US20240326195A1 - Multi-Blade Trimming and Dressing Tool - Google Patents
Multi-Blade Trimming and Dressing Tool Download PDFInfo
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- US20240326195A1 US20240326195A1 US18/193,405 US202318193405A US2024326195A1 US 20240326195 A1 US20240326195 A1 US 20240326195A1 US 202318193405 A US202318193405 A US 202318193405A US 2024326195 A1 US2024326195 A1 US 2024326195A1
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- blade
- dressing
- workpiece
- blade holder
- platen
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
- B24B3/36—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
- B24B3/46—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades of disc blades
Definitions
- Semiconductor device fabrication is a process used to create integrated circuits that are present in everyday electronic devices.
- the fabrication process is a multiple-step sequence of photolithographic and chemical processing steps during which electronic circuits are gradually created on a wafer composed of a semiconducting material.
- the edge of the wafer may become warped, damaged, or otherwise unsuitable for use with electronic circuits. Hence, the edge of the wafer may be trimmed during fabrication.
- FIGS. 1 A, 1 B, and 1 C illustrate cross-sections of intermediate stages in the processing of workpieces including a trimming step, in accordance with some embodiments.
- FIGS. 2 A, 2 B, and 2 C illustrate cross-sections of intermediate stages in the processing of workpieces including a trimming step, in accordance with some embodiments.
- FIG. 3 illustrates a schematic plan view of a trimming tool, in accordance with some embodiments.
- FIG. 4 illustrates a schematic perspective view of a trimming tool, in accordance with some embodiments.
- FIG. 5 shows schematic perspective views of a blade attached to the end of an arm of a blade holder, in accordance with some embodiments.
- FIGS. 6 A, 6 B, 6 C, 6 D, and 6 E intermediate steps of a trimming process utilizing a trimming tool are shown, in accordance with some embodiments.
- FIG. 7 illustrates process flow for a trimming process, in accordance with some embodiments.
- FIGS. 8 A and 8 B illustrate a process for dressing a blade with a dressing board, in accordance with some embodiments.
- FIGS. 9 A and 9 B illustrate dressing boards, in accordance with some embodiments.
- FIGS. 10 A, 10 B, and 10 C illustrate a sensor for a blade and example blade measurements, in accordance with some embodiments.
- FIG. 11 illustrates a schematic plan view of a trimming tool, in accordance with some embodiments.
- FIG. 12 illustrates a schematic cross-sectional view of a portion of a trimming tool, in accordance with some embodiments.
- first and second features are formed in direct contact
- additional features may be formed between the first and second features, such that the first and second features may not be in direct contact
- present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
- spatially relative terms such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures.
- the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures.
- the apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.
- the trimming tool described herein includes a blade holder configured to hold and operate multiple trimming blades such that multiple workpieces (e.g., wafers) can be trimmed by different blades on the blade holder. Additionally, the blade holder is configured to rotate such that some blades can be “dressed” (e.g., cleaned using one or more dressing boards) while other blades are used to trim workpieces. In this manner, the rate at which workpieces are trimmed may be increased while still allowing blades to be dressed as needed. This can reduce processing time and improve efficiency.
- the blade holder may also include sensors that monitor blade position or blade conditions, which can allow for more efficient and cost-effective blade dressing.
- FIGS. 1 A through 1 C and FIGS. 2 A through 2 C illustrate cross-sections of intermediate stages in the processing of workpieces including a trimming step, in accordance with some embodiments.
- the processes shown in FIGS. 1 A- 1 C and 2 A- 2 C are illustrative examples, and any other suitable processes including trimming step may be used with the embodiments of the present disclosure.
- a first wafer 10 is bonded to a second wafer 20 to form a workpiece 50 .
- the workpiece 50 may also be referred to as a “wafer,” a “reconstituted wafer,” a “bonded structure,” a “stacked wafer structure,” or the like.
- Edge portions of the workpiece 50 are then removed in a trimming process, which may be performed using embodiments described herein. In some cases, trimming a workpiece 50 may reduce warping, cracking, or debonding.
- the first wafer 10 is bonded or otherwise attached to the second wafer 20 to form the workpiece 50 .
- the first wafer 10 and/or the second wafer 20 may be a semiconductor wafer such as a silicon bulk wafer or a gallium arsenide wafer.
