JP2001022912A - Ic card and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form a card which does not undergo base deformation, sheet peeling, etc., by stabilizing the hardening reaction of an isocyanate group in a reaction type hot melt adhesive layer. SOLUTION: In this IC card 100, which encloses an IC module in a reaction- type hot melt adhesive layer 2 existing between a 1st sheet material 1 and a 2nd sheet material 4, the quantity of unreacted isocyanate group is defined as 5% or lower of that of reacting the isocyanate group. With this configuration, it is possible to provide an IC card that the hardening reaction of the isocyanate group in the layer 2 is stable and stable physical properties that are not subject to base deformation, sheet peeling, etc., are obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a license such as a car license, an identification card, a passport, an alien registration card, a library use card, and a cash card which incorporate an IC module having an IC chip and an antenna. And an IC card such as a credit card, an employee card, an employee card, a member card, a medical card and a student card, and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, ID cards such as identification cards, cash cards, credit cards, etc.
A magnetic card for recording data by a magnetic recording method is widely used in many cases. A magnetic card can rewrite data relatively easily, so it is not enough to prevent data tampering, the media is magnetic and easily affected by external influences, and the data protection is not enough. There is a problem that there are few.

Therefore, in recent years, ICs with built-in IC chips have been developed.
Cards are starting to spread. The IC card reads and writes data from and to an external device via an electric contact provided on the surface or a loop antenna inside the card. An IC card has a larger storage capacity and a greater security than a magnetic card.

[0004] In particular, a non-contact type IC card in which an antenna body for exchanging information between an IC chip and the outside is built in the card and has no electric contact outside the card, has an electric contact on the card surface. It is being used for applications that require high data confidentiality and forgery / falsification prevention because of its superior security compared to the contact type IC card described above.

[0005] As such an IC card, for example, there is a card in which a top sheet material and a back sheet material are bonded via an adhesive, and an IC module having an IC chip and an antenna body is sealed in the adhesive layer. As this adhesive, a reactive hot melt resin is used. The reactive hot melt adhesive has a solid at room temperature. This adhesive is melted by heating and then bonded, then
The adhesive has the property of absorbing moisture and curing itself. Its features include that the bondable time is longer than that of a normal hot-melt adhesive, and that the softening temperature after bonding is high, so that it has high durability and is suitable for low-temperature bonding.

That is, in the case of a normal hot melt adhesive, the heat resistance is not higher than the bonding temperature because the bonding temperature is the same as the softening temperature of the adhesive. Therefore, when high heat resistance is required, a high bonding temperature is required. For example, in the case of bonding at a temperature of 100 ° C. or more, when the card substrate is easily warped or when a layer weak to high temperature processing such as an image receiving layer for image formation by thermal transfer is provided on the card surface, There was a problem that the image receiving layer was damaged.

On the other hand, the reactive hot-melt adhesive cures after the bonding process, so that its heat-resistant temperature is several tens of degrees higher than the bonding temperature. Therefore, the above problem can be solved. An example of a reactive hot melt adhesive is a urethane polymer having an isocyanate group at its molecular terminal as a main component, and the isocyanate group is activated by reacting with water, and further reacts with a prepolymer to form a crosslinked structure. There is.

[0008]

By the way, the reactive hot melt adhesive is used after the upper and lower sheet materials are bonded together.
The reaction proceeds by absorbing moisture in the air to cure the adhesive. For this reason, if the curing is insufficient, after the IC card is handed over to the user (the card issuer who prints on the surface of the card), the durability of the card changes, the stress on the IC chip changes, and the like. Irregularities may occur on the card surface. As a result, there arises a problem that the physical properties of the card become unstable, such as an obstacle to image formation on the surface of the card.

Further, if the card is removed at a stage where curing is insufficient, the end of the card will be crushed and the flatness of the card will be lost, and stress will be applied to the connection between the IC chip and the antenna. Transmission, which can cause electrical damage. By the way, it is difficult to determine whether the IC card is completely cured by measuring the amount of deformation of the adhesive inside the card by bending or applying pressure because the hardness of the card changes depending on the thickness and material of the card substrate. Met.

