[go: up one dir, main page]

US7740797B2 - Photo-shaping method, photo-shaping system, and photo-shaping program - Google Patents

Photo-shaping method, photo-shaping system, and photo-shaping program Download PDF

Info

Publication number
US7740797B2
US7740797B2 US11/577,933 US57793305A US7740797B2 US 7740797 B2 US7740797 B2 US 7740797B2 US 57793305 A US57793305 A US 57793305A US 7740797 B2 US7740797 B2 US 7740797B2
Authority
US
United States
Prior art keywords
path
photo
data
removal
shaping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active, expires
Application number
US11/577,933
Other languages
English (en)
Other versions
US20080286139A1 (en
Inventor
Satoshi Abe
Hirokazu Shinkai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Panasonic Electric Works Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Electric Works Co Ltd filed Critical Panasonic Electric Works Co Ltd
Assigned to MATSUSHITA ELECTRIC WORKS, LTD. reassignment MATSUSHITA ELECTRIC WORKS, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ABE, SATOSHI, SHINKAI, HIROKAZU
Publication of US20080286139A1 publication Critical patent/US20080286139A1/en
Assigned to PANASONIC ELECTRIC WORKS CO., LTD. reassignment PANASONIC ELECTRIC WORKS CO., LTD. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: MATSUSHITA ELECTRIC WORKS, LTD.
Application granted granted Critical
Publication of US7740797B2 publication Critical patent/US7740797B2/en
Active legal-status Critical Current
Adjusted expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12—Both compacting and sintering
    • B22F3/16—Both compacting and sintering in successive or repeated steps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/141—Processes of additive manufacturing using only solid materials
    • B29C64/153—Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/20—Direct sintering or melting
    • B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/50—Treatment of workpieces or articles during build-up, e.g. treatments applied to fused layers during build-up
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/80—Data acquisition or data processing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10—Sintering only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C2037/90—Measuring, controlling or regulating
    • B29C2037/903—Measuring, controlling or regulating by means of a computer
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/49—Nc machine tool, till multiple
    • G05B2219/49018—Laser sintering of powder in layers, selective laser sintering SLS
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/25—Process efficiency

