US3914514A - Termination for resistor and method of making the same - Google Patents
Termination for resistor and method of making the same Download PDFInfo
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- US3914514A US3914514A US38873473A US3914514A US 3914514 A US3914514 A US 3914514A US 38873473 A US38873473 A US 38873473A US 3914514 A US3914514 A US 3914514A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 239000000203 mixture Substances 0.000 claims abstract description 30
- 239000002245 particle Substances 0.000 claims abstract description 29
- 239000011521 glass Substances 0.000 claims abstract description 21
- 229910052751 metal Inorganic materials 0.000 claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 150000001875 compounds Chemical class 0.000 claims abstract description 7
- HTXDPTMKBJXEOW-UHFFFAOYSA-N dioxoiridium Chemical compound O=[Ir]=O HTXDPTMKBJXEOW-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910000457 iridium oxide Inorganic materials 0.000 claims abstract description 6
- SJLOMQIUPFZJAN-UHFFFAOYSA-N oxorhodium Chemical compound [Rh]=O SJLOMQIUPFZJAN-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910003450 rhodium oxide Inorganic materials 0.000 claims abstract description 6
- 229910001925 ruthenium oxide Inorganic materials 0.000 claims abstract description 6
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000002923 metal particle Substances 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 11
- 229910044991 metal oxide Inorganic materials 0.000 claims description 9
- 150000004706 metal oxides Chemical class 0.000 claims description 9
- 239000003870 refractory metal Substances 0.000 claims description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 3
- 239000005751 Copper oxide Substances 0.000 claims description 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 3
- 229910000431 copper oxide Inorganic materials 0.000 claims description 3
- 229910052741 iridium Inorganic materials 0.000 claims description 3
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 3
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 3
- 229910052703 rhodium Inorganic materials 0.000 claims description 3
- 239000010948 rhodium Substances 0.000 claims description 3
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052707 ruthenium Inorganic materials 0.000 claims description 3
- SNSBQRXQYMXFJZ-MOKYGWKMSA-N (2s)-6-amino-n-[(2s,3s)-1-amino-3-methyl-1-oxopentan-2-yl]-2-[[(2s)-2-[[(2s)-2-[[(2s)-2-[[(2s)-2-[[(2s)-2-[[(2s)-2-[[(2s)-2-amino-3-phenylpropanoyl]amino]-3-hydroxypropanoyl]amino]propanoyl]amino]-3-hydroxypropanoyl]amino]propanoyl]amino]-4-methylpentanoy Chemical compound CC[C@H](C)[C@@H](C(N)=O)NC(=O)[C@H](CCCCN)NC(=O)[C@H](C)NC(=O)[C@H](CC(C)C)NC(=O)[C@H](C)NC(=O)[C@H](CO)NC(=O)[C@H](C)NC(=O)[C@H](CO)NC(=O)[C@@H](N)CC1=CC=CC=C1 SNSBQRXQYMXFJZ-MOKYGWKMSA-N 0.000 claims 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 6
- 239000012298 atmosphere Substances 0.000 abstract description 5
- 238000010304 firing Methods 0.000 abstract description 3
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 6
- 239000000037 vitreous enamel Substances 0.000 description 6
- 230000001590 oxidative effect Effects 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 239000000156 glass melt Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
- H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
- H01C17/283—Precursor compositions therefor, e.g. pastes, inks, glass frits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Definitions
- ABSTRACT A method of making a resistor termination comprising the steps of applying to the surface of a substrate and firing a mixture of glass frit and particles of a compound taken from the group consisting of ruthenium oxide, iridium oxide, and rhodium oxide and mixtures thereof, until the compound dissociates to form and sinter the metal.
- the mixture is fired at a temperature of at least 900C and preferably at 1,150C in a reducing or non-oxidizing atmosphere such as that provided by nitrogen.
- a glass film with metal particles therein strongly bonded to the substrate When cooled there is provided a glass film with metal particles therein strongly bonded to the substrate.
- the present invention relates to.a method of making a resistor termination and the termination produced thereby, and more particularly to a methodof making a conductive termination for a vitreous'en'amel resistor.
- Vitreous enamel resistors include 'a substrate having on a surface thereof, a film of glass and particlesof'a' metal borides, and nitrides, have been fired in .non-
- the glass solidifies to form the glass film with the conductive particles therein.
- the termination generally used for resistors of the type produced in a non-oxidizing atmosphere was a film of a metal, such as nickel or copper.
