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WO1998032172A1 - Composant electronique - Google Patents

Composant electronique Download PDF

Info

Publication number
WO1998032172A1
WO1998032172A1 PCT/DE1997/000105 DE9700105W WO9832172A1 WO 1998032172 A1 WO1998032172 A1 WO 1998032172A1 DE 9700105 W DE9700105 W DE 9700105W WO 9832172 A1 WO9832172 A1 WO 9832172A1
Authority
WO
WIPO (PCT)
Prior art keywords
island
integrated circuit
electronic component
housing
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE1997/000105
Other languages
German (de)
English (en)
Inventor
Bernhard SCHÄTZLER
Georg Ernst
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE19526010A priority Critical patent/DE19526010B4/de
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Priority to PCT/DE1997/000105 priority patent/WO1998032172A1/fr
Priority to EP97908115A priority patent/EP0954879A1/fr
Publication of WO1998032172A1 publication Critical patent/WO1998032172A1/fr
Anticipated expiration legal-status Critical
Priority to US09/688,465 priority patent/US6870245B1/en
Ceased legal-status Critical Current

Links

Classifications

    • H10W74/111—
    • H10W70/411—
    • H10W90/736—

Definitions

  • the invention relates to an electronic component, in particular thin QFPs, in which a standardized lead frame and an integrated circuit are used and embedded in a casting or molding compound.
  • SMD components Surface-mounted electronic components, also called SMD components, are usually embedded in a housing made of a plastic molding compound, from which the electronic connections are led out.
  • these housings correspond to a standard with fixed dimensions, in order to enable standardized manufacture and automatic assembly of circuit boards.
  • the dimensions of these housings are specified in German and international standards.
  • the lead frames that are used for the precisely positioned embedding of the electrical connections are also standardized. In the middle of these lead frames, islands are provided on which the integrated circuits are attached. Lead frame and integrated circuit are then pressed together in the housing made of molding compound. Due to the different expansion coefficients of the
  • Iron / nickel alloy which is usually used for the lead frame, the silicon chip that forms the integrated circuit, and the molding compound of the housing and the reaction shrinkage of the molding compound that also occurs, leads to stresses. This results in diagonal housing curvatures of up to 100 ⁇ m, particularly in the case of large flat housings (thin QFPs, also called TQFPs).
  • the invention is therefore based on the object of providing a method and an electronic component of the type mentioned at the outset which minimizes the deflection of the housing in a structurally simple manner.
  • a standardized lead frame with a predetermined number of leads and a central island for receiving an integrated circuit is used in the method for producing an electronic component, each lead frame being suitable for a group of different sized integrated circuits.
  • the island then becomes one Size reduced that . is essentially adapted to the size of the integrated circuit used in each case.
  • the lead frame with the integrated circuit attached to it is embedded in a casting or molding compound and this is centered so that the same amount of molding compound is present above the circuit and below the island. A protrusion of the island over the base of the integrated circuit, which would result in an asymmetry in the molding compound distribution, is largely avoided.
  • Training is achieved that no stresses occur at the reaction shrinkage of the molding compound on the circumference of the integrated circuit between its edge and the island edge, which lead to a curvature of the housing.
  • the lead frame is preferably punched with the island integrally formed therein in order to bring the island to the desired size.
  • the adaptation of the island takes place favorably after the production of the standard leadframes, because then only a complete standardized lead frame has to be used.
  • the size adjustment of the island can also be integrated into the manufacturing process of the lead frame, however, then different adapted lead frames with island sizes that are adapted to the respective size of the integrated circuit must be produced.
  • the tools for manufacturing the lead frame are modular in order to easily adapt the island size.
  • the island is reduced to a size slightly larger than that of the integrated circuit.
  • the integrated circuit is namely preferably attached to the island by gluing with a silver conductive adhesive. The one that emerges between the integrated circuit and the island Glue is checked and serves as a measure for correct attachment. A fillet is formed in the area of the island overhang, which is easy to control visually.
  • the method according to the invention produces an electronic component with an integrated circuit and a standardized housing made of casting or molding compound, in which the integrated circuit is embedded, and with a lead frame which has a central island for receiving the integrated circuit.
  • This electronic component is characterized in that the island is essentially flush with the integrated circuit, and in that the distance between the top of the housing and the integrated circuit corresponds to the distance between the bottom of the housing and the island. If the island is larger than the integrated circuit attached to it, there is a different molding compound thickness in the area of the island protrusion between the top side of the island and the top side of the housing on the one hand and the bottom side of the island and the bottom side of the housing on the other. This difference in thickness, in conjunction with the rigid lead frame made of a special metal alloy, causes stresses in the housing which have an effect on the housing curvature.