Definitions

  • the present invention relates to a photo-shaping technique of manufacturing a three-dimensional object from powder material, and more particularly to a photo-shaping method of obtaining a target three-dimensional object by removing an outer face of a three-dimensional object presently formed during repetition of forming sintered layers by irradiating a light beam onto a specified position of a powder material layer to sinter the powder layer, and to a photo-shaping system and a photo-shaping program for implementing the photo-shaping method.
  • a conventional photo-shaping method is disclosed in Japanese Patent Application Laid-Open Publication No. 2002-115004 (patent document 1).
  • a light beam is irradiated onto a specified position of a powder material layer to sinter (including a case of once melt) a corresponding portion of the powder material layer to form a sintered layer.
  • the sintered layer is then covered with a new powder material layer, and a light beam irradiated onto a specified position thereof to sinter a corresponding portion of the new powder material layer, thereby forming a new sintered layer integrally united with the underlying sintered layer. While repeating this process of forming the sintered layers, the outer face of a formed body obtained by laminating the sintered layers is subject to removal process during repetitive steps of forming the sintered layers.
  • the processing path used in the removing process i.e., second path
  • the processing path used in the removing process can be obtained by sequentially specifying a processing range in a height (vertical) direction even in the conventional CAD.
  • the number of divisions increases in the height direction, it takes much labor and time, and operator's errors are likely to occur.
  • the second path is calculated by such number of times in setting and entering the height range, this leads operator's labor to be excessive, and errors are likely to occur.
  • a program must be generated by arranging such number of second paths in the order of processing, and must be transferred to the removal processing means, and this job also takes much time and labor when manually done.
  • the present invention has been made and an object thereof is to provide a photo-shaping method, a photo-shaping system, and a photo-shaping program capable of performing photo-shaping efficiently including removing process during repetitive steps of laminating sintered layers.
  • the invention provides a photo-shaping method which includes a process of photo-shaping a target object executed by a photo-shaping machine along with a computing process executed by a computing device, said photo-shaping process including a step of irradiating a light beam to a specified position of a powder material layer to sinter a desired part of the powder material to form a sintered layer, covering the sintered layer with a new powder material layer, irradiating a light beam to a specified position of the new powder material layer to sinter a desired part of the new powder material powder to form a new sintered layer integral with the underlying sintered layer, repeating the process of forming the sintered layers in lamination, and including a step of removing an outer face of a formed body of the sintered layers in lamination during the repetitive forming process of the sintered layers.
  • the method is characterized in that the computing process executed by the computing device comprises the steps of: storing first parameter data of various parameters in the first parameter database for the light irradiation process in the photo-shaping process; storing second parameter data of various parameters in the first parameter database for the removal process; generating a first path as a light beam irradiation path for the light irradiation process, on the basis of contour data of each section sliced at a specified pitch of three-dimensional CAD model data of the target object desired to be formed, and the first parameter data stored in the first parameter database; generating a second path as a removal processing path for the removal process, on the basis of the three-dimensional CAD model data, the second parameter data stored in the second parameter database, and removing timing data showing a timing of executing the removal process; generating driving programs for driving the photo-shaping machine for executing the photo-shaping process including the light beam irradiation and the removal processes, on the basis of the first path data, second path data and removing timing data,
  • the invention further provides a photo-shaping system which includes a photo-shaping machine for photo-shaping a target object along with a computing device, said photo-shaping machine having a light irradiation means irradiating a light beam to a specified position of a powder material layer to sinter a desired part of the powder material to form a sintered layer, covering the sintered layer with a new powder material layer, irradiating a light beam to a specified position of the new powder material layer to sinter a desired part of the new powder material powder to form a new sintered layer integral with the underlying sintered layer, repeating the process of forming the sintered layers in lamination, and having a removal processing means removing an outer face of a formed body of the sintered layers in lamination during the repetitive forming process of the sintered layers.
  • the system is characterized in that said computing device comprises: a first parameter database storing various parameters for use in the photo-shaping process executed by the light irradiation means; a second parameter database storing various parameters for use in the removal process executed by the removal processing means; first path generating means for generating a first path as a light beam irradiation path for the light irradiation means, on the basis of contour data of each section sliced at a specified pitch of three-dimensional CAD model data of the target object desired to be formed, and the parameter data stored in the first parameter database; second path generating means for generating a second path as a removal processing path for the removal processing means, on the basis of the three-dimensional CAD model data, parameter data stored in the second parameter database, and removing timing data showing a timing of executing the removal process; driving program generating means for generating driving programs for driving the photo-shaping machine and the removal processing means, on the basis of the first path data, second path data and removing timing data, whereby the photo-shaping
  • the second path generating means may determine a removing tool to be used in the removal processing means on the basis of the three-dimensional CAD model data and parameter data in the second parameter database. Therefore, removing process can be performed by using a proper tool suited to the model shape.
  • the second path generating means preferably, generates removing timing data on the basis of the three-dimensional CAD model data and parameter data in the second parameter database, and the parameter data referred to in this generation contains data relating to downward overlapping amount of depth of cutting. Therefore, appropriate removing timing can be set automatically according to the tool shape, and as compared with the case of removing always at the same removing timing, the number of times of removing can be decreased making efficient use of a length of cutting teeth of the tool, the number of times of exchange of tools can be decreased, and the overlap amount is decreased, and wasteful passes are saved, and the processing time can be shortened.
  • the second path generating means divides the second path generated on the entire object model, in the height direction at removing timing, the time-consuming recognition process of model shape is required only once, and the computing processing time can be shortened.
  • the second path generating means generates an aerial route path consecutively connecting adjacent second paths, and also generates an aerial route path by ignoring the shape above the object range of the second path being generated.
  • wasteful interference check can be omitted, and the computing processing time can be further shortened.
  • the second path generating means may divide the three-dimensional CAD model in height direction according to predetermined removing timing data, and generate a second path on the basis of the divided model shapes, and parameter data in the second parameter database containing various parameters for removing process.
  • an optimum removing tool can be used for each divided model, and wasteless second paths can be obtained.
  • the second path generating means may make a model of excess hardened portion generated when forming, and determine the obtained excess hardened model as removing range, and generate a second path on this removing range. Thus, more efficient second paths can be obtained.
  • the second path generating means may determine the removing range in a region between the lowest contour of the range specified by removing timing, and offset contour being offset from this contour to outer side by a specified amount, and generate a second path on this removing range. In this case, more efficient second paths can be obtained.
  • the second path generating means generates a second path in each region not consecutive among divided models, and generates an aerial route path linking these second paths, it is easy to recognize a portion of so-called island, and wasteless aerial route paths can be obtained.
  • the second path generating means determines a contact start position with the model depending on the tool shape contained in the second parameter database in the removal processing means as cutting means, and generates a second path on the basis of this position. Second paths can be obtained with almost no miss-hitting, and the removing time can be shortened.
