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USD394844S - Temporary package for semiconductor dice - Google Patents

Temporary package for semiconductor dice Download PDF

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Publication number
USD394844S
USD394844S US29/070,050 US7005097F USD394844S US D394844 S USD394844 S US D394844S US 7005097 F US7005097 F US 7005097F US D394844 S USD394844 S US D394844S
Authority
US
United States
Prior art keywords
semiconductor dice
temporary package
temporary
package
dice
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/070,050
Inventor
Warren M. Farnworth
Alan G. Wood
David R. Hembree
Salman Akram
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micron Technology Inc
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Priority to US29/070,050 priority Critical patent/USD394844S/en
Assigned to MICRON TECHNOLOGY, INC. reassignment MICRON TECHNOLOGY, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HEMBREE, DAVID R., WOOD, ALAN G., AKRAM, SALMAN, FARNWORTH, WARREN M.
Application granted granted Critical
Publication of USD394844S publication Critical patent/USD394844S/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is an enlarged top perspective view of a temporary package for semiconductor dice showing my new design;
FIG. 2 is a left side elevational view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a front side elevational view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a rear side elevation view thereof.

Claims (1)

  1. The ornamental design for a temporary package for semiconductor dice, as shown and described.
US29/070,050 1997-04-25 1997-04-25 Temporary package for semiconductor dice Expired - Lifetime USD394844S (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/070,050 USD394844S (en) 1997-04-25 1997-04-25 Temporary package for semiconductor dice

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/070,050 USD394844S (en) 1997-04-25 1997-04-25 Temporary package for semiconductor dice

Publications (1)

Publication Number Publication Date
USD394844S true USD394844S (en) 1998-06-02

Family

ID=71573699

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/070,050 Expired - Lifetime USD394844S (en) 1997-04-25 1997-04-25 Temporary package for semiconductor dice

Country Status (1)

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US (1) USD394844S (en)

