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WO2000000929A3 - Chipmodul zum einbau in einen chipkartenträger sowie verfahren zu dessen herstellung - Google Patents

Chipmodul zum einbau in einen chipkartenträger sowie verfahren zu dessen herstellung Download PDF

Info

Publication number
WO2000000929A3
WO2000000929A3 PCT/DE1999/001744 DE9901744W WO0000929A3 WO 2000000929 A3 WO2000000929 A3 WO 2000000929A3 DE 9901744 W DE9901744 W DE 9901744W WO 0000929 A3 WO0000929 A3 WO 0000929A3
Authority
WO
WIPO (PCT)
Prior art keywords
chip
installation
card carrier
production
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE1999/001744
Other languages
English (en)
French (fr)
Other versions
WO2000000929A2 (de
Inventor
Frank Pueschner
Erik Heinemann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of WO2000000929A2 publication Critical patent/WO2000000929A2/de
Publication of WO2000000929A3 publication Critical patent/WO2000000929A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H10W70/424—
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H10W70/699—
    • H10W76/40—
    • H10W70/681—
    • H10W72/072—
    • H10W72/07251—
    • H10W72/073—
    • H10W72/20—
    • H10W74/127—
    • H10W74/15—

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Die Bonding (AREA)

Abstract

Ein Chipmodul (1) zum Einbau in einen Chipkartenträger weist einen Halbleiterchip (5) sowie ein als Metallschicht ausgebildetes Leadframe (2) auf. Zwischen Metallschicht und Halbleiterchip (5) ist eine Schicht aus Klebstoff (11) vorgesehen, der in nicht-erhärtetem Zustand fließfähig ist und sich aufgrund einer Kapillarwirkung ausbreitet. Der Halbleiterchip (5) ist mit einer sich vom Leadframe (2) aus erstreckenden Hotmelt-Klebstoffschicht (7) bedeckt.
PCT/DE1999/001744 1998-06-26 1999-06-15 Chipmodul zum einbau in einen chipkartenträger sowie verfahren zu dessen herstellung Ceased WO2000000929A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19828653.8 1998-06-26
DE19828653A DE19828653A1 (de) 1998-06-26 1998-06-26 Chipmodul zum Einbau in einen Chipkartenträger sowie Verfahren zu dessen Herstellung

Publications (2)

Publication Number Publication Date
WO2000000929A2 WO2000000929A2 (de) 2000-01-06
WO2000000929A3 true WO2000000929A3 (de) 2000-03-16

Family

ID=7872189

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1999/001744 Ceased WO2000000929A2 (de) 1998-06-26 1999-06-15 Chipmodul zum einbau in einen chipkartenträger sowie verfahren zu dessen herstellung

Country Status (2)

Country Link
DE (1) DE19828653A1 (de)
WO (1) WO2000000929A2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2805639B1 (fr) * 2000-02-29 2002-05-24 Schlumberger Systems & Service Procede de fixation d'un module a un corps de carte
DE10016135A1 (de) * 2000-03-31 2001-10-18 Infineon Technologies Ag Gehäusebaugruppe für ein elektronisches Bauteil
DE10111028A1 (de) * 2001-03-07 2002-09-19 Infineon Technologies Ag Chipkartenmodul
DE10139395A1 (de) 2001-08-10 2003-03-06 Infineon Technologies Ag Kontaktierung von Halbleiterchips in Chipkarten

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4143456A (en) * 1976-06-28 1979-03-13 Citizen Watch Commpany Ltd. Semiconductor device insulation method
US5232962A (en) * 1991-10-09 1993-08-03 Quantum Materials, Inc. Adhesive bonding composition with bond line limiting spacer system
DE4325458A1 (de) * 1993-07-29 1995-02-09 Orga Bond Technik Gmbh Trägerelement für einen IC-Baustein

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD214721A1 (de) * 1983-04-15 1984-10-17 Funkwerk Erfurt Veb K Montage-anordnung fuer halbleiterbauelemente
US5214307A (en) * 1991-07-08 1993-05-25 Micron Technology, Inc. Lead frame for semiconductor devices having improved adhesive bond line control
KR19990028493A (ko) * 1995-06-30 1999-04-15 니시무로 타이죠 전자부품 및 그 제조방법
JP3689159B2 (ja) * 1995-12-01 2005-08-31 ナミックス株式会社 導電性接着剤およびそれを用いた回路
DE19622684A1 (de) * 1996-06-05 1997-12-11 Siemens Ag Verfahren zur Herstellung mechanisch fester Klebstoffverbindungen zwischen Oberflächen
DE19651862A1 (de) * 1996-12-13 1998-06-18 Bosch Gmbh Robert Verfahren zum Reflowlöten von mit SMD-Bauelementen bestückten Leiterplatten

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4143456A (en) * 1976-06-28 1979-03-13 Citizen Watch Commpany Ltd. Semiconductor device insulation method
US5232962A (en) * 1991-10-09 1993-08-03 Quantum Materials, Inc. Adhesive bonding composition with bond line limiting spacer system
DE4325458A1 (de) * 1993-07-29 1995-02-09 Orga Bond Technik Gmbh Trägerelement für einen IC-Baustein

Also Published As

Publication number Publication date
DE19828653A1 (de) 2000-01-05
WO2000000929A2 (de) 2000-01-06

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