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USD1096675S1 - Rotor for semiconductor manufacturing device - Google Patents

Rotor for semiconductor manufacturing device

Info

Publication number
USD1096675S1
USD1096675S1 US29/861,722 US202229861722F USD1096675S US D1096675 S1 USD1096675 S1 US D1096675S1 US 202229861722 F US202229861722 F US 202229861722F US D1096675 S USD1096675 S US D1096675S
Authority
US
United States
Prior art keywords
rotor
semiconductor manufacturing
manufacturing device
view
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/861,722
Inventor
Chang Min KWON
Chang Kyo Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AP Systems Inc
Original Assignee
AP Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AP Systems Inc filed Critical AP Systems Inc
Assigned to AP SYSTEMS INC. reassignment AP SYSTEMS INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KIM, CHANG KYO, KWON, CHANG MIN
Application granted granted Critical
Publication of USD1096675S1 publication Critical patent/USD1096675S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a perspective view of a rotor for semiconductor manufacturing device, showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a top plan view thereof; and,
FIG. 4 is a bottom plan view thereof.
All sides not shown form no part of the claimed design. The broken lines form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a rotor for semiconductor manufacturing device as shown and described.
US29/861,722 2022-06-03 2022-12-01 Rotor for semiconductor manufacturing device Active USD1096675S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR30-2022-0022233 2022-06-03
KR20220022233 2022-06-03

Publications (1)

Publication Number Publication Date
USD1096675S1 true USD1096675S1 (en) 2025-10-07

Family

ID=97228725

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/861,722 Active USD1096675S1 (en) 2022-06-03 2022-12-01 Rotor for semiconductor manufacturing device

Country Status (1)

Country Link
US (1) USD1096675S1 (en)

Citations (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5174045A (en) * 1991-05-17 1992-12-29 Semitool, Inc. Semiconductor processor with extendible receiver for handling multiple discrete wafers without wafer carriers
US5672212A (en) * 1994-07-01 1997-09-30 Texas Instruments Incorporated Rotational megasonic cleaner/etcher for wafers
US5784797A (en) * 1994-04-28 1998-07-28 Semitool, Inc. Carrierless centrifugal semiconductor processing system
US6370791B1 (en) * 2000-03-10 2002-04-16 Semitool, Inc. Processing machine with lockdown rotor
US20020170571A1 (en) * 2001-05-21 2002-11-21 Koji Egashira Rotary substrate processing apparatus and method
US6568412B2 (en) * 2000-02-28 2003-05-27 Tokyo Electron Limited Rotary processing apparatus with holding bars having drain grooves
US20040077167A1 (en) * 2002-10-11 2004-04-22 Willis George D. Retaining ring for use on a carrier of a polishing apparatus
US7029386B2 (en) * 2004-06-10 2006-04-18 R & B Plastics, Inc. Retaining ring assembly for use in chemical mechanical polishing
US7608163B2 (en) * 2002-06-04 2009-10-27 Tokyo Electron Limited Substrate processing apparatus and method
US20110065368A1 (en) * 2009-09-16 2011-03-17 SPM Technology, Inc. Retaining ring for chemical mechanical polishing
USD638951S1 (en) * 2009-11-13 2011-05-31 3M Innovative Properties Company Sample processing disk cover
US8267831B1 (en) * 2009-05-19 2012-09-18 Western Digital Technologies, Inc. Method and apparatus for washing, etching, rinsing, and plating substrates
US8298046B2 (en) * 2009-10-21 2012-10-30 SPM Technology, Inc. Retaining rings
US20120309276A1 (en) * 2011-05-31 2012-12-06 Kim Choon-Goang Retainer rings of chemical mechanical polishing apparatus and methods of manufacturing the same
USD703160S1 (en) * 2011-01-27 2014-04-22 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD793976S1 (en) * 2013-05-15 2017-08-08 Ebara Corporation Substrate retaining ring
USD794585S1 (en) * 2015-10-06 2017-08-15 Ebara Corporation Retainer ring for substrate
USD799437S1 (en) * 2015-08-25 2017-10-10 Ebara Corporation Substrate retaining ring
US20180264621A1 (en) * 2014-12-08 2018-09-20 Hyun Jeong Yoo Retainer ring for carrier head for chemical polishing apparatus and carrier head comprising same
USD836573S1 (en) * 2017-01-31 2018-12-25 Hitachi High-Technologies Corporation Ring for a plasma processing apparatus
USD940670S1 (en) * 2019-09-26 2022-01-11 Willbe S&T Co., Ltd. Retainer ring for chemical mechanical polishing device
USD981459S1 (en) * 2021-06-16 2023-03-21 Ebara Corporation Retaining ring for substrate
US11742711B1 (en) * 2019-11-19 2023-08-29 United States Of America As Represented By The Secretary Of The Air Force Rotor for a high speed electrical machine
USD1040304S1 (en) * 2018-12-17 2024-08-27 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
USD1052546S1 (en) * 2020-12-10 2024-11-26 Nuflare Technology, Inc. Cover ring of top plate for semiconductor manufacturing apparatus
USD1062662S1 (en) * 2023-03-30 2025-02-18 Samsung Electronics Co., Ltd. CMP (chemical mechanical planarization) retaining ring
USD1063595S1 (en) * 2023-03-30 2025-02-25 Samsung Electronics Co., Ltd. CMP (chemical mechanical planarization) retaining ring

