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WO1996036747A1 - Composition et procede de traitement de la surface de metaux contenant du cuivre - Google Patents

Composition et procede de traitement de la surface de metaux contenant du cuivre Download PDF

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Publication number
WO1996036747A1
WO1996036747A1 PCT/US1996/006549 US9606549W WO9636747A1 WO 1996036747 A1 WO1996036747 A1 WO 1996036747A1 US 9606549 W US9606549 W US 9606549W WO 9636747 A1 WO9636747 A1 WO 9636747A1
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moiety
amount
weight
component
present
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PCT/US1996/006549
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English (en)
Inventor
Masayuki Aoyama
Ryoji Morita
Jyun Kawaguchi
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Henkel Corp
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Henkel Corp
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Priority to US08/930,080 priority Critical patent/US5925174A/en
Publication of WO1996036747A1 publication Critical patent/WO1996036747A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/68—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous solutions with pH between 6 and 8
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
    • C23C2222/20—Use of solutions containing silanes

Definitions

  • This invention relates to a composition and process for treating a surface of copper-containing metal. More particularly, this invention relates to a surface treatment composition and process that are well suited to the purpose of impart- ing migration resistance, solder resistance, and robust adhesiveness to the sur ⁇ face of copper-containing metals.
  • Copper is in wide use, ranging from decorative and ornamental applica ⁇ tions to its applications in the electronic industry, and like most other metals it un- dergoes oxidation when exposed to the air. This causes a decline in its soldera- bility and electrical conductivity, which has prompted the implementation of vari ⁇ ous countermeasures.
  • Japanese Patent Application Laid Open [Kokai or Unexam- ined] Number Hei 1-251785 [251,785/1989] discloses a surface treatment meth ⁇ od that uses an organic inhibitor.
  • copper migration is inhibited by dipping the printed-circuit board, while heating under elevated pressure, in a so- lution that contains a metal deactivator or copper inhibitor.
  • this meth ⁇ od has difficulty achieving a uniform infiltration and as a result produces a variab ⁇ le migration resistance.
  • the treatment agent infiltrates into the adhesion interface, etc., due to the application of heat and pressure, the durability of adhesion to the copper under high temperature/high humidity condi ⁇ tions is unsatisfactory.
  • Japanese Patent Application Laid Open [Kokai or Unexamined] Number Hei 5-65466 [65,466/1993] discloses a method that inhibits copper migration and improves antitracking through the addition of a triazinethiol copper inhibitor to the adhesive for the copper-clad laminate. While this type of adhesive does prevent copper migration in those regions where it directly contacts the copper, almost no effect is obtained in regions not in contact with the adhesive.
  • the present invention takes as its object the introduction of a surface treatment agent that avoids at least some, and preferably all, of the problems de ⁇ scribed above for the prior art, or in specific terms that inhibits the susceptibility to oxidation and migration that is characteristic of copper-containing metals while, in its preferred embodiments, simultaneously achieving the solder resistance and durability of adhesion needed from surface treatment agents.
  • the present in ⁇ vention relates to a composition for treating the surface of copper-containing me ⁇ tals, this composition comprising, preferably consisting essentially of, or more preferably consisting of, a dispersion or solution in water and organic solvent of (i) at least one silane coupling agent having a functional moiety selected from the group consisting of a vinyl moiety, a mercapto moiety, and an amino moiety, each of these moieties being bonded to one carbon atom of the silane coupling agent, and an epoxy moiety bonded to two adjacent carbon atoms of the silane coupling agent and (ii) at least one compound (hereinafter often denoted as a "copper inhibitor") selected from azole compounds, azine compounds, aromatic secondary amine compounds, and aromatic diacylhydrazide compounds.