- the first wafer 10 and/or the second wafer comprises, for example, silicon, strained silicon, silicon alloy, silicon carbide, silicon-germanium, silicon-germanium carbide, germanium, a germanium alloy, germanium-arsenic, indium-arsenic, group III-V semiconductors, a combination thereof, or the like.
- the first wafer 10 and/or the second wafer 20 is a buried oxide (BOX) wafer, a device wafer, an interposer, an organic core substrate, a combination thereof, or the like.
- the first wafer 10 and the second wafer 20 may have similar or different materials or dimensions.
- the first wafer 10 may be bonded to the second wafer 20 using direct bonding (e.g., dielectric-to-dielectric bonding and/or metal-to-metal bonding), using an adhesive, or using another suitable technique.
- the second wafer 20 may be considered a “carrier,” a “carrier substrate,” or a “carrier wafer.”
- the workpiece 50 is trimmed, in accordance with some embodiments.
- a region 45 around the edge of the workpiece 50 is removed.
- the trimmed region 45 may be removed vertically downward from the first wafer 10 toward the second wafer 20 .
- the trimmed region 45 may extend partially or fully through the first wafer 10 and may extend partially or fully through the second wafer 20 .
- the trimmed region 45 shown in FIG. 1 B extends fully through the first wafer 10 and partially through the second wafer 20 .
- the first wafer 10 is thinned using a suitable process, such as a chemical mechanical polish (CMP) process, a grinding process, an etching process, a combination thereof, or the like.
- CMP chemical mechanical polish
- the thinning process reduces the thickness of the first wafer 10 .
- FIGS. 2 A- 2 C The process shown in FIGS. 2 A- 2 C is similar to the process shown in FIGS. 1 A- 1 C , except that the workpiece 50 is thinned before the workpiece 50 is trimmed.
- FIG. 2 A shows a workpiece similar to that of FIG. 1 A .
- FIG. 2 B the workpiece 50 is thinned to reduce the thickness of the first wafer 10 .
- FIG. 2 C a trimming process is performed to remove a region 45 around the edge of the workpiece 50 , similar to the trimming process described for FIG. 1 C .
- FIGS. 3 and 4 illustrate a trimming tool 100 , in accordance with some embodiments.
- FIG. 3 illustrates a schematic plan view of the trimming tool 100
- FIG. 4 illustrates a schematic perspective view of the trimming tool 100 .
- the trimming tool 100 may be used to trim one or more workpieces 50 , which may be similar to the workpieces 50 described above for FIGS. 1 A- 2 C , though other workpieces 50 are possible.
- the trimming tool 100 comprises a blade holder 110 configured to hold and operate multiple trimming blades 120 .
- FIG. 5 shows schematic perspective views of a blade 120 attached to the end of an arm 112 , in accordance with some embodiments.
- the blade 120 is attached to an actuator 122 within the arm 112 by a spindle 124 .
- the actuator 122 may comprise a motor, a hydraulic actuator, a pneumatic actuator, a robotic arm, another type of actuator or mechanism, a combination thereof, or the like.
- the actuator 122 may be configured to rotate the blade 120 (e.g., clockwise and/or counterclockwise, such as during trimming or dressing) or laterally translate (e.g., extend or retract) the blade 120 .
- FIG. 5 shows the blade 120 in two different lateral positions after translation by the actuator 122 .
- the actuator 122 may laterally translate the blade 120 within a range from about 1 mm to about 50 mm, but other ranges of translation are possible.
- the actuator 122 may translate the blade 120 to suitably align the blade 120 with a workpiece 50 during a trimming process or to suitably align the blade 120 with a dressing board 130 during a dressing process, for example.
- the arm 112 , the actuator 122 , and/or the spindle 124 may comprise a spring or damper (not shown) that reduces vibrations of the blade 120 during operation.
- a blade 120 attached to an arm 112 may have a diameter in the range of about 10 mm to about 300 mm, though other diameters are possible.
- the blade 120 may be formed of any suitable materials or have any suitable characteristics.
- the blade 120 may comprise a bonding material of ceramic, resin, rubber, chlorine oxide (e.g., oxychloride), nickel, the like, or a combination thereof.
- the blade 120 may have a grit size in the range of #100 to #7000, though other grit sizes are possible.
