WO1998054002A1 - Non-contact ic card and method for manufacturing the same - Google Patents

Abstract

A non-contact IC card which is free from sink marks and has excellent surface smoothness. This card comprises a loop coil for antenna and an IC chip both incorporated in a vinyl chloride sheet which has been expanded so as to allow the loop coil and IC chip to be buried therein.

Description

 Description Non-contact IC card and manufacturing method

 The present invention relates to a non-contact type IC card and a method for manufacturing the same. Background art

 Recently, IC cards with built-in IC chips have appeared in place of conventional magnetic stripe type cards, and commercialization of gasoline payment cards and telephone cards has begun. IC cards with built-in IC chips are much more reliable in terms of information volume, processing speed, security, etc. than conventional magnetic stripe type cards. It is thought that it becomes.

 IC cards are roughly classified into two types: a contact-type IC card, whose contact with a reader / writer that reads and writes information on the IC chip is exposed on the card surface, and an antenna coil and IC chip inside the card. There are two types of “contactless IC cards” that are built-in and can read and further rewrite the information on the IC chip with the induced current generated in the coil when a force passes through a magnetic field.

 The contact type IC force is a force that can use a high-performance IC chip.It requires a card to be inserted into a reader / writer, which is troublesome, and the reader / writer physically contacts the card. Therefore, the durability of the card due to friction and wear and the maintenance of the reader / writer become problems.

On the other hand, non-contact IC cards do not need to be inserted into reader / writers, There is no physical contact with the reader / writer.For example, if a non-contact IC card is used for the telephone card, the telephone can be prevented from being stained due to contact with the card, so This has the advantage that maintenance is easier. Also, there is no need to insert the card into the reader / writer every time. For example, information can be exchanged at the nonstop when passing through automatic ticket gates on expressways or tollgates on expressways. This is effective in eliminating the problem. Therefore, the non-contact type IC card is expected to have a large market as a pre-paid card for public institutions and telephone cards.

Non-contact IC cards were mainly manufactured by the injection molding method in which an IC chip and a loop coil for an antenna were fixed in a force-shaped mold, and then resin was injected and integrated. . Tokoro force ^s, in the production of IC force one de In this method, or IC chip is subjected to damage by the pressure and temperature at the time of resin injection, it must be subjected to printing in the IC card one by one after the molding Cost-ups were a problem.

To solve this problem, a method has been adopted in which large-sized sheets are embedded with IC chips (COB) without using injection molding, and a large number of cards are cut out from the large-sized sheets. Note that a rigid PVC sheet is usually used for a large-sized sheet from the viewpoint of physical properties such as mechanical properties and mechanical properties, and from the viewpoint of cost and the like. The manufacturing method will be specifically described. First, cut the concave part for mounting the IC chip on the center sheet of the card (hereafter referred to as the “core sheet”) (hereafter referred to as “counterboring processing”) and then load the IC chip into the concave part. After punching out a window of the size of an Ic chip, an IC chip is loaded into the punched window, and a sheet for concealing the IC chip on one or both sides of the core sheet (hereinafter referred to as “oversheet”) ), And heat-sealed and integrated by heat press to embed the IC chip etc. (COB) Form a large sheet. After that, it is punched and finished into a card shape. In this case, the oversheet may be printed in advance, or may be printed on the oversheet after hot pressing and before punching.

 However, manufacturing an IC card by this method is time-consuming, and requires the formation of a recess slightly larger than the size of the IC chip in the core sheet or the punching of the window to load the IC chip. Later, sinks occur on the force surface and the smoothness of the card deteriorates. Therefore, when printing on the over layer after pressing, printability is reduced. The recently developed multi-function cards not only have a non-contact IC chip built-in, but also have a contact IC chip and magnetic stripe on one card, making it a contact-type reader / writer. May be inserted. Further, there is a case where a thermal rewritable recording medium capable of repeating printing and erasing by heat is applied to the card surface, so that surface smoothness is particularly required. Thus, the smoothness of the card surface is expected to become an increasingly important issue in the future. Disclosure of the invention

 The present invention has been made to solve the above problems, and an object of the present invention is to provide a non-contact IC force guide which does not cause sink marks and has excellent surface smoothness and a method for producing the same. It is in.

 The first aspect of the non-contact type IC card of the present invention is that the antenna loop coil and the IC chip are incorporated into a foamed vinyl chloride sheet which has been foamed so that the antenna loop coil and the IC chip can be embedded. It is characterized by being carried out.