  • the invention further provides a photo-shaping program of creating driving programs executed by a computer for executing a process of photo-shaping a target object executed by a photo-shaping machine along with a computing process, said photo-shaping process including a step of irradiating a light beam to a specified position of a powder material layer to sinter a desired part of the powder material to form a sintered layer, covering the sintered layer with a new powder material layer, irradiating a light beam to a specified position of the new powder material layer to sinter a desired part of the new powder material powder to form a new sintered layer integral with the underlying sintered layer, repeating the process of forming the sintered layers in lamination, and including a step of removing an outer face of a formed body of the sintered layers in lamination during the repetitive forming process of the sintered layers.
  • the program is characterized in that the computing process executed by the computer comprises the steps of: storing first parameter data of various parameters in the first parameter database for the light irradiation process; storing second parameter data of various parameters in the first parameter database for the removal process; generating a first path as a light beam irradiation path for the light irradiation process, on the basis of contour data of each section sliced at a specified pitch of three-dimensional CAD model data of the target object desired to be formed, and the first parameter data stored in the first parameter database; generating a second path as a removal processing path for the removal process, on the basis of the three-dimensional CAD model data, the second parameter data stored in the second parameter database, and removing timing data showing a timing of executing the removal process; generating driving programs for driving the photo-shaping machine for executing the photo-shaping process including the light beam irradiation and the removal processes, on the basis of the first path data, second path data and removing timing data, thereby performing the photo-shaping and
  • the first path and second path can be obtained from the parameter data stored in the first parameter database containing various parameters for photo-shaping, parameter data stored in the second parameter database containing various parameters for removal process, removing timing data, and model data, and capable of obtaining driving programs for executing these first path and second path sequentially.
  • operator's labor and time of executing processes of photo-shaping can be substantially saved, and processes of photo-shaping can be executed efficiently by executing the removal process during repetitive steps of laminating sintered layers.
  • FIGS. 1A , 1 B are block diagrams showing an embodiment of a photo-shaping system according to the invention.
  • FIGS. 2A , 2 B are explanatory diagrams of parameter data contained in a first parameter database.
  • FIGS. 3A , 3 B are explanatory diagrams of parameter data contained in a second parameter database.
  • FIGS. 4A , 4 B are explanatory diagrams of model data to be taken in.
  • FIG. 5 is an explanatory diagram of a first path.
  • FIGS. 6A , 6 B are explanatory diagrams of other example of parameter data contained in the second parameter database.
  • FIG. 7 is a flowchart showing an interference check.
  • FIG. 8 is a side view showing an excess hardened portion and a tool.
  • FIG. 9 is an explanatory diagram of division of a second path.
  • FIGS. 10A , 10 B are explanatory diagrams showing an aerial route path, where 10 A being a side view and 10 B being a plan view.
  • FIG. 11 is a flowchart showing a second path generating process accompanied by dividing process.
  • FIG. 12 is an explanatory diagram of model division.
  • FIG. 13 is a flowchart showing another example of the second path generating process accompanied by dividing process.
  • FIG. 14A is a perspective view of an example of model
  • 14 B is an explanatory diagram of divided model with overlap.
  • FIG. 15A is a side view of an example of model
  • 15 B is a side view of manufacturing intermediate state of the same model
  • 15 C is a side view of a model of an excess hardened portion.
  • FIG. 16 is an explanatory diagram showing making procedure of a model of an excess hardened portion.
  • FIG. 17 is an explanatory diagram showing another example of determination of generating a range of a second path.
  • FIG. 18 is an explanatory diagram showing a reference range for interference check.
  • FIG. 19A is a side view showing a problem when using a ball end mill as a tool
  • 19 B is a magnified side view showing solving means of the problem.
  • FIG. 20A is a cut-away perspective view of an example of a photo-shaping machine, and 20 B is a partial perspective view thereof.
  • FIGS. 20A and 20B show an example of a photo-shaping system according to the present invention which mainly includes a photo-shaping machine 10 , a computing device 1 and a CAD (computer aided design) portion, together with other peripheral devices.
  • the photo-shaping machine 10 per se is similar to that disclosed in Patent document 1. More specifically, the photo-shaping machine 10 includes powder layer forming means 6 , light beam irradiating means 7 , removal processing means 8 , and a chamber 28 which incorporates the powder layer forming means 6 , removal processing means 8 and others in its inside.
  • the powder layer forming means 6 feeds metal powder from a powder tank 63 onto a stage 60 which is driven up and down by moving a cylinder within a space surrounded on the outer circumference.
  • the supplied metal powder is uniformly layered by a squeezing blade 61 to form a powder layer F having a specified thickness on the stage 60 .
  • the light beam irradiating means 7 irradiates laser beams emitted from a laser oscillator 70 to the powder layer F by way of a scanning optical system composed of a beam shape correcting portion 75 , a galvano-mirror 71 and the like.
  • the light beam irradiating means 7 is disposed outside the chamber 28 , and the light beam from the light beam irradiating means 7 is irradiated onto the powder layer F through a light permeable window 29 provided in the chamber 28 .
  • the removal processing means 8 has a milling head 81 provided on an XY drive mechanism 80 above a base portion of the powder layer forming means 6 .
  • Metal powder overflowing from the powder tank 63 is supplied onto the base surface of the stage 60 and is simultaneously leveled uniformly by the blade 61 to form a first layer of the powder layer F.
  • a light beam such as laser beam LB is irradiated onto a desired portion of the powder layer F to be hardened, so that the metal powder is sintered to form a first sintered layer which is integrally united with the base portion.
  • the stage 60 is slightly lowered, and metal powder is newly supplied from the powder tank 63 again and leveled by the blade 61 , so that a second powder layer F is formed on both the first powder layer F and the first sintered layer.
  • a light beam such as laser beam LB is irradiated onto a desired portion of the second powder layer F to be hardened, and the powder is sintered to form a second sintered layer which is integrally united with the underlying first sintered layer.
  • a plurality of sintered layers are stacked up in lamination.
  • the thickness of the laminated sintered layers reaches a predetermined value previously specified in accordance with, e.g., a tool length of the milling head 81 of the removal processing means 8 , the removal processing means 8 is once driven to cut off the surface (i.e., milling the side face) of the formed body stacked up to now, and the outer face thereof is thus subject to removal processing so that the whole surface thereof is finished.
  • substantially spherical iron powder with grain size of 10 to 100 um can be used as the powder, and carbon dioxide laser beam can be used as the light beam, but the invention is not limited to use them.
  • the removal processing means 8 is not limited to use the milling head 81 and other cutting means may be used.
  • the computing device 1 includes a first parameter database 2 containing various parameters for performing photo-shaping, and a second parameter database 3 containing various parameters for removal or cutting process.
  • the computing device 1 further includes a model data take-in unit 11 , a slice processing unit 12 , a first path generating unit 13 for generating a first path P 1 for photo-shaping process, a second path generating unit 14 for generating a second path P 2 for removal or cutting process, and further includes a driving program generating unit 15 .
  • the first and second parameter databases ( 2 , 3 ) may be formed as a single database.
  • the computing device 1 including CPU, RAM and ROM is connected, by way of an I/O interface 101 , to a storage unit 102 , communication units 103 ( 103 ′), a mouse 105 , a keyboard 106 , a display unit 104 , and a controller 107 .
  • the CPU When specified instructions are supplied by manipulating the keyboard and/or the mouse, the CPU reads out a program stored in the ROM or recorded in the storage unit 102 according to the instructions, and loads the program to the RAM to be executed. Alternatively, execution of a program may be also instructed by information received from the communication unit 103 ( 103 ′). Then, the CPU issues the processing result as required and the processing result is displayed on the display unit 104 composed of such as LCD or CRT, or transmitted to a printer (not shown) or transmitted to an outside equipment through the communication unit, or stored in the storage unit 102 .