- the blade 120 may have grit comprising diamond, cubic boron nitride (CBN), silicon carbide, aluminum oxide, zirconia alumina, zirconium dioxide, ceramic, garnet, the like, or a combination thereof.
- the blade 120 may have a grit coating comprising nickel, nickel chrome, nickel aluminum, aluminum bronze, aluminum oxide, chrome oxide, zirconium oxide, chrome carbide nickel chrome, nickel graphite, aluminum, copper, molybdenum, tungsten carbide cobalt, titanium oxide, the like, or a combination thereof. Other materials are possible.
- the various blades 120 attached to the arms 112 of a blade holder 110 may have similar or different characteristics. For example, returning to FIGS. 3 and 4 , the blades 120 A and 120 C respectively attached to arms 112 A and 112 C have a relatively course grit, and the blades 120 B and 120 D respectively attached to arms 112 B and 112 D have a relatively fine grit. Other combinations of blades and blade characteristics are possible.
- a trimming process for a workpiece 50 may comprise trimming the workpiece 50 with a course blade 120 (e.g., blade 120 A or 120 C) and then trimming the workpiece 50 with a fine blade 120 (e.g., blade 120 B or 120 D).
- blades 120 A and 120 C may be referred to as “course blades” herein, and blades 120 B and 120 D may be referred to as “fine blades” herein.
- the multi-armed blade holder 110 described herein allows for a single workpiece 50 to be trimmed with multiple blades 120 during a trimming process.
- the trimming tool 100 comprises a trimming station 102 that supports and rotates workpieces 50 during a trimming process, in accordance with some embodiments.
- the trimming station 102 comprises a first platen 104 A and a second platen 104 B that are each configured to hold a workpiece 50 .
- FIGS. 3 - 4 show the first platen 104 A holding a first workpiece 50 A and the second platen 104 B holding a second workpiece 50 B.
- a trimming station 102 may comprise a different number of platens 104 in other embodiments.
- a platen 104 may secure a workpiece 50 using, e.g. vacuum suction or another suitable technique, and may rotate the workpiece 50 (e.g., clockwise or counterclockwise) during a trimming process, in some embodiments.
- the trimming tool 100 also comprises one or more dressing boards 130 , in accordance with some embodiments.
- the dressing boards 130 are used to clean, reshape, and refresh blades 120 after performing a trimming process.
- the dressing boards 130 are supported by a dressing station 132 , and in some embodiments, each dressing board 130 may have its own dressing station 132 .
- FIGS. 3 - 4 show a first dressing board 130 A on a first dressing station 132 A and a second dressing board 130 B on a second dressing station 132 B. In other embodiments, both the first dressing board 130 A and the second dressing board 130 B may be supported by the same dressing station 132 .
- a dressing board 130 may be rotated, translated, or positioned by the dressing station 132 .
- the various dressing boards 130 may have similar or different characteristics.
- the first dressing board 130 A may be suited for a blade 120 having relatively course grit (e.g., blade 120 A or 120 C)
- the second dressing board 130 B may be suited for a blade 120 having relatively fine grit (e.g., blade 120 B or 120 D).
- a dressing board 130 may be referred to as a “course dressing board” or a “fine dressing board” herein.
- Other combinations of dressing boards and dressing board characteristics are possible.
- the trimming tool 100 comprises a sensor arm 106 that measures characteristics of a workpiece 50 during or after performing a trimming process.
- the sensor arm 106 may monitor, detect, or measure characteristics of a trimmed region (e.g., trimmed region 45 of FIGS. 1 B- 1 C or 2 B- 2 C ) of a workpiece 50 , such as depth, width, roughness, location, or the like.
- the sensor arm 106 may comprise one or more sensors, which may be laser-based sensors, optical sensors (e.g., OCD sensors, CCD sensors, or the like) or other types of sensors.
- the sensor arm 106 may be operable to rotate or translate between a first position to measure a first workpiece 50 (e.g., first workpiece 50 A in FIG. 3 ) and a second position to measure a second workpiece 50 (e.g., second workpiece 50 B in FIG. 3 ).
- each platen 104 has an associated sensor arm 106 .
- a trimming tool comprising a multi-blade holder may have a different configuration than the trimming tool 100 shown in FIGS. 3 - 4 .