Cited By (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD401567S (en) 1997-04-25 1998-11-24 Micron Technology, Inc. Temporary package for semiconductor dice
US6222379B1 (en) 1991-06-04 2001-04-24 Micron Technology, Inc. Conventionally sized temporary package for testing semiconductor dice
US6353326B2 (en) 1998-08-28 2002-03-05 Micron Technology, Inc. Test carrier with molded interconnect for testing semiconductor components
US6558600B1 (en) 2000-05-04 2003-05-06 Micron Technology, Inc. Method for packaging microelectronic substrates
US6576494B1 (en) 2000-06-28 2003-06-10 Micron Technology, Inc. Recessed encapsulated microelectronic devices and methods for formation
US6638595B2 (en) 2000-06-28 2003-10-28 Micron Technology, Inc. Method and apparatus for reduced flash encapsulation of microelectronic devices
US6653173B2 (en) 2000-06-16 2003-11-25 Micron Technology, Inc. Method and apparatus for packaging a microelectronic die
US6656769B2 (en) 2000-05-08 2003-12-02 Micron Technology, Inc. Method and apparatus for distributing mold material in a mold for packaging microelectronic devices
US20040026773A1 (en) * 2002-08-08 2004-02-12 Koon Eng Meow Packaged microelectronic components
US20040031621A1 (en) * 2002-08-19 2004-02-19 Heng Puah Kia Packaged microelectronic component assemblies
US20040038447A1 (en) * 2002-08-21 2004-02-26 Corisis David J Packaged microelectronic devices and methods for assembling microelectronic devices
US20040155331A1 (en) * 2003-02-11 2004-08-12 Blaine Thurgood Packaged microelectronic devices and methods for packaging microelectronic devices
US6796028B2 (en) 2000-08-23 2004-09-28 Micron Technology, Inc. Method of Interconnecting substrates for electrical coupling of microelectronic components
US6838760B1 (en) 2000-08-28 2005-01-04 Micron Technology, Inc. Packaged microelectronic devices with interconnecting units
US20050019988A1 (en) * 2002-04-04 2005-01-27 Tongbi Jiang Method and apparatus for attaching microelectronic substrates and support members
US6876066B2 (en) 2001-08-29 2005-04-05 Micron Technology, Inc. Packaged microelectronic devices and methods of forming same
US6921860B2 (en) 2003-03-18 2005-07-26 Micron Technology, Inc. Microelectronic component assemblies having exposed contacts
US6951982B2 (en) 2002-11-22 2005-10-04 Micron Technology, Inc. Packaged microelectronic component assemblies
US6979595B1 (en) 2000-08-24 2005-12-27 Micron Technology, Inc. Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices
US20060035503A1 (en) * 2003-08-29 2006-02-16 Seng Eric T S Invertible microfeature device packages and associated methods
US20060040422A1 (en) * 2002-08-08 2006-02-23 Micron Technology, Inc. Microelectronic devices and methods for manufacturing and operating packaged microelectronic device
US7057281B2 (en) 2003-03-04 2006-06-06 Micron Technology Inc. Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths
US20060189036A1 (en) * 2005-02-08 2006-08-24 Micron Technology, Inc. Methods and systems for adhering microfeature workpieces to support members
US20060208366A1 (en) * 2004-07-23 2006-09-21 Micron Technology, Inc. Microelectronic component assemblies with recessed wire bonds and methods of making same
US20060261498A1 (en) * 2005-05-17 2006-11-23 Micron Technology, Inc. Methods and apparatuses for encapsulating microelectronic devices
US7157310B2 (en) 2004-09-01 2007-01-02 Micron Technology, Inc. Methods for packaging microfeature devices and microfeature devices formed by such methods
US20070045875A1 (en) * 2005-08-30 2007-03-01 Micron Technology, Inc. Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods
US7218001B2 (en) 2003-10-31 2007-05-15 Micron Technology, Inc. Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components
US20070181989A1 (en) * 2006-02-08 2007-08-09 Micron Technology, Inc. Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
US7273769B1 (en) 2000-08-16 2007-09-25 Micron Technology, Inc. Method and apparatus for removing encapsulating material from a packaged microelectronic device
US20080206930A1 (en) * 2007-02-23 2008-08-28 Micron Technology, Inc. Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece
US20080224329A1 (en) * 2007-03-13 2008-09-18 Micron Technology, Inc. Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
US7745944B2 (en) 2005-08-31 2010-06-29 Micron Technology, Inc. Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts
US20100276814A1 (en) * 2005-12-29 2010-11-04 Micron Technology, Inc. Methods for packaging microelectronic devices and microelectronic devices formed using such methods
US7910385B2 (en) 2006-05-12 2011-03-22 Micron Technology, Inc. Method of fabricating microelectronic devices
US8202754B2 (en) 2006-03-29 2012-06-19 Micron Technology, Inc. Packaged microelectronic devices recessed in support member cavities, and associated methods

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USD317592S (en) 1987-01-19 1991-06-18 Canon Kabushiki Kaisha Semiconductor element
US5053853A (en) 1990-05-08 1991-10-01 International Business Machines Corporation Modular electronic packaging system
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USD359028S (en) 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
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US5451165A (en) 1994-07-27 1995-09-19 Minnesota Mining And Manufacturing Company Temporary package for bare die test and burn-in
US5455452A (en) 1993-06-25 1995-10-03 International Business Machines Corporation Semiconductor package having an LOC structure
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USD317592S (en) 1987-01-19 1991-06-18 Canon Kabushiki Kaisha Semiconductor element
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US5302891A (en) 1991-06-04 1994-04-12 Micron Technology, Inc. Discrete die burn-in for non-packaged die
US5471088A (en) 1992-11-07 1995-11-28 Goldstar Electron Co., Ltd. Semiconductor package and method for manufacturing the same
US5442232A (en) 1992-12-28 1995-08-15 Kabushiki Kaisha Toshiba Thin semiconductor package having many pins and likely to dissipate heat
US5455452A (en) 1993-06-25 1995-10-03 International Business Machines Corporation Semiconductor package having an LOC structure
US5517125A (en) 1993-07-09 1996-05-14 Aehr Test Systems, Inc. Reusable die carrier for burn-in and burn-in process
US5530376A (en) 1993-08-25 1996-06-25 Sunright Limited Reusable carrier for burn-in/testing of non packaged die
US5543725A (en) 1993-08-25 1996-08-06 Sunright Limited Reusable carrier for burn-in/testing on non packaged die
USD359028S (en) 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
US5581195A (en) 1993-11-20 1996-12-03 Samsung Electronics Co., Ltd. Semiconductor chip holding device
US5451165A (en) 1994-07-27 1995-09-19 Minnesota Mining And Manufacturing Company Temporary package for bare die test and burn-in

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
1994 Dram Data Book, Micron Semiconductor, Inc., pp. 7-7-7-13, Apr., 1994.