In view of the above, the present invention has solved the above-mentioned problems, and has a stable physical property in which a curing reaction of an isocyanate group in a reactive hot-melt adhesive layer is stable, and further, there is no deformation of a substrate or peeling of a sheet. An object of the present invention is to provide an IC card capable of forming the above-mentioned card and a method for manufacturing the same.

[0011]

In order to solve the above problems and achieve the object, an IC card according to the present invention is interposed between a first sheet material and a second sheet material. In an IC card in which an IC module is sealed in a reactive hot melt adhesive layer, the amount of unreacted isocyanate groups in the reactive hot melt adhesive layer is 5% or less of the amount of reacted isocyanate groups. It is characteristic.

According to the IC card of the present invention, the amount of unreacted isocyanate groups in the reactive hot melt adhesive layer is 5% or less, preferably 2% or less, of the reacted isocyanate groups. As a result, it is possible to provide a card having a stable curing reaction and having stable physical properties without deformation or peeling of a sheet when used by a user.

In particular, when the amount of the isocyanate group is 2% or less, the card is almost completely cured, so that a convex portion corresponding to the shape of the IC chip and a concave portion outside the IC chip are not generated on the card surface. It is possible to record without any trouble on the card surface (contact recording method using an ink ribbon) even in printing having a concave and convex portion with a depth of about 1 to 5 μm, and it is excellent in image formability when an IC card is issued in a later process. In addition, a raw card substrate can be provided.

According to a method of manufacturing an IC card according to the present invention, in a method of manufacturing a plurality of IC cards from one or a long roll-shaped sheet material, an IC chip is sealed in a reactive hot melt adhesive. And a step of sandwiching the IC chip between sheet materials and a step of performing card cutting (cutting) after the amount of isocyanate groups in the reactive hot melt adhesive becomes 10% or less of the reacted isocyanate group amount. It is characterized by the following.

According to the method of manufacturing an IC card according to the present invention, the degree of curing of the reactive hot-melt adhesive can be confirmed at the time of card manufacturing, and the card is subjected to a strong impact by a card cutting machine in a card removing process. And the thickness at the end of the card is 90 to 99.8 with respect to the thickness at the center of the card.
% Can be maintained.

In the unreacted state where the residual isocyanate group is 10% or less, the hot melt adhesive does not easily adhere to the cutter blade at the time of card removal. The linearity of the card can be maintained.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an IC card and a method of manufacturing the same according to an embodiment of the present invention will be described with reference to the drawings. (1) IC Card as Embodiment FIG. 1 is a cross-sectional view showing a configuration example of an IC card 100 as an embodiment of the present invention. In the present embodiment, the amount of unreacted isocyanate groups in the reactive hot melt adhesive layer is set to 5% or less, preferably 2% or less of the reacted isocyanate groups, so that the curing reaction of the isocyanate groups is stable. In addition, a card having stable physical properties without substrate deformation or sheet peeling can be formed.

An IC card 100 shown in FIG. 1 is composed of a first sheet material 1 and a second sheet material 4, an adhesive layer 2 interposed between these sheet materials 1 and 4, and the IC module 3. Become. The IC module 3 is sealed in the adhesive layer 2. The surface of the sheet material 1 may be provided with an image receiving layer (not shown) for printing an image or written information.

The IC module 3 shown in FIG. 2 is of a coil type, and has an IC chip 6 for electrically recording information relating to a user of the IC card 100 and the IC chip 6.
Is connected to the coil 5. The coil 5 is formed by winding a copper wire several times. The IC module 3 'shown in FIG.
The printed board 8 on which is formed and the IC chip 6 are joined. The IC chip 6 is a memory only or a microcomputer in addition to the memory. The IC modules 3 and 3 'may include a capacitor.

