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WO1996041359B1 - Procede et appareil perfectionnes pour un dispositif fusible monte en surface - Google Patents

Procede et appareil perfectionnes pour un dispositif fusible monte en surface

Info

Publication number
WO1996041359B1
WO1996041359B1 PCT/US1996/009147 US9609147W WO9641359B1 WO 1996041359 B1 WO1996041359 B1 WO 1996041359B1 US 9609147 W US9609147 W US 9609147W WO 9641359 B1 WO9641359 B1 WO 9641359B1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
fusible link
conductive
layer
mount fuse
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US1996/009147
Other languages
English (en)
Other versions
WO1996041359A1 (fr
Filing date
Publication date
Priority claimed from US08/482,829 external-priority patent/US5943764A/en
Application filed filed Critical
Priority to AU61547/96A priority Critical patent/AU6154796A/en
Priority to EP96919129A priority patent/EP0830704B1/fr
Priority to DE69600974T priority patent/DE69600974T2/de
Priority to DK96919129T priority patent/DK0830704T3/da
Priority to JP9501537A priority patent/JPH10512094A/ja
Publication of WO1996041359A1 publication Critical patent/WO1996041359A1/fr
Publication of WO1996041359B1 publication Critical patent/WO1996041359B1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Abstract

L'invention concerne un fusible monté en surface (58) à couche mince comportant deux sous-ensembles matière. Le premier sous-ensemble comprend une liaison fusible (42), son substrat de support (13) et ses plots terminaux (34, 36). Le deuxième sous-ensemble comprend une couche protectrice (56) qui recouvre la liaison fusible (42) de manière à assurer une protection contre les chocs et l'oxydation. Cette couche protectrice (56) est de préférence constituée d'un materiau polymère. Le matériau polymère idéal est un gel ou une pâte de polyuréthane. En outre, le substrat de support idéal est une époxy FR-4 ou un polyimide.
PCT/US1996/009147 1995-06-07 1996-06-06 Procede et appareil perfectionnes pour un dispositif fusible monte en surface Ceased WO1996041359A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
AU61547/96A AU6154796A (en) 1995-06-07 1996-06-06 Improved method and apparatus for a surface-mounted fuse dev ice
EP96919129A EP0830704B1 (fr) 1995-06-07 1996-06-06 Procede et appareil perfectionnes pour un dispositif fusible monte en surface
DE69600974T DE69600974T2 (de) 1995-06-07 1996-06-06 Verbessertes verfahren und gerät für oberflächenmontierte sicherungsvorrichtung
DK96919129T DK0830704T3 (da) 1995-06-07 1996-06-06 Forbedret fremgangsmåde og apparatur til en overflademonteret sikringsindretning
JP9501537A JPH10512094A (ja) 1995-06-07 1996-06-06 薄膜表面実装ヒューズおよびその製造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US47256395A 1995-06-07 1995-06-07
US08/482,829 1995-06-07
US08/482,829 US5943764A (en) 1994-05-27 1995-06-07 Method of manufacturing a surface-mounted fuse device
US08/472,563 1995-06-07

Publications (2)

Publication Number Publication Date
WO1996041359A1 WO1996041359A1 (fr) 1996-12-19
WO1996041359B1 true WO1996041359B1 (fr) 1997-02-06

Family

ID=27043825

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1996/009147 Ceased WO1996041359A1 (fr) 1995-06-07 1996-06-06 Procede et appareil perfectionnes pour un dispositif fusible monte en surface

Country Status (10)

Country Link
EP (1) EP0830704B1 (fr)
JP (1) JPH10512094A (fr)
CN (1) CN1191624A (fr)
AT (1) ATE173355T1 (fr)
AU (1) AU6154796A (fr)
CA (1) CA2224070A1 (fr)
DE (1) DE69600974T2 (fr)
DK (1) DK0830704T3 (fr)
ES (1) ES2124634T3 (fr)
WO (1) WO1996041359A1 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5923239A (en) * 1997-12-02 1999-07-13 Littelfuse, Inc. Printed circuit board assembly having an integrated fusible link
EP1074034B1 (fr) * 1998-04-24 2002-03-06 Wickmann-Werke GmbH Fusible electrique
US6002322A (en) * 1998-05-05 1999-12-14 Littelfuse, Inc. Chip protector surface-mounted fuse device
GB0001573D0 (en) * 2000-01-24 2000-03-15 Welwyn Components Ltd Printed circuit board with fuse
CN1327467C (zh) 2001-06-11 2007-07-18 维克曼工厂有限公司 熔断器件及其制造方法
US7551048B2 (en) 2002-08-08 2009-06-23 Fujitsu Component Limited Micro-relay and method of fabricating the same
CN101197351B (zh) * 2006-12-05 2010-09-01 邱鸿智 芯片慢熔型保险丝结构与制造方法
CN101894717B (zh) * 2009-05-21 2012-10-24 邱鸿智 具钻孔电极与压模包覆保险丝结构及制造方法
US9117615B2 (en) 2010-05-17 2015-08-25 Littlefuse, Inc. Double wound fusible element and associated fuse
JP5505142B2 (ja) * 2010-07-06 2014-05-28 富士通株式会社 ヒューズおよびその製造方法
CN101964287B (zh) * 2010-10-22 2013-01-23 广东风华高新科技股份有限公司 薄膜片式保险丝及其制备方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4164725A (en) * 1977-08-01 1979-08-14 Wiebe Gerald L Three-piece solderless plug-in electrically conducting component
GB1604820A (en) * 1978-05-30 1981-12-16 Laur Knudson Nordisk Elektrici Electrical safety fuses
DE3044711A1 (de) * 1980-11-27 1982-07-01 Wickmann-Werke GmbH, 5810 Witten Schmelzsicherung
DE3530354A1 (de) * 1985-08-24 1987-03-05 Opel Adam Ag Elektrische sicherungsanordnung
JPH0831303B2 (ja) * 1986-12-01 1996-03-27 オムロン株式会社 チツプ型ヒユ−ズ
EP0513246B1 (fr) * 1990-03-13 1994-11-02 Morrill Glasstek, Inc. Element electrique (fusible) et methode de fabrication de celui-ci
JPH0433230A (ja) * 1990-05-29 1992-02-04 Mitsubishi Materials Corp チップ型ヒューズ
JPH04248221A (ja) * 1991-01-23 1992-09-03 Hitachi Chem Co Ltd チップ型ヒューズの製造法
JPH04245132A (ja) * 1991-01-30 1992-09-01 Hitachi Chem Co Ltd チップヒューズ用基板及びそれを用いたチップヒューズ
JPH04245129A (ja) * 1991-01-30 1992-09-01 Hitachi Chem Co Ltd チップ型ヒューズ
JPH04255627A (ja) * 1991-02-08 1992-09-10 Hitachi Chem Co Ltd チップ型ヒューズの製造法
JPH05166454A (ja) * 1991-12-11 1993-07-02 Hitachi Chem Co Ltd チップ型ヒューズ
US5166656A (en) * 1992-02-28 1992-11-24 Avx Corporation Thin film surface mount fuses
JPH0636672A (ja) * 1992-07-16 1994-02-10 Sumitomo Wiring Syst Ltd カード型ヒューズおよびその製造方法
US5552757A (en) * 1994-05-27 1996-09-03 Littelfuse, Inc. Surface-mounted fuse device

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