  • the steps of describing programs for the computing device (computer) 1 to execute various processes are not always required to be processed in time series, and they may be processed in parallel or individually.
  • the computing device 1 is not limited to a single unit, but also plural computing devices may be used to discretely process the programs.
  • the computing device may be located at a remote position and programs may be transferred to such a remote computing device to be executed.
  • the storage unit 102 is not limited to a particularly specified type, and as far as the programs and data to be executed by the CPU can be stored, any type of recording medium or memory device may be used as the storage unit 102 , for example, magnetic disks such as internal hard disk and removable disk, magneto-optical disk, optical disk, nonvolatile memory, EPROM, EEPROM, other semiconductor memory device such as flush memory device, and any other recording medium that can be read by a computer.
  • magnetic disks such as internal hard disk and removable disk, magneto-optical disk, optical disk, nonvolatile memory, EPROM, EEPROM, other semiconductor memory device such as flush memory device, and any other recording medium that can be read by a computer.
  • a computer-readable recording medium recorded with photo-shaping programs of the present invention can develop specific effects of the invention when used along with the computing device 1 capable of reading out the photo-shaping programs from the recording medium to be executed.
  • the model data take-in unit 11 fetches three-dimensional model data from the three-dimensional CAD of a target object to be produced.
  • the slice processing unit 12 slices the model data at a specified pitch to obtain contour data of each section.
  • the first path generating unit 13 generates a first path P 1 for routing the light beam irradiation on the basis of the contour data of each section and parameter data stored in the first parameter database 2 .
  • the second path generating unit 14 generates a second path P 2 for routing the removal process (i.e., milling or cutting process) on the basis of the three-dimensional CAD model data, parameter data stored in the second parameter database 3 , and removing timing data showing a removal processing timing.
  • the driving program generating unit 15 generates a driving program P 3 for driving the photo-shaping machine 10 and removal processing means 8 provided in the photo-shaping machine, on the basis of the above obtained data of the first path P 1 , second path P 2 , and the removing timing data.
  • This means that the model data take-in unit 11 and the various processing units 12 to 15 can be implemented by computer programs (i.e., application software) for executing the operation in the computing device 1 .
  • the first parameter database 2 stores various data of the photo-shaping machine per se as shown in Table of FIG. 2A and various parameters relating to a shaping process as shown in Table of FIG. 2B .
  • the latter data table shown in FIG. 2B includes various data such as light beam irradiation spot diameter, light beam irradiation power, irradiation speed, irradiation pattern (solid painting pattern in section), and irradiation interval, regarding each powder material to be sintered.
  • FIG. 2B shows an example of the latter data table, in which data is described in each sinter powder material and each slice pitch to be mentioned later.
  • the second parameter database 3 stores various data (parameters) relating to the removal processing means 8 for performing milling or cutting process provided in the photo-shaping machine.
  • the database 3 includes a tool master data portion storing data of tool diameters and underhead length of tools (end mills) usable in each work material and tool material, holder diameter, data of types such as a ball type or flat type, or other specification.
  • a cutting condition data portion stores collecting tools usable in each finishing mode, and drive conditions thereof.
  • the model data take-in unit 11 fetches three-dimensional model data of a target object desired to be produced from the three-dimensional CAD as a three-dimensional solid model or surface model (for example, STL model) describing at least face and back attributes of surfaces.
  • a three-dimensional solid model or surface model for example, STL model
  • Expression format of the model data may be specified any of curvature expression such as NURBS, and polygonal approximate expression by triangle or the like.
  • the curvature expression is preferred where curvature precision is demanded in the desired model, and the polygonal approximate expression is preferred where the processing time is more important.
  • model data of rough polygonal approximate precision as shown in FIG. 4A may be used.
  • the precise polygonal approximate model (for example, STL expression) data or curvature display model data as shown in FIG. 4B may be applied. That is, types of the model data may be different between the case when generating the first path P 1 for shaping process and the case when generating the second path P 2 for removal process.
  • systems of coordinates defining the positions thereof should be matched.
  • an offset amount OFST in offset process described in this publication is not limited to a value of a light beam spot diameter, but may be preset to a specified amount. This specified amount is preferably referenced on the value preliminarily described in, e.g., the first parameter database 2 , or may be also a value entered by an operator during the process.
  • the offset process direction is not limited to the inner side of the contour line, but the offset may be shifted to the outer side from the contour line so that a large allowance for removal may be provided in the removing process.
  • the slice pitch may be either entered by the operator, or determined automatically depending on the powder material, model shape, or required precision.
  • the first path generating unit 13 refers to the parameter data stored in the first parameter database 2 , and generates a first path P 1 in each section shape for routing the light beam irradiation on the basis of the contour data of each section.
  • the first path generating step as shown in FIG. 5 , positional coordinates when scanning on the contour of the sliced section M 1 of a model by a light beam LB are described sequentially, and solid painting path coordinates inside the sliced section are described sequentially.
  • the first path P 1 is generated in a format usable as NC data for a NC controlled photo-shaping machine.
  • the spot diameter of the light beam LB, irradiation speed v, irradiation interval p, irradiation power and other irradiation conditions should be described in the data of first path P 1 . Thus, it is not necessary to set these conditions separately when starting the process, and operation errors can be curtailed.
  • the second path generating unit 14 generates a second path P 2 in a format usable as NC data for NC controlled removal processing means, on the basis of the model data and removing timing data given separately.
  • the operator may select from the tools stored in the second parameter database 3 , or the second path generating unit 14 may automatically determine the tool to be used by referring to the model shape as mentioned below.
  • the processing method may include conventional cutting process such as contour line processing, surface copy processing, corner skip processing, and others, although not limited thereto.
  • the second path P 2 is generated for removal process.
  • This process may be realized by an offset method, reverse offset method, and Z_Map method employed in the conventional CAM for cutting process, and others, although not limited thereto.
  • the second path P 2 should be divided in the height direction depending on the value of the removing timing data by referring thereto.
  • the path should be divided at every 5 mm in height direction.
  • the removing timing data may be either specified by the operator, or may be based on a value preset in the second parameter database 3 .
  • the second path generating unit 14 may be constructed to generate the removing timing data on the basis of the model data and second parameter data stored in the second parameter database 3 .
  • the removing timing data may be selected automatically depending on the tool to be used. In this case, the division method is described later.
  • the driving program generating unit 15 When the first path P 1 is generated by the first path generating unit 13 and the second path P 2 is generated by the second path generating unit 14 , the driving program generating unit 15 generates a driving program P 3 for supervising the first path P 1 , second path P 2 , and removing timing data.
  • the program P 3 is used for driving both the photo-shaping machine 10 and the removal processing means 8 along with the first and second paths P 1 and P 2 as sub-programs. That is, the first path P 1 is used as NC data for photo-shaping machine and the second path P 2 is used as NC data for removal processing means.
  • the driving program P 3 , first path P 1 and second path P 2 are transferred to the controller 107 for controlling the operations of the photo-shaping machine and its removal processing means.
  • the program P 3 fetches the necessary first path P 1 and second path P 2 sequentially, so that the photo-shaping machine and its removal processing means are driven.
  • the photo-shaping machine and its removal processing means execute a photo-shaping process by irradiating a light beam according to the first path P 1 , thereby forming the sintered layers to be laminated, and then the removal processing means is operated according to the second path P 2 for executing removal process every timing specified by the removing timing data.
