JPH10512094A - 薄膜表面実装ヒューズおよびその製造方法 - Google Patents
薄膜表面実装ヒューズおよびその製造方法Info
- Publication number
- JPH10512094A JPH10512094A JP9501537A JP50153797A JPH10512094A JP H10512094 A JPH10512094 A JP H10512094A JP 9501537 A JP9501537 A JP 9501537A JP 50153797 A JP50153797 A JP 50153797A JP H10512094 A JPH10512094 A JP H10512094A
- Authority
- JP
- Japan
- Prior art keywords
- link
- fuse
- surface mount
- layer
- terminal pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 230000004927 fusion Effects 0.000 claims abstract description 66
- 239000000758 substrate Substances 0.000 claims abstract description 63
- 239000000463 material Substances 0.000 claims abstract description 41
- 239000011241 protective layer Substances 0.000 claims abstract description 35
- 239000004593 Epoxy Substances 0.000 claims abstract description 21
- 239000002861 polymer material Substances 0.000 claims abstract description 13
- 230000003647 oxidation Effects 0.000 claims abstract description 6
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 6
- 239000004814 polyurethane Substances 0.000 claims abstract description 6
- 229920002635 polyurethane Polymers 0.000 claims abstract description 6
- 239000004642 Polyimide Substances 0.000 claims abstract description 5
- 229920001721 polyimide Polymers 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 108
- 229910052802 copper Inorganic materials 0.000 claims description 58
- 239000010949 copper Substances 0.000 claims description 58
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 55
- 238000000034 method Methods 0.000 claims description 52
- 229910052751 metal Inorganic materials 0.000 claims description 49
- 239000002184 metal Substances 0.000 claims description 49
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 36
- 230000008018 melting Effects 0.000 claims description 28
- 238000002844 melting Methods 0.000 claims description 28
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims description 18
- 229910052759 nickel Inorganic materials 0.000 claims description 18
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 229910001174 tin-lead alloy Inorganic materials 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 230000008021 deposition Effects 0.000 claims description 4
- 239000010408 film Substances 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 238000007740 vapor deposition Methods 0.000 claims description 4
- 239000011253 protective coating Substances 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 229920002120 photoresistant polymer Polymers 0.000 description 23
- 238000007747 plating Methods 0.000 description 22
- 238000007639 printing Methods 0.000 description 16
- 238000000576 coating method Methods 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 12
- 239000000499 gel Substances 0.000 description 11
- 238000005530 etching Methods 0.000 description 8
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 6
- 239000002356 single layer Substances 0.000 description 6
- 238000005429 filling process Methods 0.000 description 5
- 238000000151 deposition Methods 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 238000005240 physical vapour deposition Methods 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 3
- 150000001879 copper Chemical class 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PPIIGEJBVZHNIN-UHFFFAOYSA-N [Cu].[Sn].[Pb] Chemical compound [Cu].[Sn].[Pb] PPIIGEJBVZHNIN-UHFFFAOYSA-N 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 101000856234 Clostridium acetobutylicum (strain ATCC 824 / DSM 792 / JCM 1419 / LMG 5710 / VKM B-1787) Butyrate-acetoacetate CoA-transferase subunit A Proteins 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 241000282337 Nasua nasua Species 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 229910052770 Uranium Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/046—Fuses formed as printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
- H01H69/02—Manufacture of fuses
- H01H69/022—Manufacture of fuses of printed circuit fuses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/0411—Miniature fuses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/055—Fusible members
- H01H85/08—Fusible members characterised by the shape or form of the fusible member
- H01H85/11—Fusible members characterised by the shape or form of the fusible member with applied local area of a metal which, on melting, forms a eutectic with the main material of the fusible member, i.e. M-effect devices
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Fuses (AREA)
- Lock And Its Accessories (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US47256395A | 1995-06-07 | 1995-06-07 | |
| US08/482,829 | 1995-06-07 | ||
| US08/472,563 | 1995-06-07 | ||
| US08/482,829 US5943764A (en) | 1994-05-27 | 1995-06-07 | Method of manufacturing a surface-mounted fuse device |
