission signals f 1 and f 2 are input to the first RF power module 15 and the second RF power module 16, respectively.
- the RF power module 15 is a power amplifier module compatible with the GSM communication system.It has matching circuits MC 1 and MC 2 consisting of RF power MOS field-effect transistor T 1 for passive amplification, passive elements, etc., and drain bias. It consists of a DC choke inductance element Lc1 and so on.
- the transistor T 1 is turned on by the first bias control signal 22 output from the CPU of the system control unit 19 linked to the GSMZDC S1800 switching switch of the mobile communication device.
- the gate voltage applied to the switch is switched between a power-off bias level and a predetermined bias level to be output.
- the RF power module 16 is a power amplifier module compatible with the DCS 1800 communication system, and has matching circuits MC3 and MC3 composed of RF power MOS field-effect transistor T2 for final-stage amplification, passive elements, and the like.
- 4.Drain bias It is composed of a flow choke inductance element Lc 2 and the like.
- the transistor T 2 is connected to the transistor T 2 by the second bias control signal 23 output from the CPU of the system control unit 19 that is linked to the GSM / DC S 1800 switching switch of the mobile communication device.
- the gate voltage to be applied is switched between a cut-off bias level and a predetermined bias level and output.
- the RF power modules 15 and 16 are optimally designed with matching by the matching circuits MC1 to MC4 so as to efficiently amplify the radio signal of each communication method.
- the bias control signal 22 of the RF power module 15 is set to a predetermined bias level, while the bias control signal 23 of the RF power module 16 is cut off.
- the bias level By setting the bias level, only the RF power module 15 can be selectively operated to amplify the GSM radio signal f 1 (0.9 GHz band).
- the bias control signal 23 of the RF power module 16 is set to a predetermined bias level, while the bias control signal 22 of the RF power module 15 is cut-off. By setting this to the ground level, it is possible to selectively operate only the RF power module 16 to amplify the DCS 1800 radio signal f 2 (1.8 GHz band).
- RF modules are provided for each of the two communication systems, and they are used properly according to the settings of the communication systems.
- the RF power modules installed inside are economically and efficiently because they are optimally designed for each communication method.
- the high-frequency power amplifier module applied to the mobile phone satisfies the specifications of the high-frequency characteristics determined by each system such as the output power, There is a demand for higher efficiency and smaller size.
- a technique for controlling harmonics is well known.
- one end of a 14-wavelength transmission line disclosed in Japanese Patent Application Laid-Open No. 60-109310 is short-circuited at a high frequency, and the other end is connected to an amplifying element and a series resonance circuit.
- a fundamental wave signal output is obtained from a series resonance circuit.
- the fundamental and odd harmonics are short-circuited at the connection point between the output side of the amplifier and the 14-wavelength transmission line, and the product of the current and voltage at the output terminal of the amplifier becomes zero.
- a class F operation mode can be obtained, and efficiency can be improved.
- the high-frequency power amplifier circuit of the above-mentioned conventional example has an output side of an amplifying element 25 and a series resonance circuit 6 and one end of the series resonance circuit 26 are connected to the output terminal 27 to form a power amplifier circuit.
- the amplifying element 25 operates with a basic signal input, a voltage is distributed on the 14-wavelength transmission line 23.
- FIG. 8 (b) shows the state of the voltage distribution on the 14-wavelength transmission line 24, and shows the voltage distribution obtained with respect to the fundamental and second harmonic signal inputs.
- connection portion I Since one end ⁇ of the 1/4 wavelength transmission line 24 is completely short-circuited at high frequency, the connection portion I is supplied with the short-circuit voltage for the fundamental wave and the short-circuit voltage for the second harmonic wave. The same is true for the third and higher harmonics. At connection point I, the connection is open for all odd-order harmonics in the same way as for the fundamental, and for all even-order harmonics. As with the second harmonic, a short circuit occurs.
- the configuration of the high-frequency power amplifier module is a high-efficiency dual system that uses two frequency bands in one series, in which a one-input one-output drive stage amplifier and a high-frequency output transistor are commonly used for two communication systems.