  • a dispersion or solution in water and organic solvent of (i) at least one silane coupling agent having a functional moiety selected from the group consisting of a vinyl moiety, a mercapto
  • silane coupling agents for use in the present inven ⁇ tion are compounds conforming to the following general chemical formula (I):
  • Y represents a moiety selected from the group consisting of a mercapto moiety and an amino moiety, each of these moieties being bonded to a single carbon atom in moiety R 1 , and an ⁇ , ⁇ -epoxy moiety bonded to two adjacent carbon atoms in moiety R 1 ;
  • R 1 represents either (1 ) a saturated hydrocarbon moiety having: (1.1) two open valences if Y is not an ⁇ , ⁇ -epoxy moiety and three open valences if Y is an ⁇ , ⁇ - epoxy moiety; (1.2) a number of total carbon atoms that is at least 2, or preferab- ly at least 3 and independently preferably is not more than, with increasing pref ⁇ erence in the order given, 11, 10, 9, 8, 7, or 6; and (1.3) a number of carbon atoms, in the longest continuous chain of carbon atoms within said saturated hy ⁇ drocarbon moiety that is between the moiety Y and the Si atom in general form ⁇ ula (I), that is at least 2, or preferably at least 3, and independently is not more than 8, or preferably is not more than 6 or (2) a moiety formally derived from a moiety as described in part (1 ) of this definition above by either (2.1 ) substituting an ether oxygen atom for one -CH 2
  • the moiety Y in general formula (I) is preferably bonded to the carbon atom of the R 1 moiety that is farthest from the Si atom in general formula (I), but may be bonded to a different carbon atom as long as the number of carbon at- oms in the longest continuous chain between the Y moiety and the Si atom in general formula (I) satisfies the condition specified above.
  • the R 1 moiety is ex ⁇ emplified by alkylene, a saturated hydrocarbon moiety with three open valences (for epoxy moiety bonding), and cyclopentylene or cyclohexylene.
  • the R 1 moiety may be straight chain, cyclic, or branched chain, with straight chain being pre- ferred.
  • silane coup ⁇ ling agents with general formula (I):
  • amino-containing compounds N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane N-(2-aminoethyl)-3-aminopropyltrimethoxysilane 3-aminopropyltriethoxysilane;
  • Silane coupling agents that do not conform to general formula (I) are still useful in the present invention if they conform to general formula (II):
  • Preferred examples of this type of silane coupling agents are: (d) vinyl-containino compounds vinyltrimethoxysilane and vinylthethoxysilane.
  • a surface treatment composition according to the present invention con ⁇ tains at least one and usually only one of the aforementioned silane coupling agents, although mixtures of two or more of the aforementioned silane coupling agents can also be used.
  • the azole compounds and azine com ⁇ pounds are exemplified by azoles and azines, which in each instance may carry 1 to 3, preferably 1 or 2, substituent moieties.
  • Said substituent moieties are inde- pendently selected from the group consisting of: C., to C 12 straight chain and branched alkyl moieties, which preferably are short straight chain alkyl moieties such as methyl and ethyl; and from the following moieties: vinyl; benzyl; phenyl; tolyl; xylyl; naphthyl; methoxy; ethoxy; amino; phenylamino; N-(3-salicyloyl)a- mino; mercapto; mercaptomethyl; mercaptoethyl; -CH 2 -N(R ) 2 , in which each R 4 moiety, which may be the same as or different from the other R 4 moiety in the formula, represents a C to C 8 , preferably a C 4 to C 8 , straight chain or branched, preferably straight chain, alkyl moiety; and -N(R 5 ) 2 , in which each R 5
  • the mercapto moiety may take the form of the salt with an alkali metal (preferably, primarily for rea ⁇ sons of economy, sodium or potassium).
  • an alkali metal preferably, primarily for rea ⁇ sons of economy, sodium or potassium.
  • the azoles under consideration are exemplified by imidazoles, pyrazoles, triazoles, and tetrazoles, in each instance possibly condensed with a benzene nucleus, among which imidazoles (including benzimidazoles), triazole (including benzotriazoles), and tetrazole are preferred.