Since the IC card 100 is of a non-contact type, it has no information input / output terminals. The information is converted into a specific modulated radio wave, received by the coil 5 and the antenna pattern 7, demodulated by the IC chip 6, written into a memory or the like, or read therefrom. In a method used for a normal non-contact type IC card, the driving power supply can take in external electromagnetic energy into the antenna pattern 7 or the like. For example, a DC power supply is obtained by rectifying an electromotive force generated by electromagnetic induction. Of course, in addition to this, it is also conceivable to take in electricity from external high-frequency electromagnetic energy into the antenna pattern 7 or another object.

A plastic film having a thickness of 50 to 200 μm is used for the sheet material 1 and the sheet material 4. For example, polyester, polyethylene, polyvinyl chloride, polyolefin such as polypropylene, polycarbonate and the like are used for the plastic film. In this example, the sheet material for the front surface is made of a printing material, and image display information is printed in a predetermined area in advance.

The image display information includes, for example, “XXX employee ID”, “name”, and the like in the field where the IC card 100 is used.
"Issue date" ... and so on. The printing member is provided with an image receiving layer for forming a photograph of the face of the user of the IC card 100. A face photograph or the like is formed by applying heat from a thermal head from the ink sheet side containing the dye, and the heat sublimates or transfers the dye to the image receiving layer. As the material of the image receiving layer,
Polymer materials such as polyester resin, polyvinyl chloride resin, polyvinyl acetal resin, polyvinyl butyral resin, epoxy resin, and acrylic resin can be used.

The adhesive layer 2 is made of a reactive hot melt adhesive, for example, TE030, T30 manufactured by Sumitomo 3M Limited.
E100, Hibon 4820 manufactured by Hitachi Chemical Polymers,
Bondmaster 170 series manufactured by Kanebouenusc, Macroplast QR manufactured by Henkel
3460 or the like is used. The reactive hot melt resin contains a urethane polymer having an isocyanate group (NCO) at a molecular terminal as a main component as shown in the formula (1). In the formula (1), NHCOO represents a urethane bond.

[0024]

(Equation 1)

After the sheet material 1, the IC module 3 and the sheet material 4 are bonded to each other, the reactive hot melt resin contains water (H
_In response to ₂ O), a chain extension reaction as shown in the formula (2) occurs.

[0026]

(Equation 2)

The urethane bond molecule (NHCOO) of the reactive hot melt resin is changed to a urea bond molecule (NHCONH) by the chain extension reaction. The water at this time is naturally taken in from the air in the conventional method, but according to this method, the chain extension reaction can be promoted by the water remaining in the adhesive member 10 that has been in a water-absorbing state before the heat bonding. . Note that carbon dioxide (CO ₂ ) is generated in the chain extension reaction, and this CO ₂ is emitted into the air.

Then, as shown in the formula (3), the urethane bond molecule and the isocyanate group of the reactive hot melt resin undergo a branching / crosslinking reaction to be converted to an NCOO-CO-NH- allophanate bond molecule.

[0029]

(Equation 3)

Further, as shown in the formula (4), the urea binding molecule and the OCN group of the reactive hot melt resin also undergo a branching / crosslinking reaction and change into a biuret binding molecule of NCONH-CO-NH-.

[0031]

(Equation 4)

When this isocyanate group hardly remains in the adhesive portion, the sheet material 1, I
The C module 3 and the sheet material 4 are completely cured. In this example, when the IC card 100 is almost completely cured, the amount of unreacted isocyanate groups in the reactive hot melt adhesive layer is 5% or less of the amount of reacted isocyanate groups, and preferably, the reacted isomers are reacted. It is characterized by not more than 2% of the amount of isocyanate groups. In this state, the curing reaction of the isocyanate group is stabilized, and the IC card 100 having stable physical properties without deformation or peeling of the sheet when used by the user can be provided.

