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US5778970A - Heat dissipation apparatus - Google Patents

Heat dissipation apparatus Download PDF

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Publication number
US5778970A
US5778970A US08/718,260 US71826096A US5778970A US 5778970 A US5778970 A US 5778970A US 71826096 A US71826096 A US 71826096A US 5778970 A US5778970 A US 5778970A
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US
United States
Prior art keywords
heat
heat dissipation
dissipation apparatus
base
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US08/718,260
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English (en)
Inventor
Juei-Chi Chang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitac International Corp
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Mitac International Corp
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Filing date
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Assigned to MITAC INTERNATIONAL CORP. reassignment MITAC INTERNATIONAL CORP. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHANG, JUEI-CHI
Application granted granted Critical
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Expired - Lifetime legal-status Critical Current

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    • H10W40/22—
    • H10W40/228—
    • H10W40/43—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00—Heat exchange
    • Y10S165/903—Convection

Definitions

  • the present invention relates to a heat dissipation apparatus, and more specifically, to an apparatus for dissipating heat from a heat source to an external cooling ambient.
  • a semiconductor chip module such as the central processing unit (CPU) of a computer system
  • CPU central processing unit
  • the heat generated per unit area also increases. Since the heat degrades the performance of the semiconductor chip module, the heat dissipation efficiency has become an important issue in the designation of the chip module as well as the computer system which contains the chip module.
  • a traditional heat sink which includes a base 10 and a plurality of fins 20 is in close contact with a semiconductor chip module 1.
  • the base 10 is made of conductive material such as aluminum.
  • a contact surface 12 of the base 10 can be attached to the semiconductor chip module through a silicon rubber pad 2 for conducting the heat away.
  • the fins 20 are also made of conductive material and are arranged over the base 10 for dissipating the heat from the base 10 to the surrounding air.
  • the aforementioned heat dissipation structure has been widely employed in a personal computer system.
  • the CPU in each computer system has the heat sink placed thereon, as shown in FIG. 1.
  • the computer system since the computer system has a case to protect its internal elements, the air convection between the interior and exterior of the computer system is strictly limited. That is, it is difficult to transfer the heat dissipated from the heat sink to the exterior of the computer system. Therefore, the temperature inside the computer system keeps increasing and the heat dissipation efficiency of the heat sink decreases. Thus, the performance of the CPU or other semiconductor chip module is affected.
  • the present innovation provides a heat dissipation apparatus for efficiently removing the heat generated from a heat source to a cooling ambient.
  • the heat dissipation apparatus of the present invention transfers the heat from a semiconductor chip module in a computer system to the surrounding air of the computer system, thereby increasing the heat dissipation efficiency.
  • the heat dissipation apparatus of the present invention includes a base, a plurality of fins, and a heat transfer pipe.
  • the base has a contact surface which can be attached to a heat source to conduct heat away.
  • the fins over the base dissipate the heat from the base to the surrounding air.
  • the heat transfer pipe has a first opening and a second opening. The first opening is adjacent to the fins and the second opening is in a cooling ambient, thereby transferring the heat in the hot air around the fins to the cooling ambient.
  • the heat transfer pipe of the present invention can be connected to the base. Moreover, the present invention can provide a plurality of heat transfer pipes to increase the heat dissipation efficiency.
  • the plurality of heat transfer pipes which can be an assembly, are made of conductive material, such as aluminum.
  • the heat source is a semiconductor chip module, such as a CPU in a computer system
  • the cooling ambient is the air surrounding the computer system.
  • FIG. 1 is a schematic diagram illustrating a conventional heat dissipation structure
  • FIG. 2 illustrates each portion of the heat dissipation apparatus of the present invention including a semiconductor chip module