  • a target object of a photo-shaping product is manufactured by repeating the above processes.
  • data for selecting a proper tool depending on the undulation, curvature rate, horizontality or verticality of the surface of the object to be cut off is recorded in the second parameter database 3 as shown in Table of FIG. 6A , or data of priority of tools where plural tools can be used is recorded as shown in Table of FIG. 6B .
  • Step S 3 information of a surface shape and information of a vicinal interference surface area are acquired from the model data (Step S 3 ), and the tool is selected based on the data depending on the surface shape (Steps S 4 , S 5 ), and interference with vicinal surface is checked (Step S 6 ), and if interference is detected, a tool of lower priority (usually a tool of smaller diameter) is selected.
  • Automatic selection of a removing tool is a conventional technique and not new, but in order to execute the removing process in the lamination process of stacking up the sintered layers in the present embodiment, the selection algorithm in the present embodiment is different from the conventional algorithm in the following points. That is, at the time of executing the removing process in the present invention, there exists no more laminated sintered layer at a position higher than the height of the sintered layers presently stacked up to be subject to the removal process. Therefore, a step of “checking for interference of a tool, tool holder or spindle with a formed body to be subject to removal” can be skipped. Whereas, in the conventional method, such a checking step was essential when a finished product is subject to removal process. Accordingly, the tool selection processing time can be remarkably shortened in the present invention.
  • the removing timing data (depth of cut) T may be determined on the basis of underhead length L and end diameter R of a tool 9 as shown in FIG. 8 .
  • the following points should be preferably taken into consideration. That is, at the time of performing photo-shaping process, as shown in FIG.
  • a drooping excess of a sintered portion 50 is formed at the side of the presently laminated and sintered portion 5 , and an overlap amount “ovr” necessary for removing the drooping portion of the excess sintered portion 50 must be included in the second parameter database 3 , in addition to the underhead length L and end diameter R of the tool 9 , and the value subtracting the overlap amount “ovr” and the end diameter R from the underhead length L of the tool 9 .
  • a smaller value than that is set as the removing timing data T.
  • the division process executed depending on the removing timing data T is explained below.
  • the second path P 2 is firstly calculated on the entire model data, and subsequently the second path P 2 for the entire model data is divided according to the removing timing data T.
  • the model data may be first divided in the height direction depending on the removing timing data T, and then individual second paths P 2 may be generated on the basis of the respective divided model data.
  • the second path P 2 of the entire model is first generated, and portions corresponding to each removing height range divided by the removing timing data T are sequentially extracted from the entire second path P 2 , so that the divided second paths P 2 are obtained.
  • the second path P 2 of the entire model can be confirmed, and missing processing step or path can be confirmed.
  • the second path P 2 is extracted after overlapping and setting each removing height range divided by the removing timing data T.
  • a plurality of removal second paths P 2 a , P 2 b , P 2 c are generated for the portions (islands), and simultaneously or after the generation, an aerial route path P 2 ′ is generated for linking these plural second paths P 2 a , P 2 b , so that one second path P 2 is created.
  • the aerial route path P 2 ′ can be calculated easily because, same as in the case of the automatic selection of the tool for removing process mentioned above, nothing is formed above the object portion of the second paths P 2 a, P 2 b , P 2 c to be connected at the moment of removing. Therefore, there is no interfering object above this portion, and it is not practically necessary to calculate the aerial route path P 2 ′ in consideration of interference.
  • the aerial route path P 2 ′ is generated by shifting slightly above the second paths P 2 a, P 2 b , P 2 c so that the tool end may pass slightly above, for example, 0.1 mm to 1 mm higher than the upper side of the object portion of the second paths P 2 a , P 2 b , P 2 c to be connected.
  • FIG. 11 is a flowchart showing the operation of generating the above second path P 2 including the aerial route path P 2 ′.
  • FIG. 13 shows the flowchart in this case.
  • an aerial route path P 2 can be generated as mentioned above.
  • the second paths P 2 are calculated individually for plural pieces of model data, it is preferable that a plurality of second path generating programs are started so that the divided plural model data are transferred to the second path generating programs to be processed in parallel, and thus the computation time can be shortened.
  • an economical second path P 2 can be obtained by using an appropriate tool depending on the divided model shapes.
  • a model of shape (Ma) has a removing surface only on a vertical plane of a side, and a flat end mill of large diameter is selected as a tool, and processing by a great depth of cut is realized, and as for models of shape (Mb), (Mc), (Md) and (Me) in FIG. 12 , having curvature and slope, ball end mills may be selected as a tool to finish the surface smoothly.
  • models of shape (Mc) and (Me) in FIG. 12 since there is no stepped portion, ball end mills of large diameter as a tool can be used to process promptly.
  • models of shape (Mb) and (Md) in FIG. 12 since there are stepped portions, and ball end mills of small diameter as a tool are selected to process the stepped portions efficiently.
  • the removing pass P 2 when generating the removing pass P 2 based on the divided models, it is easy to solve the following problems in the case of generating the second path P 2 overlapped to the lower side. That is, as shown in FIG. 15 A, in the case of a model in a shape having a moderate slope portion, the portion shown in FIG. 15B is subject to removal, and a sintered layer is laminated thereon. Thereafter, when removing next time, in the above calculation of the second path P 2 , since the entire region of moderate slope portion is in the range of the overlap amount “ovr”, the second path P 2 is set in this entire region. Indeed, however, the drooping excess hardened portion 50 only overlaps with a part of the moderate slope portion as shown in FIG.
  • the other portion is the portion being cut off by the preceding removing process, and excess hardened portion 50 does not exist.
  • this portion does not require another removing process, and if the second path P 2 is generated from the divided model extended to the lower side merely by the overlap amount “ovr”, the second path P 2 is generated while consuming wasteful time.
  • the model of excess hardened portion 50 at this time is obtained, as shown in FIG. 16 .
  • this model is the model segmented by the removing timing data T combined with the model of the lower layer side) from the region enclosed by them.
  • offset amounts ⁇ , ⁇ and the downward extending amount are preliminarily determined depending on the powder material to be used and its sintering condition, and these amount are stored in the second parameter database 3 .
  • the model shape of a lower layer side when determining the second path P 2 on the basis of each model divided according to the removing timing data T, when calculating the second path P 2 , it is preferred to refer to the model shape of a lower layer side further from the calculating range of the second path P 2 determined by the removing timing data T and overlap amount “ovr”, where the model shape of a lower layer side is referred as an interference checking area with the tool.
  • the lower portion 9 b from the removing object range Z is transferred to the second path generating unit 14 as reference region.
  • the range of the model to be referred to may be all model shape lower than the removing object range Z, but it may be the range corresponding to the radius R of the tool 9 in consideration of a speed.
  • the tool 9 to be used is a ball end mill
  • the contacting height of the tool 9 is determined on the basis of the end radius R of the tool 9 stored in the second parameter database 3 and the predicted data of width w of the excess hardened portion 5 , and by starting cutting from this height, processing time loss by failure can be eliminated.
  • the present invention is capable of obtaining the first path and second path from the parameter data stored in the first parameter database containing various parameters for photo-shaping, parameter data stored in the second parameter database containing various parameters for removal process, removing timing data, and model data, and capable of obtaining driving programs for executing these first path and second path sequentially.
  • operator's labor and time of executing processes of photo-shaping can be substantially saved, and processes of photo-shaping can be executed efficiently by executing the removal process during repetitive steps of laminating sintered layers.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Powder Metallurgy (AREA)
US11/577,933 2004-10-26 2005-10-21 Photo-shaping method, photo-shaping system, and photo-shaping program Active 2027-04-03 US7740797B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004311506A JP3687677B1 (ja) 2004-10-26 2004-10-26 光造形方法と光造形システム並びに光造形用プログラム
JPP2004-311506 2004-10-26
PCT/JP2005/019831 WO2006046671A1 (fr) 2004-10-26 2005-10-21 Procede systeme et programme de photo-usinage