- High frequency power amplifier for band system The realization of modules is desired.
- the above-described conventional technique of controlling harmonics using a quarter-wave transmission line has a problem in applying a power amplifier module to two different frequency band mobile phone systems as shown in FIG. there were.
- the GSM system and the DCS 1800 system On the other hand, transmission lines are required, and miniaturization is difficult.
- recent demands for smaller packages make it difficult to incorporate 0.9 GHz and 1.8 GHz 1Z4 wavelength transmission lines in the same package.
- the circuit configuration is provided with a power amplifier dedicated to GSM and a power amplifier dedicated to DCS 1800, and the method of selectively using both circuits requires two power amplifiers, making miniaturization difficult. .
- the present invention has been made in order to solve such a problem.
- One power amplifier module supports a dual-band communication system using two frequency bands in combination, and is a high-efficiency, compact power amplifier. It aims to provide modules. Disclosure of the invention
- the high-frequency power amplifier module according to the present invention can be suitably used for a dual-band wireless device capable of transmitting and receiving two band frequencies il and f2 (fKf2), and a driving stage configuring the high-frequency power amplifier module.
- An amplifier and a high-frequency power output transistor are used in common for the radio signals of both systems, and the output stage circuit, including the high-frequency power output transistor, suppresses the high-frequency power output transistor and harmonic power.
- an output matching circuit matched to the band frequencies of both systems for extraction.
- the parallel resonator is set so as to exhibit resonance at a frequency corresponding to a predetermined even-order harmonic of the band frequency f 2, and the transmission heat path is a parasitic element existing at a drain portion of a high-frequency power output transistor.
- the impedance at the drain end is set to be short-circuited with respect to the even-order harmonic.
- the combination of a series resonator set to exhibit resonance at a frequency corresponding to a predetermined odd-order harmonic of the band frequency f1, a transmission line, and a parasitic reactance of a high-frequency power output transistor makes the drain terminal
- the circuit element constants constituting the above parallel resonator are set so that the impedance of the parallel resonator is open to a predetermined odd-order harmonic of f1.
- FIG. 1 is a circuit diagram showing one embodiment of the high-frequency power amplifier module according to the present invention.
- FIG. 2 is a characteristic diagram showing a gain characteristic of a driving stage amplifier used in the circuit of FIG. 1.
- FIG. 3 is an equivalent circuit diagram at the time of 3.6 GHz operation in the circuit of FIG.
- FIG. 4 is an equivalent circuit diagram at the time of 2.7 GHz operation in the circuit of FIG.
- FIG. 5 is a diagram for explaining the impedance at the drain end of the output stage transistor in the circuit of FIG. 1.
- FIG. 5 (a) is a circuit configuration diagram
- FIG. 5 (b) is a Smith chart diagram.
- FIG. 6 is a circuit diagram showing another embodiment of the high-frequency power amplifier module according to the present invention.
- FIG. 7 is a circuit diagram showing a configuration example of a mobile communication device studied prior to the present invention.
- FIG. 8 is a circuit diagram for explaining an example of a conventional power amplifier module. BEST MODE FOR CARRYING OUT THE INVENTION
- FIG. 1 is a circuit diagram of a GSM / DCS 1800 dual-band compatible high-frequency power amplifier module showing one embodiment of the high-frequency power amplifier module according to the present invention.
- reference numeral 1 denotes a high-frequency power output transistor (Si-MOS FET (chip)) for amplifying wireless signal power
- 2 denotes a transmission line
- 3 denotes an inductor for a parallel resonance circuit
- 4 denotes a parallel resonance circuit.
- Capacitor 5 is an inductor for a series resonance circuit
- 6 is a capacitor for a series resonance circuit
- 7 is a parasitic reactance of the high-frequency power output transistor 1
- 8 is a drive stage amplifier
- 9 is a parallel resonance circuit
- 10 is a series resonance circuit
- ZL is the load impedance
- Lc is the choke inductor for DC bias power supply
- MC11 ⁇ ! 1C13 is a matching circuit of the driving stage amplifier
- MC0 is an output matching circuit for matching the amplified impedance of the GSM / DC S1800 with the load impedance ZL.