- a metal such as nickel or copper.
- the invention accordingly comprises the several steps and the relation of one or more of such steps with respect to each of the others, and the composition possessing the features, properties, and the relation of constitutents which are exemplified in the following detailed disclosure, and the scope of the invention will be indicated in the claims.
- FIGURE of the drawing is a sectional view of a resistor having the termination of the present invention.
- a resistor 10 which comprises a substrate 12 of an electrical insulating material, such as a ceramic, a termination film 14 on a surface of the substrate 12, and a resistance film 16 on the surface of the substrate and contacting the termination film 14.
- the resistance film 16 is a vitreous enamel resistance film which comprises a film of glass 2 having particles of a conductive material embedded therein and dispersedtherethroughout.
- the conductive material may be a'nyof the well known materials used in vitreous enamelresistors.
- the termination film 14 comprises a layer of glass having particles of either ruthenium, iridium, rhodium or mixtures thereof, embedded'in and dispersed therethroughout.
- the amount of the metal present in the termination film is preferably between 60% and 92% by volume or 79% to 99% by weight.
- the glass may be any glass having a suitable melting temperature, i.e., a melting temperature below that of the metal.
- the glasses most preferable are the borosilicate glasses, such as lead borosilicate, bismuth, cadmium, barium, calcium, or other alkaline earth borosilicates. If desired, up to 5% of the metal can be replaced by copper particles to improve the solderability of the termination film 14.
- the termination material comprises a mixture of a glass frit and particles of either ruthenium oxide, iridium oxide, rhodium oxide or mixtures of the oxides.
- the amount of the oxide included is dependent on the volume percent of the metal desired in I the termination film. The following table shows the amount of the oxide by weight percent needed to achieve 60% and 92% by volume of the metal .in the termination film. 1
- the glass frit and the metal oxide particles are thoroughly mixed together, such as by milling, in a suitable vehicle, such as butyl carbital acetate, a mixture of butyl carbitol acetate and toluol or any well known screening medium.
- a suitable vehicle such as butyl carbital acetate, a mixture of butyl carbitol acetate and toluol or any well known screening medium.
- the viscosity of the mixture is then adjusted for the desired manner of applying the material either by adding or removing some of the vehicle medium.
- copper is to be included in the termination film, it is included in the termination material either as copper particles or copper oxide particles.
- the termination material is then applied to the substrate 12 by any desired technique, such as brushing, dipping, spraying or screen stencil application.
- the coated film is then preferably dried, such as by heating at a low temperature, such as C for about 10 minutes.
- the film is heated at a higher temperature, about 400C or higher, to burn off the vehicle.
- the film is fired at a temperature at which the glass melts, generally at least 900C and preferably l,l50C, in an atmosphere, such as nitrogen, which allows dissociation of the metal oxide and sintering of the metal thus formed.
- the vitreous enamel resistance film 16 can be applied to the substrate in the manner well known in the art.
- the change in resistance shown in the Table is for the application of 50 watts per square for a period of 100 hours.
- the small change in resistance from the power loading and the low value of current noise for the resistors indicate good electrical continuity between the resistor and the termination film.
- a method of making a termination for refractory metal glaze resistors comprising the steps of:
- a termination film for an electrical refractory metal glaze resistor consisting of a glass film bonded to the surface of an insulating substrate, and particles of metal from the group consisting of ruthenium, iridium and rhodium, and mixtures thereof, embedded within and dispersed throughout the glass film, the metal particles being present in the amount of 60% to 92% by volume.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
- Details Of Resistors (AREA)
- Conductive Materials (AREA)
- Glass Compositions (AREA)
Abstract
A method of making a resistor termination comprising the steps of applying to the surface of a substrate and firing a mixture of glass frit and particles of a compound taken from the group consisting of ruthenium oxide, iridium oxide, and rhodium oxide and mixtures thereof, until the compound dissociates to form and sinter the metal. The mixture is fired at a temperature of at least 900*C and preferably at 1,150*C in a reducing or nonoxidizing atmosphere such as that provided by nitrogen. When cooled there is provided a glass film with metal particles therein strongly bonded to the substrate.
Description
United States Patent 11 1 MacKenzie et al.
[4 1 Oct. 21, 1975 1 TERMINATION FOR RESISTOR AND METHOD OF MAKING THE SAME [75] Inventors: George D. MacKenzie, Maple Glen,
Pa.; Michael G. Noblett, Ventnor, NJ.
