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WO1994010098A1 - Composition de poudre dielectrique - Google Patents

Composition de poudre dielectrique Download PDF

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Publication number
WO1994010098A1
WO1994010098A1 PCT/GB1993/002260 GB9302260W WO9410098A1 WO 1994010098 A1 WO1994010098 A1 WO 1994010098A1 GB 9302260 W GB9302260 W GB 9302260W WO 9410098 A1 WO9410098 A1 WO 9410098A1
Authority
WO
WIPO (PCT)
Prior art keywords
powder composition
dielectric
sol
composition
filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/GB1993/002260
Other languages
English (en)
Inventor
Gary Paul Shorthouse
John Smyth
Allan Rein Berzins
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Johnson Matthey PLC
Original Assignee
Johnson Matthey PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnson Matthey PLC filed Critical Johnson Matthey PLC
Publication of WO1994010098A1 publication Critical patent/WO1994010098A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/08—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartz; glass; glass wool; slag wool; vitreous enamels
    • H01B3/087—Chemical composition of glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/08—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartz; glass; glass wool; slag wool; vitreous enamels
    • H01B3/088—Shaping of glass or deposition of glass
    • H10W70/69—

Definitions

  • This invention relates to a dielectric powder composition for use in a dielectric tape.
  • the improved performance of integrated circuits has emphasised the requirement for multilayer interconnect systems in order to provide high density circuits, fast signal propagation, and direct silicon die attachment.
  • the dielectric material used in the fabrication of these multilayer circuits should have a low dielectric constant and should show a low dielectric loss.
  • Thick film technology has been used in electronic interconnection circuitry for many years, to provide multilayer interconnection of electrical circuit components. The technology uses screen printing and high temperature firing, at temperatures ranging from 600° C to 1000° C. to provide alternate conductor and dielectric layers, with conductor layers being connected through holes (vias) provided in the dielectric.
  • High temperature co-fired technology has also been used to fabricate multilayer circuits.
  • this technology offers processing advantages over thick film, it involves lamination of a number of thin sheets of ceramic dielectric material such as Al 2 O 3 interspersed with alternating printed layers of conductive material; co-firing alumina with metallisation requires temperatures of 1600°C and the use of refractory metals such as molybdenum or tungsten, both of which have conductivity inferior to that possessed by metals available for use below 1000°C.
  • LTCF low temperature co-fired tape technology
  • This technology involves the lamination of a number of unfired sheets of dielectric material which have been printed with conductor layers such as gold, silver, silver/palladium or copper, followed by firing at temperatures of under 1000°C.
  • LTCF allows the use of high conductivity metals and retains the processing advantages of HTCF.
  • the basic technology has been described in many publications and is currently in commercial use.
  • LTCF dielectric tapes are generally formed from a dielectric composition which is a combination of ceramic materials such as alumina and various glasses, having dielectric constants of between 6 and 8.
  • EP-A-0.326.093 describes a composition for making dielectric layers having lower dielectric constants, comprising an admixture of solids being essentially a borosilicate glass containing alumina and 1.5-4.0 wt% of a mixture of oxides of alkali metals and/or alkaline earth metals including 0.3- 1.0wt% Li- O, and ceramic filler.
  • the oxides of alkali and/or alkaline earth metals are essential in order to obtain adequate sintering at usable temperature.
  • alkali metal oxides and/or alkaline earth metal oxides increases the electrical dissipation factor when the composition of EP-A-0,326.093 is used in low temperature co-fired tape and therefore has adverse effect on electrical performance.
  • the present invention provides a powder composition for use in a dielectric tape, which composition is free of any alkali metal oxide or alkaline earth metal oxide, and comprises a sol-gel derived sinterable glass precursor and a filler.
  • sol-gel derived dielectric material allows the dielectric composition of the present invention to sinter at temperatures much below those required by similar materials produced by other methods, and therefore eliminates the need for the use of alkali metal- or alkaline-earth metal -oxides. Much improved electrical properties are achieved in consequence.
  • the dielectric composition of the present invention is of low permittivity, comparable to that of the composition of EP-A-0.326.093.
  • sol-gel derived sinterable glass-precursors are sol-gel derived borosilicates having boron to silicon ratios (by weight as oxides of total oxides) of between 1:20 to 1: 1. and aluminoborosilicates similar to the borosilicates. with part of the silicon replaced by aluminium.
  • the precursor is a sol-gel derived borosilicate as described above.
  • the precursors consist of small particles, for example having diameters ranging from 0. 1 to 15 ⁇ m.
  • they are manufactured by spray-drying sol-gels that have been dispersed in water. freeze-drying gels or by alternative drying methods, or by precipitation directly from a chemical reaction, followed by further treatments.
  • the filler may be any conventional low permittivity material. such as quartz, and may or may not be formed via sol-gel processing techniques.
  • a particularly useful filler comprises silica spheres which have been precipitated from silicon alkoxides. Typically, these spheres are of diameters ranging from 0.2 to 3 ⁇ m.
  • the filler is present in the powder compositions of the present invention in amounts ranging from 10-80 wt% of total composition.
  • the powder compositions of the present invention may be made into dielectric tape using conventional processing techniques, such as slip casting of a slurry of the dielectric particles dispersed in a solution of binder polymer, plasticiser and solvent onto a flexible carrier, followed by removal of the solvent.
  • the present invention provides a dielectric tape comprising the powder composition of the present invention.
  • a typical procedure for the preparation of a b ⁇ rosilicate composition of the present invention is outlined below.
  • Tetraethylorthosilicate (2 moles) is mixed with ethan- l-ol
  • the dispersed gel is then immediately spray-dried at elevated temperature and pressure.
  • the resulting powder is then heated to 150° C for one hour during which time a further drying occurs.
  • the powder is heated to between 400° and 800° C (depending on composition ) to yield either the required material or a partially sintered compact of the material which must be subjected to grinding to produce the required powder.
  • the gel is freeze-dried and the resulting powder is thermally processed as above.
  • powders produced by spray drying are composed of tiny spheroids with diameters ranging from 0. 1 to 5 micrometers.
  • Materials that are dried using elevated temperatures or by freeze drying are not spheroidal.
  • the organic constituents are burned out or pyroiysed. and the inorganic components sinter together to form a block.
  • some dimensional change is unavoidable as the inorganic materials shrink.
  • it is possible to control the amount of shrinkage by careful control of the particle sizes, composition and proportions of constituents of the powder composition. It is preferable to control the shrinkage in order to retain dimensional stability of the interconnection lines, particularly if lines of controlled electrical impedance are required, or features that allow the placement of components on the sintered block. While the silica powder (which is spherical) does not substantially shrink during firing, there is considerable shrinkage of the (non-spherical) borosilicate.
  • the spherical silica would form a close packed matrix, with the interstices between the silica particles being filled with borosilicate. In practice this is difficult or even impossible to achieve, and the powder mixture composition has to be adjusted to provide an approximation to this ideal. It is thought that a composition of 20-30% borosilicate and 70-80% silica would provide such a close-packed matrix.
  • the mechanical strength of the sintered tape should also be as high as possible. This is also a function of the powder and is dependent on the amount of voids or air pockets within the fired composite. Generally, strength is increased with more dense structure (minimum voids), thus the powder composition should be such as to maximise the final density.
  • the tape Whilst the primary application of the tape is for electronic interconnection circuitry, there are additional applications particularly for the manufacture of packages for high speed integrated circuits. In this case the tape is formed into the package structure prior to firing. It is clear that these powders can be used to form similar packages directly by using a moulding process which eliminates the use of an intermediate tape.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Inorganic Insulating Materials (AREA)