Cited By (101)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6222379B1 (en) 1991-06-04 2001-04-24 Micron Technology, Inc. Conventionally sized temporary package for testing semiconductor dice
USD401567S (en) 1997-04-25 1998-11-24 Micron Technology, Inc. Temporary package for semiconductor dice
US6642730B1 (en) 1998-08-28 2003-11-04 Micron Technology, Inc. Test carrier with molded interconnect for testing semiconductor components
US6353326B2 (en) 1998-08-28 2002-03-05 Micron Technology, Inc. Test carrier with molded interconnect for testing semiconductor components
US6544461B1 (en) 1998-08-28 2003-04-08 Micron Technology, Inc. Test carrier with molded interconnect for testing semiconductor components
US6558600B1 (en) 2000-05-04 2003-05-06 Micron Technology, Inc. Method for packaging microelectronic substrates
US20030209831A1 (en) * 2000-05-04 2003-11-13 Williams Vernon M. Method and apparatus for packaging microelectronic substrates
US6656769B2 (en) 2000-05-08 2003-12-02 Micron Technology, Inc. Method and apparatus for distributing mold material in a mold for packaging microelectronic devices
US6653173B2 (en) 2000-06-16 2003-11-25 Micron Technology, Inc. Method and apparatus for packaging a microelectronic die
US6664139B2 (en) 2000-06-16 2003-12-16 Micron Technology, Inc. Method and apparatus for packaging a microelectronic die
US6677675B2 (en) 2000-06-16 2004-01-13 Micron Technology, Inc. Microelectronic devices and microelectronic die packages
US6683388B2 (en) 2000-06-16 2004-01-27 Micron Technology, Inc. Method and apparatus for packaging a microelectronic die
US6819003B2 (en) 2000-06-28 2004-11-16 Micron Technology Inc. Recessed encapsulated microelectronic devices and methods for formation
US6638595B2 (en) 2000-06-28 2003-10-28 Micron Technology, Inc. Method and apparatus for reduced flash encapsulation of microelectronic devices
US6644949B2 (en) 2000-06-28 2003-11-11 Micron Technology, Inc. Apparatus for reduced flash encapsulation of microelectronic devices
US6576494B1 (en) 2000-06-28 2003-06-10 Micron Technology, Inc. Recessed encapsulated microelectronic devices and methods for formation
US6841423B2 (en) 2000-06-28 2005-01-11 Micron Technology, Inc. Methods for formation of recessed encapsulated microelectronic devices
US7273769B1 (en) 2000-08-16 2007-09-25 Micron Technology, Inc. Method and apparatus for removing encapsulating material from a packaged microelectronic device
US7405487B2 (en) 2000-08-16 2008-07-29 Micron Technology, Inc. Method and apparatus for removing encapsulating material from a packaged microelectronic device
US6982386B2 (en) 2000-08-23 2006-01-03 Micron Technology, Inc. Interconnecting substrates for electrical coupling of microelectronic components
US6796028B2 (en) 2000-08-23 2004-09-28 Micron Technology, Inc. Method of Interconnecting substrates for electrical coupling of microelectronic components
US6983551B2 (en) 2000-08-23 2006-01-10 Micron Technology, Inc. Interconnecting substrates for electrical coupling of microelectronic components
US20060180907A1 (en) * 2000-08-24 2006-08-17 Micron Technology, Inc. Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectonic devices
US7049685B2 (en) 2000-08-24 2006-05-23 Micron Technology, Inc. Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices
US6979595B1 (en) 2000-08-24 2005-12-27 Micron Technology, Inc. Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices
US7332376B2 (en) 2000-08-28 2008-02-19 Micron Technology, Inc. Method of encapsulating packaged microelectronic devices with a barrier
US6838760B1 (en) 2000-08-28 2005-01-04 Micron Technology, Inc. Packaged microelectronic devices with interconnecting units
US7101737B2 (en) 2000-08-28 2006-09-05 Micron Technology, Inc. Method of encapsulating interconnecting units in packaged microelectronic devices
US20070063335A1 (en) * 2000-08-28 2007-03-22 Micron Technology, Inc. Packaged microelectronic devices with interconnecting units and methods for manufacturing and using the interconnecting units
US6943450B2 (en) 2001-08-29 2005-09-13 Micron Technology, Inc. Packaged microelectronic devices and methods of forming same
US6876066B2 (en) 2001-08-29 2005-04-05 Micron Technology, Inc. Packaged microelectronic devices and methods of forming same