- FIG. 11 illustrates a trimming tool 300 , in accordance with some embodiments.
- the trimming tool 300 has a blade holder 110 configured to hold six blades 120 A-F, which may be similar blades or blades of different types.
- the trimming tool 300 also includes five platens (not separately shown) to hold five workpieces 50 A-E and includes one dressing board 130 on a dressing station 132 .
- the trimming tool 300 is configured such that the five workpieces 50 A-E may be trimmed simultaneously by five of the blades 120 (e.g., blades 120 A-E) while the remaining blade 120 (e.g., blades 120 F) is dressed at the dressing board 130 .
- the blade holder 110 may rotate in order to align different blades 120 A-F with different platens or with the dressing board 130 .
- Another number or arrangement of blades 120 , workpieces 50 , dressing boards 130 , or other features is possible in other embodiments.
- FIGS. 6 A through 6 E intermediate steps of an example trimming process utilizing the trimming tool 100 are shown, in accordance with some embodiments.
- the trimming process shown in FIGS. 6 A- 6 E is an illustrative example, and other trimming processes with different steps or different sequences of steps may be used in other embodiments. Some of the actions described below for a step may be performed sequentially, and some of the actions described below for a step may be performed simultaneously. Some of the actions described below for a step may be performed in a different order than described. Using a suitable trimming process such as that described for FIGS.
- the trimming tool 100 as described herein allows for the efficient trimming of workpieces 50 including the dressing of blades 120 with an improved “wafer-per-hour” rate. Additionally, the trimming process described in FIGS. 6 A- 6 E allow for each workpiece 50 to be trimmed with a course blade and then a fine blade, which can improve the smoothness and reproducibility of the trimmed region and reduce the risk of cracking or warping of the workpiece 50 .
- the blade holder 110 is in a position such that a workpiece 50 on the first platen 104 A can be trimmed using the fine blade 120 B and a workpiece 50 on the second platen 104 B can be trimmed using the course blade 120 A.
- the position of the blade holder 110 in FIG. 6 A may be considered an “initial position” or a “first position.”
- the workpiece 50 A on the first platen 104 A is trimmed using the fine blade 120 B and then removed from the first platen 104 A (e.g., by a robotic arm 60 ).
- the workpiece 50 A may be removed from the first platen 104 A and transferred to a cleaning station or the like, for example.
- the workpiece 50 B is loaded onto the second platen 104 B (e.g., by a robotic arm 60 ) and then trimmed using the course blade 120 A.
- the blade holder 110 is also in a position such that the course blade 120 C may be dressed using the course dressing board 130 A and the fine blade 120 D may be dressed using the fine dressing board 130 B.
- the blades 120 C-D may be dressed while the workpieces 50 A-B are trimmed by the blades 120 A-B.
- the dressing of the blades 120 C and/or 120 D when the blade holder 110 is in the first position is optional, and one, both, or neither of the blades 120 C-D may be dressed.
- the condition of a blade 120 may be monitored or measured, and whether or not the blade 120 is dressed may be determined from the condition of the blade 120 .
- a blade 120 may be dressed after trimming a predetermined number of workpieces 50 since the previous dressing of the blade 120 .
- the blade holder 110 is rotated to a position such that a workpiece 50 on the first platen 104 A can be trimmed using the course blade 120 C and a workpiece 50 on the second platen 104 B can be trimmed using the fine blade 120 B.
- the blade holder 110 may be rotated 90° around the central axis 113 as shown in FIG. 6 B , or may be rotated another appropriate angle.
- the position of the blade holder 110 in FIG. 6 B may be considered a “second position.”
- a workpiece 50 C is loaded onto the first platen 104 A (e.g., by a robotic arm 60 ) and then trimmed using the course blade 120 C.
- the workpiece 50 B on the second platen 104 B is trimmed using the fine blade 120 B and then removed from the second platen 104 B (e.g., by a robotic arm 60 ).
- the blade holder 110 is also in a position such that the course blade 120 A is aligned with the fine dressing board 130 B and the fine blade 120 D is aligned with the course dressing board 130 A.
- no blades 120 are dressed when the blade holder 110 is in the second position.
- the blade holder 110 is rotated to a position such that a workpiece 50 on the first platen 104 A can be trimmed using the fine blade 120 D and a workpiece 50 on the second platen 104 B can be trimmed using the course blade 120 C.