- the driving stage amplifier 8 is composed of a two-stage Si-MOS FET, and has a power matching circuit MC 11 1 to MC 13 which is a circuit having almost the same configuration as the conventional power amplifier 17 in FIG. Matching is performed for two frequencies, the GSM communication system and the DCS 1800 communication system, and the peak of the gain exists at that frequency.
- Fig. 2 is a diagram showing the frequency characteristics of the gain when the drain bias Vcc of the driving stage amplifier 8 is set to 3.6 V. The peak of the gain is 0.9 GHz in the GSM system and 1 in the DCS 1800 system. A matching method is adopted to achieve the 8 GHz band.
- This matching can be realized, for example, by combining an inductance element and a capacitance element and setting an appropriate value so as to obtain a high gain.
- the radio signals in the two kinds of frequency bands are amplified to high gain by the driving stage amplifier 8 and then input to the high frequency power output transistor 1. Due to such characteristics, the driving stage amplifier 8 has an amplifier 1 having a wide band characteristic so as to include both the frequency bands (fl to f2) of the GSM system and the DCS 1800 system in the amplification band.
- the wireless signal that is input to the high-frequency power output transistor while preventing the leakage of harmonics that causes a decrease in communication quality Can be amplified.
- the output circuit of the high-frequency power output transistor 1 in the final stage includes a transmission line 2 that performs harmonic control, a parallel resonance circuit 9, and a series circuit in order to amplify the radio signal output from the drive amplifier 8 with high efficiency.
- Resonant circuit 10 and output consisting of inductance element and capacitance element for matching load impedance ZL with each amplified signal frequency (2.7 GHz and 3.6 GHz) of GSMZDC S 1800 communication system Matching circuit MCO.
- the parallel resonance circuit 9 is operated at 3.6 GHz so that its impedance becomes large at the frequency 3.6 GHz. It is set to resonate.
- the values of the inductance 3 for the parallel resonance circuit and the capacitor 4 for the parallel resonance circuit, which constitute the parallel resonance circuit 9, are calculated as follows, together with the parasitic reactance 7 and the transmission line 2 existing at the drain of the high-frequency power output transistor 1. Set so that the drain terminal of high-frequency power output transistor 1 is open at 7 GHz.
- the series resonance circuit 10 2. Set to resonate at 2.7 GHz so that the impedance at 7 GHz is small.
- the high-frequency power output transistor 1 receives a fundamental signal of GSM (0.9 GHz) / DC S 1800 (1.8 GHz) and operates, it is a second harmonic of 1.8 GHz.
- the equivalent circuit is different at 2.7 GHz, which is the third harmonic of 6 GHz and 0.9 GHz, and the voltage at the drain end is also different.
- the parallel resonance circuit 9 is configured to resonate at 3.6 GHz so that the impedance of the parallel resonance circuit 9 becomes large. It looks like a circuit.
- the transmission line 2 is set to have such a length as to cause a short circuit at the drain terminal of the high-frequency power output transistor 1 at 3.6 GHz together with the parasitic reactance 7 existing at the drain portion of the high-frequency power output transistor 1.
- the high-frequency power output transistor 1 has a signal input of 3.6 GHz, which is twice the frequency used in the DC S 1800 system, and operates, the high-frequency power is output from the open end of the transmission line 2 through the transmission line 2 and parasitic reactance 7 The impedance is converted before reaching the drain end of the power output transistor 1, and the voltage at each part changes. Then, the drain end of the high-frequency power output transistor 1 is short-circuited.
- the series resonance circuit 10 is configured to resonate at 2.7 GHz so that the impedance of the series resonance circuit 10 becomes small.
- the equivalent circuit shown in Fig. 4 is obtained.
- the values of the inductor 3 and the capacitor 4 that constitute the parallel resonance circuit 9 are set so that the drain end of the high-frequency power output transistor 1 is open at 2.7 GHz together with the transmission line 2 and the parasitic reactance 7. I do.