US20050019988A1 (en) * 2002-04-04 2005-01-27 Tongbi Jiang Method and apparatus for attaching microelectronic substrates and support members
US20070020811A1 (en) * 2002-04-04 2007-01-25 Micron Technology, Inc. Method and apparatus for attaching microelectronic substrates and support members
US7091064B2 (en) 2002-04-04 2006-08-15 Micron Technology, Inc. Method and apparatus for attaching microelectronic substrates and support members
US7109588B2 (en) 2002-04-04 2006-09-19 Micron Technology, Inc. Method and apparatus for attaching microelectronic substrates and support members
US7615871B2 (en) 2002-04-04 2009-11-10 Micron Technology, Inc. Method and apparatus for attaching microelectronic substrates and support members
US20060040422A1 (en) * 2002-08-08 2006-02-23 Micron Technology, Inc. Microelectronic devices and methods for manufacturing and operating packaged microelectronic device
US8637973B2 (en) 2002-08-08 2014-01-28 Micron Technology, Inc. Packaged microelectronic components with terminals exposed through encapsulant
US7306974B2 (en) 2002-08-08 2007-12-11 Micron Technology, Inc. Microelectronic devices and methods for manufacturing and operating packaged microelectronic device assemblies
US20080067642A1 (en) * 2002-08-08 2008-03-20 Micron Technology, Inc. Packaged microelectronic components
US7195957B2 (en) 2002-08-08 2007-03-27 Micron Technology, Inc. Packaged microelectronic components
US7067905B2 (en) 2002-08-08 2006-06-27 Micron Technology, Inc. Packaged microelectronic devices including first and second casings
US20040026773A1 (en) * 2002-08-08 2004-02-12 Koon Eng Meow Packaged microelectronic components
US6836009B2 (en) 2002-08-08 2004-12-28 Micron Technology, Inc. Packaged microelectronic components
US9418872B2 (en) 2002-08-08 2016-08-16 Micron Technology, Inc. Packaged microelectronic components
US20040031621A1 (en) * 2002-08-19 2004-02-19 Heng Puah Kia Packaged microelectronic component assemblies
US6933170B2 (en) 2002-08-19 2005-08-23 Micron Technology, Inc. Packaged microelectronic component assemblies
US6781066B2 (en) 2002-08-19 2004-08-24 Micron Technology, Inc. Packaged microelectronic component assemblies
US20040038447A1 (en) * 2002-08-21 2004-02-26 Corisis David J Packaged microelectronic devices and methods for assembling microelectronic devices
US6740546B2 (en) 2002-08-21 2004-05-25 Micron Technology, Inc. Packaged microelectronic devices and methods for assembling microelectronic devices
US6924550B2 (en) 2002-08-21 2005-08-02 Micron Technology, Inc. Packaged microelectronic devices and methods for assembling microelectronic devices
US6951982B2 (en) 2002-11-22 2005-10-04 Micron Technology, Inc. Packaged microelectronic component assemblies
US6879050B2 (en) 2003-02-11 2005-04-12 Micron Technology, Inc. Packaged microelectronic devices and methods for packaging microelectronic devices
US20040155331A1 (en) * 2003-02-11 2004-08-12 Blaine Thurgood Packaged microelectronic devices and methods for packaging microelectronic devices
US7691680B2 (en) 2003-03-04 2010-04-06 Micron Technologies, Inc. Method of fabricating microelectronic component assemblies employing lead frames having reduced-thickness inner lengths
US7057281B2 (en) 2003-03-04 2006-06-06 Micron Technology Inc. Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths
US7425470B2 (en) 2003-03-04 2008-09-16 Micron Technology, Inc. Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths
US6921860B2 (en) 2003-03-18 2005-07-26 Micron Technology, Inc. Microelectronic component assemblies having exposed contacts
US7259451B2 (en) 2003-08-29 2007-08-21 Micron Technology, Inc. Invertible microfeature device packages
US20060035503A1 (en) * 2003-08-29 2006-02-16 Seng Eric T S Invertible microfeature device packages and associated methods
US7368810B2 (en) 2003-08-29 2008-05-06 Micron Technology, Inc. Invertible microfeature device packages
US7218001B2 (en) 2003-10-31 2007-05-15 Micron Technology, Inc. Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components
US7691726B2 (en) 2003-10-31 2010-04-06 Micron Technology, Inc. Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components
US7250328B2 (en) 2004-07-23 2007-07-31 Micron Technology, Inc. Microelectronic component assemblies with recessed wire bonds and methods of making same