Publications (2)

Publication Number Publication Date
US20080286139A1 US20080286139A1 (en) 2008-11-20
US7740797B2 true US7740797B2 (en) 2010-06-22

Family

ID=35004104

Family Applications (1)

Application Number Title Priority Date Filing Date
US11/577,933 Active 2027-04-03 US7740797B2 (en) 2004-10-26 2005-10-21 Photo-shaping method, photo-shaping system, and photo-shaping program

Country Status (6)

Country Link
US (1) US7740797B2 (fr)
EP (1) EP1805003B1 (fr)
JP (1) JP3687677B1 (fr)
KR (1) KR100892353B1 (fr)
CN (1) CN101048273B (fr)
WO (1) WO2006046671A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120016507A1 (en) * 2009-05-20 2012-01-19 Mitsubishi Electric Corporation Processing simulation method and apparatus, and program making computer execute the method
US20150093720A1 (en) * 2012-05-10 2015-04-02 Renishaw Plc Method of manufacturing an article
US9586285B2 (en) 2013-07-10 2017-03-07 Panasonic Intellectual Property Management Co., Ltd. Method and apparatus for manufacturing three-dimensional shaped object
US9604282B2 (en) 2013-07-10 2017-03-28 Panasonic Intellectual Property Management Co., Ltd. Method for manufacturing three-dimensional shaped object
US10383713B2 (en) 2012-05-10 2019-08-20 Renishaw Plc Method of manufacturing an article

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5453022B2 (ja) * 2009-09-01 2014-03-26 株式会社松浦機械製作所 Ｃａｍシステム
GB2489493B (en) * 2011-03-31 2013-03-13 Norsk Titanium Components As Method and arrangement for building metallic objects by solid freeform fabrication
US12397363B2 (en) 2011-03-31 2025-08-26 Norsk Titanium As Method and arrangement for building metallic objects by solid freeform fabrication
US10562132B2 (en) * 2013-04-29 2020-02-18 Nuburu, Inc. Applications, methods and systems for materials processing with visible raman laser
CA2910559C (fr) * 2013-04-29 2021-06-01 Mark S. Zediker Dispositifs, systemes et procedes d'impression tridimensionnelle
JP5840312B1 (ja) * 2015-02-16 2016-01-06 株式会社松浦機械製作所 三次元造形方法
CN110099766B (zh) 2016-12-28 2021-07-13 三菱电机株式会社 层叠造型辅助装置及层叠造型辅助方法
JP6251447B1 (ja) * 2017-08-07 2017-12-20 株式会社松浦機械製作所 三次元造形物の内部空間における切削パスの自動作成方法
CN107457995B (zh) * 2017-09-18 2019-03-26 安阳工学院 基于nurbs曲面描述的五轴联动3d打印方法
US10518356B2 (en) * 2018-02-05 2019-12-31 General Electric Company Methods and apparatus for generating additive manufacturing scan paths using thermal and strain modeling
CN109773186B (zh) * 2019-01-30 2021-07-02 湖南华曙高科技有限责任公司 用于制造三维物体的增材制造方法及其设备、可读存储介质
JP7263838B2 (ja) * 2019-02-27 2023-04-25 セイコーエプソン株式会社 三次元造形物の造形方法
JP2021133633A (ja) * 2020-02-28 2021-09-13 セイコーエプソン株式会社 三次元造形物の製造方法、および三次元造形装置
JP7612008B2 (ja) * 2021-05-07 2025-01-10 三菱電機株式会社 数値制御装置および数値制御方法
DE102022117935A1 (de) * 2021-07-28 2023-02-02 Eos Gmbh Electro Optical Systems Generierung von optimierten Prozessgrößenwerten und Steuerdaten für einen additiven Aufbauprozess
CN116968316B (zh) * 2023-09-22 2024-02-20 易加三维增材技术(杭州)有限公司 模型碰撞检测方法、装置、存储介质和电子设备