In particular, when the amount of the isocyanate group is 2% or less, the card is almost completely cured, so that a convex portion corresponding to the shape of the IC chip and a concave portion outside the IC chip are not generated on the card surface. It is possible to record without any trouble on the card surface (contact recording method using an ink ribbon) even in printing having a concave and convex portion with a depth of about 1 to 5 μm, and it is excellent in image formability when an IC card is issued in a later process. In addition, a raw card substrate can be provided.

(2) IC Card 100 as Embodiment
FIG. 4 shows a card manufacturing apparatus 20 according to an IC card manufacturing method.
FIG. 4 is a block diagram showing an example of the configuration of 0. In this example, it is assumed that a plurality of IC cards are created from a long roll-shaped sheet material. Of course, a sheet-like material divided into upper and lower sheets may be used.

The IC card manufacturing apparatus 9 shown in FIG.
For example, a delivery shaft 10 for delivering the sheet material 1 for the front surface is provided, and the sheet material 1 delivered from the delivery shaft 10 is supplied over the guide roller 11 and the drive roller 12. The sheet material 1 on which an image receiving layer is formed in advance may be used. An adhesive applicator coater 13 is provided between the delivery shaft 10 and the driving roller 11, and a reactive hot melt adhesive 2 a is applied to a surface of the sheet material 1 to be applied with a predetermined thickness.

A delivery shaft 14 for delivering the sheet material 4 for the back surface is provided on the side facing the delivery shaft 10 described above. The sheet material 4 delivered from the delivery shaft 14 is supplied to the guide roller 15 and the drive roller 16. Supplied and supplied. An adhesive applicator coater 17 is provided between the feed shaft 14 and the drive roller 15, and the reactive hot melt adhesive 2b is applied to the surface of the sheet material 4 to be coated with a predetermined thickness.

The sheet material 1 coated with the adhesive 2a and the sheet material 4 coated with the adhesive 2b shown in FIG. Is done. At this time, the reactive hot melt adhesives 2a, 2b
In order to enclose the IC module 3, the IC module 3 is inserted at a position where the sheet material 1 and the sheet material 4 are separated and opposed to each other. The IC module 3 is supplied as a single unit or a plurality of units in the form of a sheet or a roll.

A heating laminating section 19 and a cutting section 20 are arranged along the conveying path 18 of the card manufacturing apparatus 9 along the conveying direction of the sheet materials 1 and 4. The heating laminating section 19 is preferably a vacuum heating lamination. Alternatively, a protective film supply unit (not shown) may be provided before the heating lamination unit 19. It is preferable that the protective film supply units are arranged above and below the transport path 18 so as to face each other. The heating laminating unit 19 includes a flat heating laminating upper mold 21 and a heating laminating lower mold 22 which are arranged to face each other up and down the transport path 18.

The upper and lower molds 21 and 22 for heating lamination are provided so as to be movable in the direction of coming into contact with and separating from each other. In this example, the heating temperature is about 40 ° C. to 120 ° C., and the heating time is about 10 seconds to 120 seconds, depending on the application thickness of the reactive hot melt adhesives 2a and 2b. The adhesive 2 melts when heat is applied, and solidifies when it cools. The means for heating and laminating the sheet materials 1 and 4 is not limited to the heating laminating unit 19, and may be a vacuum heat press device or a heat roller device. As a result, a long sheet-shaped card assembly in which the IC module 3 is sandwiched between the sheet materials 1 and 4 can be formed.

After passing through the heating laminating section 19, it is guided to a cutting section 20 by a driving roller 24, and the cutting section 2
At 0, the long sheet-shaped card assembly is cut into a single-sheet sheet-shaped card assembly 25 of a predetermined size. The cutting unit 20 is moved up and down by an up-down drive unit 23. Thereafter, in order to cause a curing reaction of the isocyanate group shown in FIG. 5A, the single-sheet-shaped card assembly shown in FIG. 5A is stored (about 5 to 10 days at a humidity of 55% RH).
Then, after a certain period, it is determined that the isocyanate group in the reactive hot melt adhesive 2 has become 10% or less of the reacted isocyanate group amount, and the card picking shown in FIG. (Cutting), and punching into an IC card 100 of a predetermined size.