  • FIG. 3 is a schematic diagram illustrating the heat transfer process in the heat dissipation apparatus of the present invention.
  • FIG. 4 illustrates the heat dissipation effect of a CPU without any heat dissipation apparatus
  • FIG. 5 illustrates the heat dissipation effect of a CPU in accompaniment with a heat transfer pipe which does not contact the CPU;
  • FIG. 6 illustrates the heat dissipation effect of a CPU with a heat transfer pipe which contacts the CPU
  • FIG. 7 illustrates the dissipation effect of a CPU with the heat dissipation apparatus in which the heat transfer pipe does not contact the base;
  • FIG. 8 illustrates the dissipation effect of a CPU with the heat dissipation apparatus in which the heat transfer pipe is connected to the base;
  • FIG. 9 illustrates another embodiment of the present invention.
  • the heat dissipation apparatus includes a base 30, a plurality of fins 40 and at least one heat transfer pipe 50.
  • the heat dissipation apparatus of the present invention is provided for dissipating heat of a heat source, such as a semiconductor chip module 1, to a cooling ambient.
  • a heat source such as a semiconductor chip module 1
  • the semiconductor chip module 1 is a CPU of a computer system and the cooling ambient is the surrounding air of the computer system.
  • the base 30 of the heat dissipation apparatus is made of conductive material, such as aluminum. It includes a contact surface 32 with which the heat dissipation apparatus can be in contact with the CPU 1. Moreover, a silicon rubber pad 2 can be provided between the contact surface 32 and the CPU 1 to improve the contact condition.
  • the fins 40 are also made of conductive material, for example, aluminum. They are arranged over the base 30 to dissipate the heat thereof.
  • the fins 40 and the base 30 can be an assembly. When the CUP operates, the heat generated can be conducted away by means of the base 30 and the fins 40, thus increasing the temperature of the air around the fins 40.
  • the present invention provides the heat transfer pipe 50 between the fins 40 and the cooling ambient.
  • the heat transfer pipe 50 has a first opening 52 and a second opening 54.
  • the first opening 52 is adjacent to the fins and the second opening 54 is in the cooling ambient, that is, the second opening 54 is in the exterior of the computer system. Since the air temperature near the first opening 52 is higher than that near the second opening 54, the hot air surrounding the fins will have convection with the cold air in the exterior of the computer system through the heat transfer pipe 50. Therefore, the heat generated from the CPU can be efficiently removed.
  • the present invention can utilize more than one heat transfer pipe 50 to remove the heat inside the computer system.
  • These heat transfer pipes can be arranged in parallel or in an assembly.
  • the present embodiment has four pipes connected in parallel.
  • these pipes can be made of conductive material, when they contact with the base 30, the heat can be dissipated directly through the pipes by means of conductive transfer. This effect can be enhanced if the heat transfer pipes 50 and the base 30 are made of the same material at the same time.
  • the convection between the hot air near the heat source and the cold air of the cooling ambient is schematically illustrated in FIG. 3.
  • q the heat convection amount per unit time
  • A the convection area
  • r the conductive coefficient
  • ⁇ T the temperature difference between the two openings 52 and 54
  • the temperature of an operating CPU with a heat transfer pipe nearby reaches a saturation value of about 90° C.
  • FIG. 6 illustrates the heat dissipation effect of an operating CPU which is in contact with a heat transfer pipe.
  • the saturation temperature is about 83° C.
  • the heat dissipation apparatus of the present invention is attached to a CPU, but the heat transfer pipe does not contact the base.
  • the heat dissipation effect is illustrated in FIG. 7. As shown in the figure, a saturation temperature of about 82° C. is achieved.
  • the CPU utilizing the heat dissipation apparatus of the present invention has the lowest saturation temperature.
  • the improvement in heat dissipation effect due to the heat transfer pipe is also proved through the experiments.
  • a cover can be provided over the base of the heat dissipation apparatus.
  • the cover 58 is formed over the base 30.
  • the cover 58 includes a pair of plates at opposite sides of the base 30 and a plate over the fins. Therefore, the heat of the fins 40 can be removed by air flow from opening 60 to the cooling ambient through the heat transfer pipes.
  • the cover 58 illustrated in FIG. 9 is separated from the heat transfer pipes 50, it can be an extension portion of the heat transfer pipes 50, thereby collecting most of the heat near the fins 40 and dissipating the heat to the cooling ambient.

