[go: up one dir, main page]

WO1991006690A1 - Melange pour le nettoyage de cartes imprimees - Google Patents

Melange pour le nettoyage de cartes imprimees Download PDF

Info

Publication number
WO1991006690A1
WO1991006690A1 PCT/EP1990/001925 EP9001925W WO9106690A1 WO 1991006690 A1 WO1991006690 A1 WO 1991006690A1 EP 9001925 W EP9001925 W EP 9001925W WO 9106690 A1 WO9106690 A1 WO 9106690A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit boards
printed circuit
mixture
cleaning printed
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP1990/001925
Other languages
German (de)
English (en)
Inventor
Tooru Amada
Tadahiko Morihana
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel AG and Co KGaA
Original Assignee
Henkel AG and Co KGaA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel AG and Co KGaA filed Critical Henkel AG and Co KGaA
Publication of WO1991006690A1 publication Critical patent/WO1991006690A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/261—Alcohols; Phenols
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/43—Solvents
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • C11D7/5013—Organic solvents containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • C11D7/5022—Organic solvents containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
    • C23G5/024—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing hydrocarbons
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/24—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/263—Ethers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/264—Aldehydes; Ketones; Acetals or ketals
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/266—Esters or carbonates
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/329—Carbohydrate or derivatives thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity

Definitions

  • the present invention relates to a mixture for cleaning printed circuit boards (printed circuit boards).
  • chlorofluorohydrocarbons have been used to remove remaining soldering fluxes which adhere to printed circuit boards after soldering.
  • chlorofluorohydrocarbons efforts have been made to develop alternative cleaners.
  • Examples of alternative solvents are those which use surfactants, those which use organic solvents, etc. are known.
  • Examples of cleaners of the organic solvent type are those which use chlorine-containing solvents, such as are described, for example, in Japan Tokkyo Kokai Koho Sho64-152200, and those which use terpene solvents, as are used, for example, in Japan Kokai Kokkyo Koho Sho64-501908, etc. are known.
  • the former are problematic with regard to contamination of the groundwater by chlorine-containing solvents, while in the latter there is a difficulty in maintaining the supply of a constant quality product since it is a natural product; there are also problems with the characteristic smell and the high price.
  • the present invention aims to provide a mixture for cleaning printed circuit boards (printed circuit boards) which is suitable for the removal of rosin type soldering fluxes without using halogen-containing solvents such as chlorofluorocarbon solvents or chlorine-containing solvents .
  • the present invention relates to a mixture for cleaning printed circuit boards (printed circuit boards) containing one or more aliphatic hydrocarbons with an average number of carbon atoms from 8 to 20 and one or more organic compounds with one or more polar groups.
  • the aliphatic hydrocarbons which can be used for the present invention can be either straight-chain or branched, either saturated or unsaturated and also those with one or more alicyclic hydrocarbon group (s), but those with one or more straight-chain or saturated hydrocarbon groups Group (s) preferred as the main component. They can natur ⁇ according to ⁇ part of less than 20 wt .-%, especially 10 wt .-%, containing aromatic hydrocarbons such as toluene, xylene and other alkyl benzenes, etc ..
  • an average carbon number of 8 to 20, in particular 8 to 15, is preferred; such a liquid is desired which is preferably low viscosity and less volatile at the cleaning temperature, while it can be easily removed at the drying temperature.
  • the average carbon number means the value of the sum of the products from the carbon number each (hydrocarbon) component and the corresponding weight proportion in the mixture. Generally a value in the range of 8 to 22 is recommended.
  • preferred aliphatic hydrocarbons are embodied by straight-chain hydrocarbons such as n-octane, n-nonane, n-decane, n-undecane, n-dodecane, n-tridecane, n-tetradecane, n-pentadecane etc. or their branched (isomers ) Forms of the type of iso-, sec-, tert- etc. hydrocarbons.
  • organic compounds with one or more polar groups either solid or liquid organic compounds with oxygen and / or nitrogen atom (s) within the molecule are preferred.
  • Liquids are preferred (over solid substances); suitable are those having a boiling point of about 100 ⁇ C to 300 ° C, more preferably from about 100 ° C to 250 ° C.
  • Particular examples of particularly preferred organic compounds with one or more polar groups are those with an alcohol group and with a boiling point below 300 ° C., ie straight-chain alcohols such as butanol, hexyl alcohol, decanol etc.
  • Organic compounds with one or more polar groups when combined with the aliphatic hydrocarbons mentioned above, show a synergistic effect in the removal of fluxes of the rosin type.
  • the mixing ratio of the organic compounds with polar groups to the aliphatic hydrocarbons is set so that the former make up less than 80% by weight, preferably less than 65% by weight, of both. If the percentage by weight of the organic compounds exceeds 80%, the resin film part of the printed circuit boards with the printed circuits may swell or flake off.
  • circuit board cleaners covered by the present invention preferred are those whose viscosity is as low as possible at the application temperature, which have a low surface tension and which are excellent in both penetration and wetting power. In this way, an effective removal of dirt on the individual parts of the plates with the printed circuits can be achieved.
  • the value of the viscosity is preferably below approx. 50 mPa.s (50 cP), and more advantageously below 30 mPa.s (30 cP) at 25 ° C.
  • Detergent mixtures of the present invention may further contain other additives.
  • surfactants can be added to lower the surface tension.
  • Surfactants which can be used for this purpose are, for example, hydrocarbon surfactants such as dioctylsulfosuccinate, surfactants of the silicone type such as modified polydimethylsiloxane, fluorine-containing surfactants such as perfluoroalkylcarbonic acid derivatives and others.
  • the content of these surfactants to be used for the stated purpose is 0.001 to 10% by weight, more preferably 0.005 to 5% by weight, of the total composition. Excessive use of surfactants is not recommended as these remain in the residues.
  • anti-corrosion agents can be used to inhibit corrosion on the metallic surface of the object to be cleaned, for example copper corrosion inhibitors such as benzotriazole; Tolyltriazole etc.
  • a suitable concentration range for these corrosion inhibitor additives comprises 0.01 to 5% by weight, more preferably 0.01 to 1% by weight.
  • the printed circuit boards are immersed in the cleaner mixture, which is between room temperature and about 100 ° C., preferably between 30 ° C. and 70 ° C. if desired, additional ultrasound, stirring, vibration, air blowing, liquid circulation can be carried out at the same time, or cleaning can be carried out by spraying, wiping, etc.
  • the circuit boards can either be removed (from the cleaner bath) and simply dried, or they can be cleaned again using the same cleaner (bath) or conventional halogen-containing solvents such as chlorofluorocarbons or chlorine-containing cleaners or cleaners alcohol-type.
  • a cleaner of the present invention containing no surfactant is preferable because otherwise undesirable substances may remain on the circuit boards.
  • the amount of halogen-containing solvents used for the second cleaning is extremely small compared to that in the conventional method; In addition, it is also possible to reuse the solvents recycled in the circuit.
  • Water can also be used for this rinsing.
  • the use of water is particularly advantageous if either a considerable amount of water-soluble substances remain on the printed circuit boards or if fine dust-like residues are present there in large quantities.
  • a cleaner mixture for printed circuit boards which is adapted to this procedure can itself contain surfactants for emulsification with water.
  • Surfactants that can be used for this purpose are, for example, surfactants of the non-ionic type with added ethylene oxide, non-ionic surfactants of the ester type with polyhydric alcohols / higher alcohols, non-ionic surfactants of the alkanolamide type, anionic surfactants such as alkylbenzenesulfonates, alkyl succinates, etc. (and where possible their mixtures).
  • the printed circuit boards after having been subjected to the above treatment, can be steam cleaned, if necessary, using a solvent that hardly azeotropically distils with the detergent mixture, for example ethanol, isopropanol, chlorofluorocarbons, chlorine-containing solvents, etc.
  • a solvent that hardly azeotropically distils with the detergent mixture for example ethanol, isopropanol, chlorofluorocarbons, chlorine-containing solvents, etc.
  • the amount of halogen-containing solvents used for this cleaning is extremely small compared to that in the conventional method in which the solvents are used from the beginning; Furthermore, it is also possible to reuse the solvents recycled in the circuit.
  • TABLE 1 shows the formulations of cleaner mixtures for printed circuit boards. The cleaning power of these cleaner mixtures was determined using the following cleaning test:
  • TABLE 2 shows the formulations of detergent mixtures for printed circuit boards.
  • the cleaning power of these cleaner mixtures was determined using the following cleaning test.
  • a commercially available gas oil as solvent which contained relatively large amounts of high-boiling hydrocarbons
  • a chlorofluorocarbon solvent were tested.
  • Colophonium-type soldering fluxes on printed circuit boards can be removed effectively by the cleaner mixtures of the present invention without the need for halogen-containing solvents.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Detergent Compositions (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

La présente invention se rapporte à un mélange pour le nettoyage de cartes imprimées, c'est-à-dire de plaquettes de circuits imprimés, qui renferme aussi bien un ou plusieurs hydrocarbures aliphatiques avec un nombre moyen d'atomes de carbone allant de 8 à 20, de même qu'un ou plusieurs composés organiques avec un ou plusieurs groupes polaires.
PCT/EP1990/001925 1989-11-01 1990-10-29 Melange pour le nettoyage de cartes imprimees Ceased WO1991006690A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1/285329 1989-11-01
JP28532989A JPH03146597A (ja) 1989-11-01 1989-11-01 プリント基板の洗浄用組成物

Publications (1)

Publication Number Publication Date
WO1991006690A1 true WO1991006690A1 (fr) 1991-05-16

Family

ID=17690140

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP1990/001925 Ceased WO1991006690A1 (fr) 1989-11-01 1990-10-29 Melange pour le nettoyage de cartes imprimees

Country Status (2)

Country Link
JP (1) JPH03146597A (fr)
WO (1) WO1991006690A1 (fr)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0495348A1 (fr) * 1991-01-16 1992-07-22 Wolfgang König Agent pour enlever la couche protectrice de la surface de véhicules neufs sortant de l'usine ou similaires
EP0529869A1 (fr) * 1991-08-30 1993-03-03 Imperial Chemical Industries Plc Composition de nettoyage
WO1993006204A1 (fr) * 1991-09-24 1993-04-01 The Dow Chemical Company Compositions de solvant et procede de nettoyage semi-aqueux
EP0544035A1 (fr) * 1988-04-14 1993-06-02 Shell Internationale Researchmaatschappij B.V. Composition de nettoyage
WO1993013246A1 (fr) * 1992-01-03 1993-07-08 Exxon Chemical Patents Inc. Procede et composition utilises pour le nettoyage d'objets
EP0557912A1 (fr) * 1992-02-27 1993-09-01 KM Europa Metal Aktiengesellschaft Procédé de dégraissage d'objets métalliques
WO1994013777A1 (fr) * 1992-12-07 1994-06-23 Imperial Chemical Industries Plc Composition de nettoyage
EP0627500A1 (fr) * 1993-06-01 1994-12-07 Fujitsu Limited Agent d'enlèvement de flux, procédé et appareil de nettoyage
WO1995006102A1 (fr) * 1993-08-27 1995-03-02 Colgate-Palmolive Company Microemulsion liquide non aqueuse
FR2723958A1 (fr) * 1994-08-25 1996-03-01 Atochem Elf Sa Composition de nettoyage a base d'un melange d'alcanes et d'alcools de faible masse molaire.
US5567348A (en) * 1992-04-30 1996-10-22 Kao Corporation Detergent composition for precision parts or jigs
WO1996033261A1 (fr) * 1995-04-20 1996-10-24 Elf Atochem S.A. Composition de nettoyage a froid a base d'alcanes ou de cycloalcanes et d'un compose organique comprenant une fonction cetone
EP0726938A4 (fr) * 1994-07-07 1997-12-03 Safety Kleen Corp Composition a base de solvants amelioree
EP0717654A4 (fr) * 1994-07-07 1997-12-29 Safety Kleen Corp Procede de recyclage d'un solvant de nettoyage
EP0728838A3 (fr) * 1995-02-23 1998-09-09 Kurita Water Industries Ltd. Composition de nettoyage et méthode de nettoyage
EP1050562A1 (fr) * 1999-05-04 2000-11-08 Fina Research S.A. Composition à faible teneur en aromatiques
DE102013003467A1 (de) * 2013-03-01 2014-09-04 Bk Giulini Gmbh Reinigungsmittel und Verfahren zum Reinigen von technischen Anlagen zur Erdölverarbeitung
CN107641561A (zh) * 2016-07-21 2018-01-30 北京洁航箭达环保科技有限公司 一种新型高效的环保型助焊剂专用清洗剂及其制备方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2893497B2 (ja) * 1992-04-30 1999-05-24 花王株式会社 精密部品又は治工具類用洗浄剤組成物
JP2002012893A (ja) * 2000-06-27 2002-01-15 Chemiprokasei Kaisha Ltd 洗浄用組成物
JP6386233B2 (ja) * 2013-06-04 2018-09-05 三ツ星ベルト株式会社 導電膜を有する孔充填基板及びその製造方法並びに変色又は滲み抑制方法
CN105154269B (zh) * 2015-09-11 2018-06-29 中国石油大学(华东) 一种油类污物清洗剂及制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1450079A (fr) * 1964-10-10 1966-05-06 Hoechst Ag Agent de nettoyage et de passivation de surfaces métalliques
DE2316720A1 (de) * 1973-04-04 1974-10-31 Licentia Gmbh Verfahren zum entfernen von kolophoniumhaltigen rueckstaenden und dazugehoerige waschmittelloesung
EP0120319A2 (fr) * 1983-02-28 1984-10-03 Daikin Kogyo Co., Ltd. Composition de nettoyage pour enlever des cires
EP0287705A2 (fr) * 1987-04-24 1988-10-26 Firma Carl Freudenberg Procédé de nettoyage des réacteurs pour des mélanges à plusieurs composants contenant des isocyanates réactifs

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1450079A (fr) * 1964-10-10 1966-05-06 Hoechst Ag Agent de nettoyage et de passivation de surfaces métalliques
DE2316720A1 (de) * 1973-04-04 1974-10-31 Licentia Gmbh Verfahren zum entfernen von kolophoniumhaltigen rueckstaenden und dazugehoerige waschmittelloesung
EP0120319A2 (fr) * 1983-02-28 1984-10-03 Daikin Kogyo Co., Ltd. Composition de nettoyage pour enlever des cires
EP0287705A2 (fr) * 1987-04-24 1988-10-26 Firma Carl Freudenberg Procédé de nettoyage des réacteurs pour des mélanges à plusieurs composants contenant des isocyanates réactifs

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0544035A1 (fr) * 1988-04-14 1993-06-02 Shell Internationale Researchmaatschappij B.V. Composition de nettoyage
EP0495348A1 (fr) * 1991-01-16 1992-07-22 Wolfgang König Agent pour enlever la couche protectrice de la surface de véhicules neufs sortant de l'usine ou similaires
EP0529869A1 (fr) * 1991-08-30 1993-03-03 Imperial Chemical Industries Plc Composition de nettoyage
WO1993006204A1 (fr) * 1991-09-24 1993-04-01 The Dow Chemical Company Compositions de solvant et procede de nettoyage semi-aqueux
WO1993013246A1 (fr) * 1992-01-03 1993-07-08 Exxon Chemical Patents Inc. Procede et composition utilises pour le nettoyage d'objets
EP0557912A1 (fr) * 1992-02-27 1993-09-01 KM Europa Metal Aktiengesellschaft Procédé de dégraissage d'objets métalliques
US5567348A (en) * 1992-04-30 1996-10-22 Kao Corporation Detergent composition for precision parts or jigs
DE4314365B4 (de) * 1992-04-30 2005-12-15 Kao Corp. Reinigungszusammensetzung für Präzisionsteile oder -vorrichtungen
WO1994013777A1 (fr) * 1992-12-07 1994-06-23 Imperial Chemical Industries Plc Composition de nettoyage
US6050479A (en) * 1993-06-01 2000-04-18 Fujitsu, Ltd. Defluxing agent cleaning method and cleaning apparatus
US5695571A (en) * 1993-06-01 1997-12-09 Fujitsu Limited Cleaning method using a defluxing agent
EP0627500A1 (fr) * 1993-06-01 1994-12-07 Fujitsu Limited Agent d'enlèvement de flux, procédé et appareil de nettoyage
US6140286A (en) * 1993-06-01 2000-10-31 Fujitsu Limited Defluxing agent cleaning method and cleaning apparatus
WO1995006102A1 (fr) * 1993-08-27 1995-03-02 Colgate-Palmolive Company Microemulsion liquide non aqueuse
EP0717654A4 (fr) * 1994-07-07 1997-12-29 Safety Kleen Corp Procede de recyclage d'un solvant de nettoyage
EP0726938A4 (fr) * 1994-07-07 1997-12-03 Safety Kleen Corp Composition a base de solvants amelioree
EP0699747A1 (fr) * 1994-08-25 1996-03-06 Elf Atochem S.A. Composition de nettoyage
FR2723958A1 (fr) * 1994-08-25 1996-03-01 Atochem Elf Sa Composition de nettoyage a base d'un melange d'alcanes et d'alcools de faible masse molaire.
EP0728838A3 (fr) * 1995-02-23 1998-09-09 Kurita Water Industries Ltd. Composition de nettoyage et méthode de nettoyage
FR2733248A1 (fr) * 1995-04-20 1996-10-25 Atochem Elf Sa Composition de nettoyage a froid a base d'alcanes ou de cycloalcanes et d'un compose organique comprenant une fonction oxygenee
WO1996033261A1 (fr) * 1995-04-20 1996-10-24 Elf Atochem S.A. Composition de nettoyage a froid a base d'alcanes ou de cycloalcanes et d'un compose organique comprenant une fonction cetone
EP1050562A1 (fr) * 1999-05-04 2000-11-08 Fina Research S.A. Composition à faible teneur en aromatiques
WO2000066668A1 (fr) * 1999-05-04 2000-11-09 Fina Research S.A. Composition a faible teneur aromatique
DE102013003467A1 (de) * 2013-03-01 2014-09-04 Bk Giulini Gmbh Reinigungsmittel und Verfahren zum Reinigen von technischen Anlagen zur Erdölverarbeitung
CN107641561A (zh) * 2016-07-21 2018-01-30 北京洁航箭达环保科技有限公司 一种新型高效的环保型助焊剂专用清洗剂及其制备方法

Also Published As

Publication number Publication date
JPH03146597A (ja) 1991-06-21

Similar Documents

Publication Publication Date Title
WO1991006690A1 (fr) Melange pour le nettoyage de cartes imprimees
DE68910983T2 (de) Verwendung von monocarbonsäureestern zur entfernung von tinte und ähnlichem von druckmaschinen.
DE69228183T2 (de) Zusammensetzung und verfahren zum entfernen von rosin-lötflussmittel mit terpen und kohlenwasserstoffen
DE69430020T2 (de) Pentafluorbutan enthaltende Zusammensetzungen und deren Anwendung
DE69004521T2 (de) Reinigungsmittel auf der Basis eines dibasischen Esters und eines Kohlenwasserstofflösungsmittels und Reinigungsverfahren.
CH507774A (de) Lötflussmittel
EP0595881B1 (fr) Utilisation de compositions sans hydrocarbures halogenes pour nettoyer des ensembles electroniques et electriques des residus de soudure
DE69025594T2 (de) Nichttoxische, nichtentflammbare reiniger zum reinigen von gedruckten schaltungen
DE69004107T2 (de) Flussmittelzusammensetzung.
DE69616293T2 (de) Reinigungsverfahren und -vorrichtung
DE3115015C2 (de) Azeotropes Lösungsmittelgemisch
DE4116580A1 (de) Verwendung von fettsaeure-2-ethylhexylestern als kaltreinigungsmittel
EP0427069A2 (fr) Compositions détergents comprenant des hydrocarbures de carbone fluorés contenant de l'hydrogène et des alcanoles partiellement fluorés
DE69405574T2 (de) Reinigungsmittel
DE69409795T2 (de) Rückstandsarmes, von flüchtigen organischen verbindungen freies und keine reinigung erforderndes flussmittel sowie verfahren zu dessen verwendung
DE1963221A1 (de) Loesungsmittelgemisch
DE1546079A1 (de) Verfahren zum Entfernen von Harz-Flussmitteln von elektrischen Schaltbrettern
DE4333127A1 (de) Verfahren zum Schutz von lötfähigen Kupfer- und Kupferlegierungsoberflächen vor Korrosion
EP1191095B1 (fr) Procédé de nettoyage d'objets et liquide nettoyant
DE69127226T2 (de) Wasserlöslisches Weichlötflussmittel
EP0583719A1 (fr) Compositions à base de 1-chloro-2,2,2-trifluoroéthyl, difluorométhyl éther et d'alcanoles partiellement fluorés
DE69432702T2 (de) Verfahren zur herstellung von sauberen gegenstaenden
DE69030423T2 (de) Verfahren zur Reinigung von Lötflussmitteln auf Kolophoniumbasis
DE2321880C2 (de) Lösungsmittelgemische für die Reinigung von gelöteten elektrischen Bauteilen und ihre Verwendung
DE2133849C3 (fr)

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): CA KR US

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH DE DK ES FR GB GR IT LU NL SE

NENP Non-entry into the national phase

Ref country code: CA