  • the azole may take the form of the salt with an alkali metal (preferably, primarily for reasons of economy, sodium or potassium).
  • the azines under consideration are exemplified by pyrimidines, pyrazines, pyridazines, triazines, and the like, with triazines being preferred.
  • aromatic secondary amine compounds in which one of the phenyl moieties is substituted by a C 4 to C 10 , preferably a C 6 to C 10, straight chain or branched, preferably straight chain, alkyl moiety, or by a benzene- or toluene- sulfonylamide moiety; and phenylenediamines in which both amino moieties are substituted by independent selections from C, to C 6 , preferably C 1 to C 4 , straight chain and branched alkyl moieties and phenyl, tolyl, xylyl, and naphthyl moieties.
  • aromatic diacylhydrazide compounds are those conform ⁇ ing to general formula (III):
  • each R 6 or R 7 moiety which may be the same as or different from any other R 6 or R 7 moiety, is selected from the group consisting of straight chain and branched alkyl moieties with from 1 to 4 carbon atoms each; each of u and v, which may be the same or different, represents 1 , 2, or 3;
  • Ph 1 represents a benzene ring minus (2+u) hydrogen atoms and Ph 2 represents a benzene ring minus (2+v) hydrogen atoms; and each of x and y, which may be the same or different, represents 2, 3, 4, or 5.
  • x and y which may be the same or different, represents 2, 3, 4, or 5.
  • aromatic secondary amines octylated diphenylamine, p-(p-toluenesulfonylamido)diphenylamine, N,N'- di-2-naphthyl-p-phenylenediamine, N-phenyl-N'-isopropyl-p-phenylenedia- mine, and N,N'-diphenyl-p-phenylenediamine; aromatic diacylhvdrazide compounds
  • a surface treatment composition according to the present invention con ⁇ tains at least one and usually only one of the above-described copper inhibitors, although mixtures of two or more of them can also be used.
  • Copper-containing metals are frequently held in high-temperature environ ⁇ ments in the contemporary electronics industry, for example, in soldering opera- tions.
  • a high-melting copper inhibitor is preferably used in the surface treatment agent according to the present invention when this composition is used to treat such surfaces.
  • high-melting copper inhibitors are 3-N-(salicyloyl)- amino-1 ,2,4-triazole and N,N'-bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionyl]- hydrazine.
  • a mixed solvent of water and organic solvent is preferably used to dis ⁇ solve and/or disperse the silane coupling agent and copper inhibitor in a surface treatment composition according to the present invention.
  • Any organic solvent that is itself sufficiently soluble and/or dispersible in water, that does not impair the functions of the silane coupling agent and copper inhibitor, that is capable of dissolving and/or dispersing the same, and that can be easily evaporated at am ⁇ bient or elevated temperatures after application of the surface treatment compo- sition may be used.
  • This solvent may be any solvent ordinarily used in surface treatment agents for copper-containing metals, and, for example, the following are very suitably used: ketone solvents such as methyl ethyl ketone, methyl iso- propyl ketone, methyl isobutyl ketone, acetone, and the like; aromatic hydrocar ⁇ bon solvents such as benzene, toluene, xylene, and the like; alcohol solvents such as methanol, ethanol, isopropanol, and the like; CellosolveTM solvents (i.e., monoethers or monoesters of glycols, usually ethylene glycol) such as methyl CellosolveTM, ethyl CellosolveTM, butyl CellosolveTM, CellosolveTM acetate, and the like; and dimethylformamide, dimethyl sulfoxide, and the like.
  • Organic sol ⁇ vent is preferably used in an amount of 0.01 to 15 weight %, more preferably 1 to
  • the concentrations of each active component in a surface treatment com ⁇ position according to the present invention will now be considered.
  • the silane coupling agent is used at 0.01 to 30 weight %, or preferably at 0.08 to 25 weight %, relative to the water.
  • the adhesive strength declines at below 0.01 weight %. At the other end of the range, no additional improvement in adhesive strength is observed for quantities added in excess of 30 weight %, which are therefore simply wasted.