| PCT/US1996/009147 WO1996041359A1 (fr) | 1995-06-07 | 1996-06-06 | Procede et appareil perfectionnes pour un dispositif fusible monte en surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10512094A true JPH10512094A (ja) | 1998-11-17 |
Family
ID=27043825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9501537A Pending JPH10512094A (ja) | 1995-06-07 | 1996-06-06 | 薄膜表面実装ヒューズおよびその製造方法 |
Country Status (10)
| Country | Link |
|---|---|
| EP (1) | EP0830704B1 (fr) |
| JP (1) | JPH10512094A (fr) |
| CN (1) | CN1191624A (fr) |
| AT (1) | ATE173355T1 (fr) |
| AU (1) | AU6154796A (fr) |
| CA (1) | CA2224070A1 (fr) |
| DE (1) | DE69600974T2 (fr) |
| DK (1) | DK0830704T3 (fr) |
| ES (1) | ES2124634T3 (fr) |
| WO (1) | WO1996041359A1 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012018777A (ja) * | 2010-07-06 | 2012-01-26 | Fujitsu Ltd | ヒューズおよびその製造方法 |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5923239A (en) * | 1997-12-02 | 1999-07-13 | Littelfuse, Inc. | Printed circuit board assembly having an integrated fusible link |
| JP2002513196A (ja) * | 1998-04-24 | 2002-05-08 | ヴィックマン−ヴェルケ ゲーエムベーハー | 電気ヒューズ |
| US6002322A (en) * | 1998-05-05 | 1999-12-14 | Littelfuse, Inc. | Chip protector surface-mounted fuse device |
| GB0001573D0 (en) * | 2000-01-24 | 2000-03-15 | Welwyn Components Ltd | Printed circuit board with fuse |
| CN1327467C (zh) * | 2001-06-11 | 2007-07-18 | 维克曼工厂有限公司 | 熔断器件及其制造方法 |
| US7551048B2 (en) | 2002-08-08 | 2009-06-23 | Fujitsu Component Limited | Micro-relay and method of fabricating the same |
| CN101197351B (zh) * | 2006-12-05 | 2010-09-01 | 邱鸿智 | 芯片慢熔型保险丝结构与制造方法 |
| CN101894717B (zh) * | 2009-05-21 | 2012-10-24 | 邱鸿智 | 具钻孔电极与压模包覆保险丝结构及制造方法 |
| US9117615B2 (en) | 2010-05-17 | 2015-08-25 | Littlefuse, Inc. | Double wound fusible element and associated fuse |
| CN101964287B (zh) * | 2010-10-22 | 2013-01-23 | 广东风华高新科技股份有限公司 | 薄膜片式保险丝及其制备方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4164725A (en) * | 1977-08-01 | 1979-08-14 | Wiebe Gerald L | Three-piece solderless plug-in electrically conducting component |
| GB1604820A (en) * | 1978-05-30 | 1981-12-16 | Laur Knudson Nordisk Elektrici | Electrical safety fuses |
| DE3044711A1 (de) * | 1980-11-27 | 1982-07-01 | Wickmann-Werke GmbH, 5810 Witten | Schmelzsicherung |
| DE3530354A1 (de) * | 1985-08-24 | 1987-03-05 | Opel Adam Ag | Elektrische sicherungsanordnung |
| JPH0831303B2 (ja) * | 1986-12-01 | 1996-03-27 | オムロン株式会社 | チツプ型ヒユ−ズ |
| ATE113755T1 (de) * | 1990-03-13 | 1994-11-15 | Morrill Glasstek Inc | Elektrisches bauteil (sicherung) und dessen herstellungsverfahren. |
| JPH0433230A (ja) * | 1990-05-29 | 1992-02-04 | Mitsubishi Materials Corp | チップ型ヒューズ |
| JPH04248221A (ja) * | 1991-01-23 | 1992-09-03 | Hitachi Chem Co Ltd | チップ型ヒューズの製造法 |
| JPH04245132A (ja) * | 1991-01-30 | 1992-09-01 | Hitachi Chem Co Ltd | チップヒューズ用基板及びそれを用いたチップヒューズ |
| JPH04245129A (ja) * | 1991-01-30 | 1992-09-01 | Hitachi Chem Co Ltd | チップ型ヒューズ |
| JPH04255627A (ja) * | 1991-02-08 | 1992-09-10 | Hitachi Chem Co Ltd | チップ型ヒューズの製造法 |
| JPH05166454A (ja) * | 1991-12-11 | 1993-07-02 | Hitachi Chem Co Ltd | チップ型ヒューズ |
| US5166656A (en) * | 1992-02-28 | 1992-11-24 | Avx Corporation | Thin film surface mount fuses |
| JPH0636672A (ja) * | 1992-07-16 | 1994-02-10 | Sumitomo Wiring Syst Ltd | カード型ヒューズおよびその製造方法 |
| US5552757A (en) * | 1994-05-27 | 1996-09-03 | Littelfuse, Inc. | Surface-mounted fuse device |
-
1996
- 1996-06-06 WO PCT/US1996/009147 patent/WO1996041359A1/fr not_active Ceased
- 1996-06-06 AT AT96919129T patent/ATE173355T1/de not_active IP Right Cessation
- 1996-06-06 EP EP96919129A patent/EP0830704B1/fr not_active Expired - Lifetime
- 1996-06-06 JP JP9501537A patent/JPH10512094A/ja active Pending
- 1996-06-06 ES ES96919129T patent/ES2124634T3/es not_active Expired - Lifetime
- 1996-06-06 CN CN96195755A patent/CN1191624A/zh active Pending
- 1996-06-06 CA CA002224070A patent/CA2224070A1/fr not_active Abandoned
- 1996-06-06 DE DE69600974T patent/DE69600974T2/de not_active Expired - Lifetime
- 1996-06-06 DK DK96919129T patent/DK0830704T3/da active
- 1996-06-06 AU AU61547/96A patent/AU6154796A/en not_active Abandoned
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012018777A (ja) * | 2010-07-06 | 2012-01-26 | Fujitsu Ltd | ヒューズおよびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| ES2124634T3 (es) | 1999-02-01 |
| DE69600974T2 (de) | 1999-06-10 |
| ATE173355T1 (de) | 1998-11-15 |
| EP0830704B1 (fr) | 1998-11-11 |
| DK0830704T3 (da) | 1999-07-26 |
| CN1191624A (zh) | 1998-08-26 |
| MX9709974A (es) | 1998-06-28 |
| EP0830704A1 (fr) | 1998-03-25 |
| AU6154796A (en) | 1996-12-30 |
| WO1996041359A1 (fr) | 1996-12-19 |
| CA2224070A1 (fr) | 1996-12-19 |
| DE69600974D1 (de) | 1998-12-17 |
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