The amount of isocyanate groups in the adhesive 2 can be determined by removing the adhesive 2 from the IC card 100 by peeling the upper and lower sheets 1 and 4 like a cutter, and using the KBr method (potassium bromide tablet method). ) Is evaluated by FT-IR (Fourier transform infrared spectroscopy) measurement. FT-
The IR measurement is a method for obtaining information on the vibrational state of a molecule, and a peak due to a specific structure of a compound such as a polymer material is observed. As for the isocyanate group which disappears due to the curing reaction of the reactive hot melt resin, an absorption peak is observed at 2270 to 2250 cm ^-1 .

In addition, it absorbs moisture in the air after heat bonding,
Isocyanate groups changed by the branching / crosslinking reaction are 153
An absorption peak is observed at 0 cm ^-1 . Thus, immediately after bonding the sheet 1 and 4 by an adhesive 2, the curing reaction does not proceed, the peak intensity of 1530 cm ^-1 is large, whereas the absorption peak in 2270～2250Cm ^-1 is not observed. However, as the reaction proceeds, the peak intensity at 1530 cm ^-1 decreases because the amount of isocyanate groups decreases. Also, since the amount of isocyanate groups changed by the branching / crosslinking reaction increases accordingly,
An absorption peak appears at 2270 to 2250 cm ^-1, and the peak intensity increases as the reaction proceeds.

From the above, the peak intensity at 1530 cm ⁻¹ obtained by the FT-IR measurement of the adhesive 2 was
The ratio of the peak intensity of 0～2250Cm ^-1, i.e., can be evaluated (absorption intensity of 2250 cm ^-1) / By taking (1530 cm absorption intensity of ^-1), progress of the curing reaction of the adhesive 2 .

In this example, the reactive hot melt adhesive 2
When it is best that the residual isocyanate group in the adhesive is “0”, the absorption at 2270 to 2250 cm ⁻¹ is regarded as 0%, and the amount of the unreacted isocyanate group in this adhesive layer is Less than 5% of the amount,
Preferably, it is 2% or less of the amount of reacted isocyanate groups.

As described above, according to the method for manufacturing an IC card according to the present invention, the degree of curing of the reactive hot melt adhesive 2 can be confirmed at the time of card manufacturing, and the card cutting machine (cutting section) can be used in the card removal process. 20). The thickness at the end of the card can be maintained at 90 to 99.8% of the thickness at the center of the card assembly 25. In addition, in the unreacted state where the residual isocyanate group is 10% or less, the hot melt resin does not easily adhere to the cutter blade when removing the card. Sex can be maintained.

(3) Embodiment An IC card and a method for manufacturing the same according to the present invention will be described below with reference to embodiments. Embodiments according to the present invention are not limited to these. In this embodiment, a reactive hot melt adhesive 2 is applied to each of the upper and lower sheet materials 1 and 4 using a T-die so as to have a thickness of about 280 μm. IC between 4
The module 3 was sealed and vacuum-laminated at 60 ° C. for 1 minute to produce an IC card 100. The thickness of the finished card is 760 μm.

[Example 1] Sheet material 1 and sheet material 4
A white polyester sheet having a thickness of about 100 μm was used. The adhesive is Macropl manufactured by Henkel.
Ast QR 3460 was used. Sheet material 1, IC
After vacuum laminating the module 3 and the sheet material 4, the card assembly 25 is heated to a temperature of 23 ° C. and a humidity of 55% RH.
For 10 days. Then, the upper sheet material 1 is shaved with a cutter, and the adhesive 2 inside the card is removed with KBr.
FT-IR measurement was performed by the method. As a result, (absorption intensity at 2250 cm ^-1 ) / (absorption intensity at 1530 cm ^-1 ) was 5%.