  • the copper inhibitor is used at 0.01 to 5 weight %, or preferably at 0.02 to 4 weight %, again relative to water. Additions below 0.01 weight % can not usually prevent copper migration and in particular result in a reduced adhes ⁇ ive strength upon being heated. No additional improvement in adhesive strength is observed for quantities added in excess of 5 weight %, which again are there- fore simply wasted.
  • the silane coupling agent and copper inhibitor are preferably used in amounts such that the weight ratio of si ⁇ lane coupling agent to copper inhibitor is from 2.0:1.0 to 8.0:1.0, or more prefer- ably from 4.0: 1.0 to 6.0: 1.0.
  • the adhesive strength as a whole suffers from a de ⁇ cline when this ratio falls below 2.0:1.0, while a value for this ratio above 8.0: 1.0 impairs the film-forming properties and degrades the heat resistance.
  • a surface treat ⁇ ment composition according to the present invention may contain other additives conventionally used in surface treatment agents for copper-containing metals.
  • additives are exemplified by metal salts and organic resins.
  • Metal salts are used to improve the corrosion resistance, and to this end the metal in the salt preferably has a greater ionization tendency than copper.
  • Zinc nitrate and alum ⁇ inum phosphate are specific examples of such metal salts.
  • Organic resins are used to impart flexibility to the coating, and water-soluble or water-dispersible olefin resins, inter alia, can be used for this purpose. Insofar as the benefits of the invention are not impaired, these additives when present preferably should be used in amounts as conventionally used to achieve the described objectives.
  • a surface treatment composition according to the present invention is typ- ically prepared by dissolving or dispersing the silane coupling agent, copper in ⁇ hibitor, and any optional additives in a mixture of the water and organic solvent.
  • a surface treatment composition according to the invention is employed to best advantage for the surface treatment of printed-circuit boards, where mi ⁇ gration resistance, solder resistance, and robust adherence are critical issues.
  • the surface treatment composition according to the present invention can also be used to treat the surface of the copper and/or copper alloy portions in various other copper-using materials — or to treat the surface of the copper and/or copper alloy that can or will be used in such materials — that are used in, for example, the electronics industry, electric wire and cable industry, automotive industry, etc., and for which at least one of the preceding improved properties is a requirement. All of these materials are suitable substrates for a process ac ⁇ cording to the invention. Furthermore, no narrow restrictions apply to the compo- sition of a copper alloy to be treated, which encompasses, for example, brasses, bronzes, and the like.
  • a surface treatment composition according to the present invention can be used as a pre-treatment or post-treatment for copper-containing metals.
  • the composition may be coated on the copper foil prior to application of the foil to the printed-circuit board or may be coated on the copper foil regions of the printed-circuit board or over the entire printed-circuit board.
  • the composition is preferably coated on the entire copper foil, i.e., both front and rear surfaces.
  • the composi ⁇ tion may be coated on only the copper foil surfaces, but is preferably applied to these surfaces and to the regions bordering the material in contact with the cop ⁇ per foil, or to the entire printed-circuit board.
  • a surface treatment composition according to the present invention is most preferably applied directly to a surface of copper and/or copper alloy. How ⁇ ever, the benefits of the present invention can also be indirectly induced by the addition of a composition according to the invention to material that will come into contact with the copper and/or copper alloy, for example, to compositions such as organic resin-containing adhesives.
  • a moderately alkaline degreaser FINECLEANER® 4336 from Nihon Parkerizing Company, Limited
  • the copper foil after cleaning by the method described above, was dipped for 20 seconds at room temperature in a surface treatment bath prepared by the addition to deionized water of 0.08 weight % of 3-glycidyloxypropyltrimeth- oxysilane, 0.02 weight % of 2-methylimidazole, and 10 weight % of methanol, the percentages in each instance being percentages of the amount of the deionized water. This was followed by draining and then drying with hot air until the foil reached a temperature of 100 °C.