- the blade holder 110 may be rotated a further 90° around the central axis 113 as shown in FIG. 6 C , or may be rotated another appropriate angle.
- the position of the blade holder 110 in FIG. 6 C may be considered a “third position.”
- the workpiece 50 C on the first platen 104 A is trimmed using the fine blade 120 D and then removed from the first platen 104 A (e.g., by a robotic arm 60 ).
- a workpiece 50 D is loaded onto the second platen 104 B (e.g., by a robotic arm 60 ) and then trimmed using the course blade 120 C.
- the blade holder 110 is also in a position such that the course blade 120 A is aligned with the course dressing board 130 A and the fine blade 120 B is aligned with the fine dressing board 130 B. In this manner, the blade 120 A and/or the blade 120 B may optionally be dressed when the blade holder 110 is in the third position.
- the blade holder 110 is rotated to a position such that a workpiece 50 on the first platen 104 A can be trimmed using the course blade 120 A and a workpiece 50 on the second platen 104 B can be trimmed using the fine blade 120 D.
- the blade holder 110 may be rotated a further 90° around the central axis 113 as shown in FIG. 6 D , or may be rotated another appropriate angle.
- the position of the blade holder 110 in FIG. 6 D may be considered a “fourth position.”
- a workpiece 50 E is loaded onto the first platen 104 A (e.g., by a robotic arm 60 ) and then trimmed using the course blade 120 A.
- the workpiece 50 D on the second platen 104 B is trimmed using the fine blade 120 D and then removed from the second platen 104 B (e.g., by a robotic arm 60 ). Still referring to FIG. 6 D , the blade holder 110 is also in a position such that the course blade 120 C is aligned with the fine dressing board 130 B and the fine blade 120 B is aligned with the course dressing board 130 A. Thus, in some embodiments, no blades 120 are dressed when the blade holder 110 is in the fourth position.
- the blade holder 110 is rotated back to the first position.
- the blade holder 110 may be rotated 270° around the central axis 113 in a reverse direction, as shown in FIG. 6 D , or may be rotated another appropriate angle.
- the workpiece 50 E on the first platen 104 A is trimmed using the fine blade 120 B and then removed from the first platen 104 A (e.g., by a robotic arm 60 ).
- a workpiece 50 F is loaded onto the second platen 104 B (e.g., by a robotic arm 60 ) and then trimmed using the course blade 120 A.
- the blade 120 C and/or the blade 120 D may optionally be dressed when the blade holder 110 is in the first position. In this manner, the steps described in FIGS. 6 A through 6 E may be repeated to efficiently trim workpieces 50 and dress blades 120 .
- FIG. 7 illustrates process flow 200 for a trimming process, in accordance with some embodiments.
- the trimming process described by the process flow 200 of FIG. 7 is similar to the trimming process described previously in FIGS. 6 A- 6 E .
- a workpiece on a first platen is trimmed using a fine blade and then removed from the first platen.
- a workpiece is also loaded on a second platen and then trimmed using a course blade. Additionally, one or more blades may optionally be trimmed at step 202 .
- Step 202 is similar to the intermediate step shown in FIG. 6 A or the intermediate step shown in FIG. 6 E .
- Step 204 the blade holder is rotated to a second position.
- a workpiece is loaded on the first platen and then trimmed using a course blade.
- the workpiece on the second platen is also trimmed using the fine blade and then removed from the second platen. Steps 204 and 206 are similar to the intermediate step shown in FIG. 6 B .
- the blade holder is rotated to a third position.
- the workpiece on the first platen is trimmed using a fine blade and then removed from the first platen.
- a workpiece is also loaded on the second platen and then trimmed using the course blade. Additionally, one or more blades may optionally be trimmed at step 210 .
- Steps 208 and 210 are similar to the intermediate step shown in FIG. 6 C .
- Step 212 the blade holder is rotated to a fourth position.
- a workpiece is loaded on the first platen and then trimmed using a course blade.
- the workpiece on the second platen is also trimmed using the fine blade and then removed from the second platen. Steps 212 and 214 are similar to the intermediate step shown in FIG. 6 D .
- step 216 the blade holder is rotated back to the first position, which is similar to the intermediate step shown in FIG. 6 E .
- the trimming process may then continue from step 202 to trim additional workpieces.