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US20060208366A1 (en) * 2004-07-23 2006-09-21 Micron Technology, Inc. Microelectronic component assemblies with recessed wire bonds and methods of making same
US7157310B2 (en) 2004-09-01 2007-01-02 Micron Technology, Inc. Methods for packaging microfeature devices and microfeature devices formed by such methods
US7579684B2 (en) 2004-09-01 2009-08-25 Micron Technology, Inc. Methods for packing microfeature devices and microfeature devices formed by such methods
US20060189036A1 (en) * 2005-02-08 2006-08-24 Micron Technology, Inc. Methods and systems for adhering microfeature workpieces to support members
US9064973B2 (en) 2005-02-08 2015-06-23 Micron Technology, Inc. Die attached to a support member by a plurality of adhesive members
US20060261498A1 (en) * 2005-05-17 2006-11-23 Micron Technology, Inc. Methods and apparatuses for encapsulating microelectronic devices
US20070045875A1 (en) * 2005-08-30 2007-03-01 Micron Technology, Inc. Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods
US20100327462A1 (en) * 2005-08-30 2010-12-30 Micron Technology, Inc. Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods
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US7745944B2 (en) 2005-08-31 2010-06-29 Micron Technology, Inc. Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts
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US20100276814A1 (en) * 2005-12-29 2010-11-04 Micron Technology, Inc. Methods for packaging microelectronic devices and microelectronic devices formed using such methods
US8772947B2 (en) 2005-12-29 2014-07-08 Micron Technology, Inc. Methods for packaging microelectronic devices and microelectronic devices formed using such methods
US8203213B2 (en) 2005-12-29 2012-06-19 Micron Technology, Inc. Methods for packaging microelectronic devices and microelectronic devices formed using such methods
US7671459B2 (en) 2006-02-08 2010-03-02 Micron Technologies, Inc. Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
US20070181989A1 (en) * 2006-02-08 2007-08-09 Micron Technology, Inc. Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
US9362141B2 (en) 2006-02-28 2016-06-07 Micron Technology, Inc. Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
US9768121B2 (en) 2006-02-28 2017-09-19 Micron Technology, Inc. Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
US20100117212A1 (en) * 2006-02-28 2010-05-13 Micron Technology, Inc. Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
US8450839B2 (en) 2006-02-28 2013-05-28 Micron Technology, Inc. Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
US10211114B2 (en) 2006-02-28 2019-02-19 Micron Technology, Inc. Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
US8202754B2 (en) 2006-03-29 2012-06-19 Micron Technology, Inc. Packaged microelectronic devices recessed in support member cavities, and associated methods
US8441132B2 (en) 2006-03-29 2013-05-14 Micron Technology, Inc. Packaged microelectronic devices recessed in support member cavities, and associated methods
US8975745B2 (en) 2006-03-29 2015-03-10 Micron Technology, Inc. Packaged microelectronic devices recessed in support member cavities, and associated methods
US8138613B2 (en) 2006-05-12 2012-03-20 Micron Technology, Inc. Microelectronic devices
US7910385B2 (en) 2006-05-12 2011-03-22 Micron Technology, Inc. Method of fabricating microelectronic devices
US7833456B2 (en) 2007-02-23 2010-11-16 Micron Technology, Inc. Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece
US20080206930A1 (en) * 2007-02-23 2008-08-28 Micron Technology, Inc. Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece
US8866272B2 (en) 2007-03-13 2014-10-21 Micron Technology, Inc. Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
US7955898B2 (en) 2007-03-13 2011-06-07 Micron Technology, Inc. Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
US10163826B2 (en) 2007-03-13 2018-12-25 Micron Technology, Inc. Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
US20080224329A1 (en) * 2007-03-13 2008-09-18 Micron Technology, Inc. Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
US10692827B2 (en) 2007-03-13 2020-06-23 Micron Technology, Inc. Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

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