Abstract

Composition de poudre diélectrique ne renfermant pas de métal alcalin comprenant un précurseur de verre frittable dérivé d'un sol-gel et un matériau de remplissage; cette composition pouvant être incorporée dans une bande diélectrique à cuisson commune à basse température.
PCT/GB1993/002260 1992-11-03 1993-11-03 Composition de poudre dielectrique Ceased WO1994010098A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB929222986A GB9222986D0 (en) 1992-11-03 1992-11-03 Dielectric powder composition
GB9222986.3 1992-11-03

Publications (1)

Publication Number Publication Date
WO1994010098A1 true WO1994010098A1 (fr) 1994-05-11

Family

ID=10724438

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB1993/002260 Ceased WO1994010098A1 (fr) 1992-11-03 1993-11-03 Composition de poudre dielectrique

Country Status (2)

Country Link
GB (1) GB9222986D0 (fr)
WO (1) WO1994010098A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1323682A3 (fr) * 2001-12-25 2004-01-21 Ngk Spark Plug Co., Ltd Matériau diélectrique et corps fritté diélectrique, et carte à circuit
US6762141B2 (en) * 2000-03-13 2004-07-13 Siemens Aktiengesellschaft Ceramic mass, method for the production of a ceramic mass and use of a ceramic mass
EP3321939A1 (fr) * 2016-11-15 2018-05-16 Samsung Electronics Co., Ltd. Structure de remplissage et dispositif électronique le comprenant

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4772574A (en) * 1986-10-02 1988-09-20 General Electric Company Ceramic filled glass dielectrics
US4849380A (en) * 1988-01-28 1989-07-18 E. I. Du Pont De Nemours And Company Dielectric composition
US5071793A (en) * 1990-08-23 1991-12-10 Aluminum Company Of America Low dielectric inorganic composition for multilayer ceramic package

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4772574A (en) * 1986-10-02 1988-09-20 General Electric Company Ceramic filled glass dielectrics
US4849380A (en) * 1988-01-28 1989-07-18 E. I. Du Pont De Nemours And Company Dielectric composition
US5071793A (en) * 1990-08-23 1991-12-10 Aluminum Company Of America Low dielectric inorganic composition for multilayer ceramic package

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6762141B2 (en) * 2000-03-13 2004-07-13 Siemens Aktiengesellschaft Ceramic mass, method for the production of a ceramic mass and use of a ceramic mass
EP1323682A3 (fr) * 2001-12-25 2004-01-21 Ngk Spark Plug Co., Ltd Matériau diélectrique et corps fritté diélectrique, et carte à circuit
CN1329326C (zh) * 2001-12-25 2007-08-01 日本特殊陶业株式会社 介电材料和介电材料烧结体以及使用该陶瓷的布线板
US7309669B2 (en) 2001-12-25 2007-12-18 Ngk Spark Plug Co., Ltd. Dielectric material and dielectric sintered body, and wiring board using the same
EP1353542B1 (fr) * 2001-12-25 2018-05-16 Ngk Spark Plug Co., Ltd Méthode de production de carte de circuit à couches multiples
EP3321939A1 (fr) * 2016-11-15 2018-05-16 Samsung Electronics Co., Ltd. Structure de remplissage et dispositif électronique le comprenant

Also Published As

Publication number Publication date
GB9222986D0 (en) 1992-12-16

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