- the high-frequency power output transistor 1 operates with a 2.7 GHz signal input, it operates from the open end of the parallel resonance circuit 9 through the parallel resonance circuit 9, the transmission line 2, and the parasitic reactance 7, and The impedance is converted before reaching the drain end of the transistor 1, and the voltage at each part changes. Then, the drain end of the high-frequency power output transistor 1 is open.
- the equivalent circuit is as shown in Fig. 3, and the relative permittivity of the substrate is set to short-circuit the impedance at the drain end. depends on and thickness, dielectric constant 8.45 2, the use of ceramic substrate having a thickness of 0. 1 5 mm, the length of the transmission line 2, this c is set to 8. 5 5 mm Since the parasitic reactance component is used, the value is shorter than 1/4 wavelength.
- the values of the above-mentioned chip inductor 3 and chip capacitor 4 not only resonate at 3.6 GHz, but also at 2.7 GHz, the dimensions of the transmission line 2 and the parasitic reactance 7 set earlier. It is configured such that the impedance at the drain end of the Si-MOS FET is open.
- the impedance at the drain end of the high-frequency power output transistor 1 is the third harmonic of the GSM method.It is open at 2.7 GHz and the second harmonic of the DCS 1800 method.3. A short circuit occurs at 6 GHz.
- FIG. 3 is a circuit configuration diagram for obtaining impedance expected from the drain end of the high-frequency power output transistor 1 when (load impedance) 1 is set to 500.
- rL is a reflection coefficient when the output side is viewed from the drain end of the high-frequency power output transistor 1, and is based on 50 ⁇ .
- FIG. 5 (b) is a diagram showing the locus of rL with respect to the frequency at this time on a Smith chart.
- the signal frequency of 0.9 GHz of GSM system and the signal frequency of 1.8 GHz of DCS 1800 system exist at the center of the Smith chart, while the third harmonic of 0.9 GHz At 2.7 GHz, it is located at point A, which indicates an open circuit, and at 3.6 GHz, a second harmonic of 1.8 GHz, it is at the point B, which indicates a short circuit.
- the termination load is set to 50 ⁇
- the harmonic control described above is satisfied at any termination load impedance.
- Each of the radio signal outputs subjected to the harmonic control is output through an output matching circuit M C0 for the fundamental wave of each radio signal.
- the third harmonic of the GSM signal frequency and the second harmonic of the DCS 1800 signal frequency are controlled, so that the harmonic power is suppressed. And highly efficient amplification can be performed.
- FIG. 6 is a circuit diagram of a GSM / DC S1800 dual-band compatible high-frequency power amplifier module showing another embodiment of the high-frequency power amplifier module according to the present invention.
- the configuration of the drive stage amplifier that drives the high-frequency power output transistor 1 is the same as that in FIG.
- the same components as those shown in FIG. 1 are denoted by the same reference numerals, and detailed description thereof will be omitted. That is, in the present embodiment, a high-frequency power amplifier module is constituted by using a lumped constant inductor 11 and a lumped constant capacitor 12 instead of the transmission line 2 shown in FIG. I do.
- this high-frequency power amplifier module is the same as that of the above-described embodiment.
- the circuit can be made smaller as compared with the circuit of the first embodiment in Fig. 1. It is possible.
- the Si-MOS FET is used for the driving stage amplifier and the high-frequency power output transistor.
- G a As-ME SF Active elements that can handle RF signals such as ET and bipolar transistors, can also be used.
- both modulation schemes are GMSK, but various digital modulation schemes such as ⁇ / 4 shift QP SK (Quadrature Phase Shift Keying) modulation scheme, QPSK modulation scheme, and offset QP SK modulation scheme are used. Equations and various analog modulation methods such as FM modulation method and AM modulation method can be applied, and there is no restriction on the frequency.
- a high-frequency power amplifier module used in a dual-band wireless device capable of transmitting and receiving two band frequencies having two types of wireless communication systems two different wireless communication systems are provided. By controlling each harmonic of the band frequency, unnecessary consumption of harmonic power can be saved.