  • the ratio of the base area of the integrated circuit to the island area alone determines the degree of housing warping with the same materials, manufacturing equipment, processes and process parameters.
  • the voltages between the integrated circuit, lead frame and molding compound are balanced such that the curvature of the housing is reduced or eliminated depending on the ratio of the areas to one another.
  • the island is finally flush with the brought integrated. Circuit trained.
  • the island and integrated circuit then have exactly the same size.
  • the molding compound thicknesses between the top of the integrated circuit and the upper edge of the housing and the underside of the island and the lower edge of the housing are the same at all points in the housing and the voltages compensate one another.
  • the bimetal effect, which results from the different expansion coefficients, is avoided by the symmetrical structure.
  • the island in another embodiment of the invention it can be advantageous to make the island somewhat larger than the integrated circuit, the integrated circuit being glued to the island and the emerging adhesive then forming a fillet on the protruding edge of the island, the formation of which can be checked whether the integrated circuit is correctly glued to the island. It is particularly advantageous to design the island so that the ratio of the base area of the integrated circuit to the island is less than 0.9: 1.
  • the island is designed as a continuous, unstructured surface. This ensures that the thickness of the molding compound above and below the integrated circuit and the island is the same. In addition, the structures and special designs of the island provided in the prior art are eliminated.
  • the feed lines can be designed as far as the island.
  • Figure 1 is a side sectional view of a device according to the invention with a large integrated circuit
  • FIG. 2 shows a side sectional view through a component according to the invention with a small integrated circuit
  • Figure 3 is a side sectional view through a component according to the invention with a small integrated circuit and a flush island.
  • FIG. 1 shows a cross section through an electronic component, in which a lead frame 2 is used, which consists in particular of the leads 3 and an island 4.
  • An integrated circuit 1 is attached to the island 4 and the lead frame 2 and the integrated circuit 1 are then embedded in a housing 6 made of molding compound.
  • the circuit 1 and the island 4 are arranged in terms of height so that housing areas 7 and 8 are formed, each having a thickness a and b, which are the same size.
  • the size of the island 4 has been adapted to the base area of the integrated circuit 1 so that it essentially coincides.
  • the island 4 is only a small protrusion larger than the base area of the integrated circuit 1, so that the adhesive used to attach the integrated circuit 1 to the island 4 can escape and form a fillet 5 on the protrusion.
  • This fillet 5 forms a suitable control parameter for monitoring an optimal bonding of the integrated circuit 1 to the island 4.
  • the overall lead frame 2 is arranged in height so that the leads 3 are also centered in the housing 6. Above and below the supply lines thus extend housing areas with the same thickness, which is denoted by c in the figure.
  • the island 4 is thus lowered according to the invention in relation to the feed lines 3, in a manner adapted to the height of the integrated circuit 1. This height adjustment must be taken into account when manufacturing the lead frame 2 and the connections between the feed lines 3 and the island 4.
  • FIG. 2 shows an electronic component according to the invention with a small integrated circuit 11.
  • the island 14 is adapted in accordance with the smaller integrated circuit 11 and is accordingly made smaller.
  • a suitable ratio of the base area of the integrated circuit 11 to the island 14 is, as can be seen in Table I, between 0.7 and 0.9.
  • a small protrusion of the island 14, on which stresses occur as a result of the reaction shrinkage of the molding compound, is accepted in order to be able to produce a fillet 5 on this protrusion of the island, which is an important control parameter during production.
  • FIG. 3 Another embodiment of the invention is shown in FIG. 3, in which a small integrated circuit 11 with a flush-fitting island 24 is also shown.
  • a small integrated circuit 11 with a flush-fitting island 24 is also shown.

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

L'invention concerne un composant électronique (1) dans lequel on utilise un cadre d'amenée standard (2), dont l'îlot (4) destiné à recevoir un circuit de commutation intégré (1) est adapté, en dimensions, à la surface de base dudit circuit intégré (1), en vue de réduire au minimum ou d'empêcher les déformations du boîtier.
PCT/DE1997/000105 1995-07-17 1997-01-22 Composant electronique Ceased WO1998032172A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE19526010A DE19526010B4 (de) 1995-07-17 1995-07-17 Elektronisches Bauelement
PCT/DE1997/000105 WO1998032172A1 (fr) 1995-07-17 1997-01-22 Composant electronique
EP97908115A EP0954879A1 (fr) 1997-01-22 1997-01-22 Composant electronique
US09/688,465 US6870245B1 (en) 1997-01-22 2000-10-16 Electric component with an integrated circuit mounted on an island of a lead frame