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000073108A (ja) 1998-08-26 2000-03-07 Matsushita Electric Works Ltd 金属粉末焼結部品の表面仕上げ方法
US6144008A (en) 1996-11-22 2000-11-07 Rabinovich; Joshua E. Rapid manufacturing system for metal, metal matrix composite materials and ceramics
JP2001277369A (ja) 2000-03-28 2001-10-09 Matsushita Electric Works Ltd 光造形機用データ作成方法及びその装置
US20020041818A1 (en) * 2000-10-05 2002-04-11 Matsushita Electric Works, Ltd. Method of and apparatus for making a three-dimensional object
DE10148967A1 (de) 2000-10-05 2002-04-18 Matsushita Electric Works Ltd Verfahren und Vorrichtung zum Herstellen eines dreidimensionalen Gegenstandes
WO2002094482A1 (fr) 2001-05-21 2002-11-28 [Bu:St] Gmbh Dispositif et procede pour produire une piece a geometrie exacte
WO2003045669A1 (fr) 2001-11-26 2003-06-05 Concept Laser Gmbh Procede de fabrication de pieces a usiner tridimensionnelles dans une unite d'usinage de materiaux au laser ou un systeme de stereolithographie
EP1348506A2 (fr) 2002-03-26 2003-10-01 Matsushita Electric Works, Ltd. Procédé de fabrication d'un article fritté par frittage sélectif au laser
US20040228754A1 (en) 2002-09-30 2004-11-18 Matsushita Electric Works, Ltd. Method of making a three-dimensional sintered product
US20050029711A1 (en) 2002-09-30 2005-02-10 Matsushita Electric Works, Ltd. Method of making three-dimensional object
US20060192322A1 (en) 2003-02-25 2006-08-31 Satoshi Abe Three dimensional structure producing device and producing method
US20060208396A1 (en) 2003-02-25 2006-09-21 Satoshi Abe Three dimensional structure producing method and producing device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5094935A (en) * 1990-06-26 1992-03-10 E. I. Dupont De Nemours And Company Method and apparatus for fabricating three dimensional objects from photoformed precursor sheets
JP2001306341A (ja) * 2000-04-26 2001-11-02 Mitsubishi Electric Corp コンピュータシステムおよびコンピュータ読み取り可能な記録媒体
DE10042360C1 (de) * 2000-08-29 2002-02-28 Epcos Ag Mikrowellen-Bauelement

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6144008A (en) 1996-11-22 2000-11-07 Rabinovich; Joshua E. Rapid manufacturing system for metal, metal matrix composite materials and ceramics
US6459069B1 (en) 1996-11-22 2002-10-01 Joshua E. Rabinovich Rapid manufacturing system for metal, metal matrix composite materials and ceramics
JP2000073108A (ja) 1998-08-26 2000-03-07 Matsushita Electric Works Ltd 金属粉末焼結部品の表面仕上げ方法
JP2001277369A (ja) 2000-03-28 2001-10-09 Matsushita Electric Works Ltd 光造形機用データ作成方法及びその装置
US6657155B2 (en) 2000-10-05 2003-12-02 Matsushita Electric Works, Ltd. Method of and apparatus for making a three-dimensional object
US20020041818A1 (en) * 2000-10-05 2002-04-11 Matsushita Electric Works, Ltd. Method of and apparatus for making a three-dimensional object
DE10148967A1 (de) 2000-10-05 2002-04-18 Matsushita Electric Works Ltd Verfahren und Vorrichtung zum Herstellen eines dreidimensionalen Gegenstandes
JP2002115004A (ja) 2000-10-05 2002-04-19 Matsushita Electric Works Ltd 三次元形状造形物の製造方法及びその装置
US20040155384A1 (en) 2001-05-21 2004-08-12 Tim Sievers Method and apparatus for the production of a work piece of exact geometry
WO2002094482A1 (fr) 2001-05-21 2002-11-28 [Bu:St] Gmbh Dispositif et procede pour produire une piece a geometrie exacte
WO2003045669A1 (fr) 2001-11-26 2003-06-05 Concept Laser Gmbh Procede de fabrication de pieces a usiner tridimensionnelles dans une unite d'usinage de materiaux au laser ou un systeme de stereolithographie
US20040217095A1 (en) 2001-11-26 2004-11-04 Concept Laser Gmbh Method for producing three-dimensional work pieces in a laser material machining unit or a stereolithography unit and unit for performing the method
EP1348506A2 (fr) 2002-03-26 2003-10-01 Matsushita Electric Works, Ltd. Procédé de fabrication d'un article fritté par frittage sélectif au laser
US20030185697A1 (en) 2002-03-26 2003-10-02 Matsushita Electric Works, Ltd. Method of making sintered object
US7172724B2 (en) 2002-03-26 2007-02-06 Matsushita Electric Works, Ltd. Method of making sintered object
US20040228754A1 (en) 2002-09-30 2004-11-18 Matsushita Electric Works, Ltd. Method of making a three-dimensional sintered product
US20050029711A1 (en) 2002-09-30 2005-02-10 Matsushita Electric Works, Ltd. Method of making three-dimensional object
US20060192322A1 (en) 2003-02-25 2006-08-31 Satoshi Abe Three dimensional structure producing device and producing method
US20060208396A1 (en) 2003-02-25 2006-09-21 Satoshi Abe Three dimensional structure producing method and producing device

