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USD689030S1 - Portion of substrate for LED package - Google Patents

Portion of substrate for LED package Download PDF

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Publication number
USD689030S1
USD689030S1 US29/407,190 US201129407190F USD689030S US D689030 S1 USD689030 S1 US D689030S1 US 201129407190 F US201129407190 F US 201129407190F US D689030 S USD689030 S US D689030S
Authority
US
United States
Prior art keywords
substrate
led package
view
led
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/407,190
Inventor
Bong Kul MIN
Gyu Hyeong BAK
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Lekin Semiconductor Co Ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Assigned to LG INNOTEK CO., LTD. reassignment LG INNOTEK CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BAK, GYU HYEONG, Min, Bong Kul
Application granted granted Critical
Publication of USD689030S1 publication Critical patent/USD689030S1/en
Assigned to SUZHOU LEKIN SEMICONDUCTOR CO., LTD. reassignment SUZHOU LEKIN SEMICONDUCTOR CO., LTD. ASSIGNMENT OF ASSIGNOR'S INTEREST Assignors: LG INNOTEK CO., LTD.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a perspective view of the portion of substrate for LED package showing our new design;
FIG. 2 is a front view thereof, the rear view being a mirror image thereof;
FIG. 3 is a left side view thereof, the right side view being a mirror image thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof; and,
FIG. 6 is a cross-sectional reference view thereof through VI-VI of FIG. 2.
The broken lines shown are included for the purpose of illustrating the unclaimed portions of the article and form no part of the claim.

Claims (1)

    CLAIM
  1. The ornamental design for a portion of substrate for LED package, as shown and described.
US29/407,190 2011-05-24 2011-11-23 Portion of substrate for LED package Active USD689030S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR30-2011-0020938 2011-05-24
KR20110020938 2011-05-24

Publications (1)

Publication Number Publication Date
USD689030S1 true USD689030S1 (en) 2013-09-03

Family

ID=49035008

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/407,190 Active USD689030S1 (en) 2011-05-24 2011-11-23 Portion of substrate for LED package

Country Status (1)

Country Link
US (1) USD689030S1 (en)

Citations (36)

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US20070096114A1 (en) * 2005-09-27 2007-05-03 Nichia Corporation Light emitting apparatus
US20090151092A1 (en) * 2007-10-10 2009-06-18 Robin Bender Bender Unique Tread Marked Apparel
US20100102348A1 (en) * 2008-10-23 2010-04-29 Chen-Hsiu Lin Lead frame unit, package structure and light emitting diode device having the same
US20100200276A1 (en) * 2009-02-11 2010-08-12 Broadcom Corporation Implementations of twisted differential pairs on a circuit board
USD622211S1 (en) * 2010-02-18 2010-08-24 The Goodyear Tire & Rubber Company Tire
USD622680S1 (en) * 2009-12-04 2010-08-31 Silitek Electronic (Guangzhou) Go., Ltd. Package of a light emitting diode
USD627310S1 (en) * 2009-11-27 2010-11-16 Lite-On Technology Corp. Package of a light emitting diode
USD634285S1 (en) * 2010-02-10 2011-03-15 Lextar Electronics Corporation Lead frame
USD634284S1 (en) * 2010-02-10 2011-03-15 Lextar Electronics Corporation Lead frame
USD638378S1 (en) * 2010-02-10 2011-05-24 Lextar Electronics Corporation Lead frame
USD638353S1 (en) * 2009-10-26 2011-05-24 Toyo Tire & Rubber Co., Ltd. Automobile tire
US20110127566A1 (en) * 2009-12-01 2011-06-02 Jae Joon Yoon Light emitting device and method of manufacturing the same
USD640996S1 (en) * 2010-09-27 2011-07-05 Lite-On Technology Corporation Packing structure of light-emitting diode
USD640994S1 (en) * 2010-09-27 2011-07-05 Lite-On Technology Corporation Packing structure of light-emitting diode
USD640995S1 (en) * 2010-09-27 2011-07-05 Lite-On Technology Corporation Packing structure of light-emitting diode
US20110186873A1 (en) * 2009-06-05 2011-08-04 Emerson David T Light emitting device packages, systems and methods
US20110211348A1 (en) * 2010-04-01 2011-09-01 Kyong Jun Kim Light emitting device package and lighting system
USD644617S1 (en) * 2010-07-20 2011-09-06 Panasonic Corporation Light emitting diode case
USD645425S1 (en) * 2011-02-01 2011-09-20 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode carrier
US20110241030A1 (en) * 2010-05-17 2011-10-06 Kim Taejin Light emitting device package
US20110284900A1 (en) * 2010-05-24 2011-11-24 Seoul Semiconductor Co., Ltd. Light emitting diode package
US20120007111A1 (en) * 2011-04-08 2012-01-12 Lee Gun Kyo Light emitting device module and lighting system including the same
USD656106S1 (en) * 2011-01-07 2012-03-20 Lextar Electronics Corp. Light emitting diode lead-frame
USD656468S1 (en) * 2011-05-31 2012-03-27 Lg Display Co., Ltd. Light emitting diode
US20120074451A1 (en) * 2010-09-27 2012-03-29 Lite-On Technology Corpration Lead frame structure, a packaging structure and a lighting unit thereof
US20120153327A1 (en) * 2010-12-21 2012-06-21 Daniel Kim Semiconductor package and method of manufacturing the same
US20120161180A1 (en) * 2010-12-28 2012-06-28 Kabushiki Kaisha Toshiba Led package
US20120168810A1 (en) * 2009-07-10 2012-07-05 Furukawa Electric Co., Ltd. Lead frame for optical semiconductor device, method of producing the same, and optical semiconductor device
USD664109S1 (en) * 2011-05-26 2012-07-24 Lextar Electronics Corp. Light emitting diode lead-frame
USD664108S1 (en) * 2011-05-26 2012-07-24 Lextar Electronics Corp. Light emitting diode lead-frame
USD664105S1 (en) * 2011-02-25 2012-07-24 Lextar Electronics Corp. Light emitting diode lead-frame
USD664110S1 (en) * 2011-05-24 2012-07-24 Lg Innotek Co., Ltd. Substrate for LED package
US20120211789A1 (en) * 2011-02-22 2012-08-23 Samsung Led Co., Ltd. Light emitting device package
US20120223343A1 (en) * 2011-03-02 2012-09-06 Seoul Semiconductor Co., Ltd. Light emitting diode package
US20120305976A1 (en) * 2011-05-30 2012-12-06 Bak Gyu Hyeong Light emitting device package and lighting system including the same

Patent Citations (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD454535S1 (en) * 2000-11-29 2002-03-19 Michelin Recherche Et Technique S.A. Tire tread
US20070096114A1 (en) * 2005-09-27 2007-05-03 Nichia Corporation Light emitting apparatus
US20090151092A1 (en) * 2007-10-10 2009-06-18 Robin Bender Bender Unique Tread Marked Apparel
US20100102348A1 (en) * 2008-10-23 2010-04-29 Chen-Hsiu Lin Lead frame unit, package structure and light emitting diode device having the same
US20100200276A1 (en) * 2009-02-11 2010-08-12 Broadcom Corporation Implementations of twisted differential pairs on a circuit board
US20110186873A1 (en) * 2009-06-05 2011-08-04 Emerson David T Light emitting device packages, systems and methods
US20120168810A1 (en) * 2009-07-10 2012-07-05 Furukawa Electric Co., Ltd. Lead frame for optical semiconductor device, method of producing the same, and optical semiconductor device
USD638353S1 (en) * 2009-10-26 2011-05-24 Toyo Tire & Rubber Co., Ltd. Automobile tire
USD627310S1 (en) * 2009-11-27 2010-11-16 Lite-On Technology Corp. Package of a light emitting diode
US20110127566A1 (en) * 2009-12-01 2011-06-02 Jae Joon Yoon Light emitting device and method of manufacturing the same
USD622680S1 (en) * 2009-12-04 2010-08-31 Silitek Electronic (Guangzhou) Go., Ltd. Package of a light emitting diode
USD638378S1 (en) * 2010-02-10 2011-05-24 Lextar Electronics Corporation Lead frame
USD634284S1 (en) * 2010-02-10 2011-03-15 Lextar Electronics Corporation Lead frame
USD634285S1 (en) * 2010-02-10 2011-03-15 Lextar Electronics Corporation Lead frame
USD622211S1 (en) * 2010-02-18 2010-08-24 The Goodyear Tire & Rubber Company Tire
US20110211348A1 (en) * 2010-04-01 2011-09-01 Kyong Jun Kim Light emitting device package and lighting system
US20110241030A1 (en) * 2010-05-17 2011-10-06 Kim Taejin Light emitting device package
US20110284900A1 (en) * 2010-05-24 2011-11-24 Seoul Semiconductor Co., Ltd. Light emitting diode package
USD644617S1 (en) * 2010-07-20 2011-09-06 Panasonic Corporation Light emitting diode case
US20120074451A1 (en) * 2010-09-27 2012-03-29 Lite-On Technology Corpration Lead frame structure, a packaging structure and a lighting unit thereof
USD640995S1 (en) * 2010-09-27 2011-07-05 Lite-On Technology Corporation Packing structure of light-emitting diode
USD640994S1 (en) * 2010-09-27 2011-07-05 Lite-On Technology Corporation Packing structure of light-emitting diode
USD640996S1 (en) * 2010-09-27 2011-07-05 Lite-On Technology Corporation Packing structure of light-emitting diode
US20120153327A1 (en) * 2010-12-21 2012-06-21 Daniel Kim Semiconductor package and method of manufacturing the same
US20120161180A1 (en) * 2010-12-28 2012-06-28 Kabushiki Kaisha Toshiba Led package
USD656106S1 (en) * 2011-01-07 2012-03-20 Lextar Electronics Corp. Light emitting diode lead-frame
USD645425S1 (en) * 2011-02-01 2011-09-20 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode carrier
US20120211789A1 (en) * 2011-02-22 2012-08-23 Samsung Led Co., Ltd. Light emitting device package
USD664105S1 (en) * 2011-02-25 2012-07-24 Lextar Electronics Corp. Light emitting diode lead-frame
US20120223343A1 (en) * 2011-03-02 2012-09-06 Seoul Semiconductor Co., Ltd. Light emitting diode package
US20120007111A1 (en) * 2011-04-08 2012-01-12 Lee Gun Kyo Light emitting device module and lighting system including the same
USD664110S1 (en) * 2011-05-24 2012-07-24 Lg Innotek Co., Ltd. Substrate for LED package
USD664109S1 (en) * 2011-05-26 2012-07-24 Lextar Electronics Corp. Light emitting diode lead-frame
USD664108S1 (en) * 2011-05-26 2012-07-24 Lextar Electronics Corp. Light emitting diode lead-frame
US20120305976A1 (en) * 2011-05-30 2012-12-06 Bak Gyu Hyeong Light emitting device package and lighting system including the same
USD656468S1 (en) * 2011-05-31 2012-03-27 Lg Display Co., Ltd. Light emitting diode

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