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19526010A DE19526010B4 (de) 1995-07-17 1995-07-17 Elektronisches Bauelement
PCT/DE1997/000105 WO1998032172A1 (fr) 1995-07-17 1997-01-22 Composant electronique

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US35917899A Continuation 1997-01-22 1999-07-22

Publications (1)

Publication Number Publication Date
WO1998032172A1 true WO1998032172A1 (fr) 1998-07-23

Family

ID=25962889

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1997/000105 Ceased WO1998032172A1 (fr) 1995-07-17 1997-01-22 Composant electronique

Country Status (2)

Country Link
DE (1) DE19526010B4 (fr)
WO (1) WO1998032172A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19526010B4 (de) * 1995-07-17 2005-10-13 Infineon Technologies Ag Elektronisches Bauelement
EP0954879A1 (fr) 1997-01-22 1999-11-10 Siemens Aktiengesellschaft Composant electronique

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4258381A (en) * 1977-12-07 1981-03-24 Steag, Kernergie Gmbh Lead frame for a semiconductor device suitable for mass production
JPS60119756A (ja) * 1983-12-01 1985-06-27 New Japan Radio Co Ltd 半導体装置の製造方法
JPS60189956A (ja) * 1984-03-09 1985-09-27 Nec Corp 半導体装置用リ−ドフレ−ムの製造方法
JPS6132435A (ja) * 1984-07-24 1986-02-15 Nec Corp 半導体素子の取り付け方法
JPH04101437A (ja) * 1990-08-21 1992-04-02 Seiko Instr Inc 半導体装置の実装方法
DE4041346A1 (de) * 1990-12-21 1992-06-25 Siemens Ag Standard-kunststoffgehaeuse mit darin verkapselten halbleiterchips
US5191403A (en) * 1991-02-05 1993-03-02 Kabushiki Kaisha Toshiba Resin-sealed semiconductor device having a particular mold resin structure
DE19526010A1 (de) * 1995-07-17 1997-01-23 Siemens Ag Elektronisches Bauelement und Verfahren zur Herstellung eines elektronischen Bauelements

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3029667A1 (de) * 1980-08-05 1982-03-11 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-baustein
US4884124A (en) * 1986-08-19 1989-11-28 Mitsubishi Denki Kabushiki Kaisha Resin-encapsulated semiconductor device
EP0261324A1 (fr) * 1986-09-26 1988-03-30 Texas Instruments Incorporated Boîtier en plastique pour circuit intégré de grandes dimensions
DE3635375A1 (de) * 1986-10-17 1988-04-28 Heraeus Gmbh W C Systemtraeger fuer elektronische bauelemente
JPH0521655A (ja) * 1990-11-28 1993-01-29 Mitsubishi Electric Corp 半導体装置および半導体装置用パツケージ
DE4204286A1 (de) * 1992-02-13 1993-08-19 Siemens Ag Arbeitsverfahren und maschinengruppe zum herstellen von standard-elektronik-elementen unterschiedlicher groesse

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4258381A (en) * 1977-12-07 1981-03-24 Steag, Kernergie Gmbh Lead frame for a semiconductor device suitable for mass production
JPS60119756A (ja) * 1983-12-01 1985-06-27 New Japan Radio Co Ltd 半導体装置の製造方法
JPS60189956A (ja) * 1984-03-09 1985-09-27 Nec Corp 半導体装置用リ−ドフレ−ムの製造方法
JPS6132435A (ja) * 1984-07-24 1986-02-15 Nec Corp 半導体素子の取り付け方法
JPH04101437A (ja) * 1990-08-21 1992-04-02 Seiko Instr Inc 半導体装置の実装方法
DE4041346A1 (de) * 1990-12-21 1992-06-25 Siemens Ag Standard-kunststoffgehaeuse mit darin verkapselten halbleiterchips
US5191403A (en) * 1991-02-05 1993-03-02 Kabushiki Kaisha Toshiba Resin-sealed semiconductor device having a particular mold resin structure
DE19526010A1 (de) * 1995-07-17 1997-01-23 Siemens Ag Elektronisches Bauelement und Verfahren zur Herstellung eines elektronischen Bauelements

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 009, no. 277 (E - 355) 6 November 1985 (1985-11-06) *
PATENT ABSTRACTS OF JAPAN vol. 010, no. 032 (E - 379) 7 February 1986 (1986-02-07) *
PATENT ABSTRACTS OF JAPAN vol. 010, no. 184 (E - 415) 27 June 1986 (1986-06-27) *
PATENT ABSTRACTS OF JAPAN vol. 016, no. 336 (E - 1237) 21 July 1992 (1992-07-21) *

Also Published As

Publication number Publication date
DE19526010A1 (de) 1997-01-23
DE19526010B4 (de) 2005-10-13

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