A second aspect of the non-contact type IC force of the present invention is that the antenna sheet is formed on a foam sheet which has been foamed so that the antenna loop coil and the IC chip can be embedded. A loop coil and an Ic chip are incorporated, an oversheet is provided outside the foam sheet, and the foam sheet is heat-fusible with the oversheet.

 Here, the foamed sheet may be a foamed vinyl chloride sheet, and the over sheet may be a vinyl chloride sheet.

 Further, the foamed vinyl chloride-based sheet may contain a post-chlorinated vinyl chloride resin.

 Further, a skin layer may be provided on the outer surface of the foamed sheet or the foamed vinyl chloride-based sheet.

 The antenna loop coil and the IC chip may be arranged on a plastic sheet and then incorporated in a foamed vinyl chloride sheet or foamed sheet.

 In the first embodiment of the method for producing a non-contact IC card of the present invention, a loop coil for antenna and an IC chip are sandwiched between foamed chloride-based sheets, and heated and pressed in an atmosphere sucked to a vacuum state. After that, the foam is crushed by foaming and then cooled while maintaining the crushed state of the foam in the foamed vinyl chloride sheet to obtain a non-contact IC card.

 According to a second aspect of the method for manufacturing a non-contact type IC card of the present invention, a loop coil for an antenna and an IC chip are sandwiched between foam sheets, a paper sheet is provided outside the foam sheet, and the vacuum sheet is sucked. After heating and pressurizing in a heated atmosphere to collapse the foam, the foam in the foamed chlorinated vinyl sheet is cooled while maintaining the collapsed state to obtain a non-contact IC card. .

In the method for manufacturing a non-contact type IC card according to the first aspect or the second aspect, after disposing the antenna loop coil and the IC chip on a plastic sheet, the plastic sheet is made of a foamed polyvinyl chloride sheet or foamed sheet. of It may be sandwiched inside.

 Further, a skin layer may be further provided on the outer surface of the foamed vinyl chloride sheet or foamed sheet. BRIEF DESCRIPTION OF THE FIGURES

 FIG. 1 is a partially enlarged cross-sectional view schematically showing a state before pressurization in one embodiment of a method for producing a non-contact IC force of the present invention. BEST MODE FOR CARRYING OUT THE INVENTION

 In the non-contact type IC card of the present invention, a loop coil for an antenna, an IC chip and the like are incorporated in a foam sheet. The expansion ratio of the foam sheet is set so that a loop coil for an antenna and an IC chip (COB) can be embedded. The value of the expansion ratio is not particularly limited as long as the foamed sheet is foamed so that the thickness of the foamed sheet is equal to or greater than the thickness of C0B, and is not particularly limited, but is usually 1.5 to 5.0 times. Range. If the expansion ratio of the sheet is less than 1.5 times, when the thickness of the IC chip to be used is large, the card surface after pressing may be distorted by the IC chip and the smoothness may be deteriorated. Become. The reason why the expansion ratio was set to 5 times is that, for example, since a PVC compound has a high melt viscosity, a sheet having an expansion ratio exceeding 5 times is difficult to obtain as a practical problem. In the case of PVC compound, even if the foaming ratio is increased by increasing the amount of the foaming agent added, the physical properties of the sheet will decrease and discoloration will occur, and furthermore, there will be problems such as discoloration due to the foaming agent residue during pressing. Because. Therefore, when the PVC compound is not used, the expansion ratio may be larger than 5 times.

The foamed sheet used in the present invention can have a desired expansion ratio by adding, for example, a foaming agent. Type of foaming agent added to foam sheet The class is not particularly limited, and for example, a foaming agent such as an azodicarboxylic acid amide-based foaming agent can be used. Further, the sheet may be foamed by forcibly injecting an inert gas into the molten resin using an extruder.

 The foam sheet used in the present invention can contain additives. The type of the additive used in the present invention is not particularly limited. For example, a heat stabilizer and a lubricant required for ordinary PVC processing, a pigment necessary for hiding as a card, and the like can be added. Further, a processing aid such as a foam cell stabilizer for making the cell uniform and an impact modifier for preventing card cracking may be added. Further, a plasticizer may be contained in an amount within a range that does not significantly lower the softening temperature of the card. Generally, the softening temperature of the card is preferably higher. From the practical point of view, the amount of the plasticizer added is, for example, in the case of a foamed vinyl chloride sheet, 5 parts per 100 parts by weight of PVC or the like. It is preferable that the amount is not more than part by weight.