Example 2 The sheet material 1 has a thickness of 12
A white polyester sheet having a thickness of about 0 μm was used, and a white polyester sheet having a thickness of about 90 μm containing a fibrous material was used as the sheet material 4. Adhesive 2 includes Macroplast QR manufactured by Henkel Co., Ltd.
3460 is placed on the sheet material 1, and thereafter, one IC module container in which the IC module 3 including the IC chip 6 and the antenna pattern 7 is placed in a porous sheet material having a thickness of about 350 μm is placed. Sheet material 4 on top
(Henkel having a film thickness of about 60 μm was previously provided as an adhesive 2 on the surface facing the sheet material 1 and the IC module 3 side.
(Provided by Macroplast QR 3460, manufactured by the same company) and placed under pressure at a heating temperature of about 80 ° C. or less to form a sheet-like card assembly 25.

The viscosity (rubber hardness) of the reactive hot melt adhesive 2 provided on the sheet material 2 side is higher than that of the sheet material 1 side. 2 for easy insertion.

Then, after vacuum lamination, it was stored for 20 days in an environment of a temperature of 30 ° C. and a humidity of 70% RH. Then, the amount of the unreacted isocyanate groups in the reactive hot melt adhesive 2 for the sheet (based on the reacted amount) was determined. In the same manner as in Example 1, the upper sheet material 1 is shaved with a cutter, and the adhesive 2 inside the card is F
T-IR measurement was performed. As a result, (absorption intensity at 2250 cm ^-1 ) / (absorption intensity at 1530 cm ^-1 ) was 10%. After the residual isocyanate group became 10% or less, a card removing process was performed, and the resultant was packed in a cartridge for image transfer recording.

Comparative Example A white polyester sheet having a thickness of 100 μm was used as the sheet material 1 and the sheet material 4. The adhesive is Macroplast manufactured by Henkel.
QR 3460 was used. After vacuum lamination, the sheet was stored for 3 days in an atmosphere at a temperature of 23 ° C. and a humidity of 55% RH. Thereafter, the upper sheet material 1 was shaved with a cutter, and the adhesive 2 inside the card was subjected to FT-IR measurement by the KBr method. The result (absorption intensity of 2250 cm ⁻¹ ) / (1
The absorption intensity at 530 cm ^-1 was 58%.

When the card assembly 25 according to this comparative example is cut, the adhesive 2 adheres to the cutter, and the end face of the card becomes dirty. In addition, heat was generated, giving an extra load to the cutter power. 2 residual isocyanate groups
When the thickness of the card assembly 25 was 0%, the thickness of the card end was evaluated with respect to the thickness of the center of the card assembly 25. Moreover, it was difficult to return to the original thickness.

On the other hand, according to Examples 1 and 2, the cutability was good, and when the residual isocyanate groups were 10%, the thickness of the card end portion was 90% of the thickness of the central portion of the card assembly 25. It was found that the thickness returned to 94% of the original thickness. When the residual isocyanate group was 5% or less, the thickness of the card end portion was 95% of the thickness of the central portion of the card assembly 25, and it was found that the thickness returned to 97% of the original thickness.

In particular, after the card is manufactured, a plurality of the sheets are packed, transported and stored until the printing and printing on the card surface are performed. Therefore, unevenness due to external pressure does not occur on the card surface. In the state where the cartridge is set in the printer at the stage of front side printing and a gap starts to be generated between the cards, attention should be paid to the generation of wrinkles.
%, At most 5%.

Of course, by keeping the remaining isocyanate groups at 2% or less and 5% or less even when the IC card 100 is in use, deformation of the card during use, especially the protective seal after printing and the adhesive The generation of wrinkles due to the progress of curing can be suppressed, and the generation of gaps due to the generation of wrinkles can be suppressed. Therefore, the durability of the protective seal is maintained, and the cause of the trouble can be eliminated.

