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WO2000053364A1 - Procede et dispositif de structuration de pieces au laser - Google Patents

Procede et dispositif de structuration de pieces au laser Download PDF

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Publication number
WO2000053364A1
WO2000053364A1 PCT/DE2000/000744 DE0000744W WO0053364A1 WO 2000053364 A1 WO2000053364 A1 WO 2000053364A1 DE 0000744 W DE0000744 W DE 0000744W WO 0053364 A1 WO0053364 A1 WO 0053364A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser
workpieces
workpiece
structuring
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2000/000744
Other languages
German (de)
English (en)
Inventor
Peter Drexel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of WO2000053364A1 publication Critical patent/WO2000053364A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation

Definitions

  • the invention relates to a device and a method for laser structuring workpieces, with a first laser for generating a first laser beam, with at least one first deflection unit which deflects the first laser beam on the workpiece within a first work area assigned to the first deflection unit.
  • laser structuring When laser drilling and structuring wiring components (printed circuit boards and multichip modules), holes and conductor structures with structure dimensions ⁇ 50 ⁇ m can be produced. Patterns with trace structures of 20 ⁇ m have already been demonstrated. The minimum structure size depends on the focal length of the lens of the deflection unit used. This limits the size of the work area.
  • the workpiece and the laser unit In order to machine a workpiece that is larger than the machining area of the deflection unit, the workpiece and the laser unit have to be moved transversely to a direction of travel of the workpiece, which is associated with increased expenditure of time for the travel path and for the additional adjustment of the workpiece and laser unit to one another.
  • the object is achieved with a device of the type mentioned
  • a second deflection unit with an assigned second work area which works parallel to the first deflection unit with the first work area.
  • the two work areas overlap at most partially and this results in a higher performance through parallel operation. This means that even large workpieces can be structured very finely.
  • a second laser is provided for generating the second laser beam, which is directed onto the workpiece via the second deflection unit. This allows the two work areas to be worked on independently of each other.
  • a beam splitter is provided, which is arranged between the laser and the first deflection unit and divides the first laser beam between the two deflection units. This can avoid costs for a second laser.
  • a further deflection unit is provided between the first laser and the first deflection unit, which deflects the laser beam from the first to the second deflection unit.
  • the embodiment according to claim 5 is particularly advantageous in that the workpiece is moved essentially perpendicular to the laser beams and perpendicular to the arrangement of the laser beams among one another, since large workpieces can thereby be reached without a complex process of workpieces and laser units with respect to one another. Additional laser or deflection units can process even larger workpieces according to claim 6.
  • FIG. 1 shows a schematic front view of a device with several lasers
  • Figure 2 is a plan view of the working areas of a work piece ⁇
  • Figure 3 is a device for laser patterning using a beam splitter in front view
  • Figure 4 shows a device for laser structuring with a further deflection device in front view.
  • FIG. 1 shows how a workpiece 1 is structured using laser beams 3.
  • a total of five lasers 2 are shown in the arrangement shown there, each of which generates a laser beam 3.
  • the laser beams 3 are articulated by a total of five deflection units 4, two of which are also shown hidden.
  • Each deflection unit 4 has an objective 5 in order to focus the laser beam 3 on the workpiece 1.
  • the lasers 2 and the entire arrangement are fastened in a frame 6.
  • the workpiece 1 is moved perpendicular to the laser beams and perpendicular to the arrangement of the laser beams with one another by means of a transport device 7.
  • FIG 2 which shows the workpiece in plan view
  • the work areas 8 are shown on the workpiece 1.
  • the transport direction 9 in which the workpiece 1 is moved under the laser beams is, as can be seen, perpendicular to the laser beams and perpendicular to the arrangement of the laser beams. Due to the parallel operation described, large-area workpieces 1 can thus be structured precisely and finely, since each deflection unit 4 only has a limited working area 8 is working.
  • the working areas of the different deflection units 4 should overlap only as slightly as possible in order to be able to machine workpieces 1 that are as large as possible.
  • FIG. 3 shows a further exemplary embodiment in which, instead of five lasers 2, a beam splitter 10 is arranged, which splits the one laser beam from laser 2 into a total of five laser beams 3, which, analogous to the method already described, via five deflection units 4 onto workpiece 1 be mapped.
  • FIG. 4 shows a further exemplary embodiment in which, instead of the beam splitter 10, a further deflection unit 11 divides the laser beam of the first laser 2 into a total of five laser beams 3.
  • the different deflection units 4 have to be synchronized with one another since, owing to the further deflection unit 11, the deflection units 4 only have the laser beam available for a limited time.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

