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USD689390S1 - Pressure sensor package - Google Patents

Pressure sensor package Download PDF

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Publication number
USD689390S1
USD689390S1 US29/415,518 US201229415518F USD689390S US D689390 S1 USD689390 S1 US D689390S1 US 201229415518 F US201229415518 F US 201229415518F US D689390 S USD689390 S US D689390S
Authority
US
United States
Prior art keywords
pressure sensor
sensor package
package
elevational view
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/415,518
Inventor
Hisanobu Okawa
Hiroshi Ishida
Yasuyuki Hattori
Takashi Nishimizu
Hideki Kamimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Assigned to ALPS ELECTRIC CO., LTD. reassignment ALPS ELECTRIC CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HATTORI, YASUYUKI, ISHIDA, HIROSHI, KAMIMURA, HIDEKI, NISHIMIZU, Takashi, OKAWA, HISANOBU
Application granted granted Critical
Publication of USD689390S1 publication Critical patent/USD689390S1/en
Assigned to ALPS ALPINE CO., LTD. reassignment ALPS ALPINE CO., LTD. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: ALPS ELECTRIC CO., LTD.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a front, top and right side perspective of the pressure sensor package showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a pressure sensor package, as shown and described.
US29/415,518 2011-09-14 2012-03-12 Pressure sensor package Active USD689390S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-020968 2011-02-02
JP2011020968 2011-09-14

Publications (1)

Publication Number Publication Date
USD689390S1 true USD689390S1 (en) 2013-09-10

Family

ID=49084432

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/415,518 Active USD689390S1 (en) 2011-09-14 2012-03-12 Pressure sensor package

Country Status (1)

Country Link
US (1) USD689390S1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD712288S1 (en) * 2012-09-19 2014-09-02 Tanita Corporation Load cell
US20150075266A1 (en) * 2013-09-18 2015-03-19 Alps Electric Co., Ltd. Pressure detection device and intake pressure measurement apparatus using the same
USD724981S1 (en) * 2013-12-20 2015-03-24 Wika Alexander Wiegand Se & Co. Kg Electronic pressure transducer with output display
US9151659B2 (en) 2012-09-25 2015-10-06 Tanita Corporation Flexure element where the gap between the first arm and the second arm or between an arm and the strain generating region are equal to or smaller than one half the thickness
USD894767S1 (en) * 2018-10-15 2020-09-01 Fuji Electric Co., Ltd. Pressure sensor

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5465626A (en) * 1994-04-04 1995-11-14 Motorola, Inc. Pressure sensor with stress isolation platform hermetically sealed to protect sensor die
US20030214026A1 (en) * 2002-05-17 2003-11-20 Minoru Tokuhara Enhancement of wire bondability in semiconductor device package
US20040118214A1 (en) * 2002-12-23 2004-06-24 Motorola, Inc. Method and structure for fabricating sensors with a sacrificial gel dome
US7659551B2 (en) * 2003-05-27 2010-02-09 Cree, Inc. Power surface mount light emitting die package
US20100199777A1 (en) * 2009-02-10 2010-08-12 Hooper Stephen R Exposed Pad Backside Pressure Sensor Package
US8196476B2 (en) * 2009-04-14 2012-06-12 Kulite Semiconductor Products, Inc. Flat planar pressure transducer
US20120168884A1 (en) * 2011-01-05 2012-07-05 Freescale Semiconductor, Inc Pressure sensor and method of packaging same
USD669804S1 (en) * 2011-11-11 2012-10-30 Fuji Electric Co., Ltd. Pressure sensor
US8304847B2 (en) * 2005-11-01 2012-11-06 Fuji Electric Co., Ltd. Semiconductor pressure sensor
US8368112B2 (en) * 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
US8405200B2 (en) * 2007-05-29 2013-03-26 Kyocera Corporation Electronic-component-housing package and electronic device
US20130127879A1 (en) * 2011-11-18 2013-05-23 Qualcomm Mems Technologies, Inc. Glass-encapsulated pressure sensor

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5465626A (en) * 1994-04-04 1995-11-14 Motorola, Inc. Pressure sensor with stress isolation platform hermetically sealed to protect sensor die
US20030214026A1 (en) * 2002-05-17 2003-11-20 Minoru Tokuhara Enhancement of wire bondability in semiconductor device package
US20040118214A1 (en) * 2002-12-23 2004-06-24 Motorola, Inc. Method and structure for fabricating sensors with a sacrificial gel dome
US7659551B2 (en) * 2003-05-27 2010-02-09 Cree, Inc. Power surface mount light emitting die package
US8304847B2 (en) * 2005-11-01 2012-11-06 Fuji Electric Co., Ltd. Semiconductor pressure sensor
US8405200B2 (en) * 2007-05-29 2013-03-26 Kyocera Corporation Electronic-component-housing package and electronic device
US8368112B2 (en) * 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
US20100199777A1 (en) * 2009-02-10 2010-08-12 Hooper Stephen R Exposed Pad Backside Pressure Sensor Package
US8196476B2 (en) * 2009-04-14 2012-06-12 Kulite Semiconductor Products, Inc. Flat planar pressure transducer
US20120168884A1 (en) * 2011-01-05 2012-07-05 Freescale Semiconductor, Inc Pressure sensor and method of packaging same
USD669804S1 (en) * 2011-11-11 2012-10-30 Fuji Electric Co., Ltd. Pressure sensor
US20130127879A1 (en) * 2011-11-18 2013-05-23 Qualcomm Mems Technologies, Inc. Glass-encapsulated pressure sensor

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD712288S1 (en) * 2012-09-19 2014-09-02 Tanita Corporation Load cell
US9151659B2 (en) 2012-09-25 2015-10-06 Tanita Corporation Flexure element where the gap between the first arm and the second arm or between an arm and the strain generating region are equal to or smaller than one half the thickness
US20150075266A1 (en) * 2013-09-18 2015-03-19 Alps Electric Co., Ltd. Pressure detection device and intake pressure measurement apparatus using the same
US9804049B2 (en) * 2013-09-18 2017-10-31 Alps Electric Co., Ltd. Pressure detection device and intake pressure measurement apparatus using the same
USD724981S1 (en) * 2013-12-20 2015-03-24 Wika Alexander Wiegand Se & Co. Kg Electronic pressure transducer with output display
USD894767S1 (en) * 2018-10-15 2020-09-01 Fuji Electric Co., Ltd. Pressure sensor

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