- high gain and suppression of harmonic leakage power can be achieved by matching in accordance with the two frequencies, thereby achieving high efficiency. And longer life of the battery You.
- the driving stage amplifier and the high frequency power output transistor that constitute the high frequency power amplifier module according to the present invention are shared by both band frequencies, they have a single-line configuration common to both band frequencies, and can be downsized.
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- Amplifiers (AREA)
Description
Claims
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020017000195A KR20010106398A (ko) | 1998-07-08 | 1998-07-08 | 고주파 전력 증폭기 모듈 |
| US09/673,977 US6384688B1 (en) | 1998-07-08 | 1998-07-08 | High-frequency power amplifier module |
| PCT/JP1998/003069 WO2000003478A1 (en) | 1998-07-08 | 1998-07-08 | High-frequency power amplifier module |
| US10/084,364 US6535069B2 (en) | 1998-07-08 | 2002-02-28 | High-frequency power amplifier module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP1998/003069 WO2000003478A1 (en) | 1998-07-08 | 1998-07-08 | High-frequency power amplifier module |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US09/673,977 A-371-Of-International US6384688B1 (en) | 1998-07-08 | 1998-07-08 | High-frequency power amplifier module |
| US10/084,364 Continuation US6535069B2 (en) | 1998-07-08 | 2002-02-28 | High-frequency power amplifier module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2000003478A1 true WO2000003478A1 (en) | 2000-01-20 |
Family
ID=14208573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP1998/003069 Ceased WO2000003478A1 (en) | 1998-07-08 | 1998-07-08 | High-frequency power amplifier module |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US6384688B1 (ja) |
| KR (1) | KR20010106398A (ja) |
| WO (1) | WO2000003478A1 (ja) |
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| JP2005142689A (ja) * | 2003-11-05 | 2005-06-02 | Hitachi Metals Ltd | 高周波部品 |
| JP2008085929A (ja) * | 2006-09-29 | 2008-04-10 | Sony Corp | 電力増幅装置 |
| JP2010268113A (ja) * | 2009-05-13 | 2010-11-25 | Mitsubishi Electric Corp | マイクロ波増幅器 |
| US8149062B2 (en) | 2000-09-12 | 2012-04-03 | Black Sand Technologies, Inc. | Power amplifier circuitry having inductive networks |
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- 1998-07-08 WO PCT/JP1998/003069 patent/WO2000003478A1/ja not_active Ceased
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| JPH1056339A (ja) * | 1996-08-09 | 1998-02-24 | Murata Mfg Co Ltd | 高周波増幅器 |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8149062B2 (en) | 2000-09-12 | 2012-04-03 | Black Sand Technologies, Inc. | Power amplifier circuitry having inductive networks |
| US8149064B2 (en) | 2000-09-12 | 2012-04-03 | Black Sand Technologies, Inc. | Power amplifier circuitry and method |
| JP2005142689A (ja) * | 2003-11-05 | 2005-06-02 | Hitachi Metals Ltd | 高周波部品 |
| JP2008085929A (ja) * | 2006-09-29 | 2008-04-10 | Sony Corp | 電力増幅装置 |
| JP2010268113A (ja) * | 2009-05-13 | 2010-11-25 | Mitsubishi Electric Corp | マイクロ波増幅器 |
| CN107864682A (zh) * | 2017-05-27 | 2018-03-30 | 刘远芳 | 超微功耗信号发射装置及其应用 |
| CN107864682B (zh) * | 2017-05-27 | 2021-02-19 | 广东易百珑智能科技有限公司 | 超微功耗信号发射装置及其应用 |
| CN114400981A (zh) * | 2021-12-22 | 2022-04-26 | 南京邮电大学 | 一种基于对偶复合左右手单元的双频高效率功率放大器 |
Also Published As
| Publication number | Publication date |
|---|---|
| US6535069B2 (en) | 2003-03-18 |
| KR20010106398A (ko) | 2001-11-29 |
| US6384688B1 (en) | 2002-05-07 |
| US20020089380A1 (en) | 2002-07-11 |
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