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
English language Abstract of DE 101 48 967.
English language Abstract of JP 2000-073108, Mar. 2000.
English language Abstract of JP 2001-277369, Oct. 2001.
English language Abstract of JP 2002-115004, Apr. 2002.
U.S. Appl. No. 11/569,261 to Higashi et al., filed Nov. 17, 2006.

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120016507A1 (en) * 2009-05-20 2012-01-19 Mitsubishi Electric Corporation Processing simulation method and apparatus, and program making computer execute the method
US20150093720A1 (en) * 2012-05-10 2015-04-02 Renishaw Plc Method of manufacturing an article
US9918811B2 (en) * 2012-05-10 2018-03-20 Renishaw Plc Method of manufacturing an article
US10383713B2 (en) 2012-05-10 2019-08-20 Renishaw Plc Method of manufacturing an article
US10548696B2 (en) 2012-05-10 2020-02-04 Renishaw Plc Method of manufacturing an article
US11553995B2 (en) 2012-05-10 2023-01-17 Renishaw Plc Method of manufacturing an article
US9586285B2 (en) 2013-07-10 2017-03-07 Panasonic Intellectual Property Management Co., Ltd. Method and apparatus for manufacturing three-dimensional shaped object
US9604282B2 (en) 2013-07-10 2017-03-28 Panasonic Intellectual Property Management Co., Ltd. Method for manufacturing three-dimensional shaped object

Also Published As

Publication number Publication date
JP3687677B1 (ja) 2005-08-24
US20080286139A1 (en) 2008-11-20
JP2006124733A (ja) 2006-05-18
CN101048273A (zh) 2007-10-03
EP1805003A1 (fr) 2007-07-11
KR20070057986A (ko) 2007-06-07
WO2006046671A1 (fr) 2006-05-04
CN101048273B (zh) 2012-01-18
KR100892353B1 (ko) 2009-04-08
EP1805003B1 (fr) 2021-05-26

Similar Documents

Publication Publication Date Title
US7740797B2 (en) Photo-shaping method, photo-shaping system, and photo-shaping program
CN110312588B (zh) 层叠控制装置、层叠控制方法以及存储介质
US10105766B2 (en) System and method for machining blades, blisks and aerofoils
CN113168154A (zh) 评估在套料布置中的工件方位
US20040107019A1 (en) Automated rapid prototyping combining additive and subtractive processes
CN110744354B (zh) 确定增减材复合制造中交替时机的方法
CA2921748C (fr) Generation de trajectoire d'outil informatisee
JP5840312B1 (ja) 三次元造形方法
US20210114112A1 (en) Method for shaping laminated shaped product, device for manufacturing laminated shaped product, and program
JPWO2017110375A1 (ja) 三次元加工装置
CN116786842A (zh) 控制晶体特定取向的3d打印方法、控制系统及其设备
JP6148921B2 (ja) レーザ加工機の自動プログラミング装置
US20230176541A1 (en) Method for determining a tool path and method for material-removing machining of a workpiece and associated machine tool and computer program product
JP2004230431A (ja) 物体加工のための情報処理方法及びプログラム
JP6174208B2 (ja) シム製作方法
JP5986011B2 (ja) シム製作方法
JP5205539B1 (ja) シム製作方法
CN112453513A (zh) 离心压缩机叶轮叶片的加工方法、及叶轮叶片
CN120882524A (zh) 用于针对激光切割方法确定切割间隙宽度的计算机实现的方法
JP7736657B2 (ja) 断面形状データ生成方法及び断面形状データ生成装置
JP7158351B2 (ja) 造形物の製造方法、造形物の製造手順生成装置、及びプログラム
KR101548662B1 (ko) 부재정보 배치영역 선정 시스템 및 방법
JP7213744B2 (ja) ３次元形状加工方法
JP2022099378A (ja) 造形システム及び造形装置、並びに造形方法、並びに造形プログラム
JP2015047683A (ja) 円筒状工具を用いた加工方法

Legal Events

Date Code Title Description
AS Assignment

Owner name: MATSUSHITA ELECTRIC WORKS, LTD., JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ABE, SATOSHI;SHINKAI, HIROKAZU;REEL/FRAME:019210/0695

Effective date: 20070319

Owner name: MATSUSHITA ELECTRIC WORKS, LTD.,JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ABE, SATOSHI;SHINKAI, HIROKAZU;REEL/FRAME:019210/0695

Effective date: 20070319

AS Assignment

Owner name: PANASONIC ELECTRIC WORKS CO., LTD., JAPAN

Free format text: CHANGE OF NAME;ASSIGNOR:MATSUSHITA ELECTRIC WORKS, LTD.;REEL/FRAME:022206/0574

Effective date: 20081001

Owner name: PANASONIC ELECTRIC WORKS CO., LTD.,JAPAN

Free format text: CHANGE OF NAME;ASSIGNOR:MATSUSHITA ELECTRIC WORKS, LTD.;REEL/FRAME:022206/0574

Effective date: 20081001

STCF Information on status: patent grant

Free format text: PATENTED CASE

FEPP Fee payment procedure

Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

FPAY Fee payment

Year of fee payment: 4

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1552)

Year of fee payment: 8

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 12TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1553); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 12