  • Example 2 The copper foil, after cleaning by the method described above, was roll coated with a surface treatment bath prepared by the addition to deionized water of 4.0 weight % of N-(2-aminoethyl)-3-aminopro ⁇ yltrimethoxysilane, 1.0 weight % of 3-(N-salicyloyl)amino-1 ,2,4-triazole, and 10 weight % of methanol, the per ⁇ centages in each instance being percentages of the amount of the deionized water.
  • the copper foil was then dried with hot air to a foil temperature of 100 °C.
  • Example 3 The copper foil, after cleaning by the method described above, was roll coated with a surface treatment bath prepared by the addition to deionized water of 10 weight % of 3-mercaptopropyltrimethoxysilane, 2.5 weight % of tetrazole, and 10 weight % of butyl CellosolveTM, the percentages in each instance being percentages of the amount of the deionized water.
  • the copper foil was then o dried with hot air to a foil temperature of 100 °C.
  • Example 4 Example 4
  • the copper foil after cleaning by the method described above, was dipped for 5 seconds at room temperature in a surface treatment bath prepared by the addition to deionized water of 24.0 weight % of vinyltrimethoxysilane, 4.0 s weight % of the monosodium salt of 1 ,3,5-triazine-2,4-dithiol, and 10 weight % of methanol, the percentages in each instance being percentages of the amount of the deionized water. This was followed by wipe-off with a wringer roll and then drying with hot air until the foil reached a temperature of 100 °C.
  • Example 5 The copper foil, after cleaning by the method described above, was dipped for 20 seconds at room temperature in a surface treatment bath prepared by the addition to deionized water of 16.0 weight % of N-(2-aminoethyl)-3-amino- propyltrimethoxysilane, 4.0 weight % of N,N'-bis[3-(3,5-di-tert-butyl-4-hydroxy- phenyl)propionyl]hydrazine, and 10 weight % of methanol, the percentages in 5 each instance being percentages of the amount of the deionized water. This was followed by wipe-off with a wringer roll and then drying with hot air until the foil reached a temperature of 100°C. Comparative Example 1
  • the copper foil after cleaning by the method described above, was o dipped for 20 seconds at room temperature in a comparative treatment bath pre ⁇ pared by the addition to deionized water of 5.0 weight % of 3-glycidyloxypropyltri- methoxysilane and 10 weight % of methanol, the percentages in each instance being percentages of the amount of the deionized water. This was followed by wipe-off with a wringer roll and then drying with hot air until the foil reached a temperature of 100 °C.
  • Comparative Example 2 The copper foil, after cleaning by the method described above, was sprayed for 5 seconds at room temperature with a surface treatment bath pre ⁇ pared by the addition to deionized water of 5.0 weight % of 1 ,2,4-triazole and 10 weight % of methanol, the percentages in each instance being percentages of the amount of the deionized water. The copper foil was then squeegeed off with a wringer roll and dried with hot air until the foil reached a temperature of 100°C. Comparative Example 3
  • the copper foil after cleaning by the method described above, was sprayed for 1 second at room temperature with a surface treatment bath pre ⁇ pared by the addition to deionized water of 5.0 weight % of benzotriazole and 10 weight % of methanol, the percentages in each instance being percentages of the amount of the deionized water.
  • the copper foil was then squeegeed off with a wringer roll and dried with hot air until the foil reached a temperature of 100°C.
  • Test Method 1 Copper foil delamination strength (Evaluation of adhesion robustness) An adhesive prepared by mixing 40 parts of EpikoteTM 828 epoxy resin
  • JIS Japanese Industrial Standard
  • Test Method 2 Solder resistance The solder resistance was evaluated in accordance with JIS C-6481 on test specimens prepared as described in Test Method 1. In this test, the particu ⁇ lar test specimen was dipped for 30 seconds in molten solder (at 260 °C) and its appearance was then visually inspected and scored using the following scale:

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Anti-Oxidant Or Stabilizer Compositions (AREA)
  • Paints Or Removers (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

Cette invention concerne une composition liquide aqueuse destinée au traitement de la surface de métaux contenant du cuivre. Cette composition est une dispersion et/ou une solution dans un mélange d'eau et de solvant organique, un agent de couplage au silane au moins ayant une fraction fonctionnelle sélectionnée parmi des fractions vinyle, mercapto, amino et glycidyloxy liées à un atome de carbone dans l'agent de couplage au silane, ainsi que d'autres fractions époxy liées à deux atomes de carbone adjacents dans l'agent de couplage au silane et au moins un composé inhibiteur du cuivre sélectionné parmi des azoles, des azines, des amines secondaires aromatiques et des diacylhydrazides aromatiques. Le traitement avec cette composition procure une excellente résistance à la migration, une excellente résistance de soudure et une adhésivité de très longue durée à tout un ensemble de surfaces de métaux contenant du cuivre.
PCT/US1996/006549 1995-05-17 1996-05-14 Composition et procede de traitement de la surface de metaux contenant du cuivre Ceased WO1996036747A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US08/930,080 US5925174A (en) 1995-05-17 1996-05-14 Composition and process for treating the surface of copper-containing metals

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP14265695A JPH08311658A (ja) 1995-05-17 1995-05-17 銅系金属材料の表面処理用組成物
JP7/142,656 1995-05-17

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WO1996036747A1 true WO1996036747A1 (fr) 1996-11-21

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GB2324538A (en) * 1997-04-25 1998-10-28 Japan Energy Corp Anti-tarnishing of copper or copper alloy
EP0893947A1 (fr) * 1997-07-24 1999-01-27 MEC CO., Ltd. Méthode pour le traitement de furface du cuivre ou d'alliage de cuivre
EP1002889A3 (fr) * 1998-11-18 2000-09-13 Nippon Paint Co., Ltd. Compositions et procédés de revêtement anticorrosif pour métaux
WO2000074451A1 (fr) * 1999-05-31 2000-12-07 Alfachimici S.P.A. Procede favorisant l'adhesion entre un substrat inorganique et un polymere organique
EP1011299A3 (fr) * 1998-12-14 2003-02-05 GA-TEK Inc. Revêtements pour une résistance améliorée à la poussière de résine
WO2006122025A1 (fr) * 2005-05-10 2006-11-16 Dow Corning Corporation Procede permettant de reduire au minimum l'electromigration dans un dispositif electronique
WO2010009922A1 (fr) * 2008-07-22 2010-01-28 Nv Bekaert Sa Bras d’essuie-glace composite
RU2568267C1 (ru) * 2014-10-02 2015-11-20 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Российский государственный педагогический университет им. А.И. Герцена" Композиция для чистки и пассивации поверхности изделий из меди и медьсодержащих сплавов
EP3305943A1 (fr) * 2016-10-07 2018-04-11 Coventya SAS Solution aqueuse et procédé d'amélioration de la résistance à la corrosion d'un revêtement par conversion cr(iii) et revêtement par conversion cr(iii) modifié

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JPH10247769A (ja) * 1997-03-04 1998-09-14 Sony Corp 印刷抵抗プリント配線板及びその製作方法
WO1999060187A1 (fr) 1998-05-15 1999-11-25 Dacral S.A. Agents de traitement de surfaces metalliques, procedes de traitement de surfaces metalliques et feuilles d'acier a precouche
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EP3305943A1 (fr) * 2016-10-07 2018-04-11 Coventya SAS Solution aqueuse et procédé d'amélioration de la résistance à la corrosion d'un revêtement par conversion cr(iii) et revêtement par conversion cr(iii) modifié
WO2018065564A1 (fr) * 2016-10-07 2018-04-12 Coventya Sas Solution aqueuse et procédé permettant d'améliorer la résistance à la corrosion d'un revêtement de conversion de cr(iii) et revêtement de conversion de cr(iii) modifié
CN110121572A (zh) * 2016-10-07 2019-08-13 科文特亚简易股份有限公司 用于改善Cr(III)转化涂层耐蚀性的水溶液和方法和改性Cr(III)转化涂层

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