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
US08/718,260 1996-07-19 1996-09-20 Heat dissipation apparatus Expired - Lifetime US5778970A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW085211095U TW313277U (en) 1996-07-19 1996-07-19 Transmission interface bridge device
TW85211095 1996-07-19

Publications (1)

Publication Number Publication Date
US5778970A true US5778970A (en) 1998-07-14

Family

ID=21625941

Family Applications (1)

Application Number Title Priority Date Filing Date
US08/718,260 Expired - Lifetime US5778970A (en) 1996-07-19 1996-09-20 Heat dissipation apparatus

Country Status (3)

Country Link
US (1) US5778970A (de)
DE (1) DE29620019U1 (de)
TW (1) TW313277U (de)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6130818A (en) * 1999-05-27 2000-10-10 Hamilton Sundstrand Corporation Electronic assembly with fault tolerant cooling
US7124806B1 (en) 2001-12-10 2006-10-24 Ncr Corp. Heat sink for enhanced heat dissipation
US20090065174A1 (en) * 2007-09-10 2009-03-12 Yu-Jen Lai Heat sink for an electrical device and method of manufacturing the same
US20170049006A1 (en) * 2015-08-14 2017-02-16 Microsoft Technology Licensing, Llc Heat dissipation in electronics
US10297525B2 (en) * 2015-10-30 2019-05-21 Byd Company Limited Base plate for heat sink as well as heat sink and IGBT module having the same
CN113048812A (zh) * 2021-04-25 2021-06-29 珠海格力电器股份有限公司 散热器及制冷设备

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4149218A (en) * 1977-12-30 1979-04-10 International Business Machines Corporation Minimum delay module assembly
US4277816A (en) * 1979-05-29 1981-07-07 International Business Machines Corporation Electronic circuit module cooling
US4296455A (en) * 1979-11-23 1981-10-20 International Business Machines Corporation Slotted heat sinks for high powered air cooled modules
DE3609037A1 (de) * 1985-04-16 1986-10-30 Siemens AG, 1000 Berlin und 8000 München Gehaeuseanordnung fuer belueftete geraete, insbesondere der leistungselektronik
US4674004A (en) * 1986-07-03 1987-06-16 Burroughs Corporation Parallel-flow air system for cooling electronic equipment
JPH0258900A (ja) * 1988-08-25 1990-02-28 Fanuc Ltd 電子機器ユニットの冷却装置
US4953058A (en) * 1989-09-01 1990-08-28 General Dynamics Corporation, Space Systems Div. Modular segment adapted to provide a passively cooled housing for heat generating electronic modules
US5218513A (en) * 1992-08-04 1993-06-08 Digital Equipment Corporation Plenum for air-impingement cooling of electronic components
US5535094A (en) * 1995-04-26 1996-07-09 Intel Corporation Integrated circuit package with an integral heat sink and fan

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4149218A (en) * 1977-12-30 1979-04-10 International Business Machines Corporation Minimum delay module assembly
US4277816A (en) * 1979-05-29 1981-07-07 International Business Machines Corporation Electronic circuit module cooling
US4296455A (en) * 1979-11-23 1981-10-20 International Business Machines Corporation Slotted heat sinks for high powered air cooled modules
DE3609037A1 (de) * 1985-04-16 1986-10-30 Siemens AG, 1000 Berlin und 8000 München Gehaeuseanordnung fuer belueftete geraete, insbesondere der leistungselektronik
US4674004A (en) * 1986-07-03 1987-06-16 Burroughs Corporation Parallel-flow air system for cooling electronic equipment
JPH0258900A (ja) * 1988-08-25 1990-02-28 Fanuc Ltd 電子機器ユニットの冷却装置
US4953058A (en) * 1989-09-01 1990-08-28 General Dynamics Corporation, Space Systems Div. Modular segment adapted to provide a passively cooled housing for heat generating electronic modules
US5218513A (en) * 1992-08-04 1993-06-08 Digital Equipment Corporation Plenum for air-impingement cooling of electronic components
US5535094A (en) * 1995-04-26 1996-07-09 Intel Corporation Integrated circuit package with an integral heat sink and fan

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Hwang, U.P. et al. "Push-Pull Multi-Flow System For Air-Cooled Modules", IBM TDB, vol. 22, No. 2, Jul. 1979, pp. 696-697.
Hwang, U.P. et al. Push Pull Multi Flow System For Air Cooled Modules , IBM TDB, vol. 22, No. 2, Jul. 1979, pp. 696 697. *

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6130818A (en) * 1999-05-27 2000-10-10 Hamilton Sundstrand Corporation Electronic assembly with fault tolerant cooling
US7124806B1 (en) 2001-12-10 2006-10-24 Ncr Corp. Heat sink for enhanced heat dissipation
US20090065174A1 (en) * 2007-09-10 2009-03-12 Yu-Jen Lai Heat sink for an electrical device and method of manufacturing the same
US20170049006A1 (en) * 2015-08-14 2017-02-16 Microsoft Technology Licensing, Llc Heat dissipation in electronics
US10098259B2 (en) * 2015-08-14 2018-10-09 Microsoft Technology Licensing, Llc Heat dissipation in electronics
US10297525B2 (en) * 2015-10-30 2019-05-21 Byd Company Limited Base plate for heat sink as well as heat sink and IGBT module having the same
CN113048812A (zh) * 2021-04-25 2021-06-29 珠海格力电器股份有限公司 散热器及制冷设备

Also Published As

Publication number Publication date
DE29620019U1 (de) 1997-01-09
TW313277U (en) 1997-08-11

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