[73] Assignee: TRW, Inc., Cleveland, Ohio [22] Filed: Aug. 16, 1973 [21] Appl. No.: 388,734
[52] US. Cl. 428/426; 428/457; 427/101; 427/376; 427/377; 427/383; 252/514; 252/518 Primary Examiner-Michael F. Esposito Attorney, Agent, or Firm.lacob Trachtman [57] ABSTRACT A method of making a resistor termination comprising the steps of applying to the surface of a substrate and firing a mixture of glass frit and particles of a compound taken from the group consisting of ruthenium oxide, iridium oxide, and rhodium oxide and mixtures thereof, until the compound dissociates to form and sinter the metal. The mixture is fired at a temperature of at least 900C and preferably at 1,150C in a reducing or non-oxidizing atmosphere such as that provided by nitrogen. When cooled there is provided a glass film with metal particles therein strongly bonded to the substrate.
7 Claims, 1 Drawing Figure /4- TERM/NAT/O/V (METAL 61. A25) /6- RES/STANCE FILM /2- cyan/c TERMINATION, FOR RESISTOR AND ivniriioo or MAKING THE SAME The present invention relates to.a method of making a resistor termination and the termination produced thereby, and more particularly to a methodof making a conductive termination for a vitreous'en'amel resistor.
Vitreous enamel resistors include 'a substrate having on a surface thereof, a film of glass and particlesof'a' metal borides, and nitrides, have been fired in .non-
oxidizing environments. When the resistor is cooled,
the glass solidifies to form the glass film with the conductive particles therein.
in order to provide an electrical connection to the resistor it is desirable to provide on the substrate at each end of the resistance film a conductive termination. Heretofore, the termination generally used for resistors of the type produced in a non-oxidizing atmosphere, was a film of a metal, such as nickel or copper. However, it has been found that such metal film terminations are not suitable for many vitreous enamel resistance products.
Therefore, it is an object of the present invention to provide a novel method of making a termination for a vitreous enamel resistor.
It is another object of the present invention to provide a novel termination for a vitreous enamel resistor.
It is still another object of the present invention to provide a novel resistor termination.
These objects are achieved by applying to a substrate a mixture of a glass frit and particles of ruthenium oxide, iridium oxide, rhodium oxide or mixtures thereof. The substrate and coating are then heated in a nitrogen atmosphere at a temperature at which the glass frit melts and the metal oxide dissociates to the metal form and the metal sinters to a dense film which is strongly bonded to the substrate.
The invention accordingly comprises the several steps and the relation of one or more of such steps with respect to each of the others, and the composition possessing the features, properties, and the relation of constitutents which are exemplified in the following detailed disclosure, and the scope of the invention will be indicated in the claims.
For a fuller understanding of the nature and objects of the invention, reference should be had to the following detailed description taken in connection with the accompanying drawing in which:
The FIGURE of the drawing is a sectional view of a resistor having the termination of the present invention.
Referring to the drawing there is shown a resistor 10 which comprises a substrate 12 of an electrical insulating material, such as a ceramic, a termination film 14 on a surface of the substrate 12, and a resistance film 16 on the surface of the substrate and contacting the termination film 14. The resistance film 16 is a vitreous enamel resistance film which comprises a film of glass 2 having particles of a conductive material embedded therein and dispersedtherethroughout. The conductive material may be a'nyof the well known materials used in vitreous enamelresistors.
The termination film 14,comprises a layer of glass having particles of either ruthenium, iridium, rhodium or mixtures thereof, embedded'in and dispersed therethroughout. The amount of the metal present in the termination film is preferably between 60% and 92% by volume or 79% to 99% by weight. The glass may be any glass having a suitable melting temperature, i.e., a melting temperature below that of the metal. The glasses most preferable are the borosilicate glasses, such as lead borosilicate, bismuth, cadmium, barium, calcium, or other alkaline earth borosilicates. If desired, up to 5% of the metal can be replaced by copper particles to improve the solderability of the termination film 14.
