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WO2000065394A1 - Composant convertisseur electro-optique et son procede de fabrication - Google Patents

Composant convertisseur electro-optique et son procede de fabrication Download PDF

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Publication number
WO2000065394A1
WO2000065394A1 PCT/IB2000/000517 IB0000517W WO0065394A1 WO 2000065394 A1 WO2000065394 A1 WO 2000065394A1 IB 0000517 W IB0000517 W IB 0000517W WO 0065394 A1 WO0065394 A1 WO 0065394A1
Authority
WO
WIPO (PCT)
Prior art keywords
module
electro
converter
optical
pins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB2000/000517
Other languages
German (de)
English (en)
Inventor
Andreas Rooseboom
Jürgen Bauer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Solutions GmbH
Original Assignee
Tyco Electronics Logistics AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Logistics AG filed Critical Tyco Electronics Logistics AG
Publication of WO2000065394A1 publication Critical patent/WO2000065394A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/424—Mounting of the optical light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4255—Moulded or casted packages
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
    • G02B6/4259—Details of housings having a supporting carrier or a mounting substrate or a mounting plate of the transparent type
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • G02B6/4293—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements hybrid electrical and optical connections for transmitting electrical and optical signals

Definitions

  • the invention relates to a converter component for the connection of optical fibers to an electrical circuit and method for its production, in which an electro-optical module is attached to a metallic carrier grid (lead frame) which has connecting pins on the foot side, in which the carrier grid at least in the area of the electro-optical module attached to it, is embedded in a molded body made of moldable transparent material, which has at least one functional surface serving for optical coupling, in which the module component consisting of the carrier grid including the electro-optical module and the molded body is designed as a Transducer module is at least partially provided with a fixed frame-like outer structure and in which the electro-optical module of the module component has a unique position with respect to the outer geometry of its frame-like outer structure.
  • Transducer components of this type are specified in the earlier application 19842687.9. They are usually installed in pin strips, to which socket strips can be connected, in which optical fibers are held. For a good coupling between the transducer components and the optical waveguides assigned to them, a very precise adjustment of the transducer components with respect to the optical axis of the optical waveguides connected to them is necessary. This in turn requires precise adjustment of the converter components in the pin header mentioned. Because the transducer components are at least partially provided with a frame-like outer structure made of a plastic, in which very small manufacturing tolerances can be maintained, the actual transducer consisting of a diode can be placed in a defined position with high accuracy with respect to the outer surfaces of these outer
  • BKT ⁇ TIGUMGSOPIE Bring structure.
  • the transducer component can be quickly and easily brought into a precise position with respect to the optical waveguide assigned to it without active adjustment.
  • the frame-like outer structure is a module housing made of a plastic with very narrow manufacturing tolerances, on the underside of which the module component is positively inserted except for its connecting pins.
  • the wide front of the module housing is already provided with a socket-like connection opening for an optical fiber.
  • the adjustment with regard to the optical waveguide assigned to the converter component is thus limited here to the insertion of the module component into the module housing.
  • a position of the actual converter consisting of a diode with respect to the plug-type connection opening of the module housing is defined with high accuracy.
  • An adjustment of whatever kind can be omitted when inserting such converter components into a pin header, since in this case the pin header does not require a socket header for the optical fibers.
  • the invention is based on the object of specifying further solutions for the already proposed converter modules which further improve large-scale industrial simple and inexpensive installation in devices and devices for transmitting messages and data when used two or more times.
  • This object is achieved according to the invention in that two or more module components are combined next to one another by a common frame-like external structure to form a single design in the form of a multi-converter module.
  • the invention is based on the finding that the assembly advantages which result in converter components with a frame-like outer structure made of a plastic with narrow manufacturing tolerances are present in the same way in converter components in which two or more module components are combined in one structural unit. Another advantage is that considerably fewer components have to be handled during assembly.