Further, according to the first and second embodiments, the card assembly 25 is processed for card removal, packed in a cartridge or the like, and sent to the user (the person who prints the IC card and issues it). , IC until it finally reaches the user
The change in the degree of cure of the card 100 is extremely small. Therefore,
The rigidity of the card and the change in unevenness on the card surface are reduced,
In a process in which a user records a sharp image such as a face print, variation between cards is small and image quality can be maintained.

As described above, according to Examples 1 and 2, the amount of the remaining isocyanate groups was 0 to 0 of the reacted isocyanate groups.
When the state is reduced to 2% or 0 to 5%, the curing speed per unit time is considerably reduced. Therefore, the stress change at the interface between the sheet material 1 and the sheet material 4 is greatly reduced, and the possibility of generating wrinkles on the sheet material (or forming concave and convex portions on the card surface) is extremely low. The object of the invention is achieved.

[0058]

As described above, the IC according to the present invention is
According to the card, the amount of unreacted isocyanate groups in the reactive hot melt adhesive layer is made to be 5% or less of the amount of reacted isocyanate groups. With this configuration, the curing reaction of the isocyanate group in the reactive hot melt adhesive layer is stabilized, and a card having stable physical properties without deformation or peeling of the sheet when used by a user can be provided.

According to the method of manufacturing an IC card according to the present invention, an IC chip encapsulated in a reactive hot melt adhesive is sandwiched between sheet materials, and an isocyanate group in the reactive hot melt adhesive is After the amount becomes 10% or less, the card is cut (cut). With this configuration, it is possible to check the degree of cure of the reactive hot melt adhesive during card production,
In addition, the card withstands a strong impact from the card cutting machine in the card removal process, and the thickness of the card end portion can be maintained at 90 to 99.8% of the thickness of the card central portion.

Further, the hot melt adhesive does not easily adhere to the cutter blade at the time of card removal, and the accuracy of the end face of the card and the linearity of the card at the time of cutting can be maintained in a complicated use of the cutter. The present invention relates to a driver's license or the like, an identification card, a passport, an alien registration card, a library use card, a cash card, a credit card, an employee card, which incorporates an IC module having an IC chip and an antenna body. It is very suitable to be applied to ID cards such as employee cards, membership cards, medical cards and student cards.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a configuration example of an IC card 100 as an embodiment of the present invention.

FIG. 2 is a schematic diagram showing a configuration example of an IC module 3 built in the IC card 100.

FIG. 3 is a schematic diagram showing a configuration example of another IC module 3 ′ built in the IC card 100.

FIG. 4 is a card manufacturing apparatus 2 according to an IC card manufacturing method.
It is a block diagram which shows the example of a structure of 00.

FIG. 5 is a process chart showing an example of card picking.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 First sheet material 2 Reactive hot melt adhesive 3 IC module 4 Second sheet material 5 Coil 6 IC chip 7 Antenna pattern 8 Printed circuit board 9 Card manufacturing device 19 Heat laminating unit 20 Cutting unit 25 Card assembly

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2C005 MA32 MB01 MB08 NA09 NB26 PA18 RA04 RA10 SA14 TA22 5B035 AA08 BA00 BB09 BC01 CA03 CA23

Claims (3)

[Claims] 1. An IC card for enclosing an IC module in a reactive hot-melt adhesive layer interposed between a first sheet material and a second sheet material, wherein: Wherein the amount of unreacted isocyanate groups is 5% or less of the amount of reacted isocyanate groups. 2. The IC card according to claim 1, wherein the amount of unreacted isocyanate groups in the reactive hot melt adhesive layer is preferably 2% or less of the amount of reacted isocyanate groups. . 3. An IC card manufacturing method for producing a plurality of IC cards from one or a long roll-shaped sheet material, wherein an IC chip is sealed in a reactive hot melt adhesive.
An IC card comprising: a step of sandwiching a chip between sheet materials; and a step of removing a card after an isocyanate group in the reactive hot-melt adhesive becomes 10% or less of the reacted isocyanate group amount. Manufacturing method.