' To make the termination film 14, a termination material is first formed. The termination material comprises a mixture of a glass frit and particles of either ruthenium oxide, iridium oxide, rhodium oxide or mixtures of the oxides. The amount of the oxide included is dependent on the volume percent of the metal desired in I the termination film. The following table shows the amount of the oxide by weight percent needed to achieve 60% and 92% by volume of the metal .in the termination film. 1
The glass frit and the metal oxide particles are thoroughly mixed together, such as by milling, in a suitable vehicle, such as butyl carbital acetate, a mixture of butyl carbitol acetate and toluol or any well known screening medium. The viscosity of the mixture is then adjusted for the desired manner of applying the material either by adding or removing some of the vehicle medium. If copper is to be included in the termination film, it is included in the termination material either as copper particles or copper oxide particles.
The termination material is then applied to the substrate 12 by any desired technique, such as brushing, dipping, spraying or screen stencil application. The coated film is then preferably dried, such as by heating at a low temperature, such as C for about 10 minutes. Next, the film is heated at a higher temperature, about 400C or higher, to burn off the vehicle. Finally, the film is fired at a temperature at which the glass melts, generally at least 900C and preferably l,l50C, in an atmosphere, such as nitrogen, which allows dissociation of the metal oxide and sintering of the metal thus formed. After the termination film 14 is applied to the substrate 12, the vitreous enamel resistance film 16 can be applied to the substrate in the manner well known in the art.
The following table provides test results for resistors utilizing terminations produced in accordance with the present invention.
Not Tested The change in resistance shown in the Table is for the application of 50 watts per square for a period of 100 hours. The small change in resistance from the power loading and the low value of current noise for the resistors indicate good electrical continuity between the resistor and the termination film.
The present invention may be carried out and embodied in other specific forms without departing from the spirit or essential attributes thereof, and, accordingly, references should be made to the appended claims, rather than the foregoing specification as indicating the scope of the invention.
What is claimed is:
l. A method of making a termination for refractory metal glaze resistors comprising the steps of:
a. applying to the surface of a substrate a mixture of a glass frit and particles of a compound taken from the group consisting of ruthenium oxide, iridium oxide, rhodium oxide, and mixtures thereof, the metal oxide particles being present in the amount of 79% to 99% by weight and b. firing the mixture at a temperature of at least 900C in a non-oxidizing atmosphere until the compound dissociates to formand sinter the metal.
2. The method in accordance with claim 1 in which the mixture is fired at a temperature of at least 900C in a nitrogen atmosphere.
3. The method in accordance with claim 1 in which the mixture is fired at a temperature of between l,lOOC to l,l50C.
4. The method in accordance with claim 2 in which the metal oxide particles are present in the mixture, such that the amount of metal in the termination is between and 92% by volume.
5. The method in accordance with claim 4 in which copper particles are present in the mixture and in which of the metal oxide and copper particles no greater than 5% are of the copper particles.
6. The method in accordance with claim 5 in which the copper particles include particles of copper and copper oxide.
7. A termination film for an electrical refractory metal glaze resistor consisting of a glass film bonded to the surface of an insulating substrate, and particles of metal from the group consisting of ruthenium, iridium and rhodium, and mixtures thereof, embedded within and dispersed throughout the glass film, the metal particles being present in the amount of 60% to 92% by volume.
Claims (7)
1. A METHOD OF MAKING A TERMINATION FOR REFRACTORY METAL GLAZE RESISTORS COMPRISING THE STEPS OF: A. APPLYING TO THE SURFACE OF A SUBSTRATE A MIXTURE OF A GLASS FRIT AND PARTICLES OF A COMPOUND TAKEN FROM THE GROUP CONSISTING OF RUTHENIUM OXIDE, IRIDIUM OXIDE, RHODIUM OXIDE, AND MIXTURES THEREOF, THE METAL OXIDE PARTICLES BEING PRESENT IN THE AMOUNT OF 79% BY WEIGHT AND B. FIRING THE MIXTURE AT A TEMPERATURE OF AT LEAST 900*C IN
2. The method in accordance with claim 1 in which the mixture is fired at a temperature of at least 900*C in a nitrogen atmosphere.
3. The method in accordance with claim 1 in which the mixture is fired at a temperature of between 1,100*C to 1,150*C.
4. The method in accordance with claim 2 in which the metal oxide particles are present in the mixture, such that the amount of metal in the termination is between 60% and 92% by volume.
5. The method in accordance with claim 4 in which copper particles are present in the mixture and in which of the metal oxide and copper particles no greater than 5% are of the copper particles.
6. The method in accordance with claim 5 in which the copper particles include particles of copper and copper oxide.
7. A termination film for an electrical refractory metal glaze resistor consisting of a glass film bonded to the surface of an insulating substrate, and particles of metal from the group consisting of ruthenium, iridium and rhodium, and mixtures thereof, embedded within and dispersed throughout the glass film, the metal particles being present in the amount of 60% to 92% by volume.