  • a first preferred embodiment for a multi-converter module is in claim 2, advantageous developments thereof are given in claims 3 to 9 and suitable methods for its production in claims 10 and 11.
  • FIG. 4 shows the view of a multi-converter module of a first embodiment for two module components still without a molded body
  • FIG. 5 shows the view of a multi-converter module for six module components in a first embodiment without a molded body
  • FIG. 7 shows the converter module in FIG. 6 in a longitudinal section
  • FIG. 8 shows the module housing of the transducer module in FIG. 6 in longitudinal section with a molding surface and a plug-in part
  • FIG. 9 is a perspective view of a multi-converter module for three or more module components in a second embodiment.
  • Electro-optical converter components are located in devices and devices for the transmission of messages and data at an interface between the actual electrical circuit of a device and an optical connector.
  • This interface is a pin header.
  • Fig. 1 shows a hybrid pin header 1, which has both electrical plug connections 3 and a plug connection device 4 for optical fibers and other electrical connecting lines on its front side 2.
  • an electro-optical transducer component 6 is inserted into the hybrid pin header 1, the bottom-side connector pins 7 and 8 of which come down from the hybrid Stick out pin header 1.
  • the downward bent connecting pins 9 of the plug connections 3 and further downwardly bent connecting pins 10 of the plug connection device 4 protrude from the rear side 5 of the hybrid pin strip 1.
  • Hy ⁇ brid pin header 1 With their terminal pins' 7, 8, 9 and 10, the Hy ⁇ brid pin header 1 is connected to these mating terminals connected on a in Fig. 1, not shown printed circuit board.
  • a socket-shaped holder 11 for fastening screws is formed on its rear side 5 on both sides.
  • the converter module 12 already shown in perspective in FIG. 2 and in a longitudinal section in FIG. 3 consists of a carrier grid 13 with foot-side connecting pins 7 and 8, of which the connecting pins 7 straight connecting pins and the connecting pins 8 by double opposite Bending straight pins 7 into laterally offset pins 8 are modified.
  • the electro-optical module 14 fastened to the carrier grid 13 consists of a diode 15 for transmission or reception, which is held on the carrier grid 13 via a base 16, and a control logic chip 17.
  • the carrier grid 13 is in the region of the fastening of the electro-optical module 14 embedded in a molded body FK made of a transparent plastic.
  • the molded body FK has on the side of the electro-optical module 14 in the area of
  • Diode 15 has an optical coupling functional surface F, which is designed here as a smooth stop surface.
  • a frame-like outer structure made of a plastic with narrow manufacturing tolerances in the order of magnitude of 0.02 mm is injection molded onto the module component M consisting of the carrier grid 13, the electro-optical module 14 and the molded body FK.
  • the outer structure consists of a crossbeam 18 on the head side with beveled side surfaces 19 and a crossbeam 20 on the foot side.
  • the crossbeam 20 on the foot side is dimensioned in height H and in its cross section in such a way that that it fully encompasses the offset connecting pins 8 in the region of their bending section 21.
  • the foot-side crossbeam 20 can alternatively also be reduced in height to the height H1, at which it has a rectangular cross section. This creates the possibility, even after the crossbars 18 and 20 have been molded onto the already finished converter module 12, to bend straight connecting feet 7 into offset connecting feet 8 if necessary. It should also be mentioned that the foot-side crossbeam 20, as shown in FIG. 2, has a horizontal groove-like recess 22 on both end faces, which will be discussed in more detail in the description of FIG. 4.
  • FIG. 4 and 5 show multi-converter modules 23 and 24, of which the multi-converter module 23 in FIG. 4 has two and the multi-converter module 24 in FIG. 5 have six module components M arranged in a row next to one another, which by injection molding a common crossbeam 18 and a common crossbeam 20 are combined into a single design.
  • the crossbeams 18 and 20 are connected here to stiffen the multi-converter modules 23 and 24 via webs 25, which are each located between two module components M.
  • the crossbar 18 on the head side of the multi-transducer modules 23 and 24 is provided with at least one cutout 26 which serves to guide it in automatic placement machines and which is oriented perpendicularly to the extent of the crossbar 18.
  • the recess 26 has a cross-section which tapers conically from the outside inwards and has in its central part a saddle-shaped elevation 27, the saddle edge of which extends in the extension of the crossbar 18. As indicated in the multi-converter module 23 shown in FIG. 4, these can be connected to a pin strip with latching hooks 28 for their integration be provided.
  • the latching hooks 28 are integrally formed on the two end faces 29 of the cross beam 20 on the foot side.