 Examples of the foamed sheet used in the present invention include, but are not limited to, a foamed vinyl chloride-based sheet and a foamed soft acryl-based resin sheet. Here, the foamed vinyl chloride sheet includes a sheet containing a post-chlorinated vinyl chloride resin (post-chlorinated PVC), a sheet of a PVCC vinyl acetate copolymer, and the like. When heat resistance is required, it is preferable to use post-chlorinated PVC, so-called heat-resistant PVC. In addition, when the sheet is heat-sealed at a low temperature, a PVCC vinyl acetate copolymer can be used.

In the present invention, the IC chip and the like may be directly incorporated between the foamed sheets, but may be incorporated in the plastic sheet in advance, and the plastic sheet may be incorporated between the foamed sheets. However, the plastic sheet must be heat-fusible with the foam sheet. Examples include vinyl chloride sheets, acryl resin sheets, and ABS resin sheets. The thickness of the sheet is not particularly limited as long as it has an appropriate strength capable of holding an IC chip or the like, and may be appropriately determined from the final thickness of the IC card to be used.

 Further, in the present invention, the number of foam sheets may be one, but an IC chip or the like may be incorporated between two layers of foam sheets, or a sheet composed of two or more layers of foam sheets may be used. It may be incorporated in between.

 In the present invention, an over sheet can be provided outside the foam sheet. The material used for the oversheet is not particularly limited, but it has good adhesiveness to the foam sheet, so that the foam sheet can be adhered at the same time as the foam sheets are adhered to each other. Therefore, non-foamed chloride-based sheets (non-foamed PVC sheets) are preferably used.

 The oversheet may be a transparent sheet or an opaque sheet, and the oversheet may be printed in advance or may be printed after pressing. In the present invention, the oversheet may be laminated on one side or both sides of the foam sheet. A heat-sensitive rewritable recording medium capable of repeating printing by heating and erasing of printing may be applied to the surface of the oversheet after pressing.

 In the present invention, a skin layer may be provided on a surface of the foam sheet that is not in contact with the IC chip or the like, and a skin layer may be provided on one surface of the foam sheet or on both surfaces. It may be. The skin layer is a printable layer having a smooth surface. A white chloride chloride film or the like is used as the skin layer.

In the non-contact type IC card of the present invention, first, a plurality of sets of antenna loop coils, IC chips and the like are arranged at predetermined positions between two foam sheets having a suitable foaming ratio. Overlap the oversheet on the outside and put it on two While sandwiched between chrome-plated steel sheets, heat and apply pressure while evacuated to a vacuum to crush bubbles in the foam sheet. After cooling to room temperature, it is punched into a card shape. Get the card.

 However, the antenna loop coil, IC chip, etc. were made into one set, and many sets of IC chips, etc. were arranged on the polymer layer at equal intervals in consideration of the desired card size, etc., and temporarily fixed with an adhesive. . This sheet was punched into a set of IC chips and the like to finish it into a card shape, and a non-contact IC card was manufactured. The number of turns of the coil for the antenna can be appropriately selected according to the method of using the card.

 When the foamed sheet is a foamed vinyl chloride sheet, it is not necessary to provide a transparent sheet. Further, the two foam sheets sandwiching the IC chip or the like may be composed of a plurality of foam sheets, respectively.

 When the non-contact type IC card of the present invention has a skin layer, the skin layer is provided by being melted and integrated on one surface of the foamed sheet. An IC chip or the like is arranged on the surface of the sheet where the skin layer is not provided, and a non-contact type IC force is manufactured as described above.

In the present invention, instead of directly arranging the IC chips and the like between the foam sheets, those having been previously arranged on a plastic sheet may be used. This manufacturing method will be described with reference to FIG. An antenna loop coil and an IC chip 2 are placed on a plastic sheet 1. The IC chip 2 is provided with a through hole in a plastic sheet. This is sandwiched between two foam sheets 3, and then the oversheet 4 is overlaid, sandwiched between both sides with chrome-mesh steel plates 5, and heated and pressed in an atmosphere sucked by vacuum, and Crush bubbles. After that, punch out into a card shape to obtain a non-contact IC force. Example

 Examples 1-4

 Using an extruder having the composition shown in Table 1, a foamed vinyl chloride sheet having an expansion ratio and a sheet thickness shown in Table 2 was produced. However, the post-chlorinated PVC in Table 1 had a chlorination rate of 65%, and the high molecular weight PMMA used was Metaprene P-530 manufactured by Mitsubishi Rayon Co., Ltd.