Priority Applications (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US38873473 US3914514A (en) | 1973-08-16 | 1973-08-16 | Termination for resistor and method of making the same |
| JP4922574A JPS5639001B2 (en) | 1973-08-16 | 1974-05-01 | |
| AU68763/74A AU488710B2 (en) | 1973-08-16 | 1974-05-09 | Termination for resistor and method of making same |
| IT6850074A IT1014174B (en) | 1973-08-16 | 1974-05-13 | TERMINAL FOR THIN LAYER RESISTORS AND EIGHT NERLO PROCEDURE |
| CA201,231A CA993969A (en) | 1973-08-16 | 1974-05-30 | Termination for resistor and method of making same |
| FR7422322A FR2246037B1 (en) | 1973-08-16 | 1974-06-26 | |
| GB3366474A GB1465931A (en) | 1973-08-16 | 1974-07-30 | Electrical resistors |
| DE19742438048 DE2438048C3 (en) | 1973-08-16 | 1974-08-07 | Process for the production of solderable connection layers for electrical resistors |
| DK436774A DK139826B (en) | 1973-08-16 | 1974-08-15 | Solderable electrically conductive terminal coating and method of manufacturing the same. |
| GB4023475A GB1460320A (en) | 1973-08-16 | 1975-10-02 | Sodium specific glass compositions and electrodes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US38873473 US3914514A (en) | 1973-08-16 | 1973-08-16 | Termination for resistor and method of making the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3914514A true US3914514A (en) | 1975-10-21 |
Family
ID=23535288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US38873473 Expired - Lifetime US3914514A (en) | 1973-08-16 | 1973-08-16 | Termination for resistor and method of making the same |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US3914514A (en) |
| JP (1) | JPS5639001B2 (en) |
| CA (1) | CA993969A (en) |
| DK (1) | DK139826B (en) |
| FR (1) | FR2246037B1 (en) |
| GB (2) | GB1465931A (en) |
| IT (1) | IT1014174B (en) |
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2650466A1 (en) * | 1975-11-24 | 1977-05-26 | Trw Inc | ELECTRICAL RESISTANCE WITH CONNECTIONS AND METHOD OF MANUFACTURING THESE |
| US4065743A (en) * | 1975-03-21 | 1977-12-27 | Trw, Inc. | Resistor material, resistor made therefrom and method of making the same |
| US4087778A (en) * | 1976-04-05 | 1978-05-02 | Trw Inc. | Termination for electrical resistor and method of making the same |
| US4139832A (en) * | 1976-03-19 | 1979-02-13 | Hitachi, Ltd. | Glass-coated thick film resistor |
| US4146759A (en) * | 1976-08-12 | 1979-03-27 | Nissan Motor Company, Limited | Ignition distributor |
| US4155064A (en) * | 1976-08-27 | 1979-05-15 | Allen-Bradley Company | Electrical resistor element |
| US4164067A (en) * | 1976-08-27 | 1979-08-14 | Allen-Bradley Company | Method of manufacturing electrical resistor element |
| FR2431183A1 (en) * | 1978-07-15 | 1980-02-08 | Sony Corp | TELEVISION TUBE ELECTRON CANON AND RESISTANCE ELEMENT FOR THIS ELECTRON CANON |
| US4213113A (en) * | 1978-09-08 | 1980-07-15 | Allen-Bradley Company | Electrical resistor element and method of manufacturing the same |
| US4286251A (en) * | 1979-03-05 | 1981-08-25 | Trw, Inc. | Vitreous enamel resistor and method of making the same |
| US4293838A (en) * | 1979-01-29 | 1981-10-06 | Trw, Inc. | Resistance material, resistor and method of making the same |
| WO1982000233A1 (en) * | 1980-07-03 | 1982-01-21 | Western Electric Co | Thick film resistor circuits |
| US4415486A (en) * | 1981-06-11 | 1983-11-15 | U.S. Philips Corporation | Resistive paste for a resistor body |
| US4527050A (en) * | 1981-07-08 | 1985-07-02 | E.G.O. Elektro-Gerate Blanc Und Fischer | Hotplate |
| US4622240A (en) * | 1985-11-12 | 1986-11-11 | Air Products And Chemicals, Inc. | Process for manufacturing thick-film electrical components |