Patent Citations (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5174045A (en) * 1991-05-17 1992-12-29 Semitool, Inc. Semiconductor processor with extendible receiver for handling multiple discrete wafers without wafer carriers
US5784797A (en) * 1994-04-28 1998-07-28 Semitool, Inc. Carrierless centrifugal semiconductor processing system
US5672212A (en) * 1994-07-01 1997-09-30 Texas Instruments Incorporated Rotational megasonic cleaner/etcher for wafers
US6568412B2 (en) * 2000-02-28 2003-05-27 Tokyo Electron Limited Rotary processing apparatus with holding bars having drain grooves
US6370791B1 (en) * 2000-03-10 2002-04-16 Semitool, Inc. Processing machine with lockdown rotor
US20020170571A1 (en) * 2001-05-21 2002-11-21 Koji Egashira Rotary substrate processing apparatus and method
US7608163B2 (en) * 2002-06-04 2009-10-27 Tokyo Electron Limited Substrate processing apparatus and method
US20040077167A1 (en) * 2002-10-11 2004-04-22 Willis George D. Retaining ring for use on a carrier of a polishing apparatus
US7029386B2 (en) * 2004-06-10 2006-04-18 R & B Plastics, Inc. Retaining ring assembly for use in chemical mechanical polishing
US8267831B1 (en) * 2009-05-19 2012-09-18 Western Digital Technologies, Inc. Method and apparatus for washing, etching, rinsing, and plating substrates
US20110065368A1 (en) * 2009-09-16 2011-03-17 SPM Technology, Inc. Retaining ring for chemical mechanical polishing
US8298046B2 (en) * 2009-10-21 2012-10-30 SPM Technology, Inc. Retaining rings
USD638951S1 (en) * 2009-11-13 2011-05-31 3M Innovative Properties Company Sample processing disk cover
USD703160S1 (en) * 2011-01-27 2014-04-22 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
US20120309276A1 (en) * 2011-05-31 2012-12-06 Kim Choon-Goang Retainer rings of chemical mechanical polishing apparatus and methods of manufacturing the same
USD793976S1 (en) * 2013-05-15 2017-08-08 Ebara Corporation Substrate retaining ring
US20180264621A1 (en) * 2014-12-08 2018-09-20 Hyun Jeong Yoo Retainer ring for carrier head for chemical polishing apparatus and carrier head comprising same
USD799437S1 (en) * 2015-08-25 2017-10-10 Ebara Corporation Substrate retaining ring
USD794585S1 (en) * 2015-10-06 2017-08-15 Ebara Corporation Retainer ring for substrate
USD836573S1 (en) * 2017-01-31 2018-12-25 Hitachi High-Technologies Corporation Ring for a plasma processing apparatus
USD1040304S1 (en) * 2018-12-17 2024-08-27 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
USD940670S1 (en) * 2019-09-26 2022-01-11 Willbe S&T Co., Ltd. Retainer ring for chemical mechanical polishing device
US11742711B1 (en) * 2019-11-19 2023-08-29 United States Of America As Represented By The Secretary Of The Air Force Rotor for a high speed electrical machine
USD1052546S1 (en) * 2020-12-10 2024-11-26 Nuflare Technology, Inc. Cover ring of top plate for semiconductor manufacturing apparatus
USD981459S1 (en) * 2021-06-16 2023-03-21 Ebara Corporation Retaining ring for substrate
USD1062662S1 (en) * 2023-03-30 2025-02-18 Samsung Electronics Co., Ltd. CMP (chemical mechanical planarization) retaining ring
USD1063595S1 (en) * 2023-03-30 2025-02-25 Samsung Electronics Co., Ltd. CMP (chemical mechanical planarization) retaining ring

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