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TW313277U - Transmission interface bridge device - Google Patents

Transmission interface bridge device

Info

Publication number
TW313277U
TW313277U TW085211095U TW85211095U TW313277U TW 313277 U TW313277 U TW 313277U TW 085211095 U TW085211095 U TW 085211095U TW 85211095 U TW85211095 U TW 85211095U TW 313277 U TW313277 U TW 313277U
Authority
TW
Taiwan
Prior art keywords
transmission interface
bridge device
interface bridge
transmission
interface
Prior art date
Application number
TW085211095U
Other languages
English (en)
Inventor
rui-qi Zhang
Original Assignee
Mitac Int Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitac Int Corp filed Critical Mitac Int Corp
Priority to TW085211095U priority Critical patent/TW313277U/zh
Priority to US08/718,260 priority patent/US5778970A/en
Priority to DE29620019U priority patent/DE29620019U1/de
Publication of TW313277U publication Critical patent/TW313277U/zh

Links

Classifications

    • H10W40/22—
    • H10W40/228—
    • H10W40/43—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00—Heat exchange
    • Y10S165/903—Convection
TW085211095U 1996-07-19 1996-07-19 Transmission interface bridge device TW313277U (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW085211095U TW313277U (en) 1996-07-19 1996-07-19 Transmission interface bridge device
US08/718,260 US5778970A (en) 1996-07-19 1996-09-20 Heat dissipation apparatus
DE29620019U DE29620019U1 (de) 1996-07-19 1996-11-18 Wärmeableitungsvorrichtung für Halbleiter-Bausteine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW085211095U TW313277U (en) 1996-07-19 1996-07-19 Transmission interface bridge device

Publications (1)

Publication Number Publication Date
TW313277U true TW313277U (en) 1997-08-11

Family

ID=21625941

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085211095U TW313277U (en) 1996-07-19 1996-07-19 Transmission interface bridge device

Country Status (3)

Country Link
US (1) US5778970A (zh)
DE (1) DE29620019U1 (zh)
TW (1) TW313277U (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6130818A (en) * 1999-05-27 2000-10-10 Hamilton Sundstrand Corporation Electronic assembly with fault tolerant cooling
US7124806B1 (en) 2001-12-10 2006-10-24 Ncr Corp. Heat sink for enhanced heat dissipation
US20090065174A1 (en) * 2007-09-10 2009-03-12 Yu-Jen Lai Heat sink for an electrical device and method of manufacturing the same
US10098259B2 (en) * 2015-08-14 2018-10-09 Microsoft Technology Licensing, Llc Heat dissipation in electronics
CN205213228U (zh) * 2015-10-30 2016-05-04 比亚迪股份有限公司 散热器底板以及具有其的散热器和igbt模组
CN113048812A (zh) * 2021-04-25 2021-06-29 珠海格力电器股份有限公司 散热器及制冷设备

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4149218A (en) * 1977-12-30 1979-04-10 International Business Machines Corporation Minimum delay module assembly
US4277816A (en) * 1979-05-29 1981-07-07 International Business Machines Corporation Electronic circuit module cooling
US4296455A (en) * 1979-11-23 1981-10-20 International Business Machines Corporation Slotted heat sinks for high powered air cooled modules
AT384343B (de) * 1985-04-16 1987-10-27 Siemens Ag Oesterreich Gehaeuseanordnung fuer belueftete geraete, vorzugsweise der leistungselektronik
US4674004A (en) * 1986-07-03 1987-06-16 Burroughs Corporation Parallel-flow air system for cooling electronic equipment
JPH0258900A (ja) * 1988-08-25 1990-02-28 Fanuc Ltd 電子機器ユニットの冷却装置
US4953058A (en) * 1989-09-01 1990-08-28 General Dynamics Corporation, Space Systems Div. Modular segment adapted to provide a passively cooled housing for heat generating electronic modules
US5218513A (en) * 1992-08-04 1993-06-08 Digital Equipment Corporation Plenum for air-impingement cooling of electronic components
US5535094A (en) * 1995-04-26 1996-07-09 Intel Corporation Integrated circuit package with an integral heat sink and fan

Also Published As

Publication number Publication date
DE29620019U1 (de) 1997-01-09
US5778970A (en) 1998-07-14

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