| US4651126A (en) * | 1985-05-02 | 1987-03-17 | Shailendra Kumar | Electrical resistor material, resistor made therefrom and method of making the same |
| US4835038A (en) * | 1985-06-29 | 1989-05-30 | Kabushiki Kaisha Toshiba | Substrate coated with multiple thick films |
| EP0364095A3 (en) * | 1988-10-11 | 1990-11-07 | DELCO ELECTRONICS CORPORATION (a Delaware corp.) | Post-termination process for thick-film resistors of printed-circuit boards |
| US5185182A (en) * | 1990-12-10 | 1993-02-09 | Ford Motor Company | Method for inhibiting significant oxidation of a film on a substance during heating |
| US8623776B2 (en) | 2008-02-26 | 2014-01-07 | Corning Incorporated | Silicate glasses having low seed concentration |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3304199A (en) * | 1963-11-12 | 1967-02-14 | Cts Corp | Electrical resistance element |
| US3484284A (en) * | 1967-08-15 | 1969-12-16 | Corning Glass Works | Electroconductive composition and method |
| US3573229A (en) * | 1968-01-30 | 1971-03-30 | Alloys Unlimited Inc | Cermet resistor composition and method of making same |
| US3620840A (en) * | 1968-12-13 | 1971-11-16 | Methode Dev Co | Resistance material and resistance elements made therefrom |
| US3640764A (en) * | 1968-09-26 | 1972-02-08 | Minnesota Mining & Mfg | Integral heating elements |
| US3679607A (en) * | 1966-10-24 | 1972-07-25 | Int Nickel Co | Oxide resistor materials |
| US3741780A (en) * | 1970-11-04 | 1973-06-26 | Du Pont | Metallizing compositions containing bismuthate glass-ceramic conductor binder |
| US3776769A (en) * | 1970-08-27 | 1973-12-04 | Atomic Energy Authority Uk | Metallising pastes |
-
1973
- 1973-08-16 US US38873473 patent/US3914514A/en not_active Expired - Lifetime
-
1974
- 1974-05-01 JP JP4922574A patent/JPS5639001B2/ja not_active Expired
- 1974-05-13 IT IT6850074A patent/IT1014174B/en active
- 1974-05-30 CA CA201,231A patent/CA993969A/en not_active Expired
- 1974-06-26 FR FR7422322A patent/FR2246037B1/fr not_active Expired
- 1974-07-30 GB GB3366474A patent/GB1465931A/en not_active Expired
- 1974-08-15 DK DK436774A patent/DK139826B/en not_active IP Right Cessation
-
1975
- 1975-10-02 GB GB4023475A patent/GB1460320A/en not_active Expired
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3304199A (en) * | 1963-11-12 | 1967-02-14 | Cts Corp | Electrical resistance element |
| US3679607A (en) * | 1966-10-24 | 1972-07-25 | Int Nickel Co | Oxide resistor materials |
| US3484284A (en) * | 1967-08-15 | 1969-12-16 | Corning Glass Works | Electroconductive composition and method |
| US3573229A (en) * | 1968-01-30 | 1971-03-30 | Alloys Unlimited Inc | Cermet resistor composition and method of making same |
| US3640764A (en) * | 1968-09-26 | 1972-02-08 | Minnesota Mining & Mfg | Integral heating elements |
| US3620840A (en) * | 1968-12-13 | 1971-11-16 | Methode Dev Co | Resistance material and resistance elements made therefrom |
| US3776769A (en) * | 1970-08-27 | 1973-12-04 | Atomic Energy Authority Uk | Metallising pastes |
| US3741780A (en) * | 1970-11-04 | 1973-06-26 | Du Pont | Metallizing compositions containing bismuthate glass-ceramic conductor binder |
Cited By (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4065743A (en) * | 1975-03-21 | 1977-12-27 | Trw, Inc. | Resistor material, resistor made therefrom and method of making the same |
| DE2650466A1 (en) * | 1975-11-24 | 1977-05-26 | Trw Inc | ELECTRICAL RESISTANCE WITH CONNECTIONS AND METHOD OF MANUFACTURING THESE |
| FR2332600A1 (en) * | 1975-11-24 | 1977-06-17 | Trw Inc | ELECTRICAL RESISTANCE TO THIN-LAYER TERMINATION AND ITS REALIZATION PROCESS |