The obtained foamed polyvinyl chloride sheet was cut into a width of 30 cm and a length of 40 cm, and a 4-turn antenna loop coil in which a copper wire with a wire diameter of 0.15 was turned four times, and a length of 5 mm X 5 mm IC chips with a size of 0.35 mm and a thickness of 0.35 mm are arranged at equal intervals in consideration of the desired card size, temporarily fixed with a cyanoacrylate-based instant adhesive, and sandwiched between the IC chips, etc. In this way, the foamed vinyl chloride sheets cut to 30 cm in width and 40 cm in length were stacked. A non-foamed PVC sheet, a foamed vinyl chloride sheet temporarily fixed with a loop coil for an antenna or an IC chip (COB), a foamed vinyl chloride sheet, and a non-foamed PVC sheet are stacked in this order. One sheet on each side was sandwiched between two chrome plated steel sheets. Subsequently, in a vacuum-sucked atmosphere, this state was maintained under the conditions of a press temperature of 140 ° C. and a press pressure of 20 kgZcm ² until the bubbles in the foam sheet were completely crushed.

 Thereafter, while keeping the state in which the bubbles were crushed, the mixture was cooled to room temperature, and cut into a card shape to produce a non-contact type IC card of Example 1. The resulting card had a laminated sheet thickness of 800 m after pressing. The sheet No. 1 in Table 2 was used as the non-foamed vinyl chloride sheet (non-foamed PVC), and the sheet No. 3 was used as the foamed vinyl chloride-based sheet. .

Noncontact IC cards of Examples 2 to 4 and Comparative Example were produced in the same manner as in Example 1 except that the combination of sheets was changed as shown in Table 3. The surface smoothness of the obtained non-contact type IC cards of Examples 1 to 4 and Comparative Example 1 was visually judged. Table 3 summarizes the results. However, in the criteria for determining the surface smoothness, a symbol “〇” indicates a favorable state without distortion, and a symbol “X” indicates a large distortion.

table 1

Table 2 Sheet No. 1 2 3 4 5 6 Formulation No. AABCDE Expansion ratio (times) Non-foaming Non-foaming 1.5 3.0 5.0 3.0 Sheet thickness (μm) 100 400 450 900 1 500 900

Table 3 Combination of sheets Surface smoothness Comparative example 1 Plated plate 2 ZIC chip etc. Z2 / plated plate X

 1 Plate Z 1 Z 3 / '1 C chip etc. Z 3Z1Z plate メ Example 2 Plate Z1Z4 plate' I C chip etc./4/1 Z plate 〇

 3 Plated plate 1/5 / IC chip etc.Z 5/1 Z plated plate 〇

4 Plating plate 1/6 / IC chip, etc.6 1 / Melt plate 〇

As is clear from Table 3, Comparative Example 1 had poor surface smoothness, but Examples 1 to 4 had no distortion and excellent surface smoothness. In Examples 1 to 4, similar results can be obtained even when a non-foamed PVC sheet is provided as an oversheet and a power oversheet is not provided. Example 5

An antenna circuit was formed by bonding a 30-micron-thick copper foil to one side of a 100-micron-thick white vinyl chloride sheet, followed by etching. A through hole for inserting the IC chip is formed in the sheet at the end of the formed circuit, and an IC chip of 5 mm X 5 mm and 0.35 mm thickness is used as an antenna through contacts. Joined with the circuit. In this form, both sides of the plastic sheet are sandwiched between sheets of sheet No. 4 in Table 2, and both sides of the sheet are made of a 50-micron thick transparent vinyl chloride sheet obtained by Formulation A in Table 1. seen today across further by two Kuromume luck steel, the press temperature 1 in a state of vacuum suction 4 0 ° C, under the conditions of a press pressure 2 0 kg / cm ^2, collapsing air bubbles in the foam sheet total This state was maintained until the end. Thereafter, while maintaining the state in which the bubbles were crushed, the mixture was cooled to room temperature and punched into a card shape to obtain a non-contact IC force of Example 5. The resulting card had a thickness of 800 microns.

 When the surface smoothness of the obtained non-contact type I c force was visually judged, it was found that the surface was good without distortion. Example 6

When extruding sheet No. 4 in Table 2, a 20-micron-thick white vinyl chloride film was passed between the molten foamed vinyl chloride resin and the cooling roll as a skin layer. Melt and integrated with foam sheet, skin on one side A foamed vinyl chloride-based sheet having a layer was obtained. The pattern was printed by screen printing on the skin layer side of the obtained foamed vinyl chloride sheet. Next, a loop coil for an antenna in which a copper wire having a wire diameter of 0.15 mm is wound four times and an IC chip having a size of 5 mm × 5 mm in length and width and a thickness of 0.35 mm are provided with a skin layer 2 It was sandwiched between foam sheets of two foam sheets. Further, both sides of the sheet were sandwiched between transparent vinyl chloride sheets having a thickness of 80 μm obtained by Formulation A in Table 1, and then sandwiched between two chrome plated steel sheets. This condition was maintained under the conditions of 40 ° C. and a press pressure of 20 kg / cm ² until all the bubbles in the foam sheet were crushed. Thereafter, while maintaining the state in which the bubbles were crushed, the mixture was cooled to room temperature and punched into a card shape to obtain a non-contact IC card of Example 6. The resulting card had a thickness of 800 microns.