- FIGS. 8 A and 8 B illustrate the repositioning of a dressing board 130 , in accordance with some embodiments.
- a dressing board 130 may be repositioned to provide an unused surface for the dressing of a blade 120 .
- the dressing board 130 may be repositioned, for example, by an actuator within the dressing station 132 that rotates or translates the dressing board 130 .
- An illustrative example is shown in the schematic plan views of FIGS. 8 A and 8 B , in which a dressing board 130 is rotated after the dressing of a blade 120 .
- FIG. 8 A illustrates the dressing board 130 after dressing a blade 120
- FIG. 8 B illustrates the dressing board 130 prior to a subsequent dressing of a blade 120 .
- FIG. 8 A illustrates the dressing board 130 after dressing a blade 120
- FIG. 8 B illustrates the dressing board 130 prior to a subsequent dressing of a blade 120 .
- the dressing of the blade 120 results in a used region 131 A of the dressing board 130 due to the dressing process.
- the dressing board 130 is rotated by a suitable angle A 1 to move the used region 131 A away from the location under a blade 120 during dressing and move an unused region 131 B into the location under a blade 120 during dressing.
- the dressing board 130 may be rotated as needed to provide an unused region for the dressing of a blade 120 , which can improve the quality of the dressing of the blade 120 and thus improve the quality of the trimming using that blade 120 .
- a dressing board 130 may have different regions that are suitable for blades 120 having different grit sizes. In this manner, a single dressing board 130 may be used for dressing different types of blades 120 .
- FIGS. 9 A and 9 B show two illustrative examples of dressing boards 130 having different grit regions 133 that are suitable for blades 120 having different grit sizes.
- FIG. 9 A shows a dressing board 130 having grit regions 133 A-C corresponding to different grit sizes
- FIG. 9 B shows a dressing board having grit regions 133 A-B corresponding to different grit sizes.
- the different grit regions 133 A-C are arranged in concentric rings or annuli.
- the different grit regions 133 A-B are arranged as adjacent sections (e.g., two halves) of the dressing board 130 .
- adjacent sections e.g., two halves
- dressing boards 130 having other numbers, arrangements, shapes, or combinations of grit regions 133 are possible.
- a dressing board 130 may be rotated to align an unused region of the dressing board 130 and/or to align a different grit region 133 with a blade 120 prior to the dressing of the blade 120 .
- a blade 120 may be positioned over a particular region of a dressing board 130 , such as over an unused region or a region corresponding to a different grit.
- the position of the blade 120 may be controlled by adjusting the rotation angle of the blade holder 110 or by adjusting the protrusion of the blade 120 from the arm 112 using the actuator 122 (see FIG. 5 ).
- the adjustment of the blade 120 position may be combined with any of the dressing boards 130 described herein. In this manner, the size of the trimming tool 100 may be reduced, the time needed for dressing when multiple blades 120 are used may be reduced, and trimming quality may be improved.
- the blade holder 110 may include one or more sensors that allow for monitoring or measuring of blade 120 characteristics.
- An illustrative example is shown in the schematic cross-section of FIG. 10 A , which shows a portion of a blade holder 110 including a portion of the hub 111 and an arm 112 , in accordance with some embodiments.
- one or more sensors 140 may be located in the hub 111 , though the sensors 140 may have different locations in other embodiments.
- each blade 120 attached to the blade holder 110 may have a corresponding sensor 140 or set of sensors 140 located in the blade holder 110 .
- a blade holder 110 that holds four blades 120 may have four sets of sensors 140 .
- the sensors 140 may be configured to measure characteristics of the corresponding blade 120 such as position, roughness, diameter, uniformity, planarity, or other characteristics. One sensor 140 may measure more than one characteristic of a blade 120 , in some cases. In some embodiments, the sensors 140 may measure blade 120 characteristics as the blade 120 spins, which may be during trimming, during dressing, or when the blade 120 is not in use. For example, in some embodiments, a sensor 140 may measure the characteristics of a blade 120 when the blade 120 is positioned over an unsuitable dressing board 130 , such as blades 120 A or 120 D in FIG. 6 B . In some embodiments, the sensors 140 may be laser-based sensors, optical sensors, or other types of sensors. The example sensor 140 shown in FIG. 10 A is a laser-based sensor. In some embodiments, the measurements provided by a sensor 140 may indicate that a blade 120 should be dressed or replaced.