  • the end faces 30 of the head-side transverse bar 18 as the reference surfaces and the groove-like recesses 22 in the end faces 29 of the lower transverse beam 20 as Refe rence ⁇ can serve points.
  • the right end face 30 of the head-side crossbar 18 is used as a reference surface for the alignment of the diodes 15 in the horizontal direction.
  • the groove-like recesses such as the double arrow indicates ⁇ P3 for the orientation of the diodes 15 in the vertical direction, 22 used in the end faces 29 of the lower transverse beam 20th
  • Carrier grids 13 (leadframes) are initially punched out from a galvanized metal strip with connecting webs which are still required, and the straight connecting pins 7 at the base thereof are possibly partially bent into offset connecting pins 8 already after this method step.
  • Carrier grids 13 for two or more module components M are then extrusion-coated with their common frame-like outer structure, consisting of two crossbeams arranged one above the other and connected by webs 25, namely a crossbeam 18 on the head side and a crossbeam 20 on the foot side.
  • the electro-optical modules 14, namely the diodes 15 via their bases 16 and the control logic chips 17, are attached to the carrier grids 13 and contacted with the connecting lines assigned to them on the carrier grids 13.
  • the unique positioning of the diodes 15 to the intended reference surfaces or reference points of the outer geometry the crossbar 18 and / or 20 fixed.
  • the overmolded support grids 13 with their electro-optical modules 14 are each embedded in a molded body FK made of moldable transparent material with at least one functional surface F serving for optical coupling, for example a lens or a stop surface.
  • the connecting webs initially still present on the punched-out support grids 13 are punched out of the support grids 13 either after the outer structure has been molded on or after the support grids 13 have been embedded with the electroptic modules 14 into the molded body FK.
  • FIG. 6 and FIG. 7 show, in perspective and in longitudinal section, a further converter module 31, likewise already proposed, which makes use of the same module component M as the converter module 12 shown in FIGS. 2 and 3.
  • the frame-like external structure is a module housing 33 which is open on its underside 32.
  • the module component M with its molded body FK is embedded in a form-fitting manner in the module housing 33.
  • the foot-side connecting pins 7 and 8 protrude from the module housing 33 on the underside 32.
  • the module housing 33 On its front side 34, the module housing 33 has a plug-type connector opening 35 for an optical waveguide, not shown in the drawing.
  • the diode 15 of the module component M is positioned exactly on the side of the connection opening 35 in the axis A of the plug-type connection opening 35.
  • the functional surface F on the molded body side of the module component M which is a lens here, covers the connection opening 35 on the inside of the module housing 33.
  • the module housing 33 serves as a casting mold.
  • the plug-like connection opening 35 of the module housing 33 must be closed with a plug-in part 36.
  • the plug-in part 36 has on its front face 37 a molded before AF to produce the functional surface F serving for optical coupling on the molded body FK of the module component M.
  • the converter module 31 shown in FIGS. 6 to 8 can also, as shown in FIG. 9, advantageously be designed as a multi-converter module 38 in that a multi-module housing 39 is provided, into which two or more modular components M are positively embedded.
  • the multi-module housing 39 can be provided on the outside on its two side walls 40 with latching hooks 41 for its integration into a pin header.
  • the multi-converter module 38 described with reference to FIG. 9 can be produced inexpensively in mass production.
  • Carrier grids 13 (leadframes) are initially punched out of a galvanized metal strip with connecting webs which are still present, and their straight connecting pins 7 are partially bent into offset connecting pins 8 after this method step.
  • the electro-optical modules 14, namely the diodes 15 via their bases 16 and the control logic chips 17, are fastened to the carrier grids 13 and contacted with the connecting lines assigned to them on the carrier grids 13.
  • the carrier grids 13 with their electro-optical modules 14 for two or more module components M are inserted side by side into the multi-module housing 39 which is open on its underside 32 and with their diodes 15 each exactly in the axis A of the one associated with them on the multi-module housing 39 positioned like connector opening 35.
  • the carrier grids 13 with their electro-optical modules 14 are embedded using the multi-module housing 39 as a casting mold in molded body FK made of moldable transparent material, each with a functional surface F serving for optical coupling, for example a lens.
  • the socket-like connection openings 35 of the multi-module housing 39 are each formed with a shaping surface AF during their manufacture. pointing plug 36 closed.
  • the connecting webs still present on the carrier grids are punched out.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