| US4139832A (en) * | 1976-03-19 | 1979-02-13 | Hitachi, Ltd. | Glass-coated thick film resistor |
| US4087778A (en) * | 1976-04-05 | 1978-05-02 | Trw Inc. | Termination for electrical resistor and method of making the same |
| US4146759A (en) * | 1976-08-12 | 1979-03-27 | Nissan Motor Company, Limited | Ignition distributor |
| US4155064A (en) * | 1976-08-27 | 1979-05-15 | Allen-Bradley Company | Electrical resistor element |
| US4164067A (en) * | 1976-08-27 | 1979-08-14 | Allen-Bradley Company | Method of manufacturing electrical resistor element |
| FR2431183A1 (en) * | 1978-07-15 | 1980-02-08 | Sony Corp | TELEVISION TUBE ELECTRON CANON AND RESISTANCE ELEMENT FOR THIS ELECTRON CANON |
| US4213113A (en) * | 1978-09-08 | 1980-07-15 | Allen-Bradley Company | Electrical resistor element and method of manufacturing the same |
| US4293838A (en) * | 1979-01-29 | 1981-10-06 | Trw, Inc. | Resistance material, resistor and method of making the same |
| US4286251A (en) * | 1979-03-05 | 1981-08-25 | Trw, Inc. | Vitreous enamel resistor and method of making the same |
| WO1982000233A1 (en) * | 1980-07-03 | 1982-01-21 | Western Electric Co | Thick film resistor circuits |
| US4316920A (en) * | 1980-07-03 | 1982-02-23 | Bell Telephone Laboratories, Incorporated | Thick film resistor circuits |
| US4415486A (en) * | 1981-06-11 | 1983-11-15 | U.S. Philips Corporation | Resistive paste for a resistor body |
| US4527050A (en) * | 1981-07-08 | 1985-07-02 | E.G.O. Elektro-Gerate Blanc Und Fischer | Hotplate |
| US4651126A (en) * | 1985-05-02 | 1987-03-17 | Shailendra Kumar | Electrical resistor material, resistor made therefrom and method of making the same |
| US4835038A (en) * | 1985-06-29 | 1989-05-30 | Kabushiki Kaisha Toshiba | Substrate coated with multiple thick films |
| US4622240A (en) * | 1985-11-12 | 1986-11-11 | Air Products And Chemicals, Inc. | Process for manufacturing thick-film electrical components |
| EP0364095A3 (en) * | 1988-10-11 | 1990-11-07 | DELCO ELECTRONICS CORPORATION (a Delaware corp.) | Post-termination process for thick-film resistors of printed-circuit boards |
| US5164698A (en) * | 1988-10-11 | 1992-11-17 | Delco Electronics Corporation | Post-termination apparatus and process for thick film resistors of printed circuit boards |
| US5169679A (en) * | 1988-10-11 | 1992-12-08 | Delco Electronics Corporation | Post-termination apparatus and process for thick film resistors of printed circuit boards |
| US5185182A (en) * | 1990-12-10 | 1993-02-09 | Ford Motor Company | Method for inhibiting significant oxidation of a film on a substance during heating |
| US8623776B2 (en) | 2008-02-26 | 2014-01-07 | Corning Incorporated | Silicate glasses having low seed concentration |
| US9073779B2 (en) | 2008-02-26 | 2015-07-07 | Corning Incorporated | Fining agents for silicate glasses |
| US10040715B2 (en) | 2008-02-26 | 2018-08-07 | Corning Incorporated | Silicate glasses having low seed concentration |
| US10626042B2 (en) | 2008-02-26 | 2020-04-21 | Corning Incorporated | Fining agents for silicate glasses |
Also Published As
| Publication number | Publication date |
|---|---|
| GB1460320A (en) | 1977-01-06 |
| FR2246037A1 (en) | 1975-04-25 |
| JPS5053896A (en) | 1975-05-13 |
| DK436774A (en) | 1975-04-28 |
| DK139826C (en) | 1979-10-01 |
| FR2246037B1 (en) | 1978-10-27 |
| DE2438048A1 (en) | 1975-02-27 |
| AU6876374A (en) | 1975-11-13 |
| DK139826B (en) | 1979-04-23 |
| DE2438048B2 (en) | 1977-06-16 |
| JPS5639001B2 (en) | 1981-09-10 |
| IT1014174B (en) | 1977-04-20 |
| GB1465931A (en) | 1977-03-02 |
| CA993969A (en) | 1976-07-27 |
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