- a sensor 140 may measure a position of the corresponding blade 120 relative to the sensor 140 .
- the sensor 140 may use a laser to measure the distance that the blade 120 protrudes from an end of the arm 112 . In this manner, the position of the blade 120 may be more precisely determined.
- the sensor 140 may be used with the actuator 122 to more precisely or accurately adjust the position of the blade 120 .
- a sensor 140 may measure a roughness of the corresponding blade 120 .
- FIG. 10 B shows a magnified view of an edge of a blade 120 .
- the sensor 140 may be configured to measure surface variation of the edge of the blade 120 , such as a maximum variation of the blade 120 , indicated in FIG. 10 B as R 1 .
- a roughness measurement of the blade 120 may indicate that the blade 120 is in need of dressing or replacement. For example, a blade 120 may be dressed if a roughness, maximum height variation, average height variation, or the like exceeds a certain threshold.
- a sensor 140 may measure the absolute height or diameter of the corresponding blade 120 .
- FIG. 10 C shows a magnified view of an edge of a blade 120 .
- the sensor 140 may be configured to measure a height of the blade 120 , such as the minimum height of the blade 120 , indicated in FIG. 10 C as H 1 .
- a height measurement of the blade 120 may indicate that the blade 120 is in need of dressing or replacement.
- a blade 120 may be dressed or replaced if a minimum height H 1 of the blade is less than a certain threshold (e.g., threshold Tl indicated in FIG. 10 C ).
- FIG. 12 illustrates a schematic cross-sectional view of a portion of a trimming tool 400 , in accordance with some embodiments.
- the trimming tool 400 may be similar to other trimming tools described herein, except that a single blade 120 is configured to two workpieces 50 A-B.
- the trimming tool 400 comprises an upper platen 104 A that holds a workpiece 50 A above the blade 120 , and a lower platen 104 B that holds a workpiece 50 B below the blade 120 .
- the blade 120 may trim the workpieces 50 A-B simultaneously.
- the blade 120 may trim the workpieces 50 A-B sequentially.
- the trimming tool 400 also comprises a cover 410 between the workpieces 50 A-B that prevents particles or debris from accumulating on the lower workpiece 50 B. The use of the trimming tool 400 allows for the rate that workpieces are trimmed to be increased.
- Embodiments described herein have advantages.
- the trimming tools described herein allow for multi-blade dressing and multi-workpiece trimming at the same time. This can reduce time spent dressing blades and increase the rate at which workpieces are trimmed.
- Inspection tools such as sensors, are also used to monitor blade, workpiece, and dressing board conditions to achieve higher yield, more efficient dressing, and easier maintenance.
- the trimming tools described herein allow for blades to be automatically dressed as needed.
- an apparatus includes a first platen configured to hold a first workpiece; a first dressing board; and blade holder including arms extending from a central axis, wherein the blade holder is configured to hold a blade at an end of each respective arm, wherein the blade holder is operable to rotate around the central axis, wherein the blade holder is configured to trim the first workpiece using at least one blade, wherein the blade holder is configured to dress at least one blade on the first dressing board.
- the apparatus includes a second platen configured to hold a second workpiece, wherein the blade holder is configured to simultaneously trim the first workpiece using one blade and trim the second workpiece using another blade.
- the apparatus includes a second dressing board, wherein the blade holder is configured to simultaneously dress one blade on the first dressing board and another blade on the second dressing board. In an embodiment, wherein the blade holder has four arms. In an embodiment, the apparatus includes a sensor arm configured to measure a condition of a trimmed region of the first workpiece. In an embodiment, the blade holder includes a sensor configured to measure a condition of a blade held by the blade holder. In an embodiment, each arm of the blade holder includes an actuator, wherein each actuator is configured to extend or retract the blade at the end of the respective arm. In an embodiment, the first dressing board includes a first region corresponding to a first blade grit size and a second region corresponding to a second blade grit size.
- a trimming tool includes a blade holder comprising arms, wherein the blade holder holds blades, wherein each arm holds a respective blade; platens, wherein each platen is configured to hold a respective wafer, wherein the platens are aligned with a first set of arms; and dressing boards, wherein the dressing boards are aligned with a second set of arms.