Dans le cadre de la structuration très précise au laser de pièces (1), on utilise des unités de déflexion (4) qui ne travaillent que dans une plage limitée, en raison de la focale des objectifs (5). Pour usiner des pièces (1) de surface étendue, il est prévu des moyens pour produire d'autres faisceaux laser (3), ainsi que d'autres unités de déflexion (4), ce qui permet d'usiner en parallèle plusieurs zones de travail (8) sur la pièce (1) concernée, tout en garantissant une structuration de haute précision. A cet effet, ladite pièce (1) est déplacée sensiblement perpendiculairement aux faisceaux laser (3) et perpendiculairement au système de faisceaux laser (3).
PCT/DE2000/000744 1999-03-09 2000-03-09 Procede et dispositif de structuration de pieces au laser Ceased WO2000053364A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19910343.7 1999-03-09
DE19910343 1999-03-09

Publications (1)

Publication Number Publication Date
WO2000053364A1 true WO2000053364A1 (fr) 2000-09-14

Family

ID=7900255

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2000/000744 Ceased WO2000053364A1 (fr) 1999-03-09 2000-03-09 Procede et dispositif de structuration de pieces au laser

Country Status (1)

Country Link
WO (1) WO2000053364A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015221760A1 (de) 2015-11-05 2017-05-11 Volkswagen Aktiengesellschaft Verfahren zur Herstellung der Gießform eines Gießwerkzeugs
CN108176922A (zh) * 2017-11-24 2018-06-19 武汉凌云光电科技有限责任公司 一种用于密集多点同时焊接的激光输出系统及焊接方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0347685A (ja) * 1989-07-14 1991-02-28 Mitsui Toatsu Chem Inc レーザマーキング方法及び装置
US5186184A (en) * 1989-12-06 1993-02-16 Molins Plc Cigarette manufacture
EP0538044A2 (fr) * 1991-10-15 1993-04-21 Videojet Systems International, Inc. Appareil de marquage par laser avec une qualité d'impression améliorée
JPH08141769A (ja) * 1994-11-24 1996-06-04 Sumitomo Heavy Ind Ltd レーザ加工装置
EP0884128A1 (fr) * 1996-11-20 1998-12-16 Ibiden Co., Ltd. Appareil d'usinage laser, et procede et dispositif de fabrication d'une carte imprimee multicouche
JPH1158055A (ja) * 1997-08-25 1999-03-02 Matsushita Electric Ind Co Ltd 複数軸レーザ加工方法およびその装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0347685A (ja) * 1989-07-14 1991-02-28 Mitsui Toatsu Chem Inc レーザマーキング方法及び装置
US5186184A (en) * 1989-12-06 1993-02-16 Molins Plc Cigarette manufacture
EP0538044A2 (fr) * 1991-10-15 1993-04-21 Videojet Systems International, Inc. Appareil de marquage par laser avec une qualité d'impression améliorée
JPH08141769A (ja) * 1994-11-24 1996-06-04 Sumitomo Heavy Ind Ltd レーザ加工装置
EP0884128A1 (fr) * 1996-11-20 1998-12-16 Ibiden Co., Ltd. Appareil d'usinage laser, et procede et dispositif de fabrication d'une carte imprimee multicouche
JPH1158055A (ja) * 1997-08-25 1999-03-02 Matsushita Electric Ind Co Ltd 複数軸レーザ加工方法およびその装置

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 015, no. 190 (M - 1113) 16 May 1991 (1991-05-16) *
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 10 31 October 1996 (1996-10-31) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 08 30 June 1999 (1999-06-30) *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015221760A1 (de) 2015-11-05 2017-05-11 Volkswagen Aktiengesellschaft Verfahren zur Herstellung der Gießform eines Gießwerkzeugs
DE102015221760B4 (de) 2015-11-05 2022-06-23 Volkswagen Aktiengesellschaft Verfahren zur Herstellung der Gießform eines Gießwerkzeugs
CN108176922A (zh) * 2017-11-24 2018-06-19 武汉凌云光电科技有限责任公司 一种用于密集多点同时焊接的激光输出系统及焊接方法

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