 When the surface smoothness of the obtained non-contact type IC card was visually judged, it was found that the surface was good without distortion. Example 7

We obtained a foam sheet with a foaming ratio of 3 times and a thickness of 300 microns in the current sheet before embossing of a soft acrylic resin sheet developed for wallpaper. An antenna loop coil obtained by winding a copper wire with a wire diameter of 0.15 mm four times, and an IC chip with a size of 5 mm x 5 mm and a thickness of 0.35 mm, and a foam sheet 3 The sheets were placed between each sheet, and both sides were sandwiched between transparent vinyl chloride sheets of sheet No. 1 in Table 2. This was then sandwiched with Kuromume luck steel, while vacuum suction, pressing temperature 1 4 0 ° C, the bubbles in the foam sheet Ichito under the conditions of a press pressure ² 0 kg / cm 2 is the state until collapse all Held. Thereafter, while keeping the state in which the bubbles were crushed, the mixture was cooled to room temperature and punched out in a forcep shape to obtain a non-contact type IC card of Example 7. Car obtained The thickness of the pad was 800 microns.

 When the surface smoothness of the obtained non-contact type IC card was visually judged, it was found that the surface was good without distortion.

 As described in detail above, the non-contact IC card of the present invention does not require counterboring or drilling, and therefore has no sink marks and excellent surface smoothness. Further, since the non-contact type IC card of the present invention had a smooth surface, the printed pattern had no distortion and was excellent in printability.

Claims

The scope of the claims 1. A non-contact type IC card characterized in that the loop coil for an antenna and the IC chip are incorporated in a foamed vinyl chloride sheet which has been foamed so that the loop coil for an antenna and the IC chip can be embedded. .  2. The antenna loop coil and the IC chip are incorporated in a foam sheet that has been foamed so that the antenna loop coil and the IC chip can be embedded, and an oversheet is provided outside the foam sheet. A non-contact type IC card, wherein the foam sheet is heat-fusible with the over sheet.  3. The non-contact type I according to claim 2, wherein the foam sheet is a foamed vinyl chloride sheet, and the oversheet is a vinyl chloride sheet. card.  4. The non-contact I C power according to claim 1 or 3, wherein the foamed vinyl chloride-based sheet contains a post-chlorinated vinyl chloride resin. 5. The non-contact type IC card according to any one of claims 1 to 4, wherein a skin layer is provided on an outer surface of the foamed sheet or the foamed vinyl chloride-based sheet.  6. The loop coil for an antenna and an IC chip are disposed on a plastic sheet, and the plastic sheet is incorporated in the vinyl chloride foam sheet or the foam sheet. Item 7. A non-contact IC card according to any one of Items 1 to 5. 7. The antenna loop coil and IC chip are sandwiched between foamed vinyl chloride sheets and heated and pressurized in an atmosphere that has been sucked to a vacuum state. A method for producing a non-contact IC card, comprising: crushing the foam and cooling while maintaining the crushed state of the foam in the foamed vinyl chloride sheet to obtain a non-contact IC card. .  8. The loop coil for antenna and the IC chip are sandwiched between foam sheets, an oversheet is provided outside the foam sheets, and the foam is crushed by applying heat and pressure in an atmosphere sucked to a vacuum state. And then cooling the foamed vinyl chloride sheet while keeping the air bubbles in the foamed sheet to obtain a non-contact IC card.  9. The manufacturing method according to any one of claims 7 or 8, wherein the antenna loop coil and the IC chip are arranged on a plastic sheet, and then the plastic sheet is expanded with a foamed vinyl chloride sheet or 9. The method for producing a non-contact type IC card according to claim 7, wherein the method is sandwiched between foam sheets.  10. The method according to any one of claims 7 to 9, wherein a skin layer is provided on the outer surface of the expanded vinyl chloride sheet or the expanded sheet, and further, printing is performed. The method for producing a non-contact IC forceps according to any one of claims 7 to 9, characterized in that: