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USD664110S1 - Substrate for LED package - Google Patents

Substrate for LED package Download PDF

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Publication number
USD664110S1
USD664110S1 US29/407,197 US201129407197F USD664110S US D664110 S1 USD664110 S1 US D664110S1 US 201129407197 F US201129407197 F US 201129407197F US D664110 S USD664110 S US D664110S
Authority
US
United States
Prior art keywords
substrate
led package
view
led
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/407,197
Inventor
Bong Kul MIN
Gyu Hyeong BAK
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Lekin Semiconductor Co Ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Assigned to LG INNOTEK CO., LTD. reassignment LG INNOTEK CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BAK, GYU HYEONG, Min, Bong Kul
Application granted granted Critical
Publication of USD664110S1 publication Critical patent/USD664110S1/en
Assigned to SUZHOU LEKIN SEMICONDUCTOR CO., LTD. reassignment SUZHOU LEKIN SEMICONDUCTOR CO., LTD. ASSIGNMENT OF ASSIGNOR'S INTEREST Assignors: LG INNOTEK CO., LTD.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a perspective view of the substrate for LED package showing our new design;
FIG. 2 is a front view thereof, the rear view being a mirror image thereof;
FIG. 3 is a left side view thereof, the right side view being a mirror image thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof; and,
FIG. 6 is a cross-sectional reference view thereof through VI-VI of FIG. 2.
The broken lines shown are included for the purpose of illustrating the unclaimed portions of the article and form no part of the claim.

Claims (1)

  1. The ornamental design for a substrate for LED package, as shown and described.
US29/407,197 2011-05-24 2011-11-23 Substrate for LED package Active USD664110S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20110020939 2011-05-24
KR30-2011-0020939 2011-05-24

Publications (1)

Publication Number Publication Date
USD664110S1 true USD664110S1 (en) 2012-07-24

Family

ID=46513404

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/407,197 Active USD664110S1 (en) 2011-05-24 2011-11-23 Substrate for LED package

Country Status (1)

Country Link
US (1) USD664110S1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD689030S1 (en) * 2011-05-24 2013-09-03 Lg Innotek Co., Ltd. Portion of substrate for LED package
USD689029S1 (en) * 2011-05-24 2013-09-03 Lg Innotek Co., Ltd. Portion of substrate for LED package

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070096114A1 (en) * 2005-09-27 2007-05-03 Nichia Corporation Light emitting apparatus
USD634284S1 (en) * 2010-02-10 2011-03-15 Lextar Electronics Corporation Lead frame
USD638378S1 (en) * 2010-02-10 2011-05-24 Lextar Electronics Corporation Lead frame
US20110127566A1 (en) * 2009-12-01 2011-06-02 Jae Joon Yoon Light emitting device and method of manufacturing the same
USD645425S1 (en) * 2011-02-01 2011-09-20 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode carrier
US20110241030A1 (en) * 2010-05-17 2011-10-06 Kim Taejin Light emitting device package
USD652808S1 (en) * 2011-01-10 2012-01-24 Advanced Optoelectronic Technology, Inc. Light-emitting diode encapsulating structure
US20120074451A1 (en) * 2010-09-27 2012-03-29 Lite-On Technology Corpration Lead frame structure, a packaging structure and a lighting unit thereof

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070096114A1 (en) * 2005-09-27 2007-05-03 Nichia Corporation Light emitting apparatus
US20110127566A1 (en) * 2009-12-01 2011-06-02 Jae Joon Yoon Light emitting device and method of manufacturing the same
USD634284S1 (en) * 2010-02-10 2011-03-15 Lextar Electronics Corporation Lead frame
USD638378S1 (en) * 2010-02-10 2011-05-24 Lextar Electronics Corporation Lead frame
US20110241030A1 (en) * 2010-05-17 2011-10-06 Kim Taejin Light emitting device package
US20120074451A1 (en) * 2010-09-27 2012-03-29 Lite-On Technology Corpration Lead frame structure, a packaging structure and a lighting unit thereof
USD652808S1 (en) * 2011-01-10 2012-01-24 Advanced Optoelectronic Technology, Inc. Light-emitting diode encapsulating structure
USD645425S1 (en) * 2011-02-01 2011-09-20 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode carrier

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD689030S1 (en) * 2011-05-24 2013-09-03 Lg Innotek Co., Ltd. Portion of substrate for LED package
USD689029S1 (en) * 2011-05-24 2013-09-03 Lg Innotek Co., Ltd. Portion of substrate for LED package

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