L'invention concerne un composant convertisseur pour le raccordement de fibres optiques à un circuit électrique, ainsi que son procédé de fabrication, dans lequel: un module électro-optique (14) est fixé à un cadre de montage (13) métallique qui est intégré dans un corps moulé (FK) constitué d'une matière transparente moulable; le composant module (M) constitué du cadre de montage (13), y compris le module électro-optique (14), et du corps moulé (FK), sous la forme d'un module convertisseur (12, 31), est pourvu, au moins partiellement, d'une structure extérieure rigide, du type cadre; et au moins deux composants modules (M) de ce type sont assemblés par une structure extérieure du type cadre leur étant commune pour former un seul bloc constituant un module convertisseur multiple (23, 24, 38).
PCT/IB2000/000517 1999-04-26 2000-04-26 Composant convertisseur electro-optique et son procede de fabrication Ceased WO2000065394A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19918860.2 1999-04-26
DE19918860A DE19918860C2 (de) 1999-04-26 1999-04-26 Elektro-optisches Wandlerbauteil und Verfahren zu seiner Herstellung

Publications (1)

Publication Number Publication Date
WO2000065394A1 true WO2000065394A1 (fr) 2000-11-02

Family

ID=7905872

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2000/000517 Ceased WO2000065394A1 (fr) 1999-04-26 2000-04-26 Composant convertisseur electro-optique et son procede de fabrication

Country Status (2)

Country Link
DE (1) DE19918860C2 (fr)
WO (1) WO2000065394A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1077495A3 (fr) * 1999-08-19 2003-08-13 Tyco Electronics Logistics AG Procédé et appareil pour la fabrication d'un dispositif électro-optique

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10319900A1 (de) 2003-04-29 2004-11-25 Infineon Technologies Ag Optoelektronische Sende- und/oder Empfangsanordnung

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5763900A (en) * 1996-12-05 1998-06-09 Taiwan Liton Electronic Co. Ltd. Infrared transceiver package
EP0889533A2 (fr) * 1997-07-03 1999-01-07 Nec Corporation Module optique à semi-conducteur et procédé pour sa fabrication
EP0987572A2 (fr) * 1998-09-17 2000-03-22 Siemens Electromechanical Components GmbH & Co. KG Dispositif de connexion de guides d'onde de lumière à un circuit électrique

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19711138C2 (de) * 1997-03-07 1998-12-17 Siemens Ag Herstellungsverfahren für ein elektrooptisches Modul
DE19909242A1 (de) * 1999-02-22 2000-08-31 Siemens Ag Verfahren und Gießform zum Herstellen eines elektrooptischen Moduls und elektrooptisches Modul

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5763900A (en) * 1996-12-05 1998-06-09 Taiwan Liton Electronic Co. Ltd. Infrared transceiver package
EP0889533A2 (fr) * 1997-07-03 1999-01-07 Nec Corporation Module optique à semi-conducteur et procédé pour sa fabrication
EP0987572A2 (fr) * 1998-09-17 2000-03-22 Siemens Electromechanical Components GmbH & Co. KG Dispositif de connexion de guides d'onde de lumière à un circuit électrique

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1077495A3 (fr) * 1999-08-19 2003-08-13 Tyco Electronics Logistics AG Procédé et appareil pour la fabrication d'un dispositif électro-optique
US6740264B1 (en) 1999-08-19 2004-05-25 Tyco Electronics Logistics Ag Method for making an optical component

Also Published As

Publication number Publication date
DE19918860A1 (de) 2001-05-10
DE19918860C2 (de) 2002-03-07

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