- the blades are in a cross-shaped arrangement.
- the blades include at least two different types of blades.
- the dressing boards include at least two different types of dressing boards.
- the blade holder is operable to rotate to align the plurality of platens with the second set of arms and the plurality of dressing boards with the first set of arms.
- the platens include a first platen that is located above a second platen.
- each dressing board is configured to rotate independently.
- a method includes rotating a blade holder to align a first blade of the blade holder with a first platen and a second blade of the blade holder with a first dressing board; trimming a first workpiece on the first platen using the first blade; dressing the second blade using the dressing board; rotating the blade holder to align the second blade of the blade holder with the first platen; and trimming a second workpiece on the first platen using the second blade.
- the method includes rotating the dressing board after dressing the second blade.
- rotating the blade holder to align the first blade with the first workpiece also aligns a third blade with a third workpiece.
- the method includes trimming the third workpiece using the third blade while the first workpiece is trimmed using the first blade.
- the first blade has a course grit size and the second blade has a fine grit size.
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Abstract
An apparatus includes a first platen configured to hold a first workpiece; a first dressing board; and blade holder including arms extending from a central axis, wherein the blade holder is configured to hold a blade at an end of each respective arm, wherein the blade holder is operable to rotate around the central axis, wherein the blade holder is configured to trim the first workpiece using at least one blade, wherein the blade holder is configured to dress at least one blade on the first dressing board.
Description
- Semiconductor device fabrication is a process used to create integrated circuits that are present in everyday electronic devices. The fabrication process is a multiple-step sequence of photolithographic and chemical processing steps during which electronic circuits are gradually created on a wafer composed of a semiconducting material. During fabrication, the edge of the wafer may become warped, damaged, or otherwise unsuitable for use with electronic circuits. Hence, the edge of the wafer may be trimmed during fabrication.
- Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures. It is noted that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.
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FIGS. 1A, 1B, and 1C illustrate cross-sections of intermediate stages in the processing of workpieces including a trimming step, in accordance with some embodiments. -
FIGS. 2A, 2B, and 2C illustrate cross-sections of intermediate stages in the processing of workpieces including a trimming step, in accordance with some embodiments. -
FIG. 3 illustrates a schematic plan view of a trimming tool, in accordance with some embodiments. -
FIG. 4 illustrates a schematic perspective view of a trimming tool, in accordance with some embodiments. -
FIG. 5 shows schematic perspective views of a blade attached to the end of an arm of a blade holder, in accordance with some embodiments. -
FIGS. 6A, 6B, 6C, 6D, and 6E , intermediate steps of a trimming process utilizing a trimming tool are shown, in accordance with some embodiments. -
FIG. 7 illustrates process flow for a trimming process, in accordance with some embodiments. -
FIGS. 8A and 8B illustrate a process for dressing a blade with a dressing board, in accordance with some embodiments. -
FIGS. 9A and 9B illustrate dressing boards, in accordance with some embodiments. -
FIGS. 10A, 10B, and 10C illustrate a sensor for a blade and example blade measurements, in accordance with some embodiments. -
FIG. 11 illustrates a schematic plan view of a trimming tool, in accordance with some embodiments. -
FIG. 12 illustrates a schematic cross-sectional view of a portion of a trimming tool, in accordance with some embodiments. - The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
- Further, spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.
- A trimming tool for trimming wafers is described herein, according to various embodiments. The trimming tool described herein includes a blade holder configured to hold and operate multiple trimming blades such that multiple workpieces (e.g., wafers) can be trimmed by different blades on the blade holder. Additionally, the blade holder is configured to rotate such that some blades can be “dressed” (e.g., cleaned using one or more dressing boards) while other blades are used to trim workpieces. In this manner, the rate at which workpieces are trimmed may be increased while still allowing blades to be dressed as needed. This can reduce processing time and improve efficiency. The blade holder may also include sensors that monitor blade position or blade conditions, which can allow for more efficient and cost-effective blade dressing.
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FIGS. 1A through 1C andFIGS. 2A through 2C illustrate cross-sections of intermediate stages in the processing of workpieces including a trimming step, in accordance with some embodiments. The processes shown inFIGS. 1A-1C and 2A-2C are illustrative examples, and any other suitable processes including trimming step may be used with the embodiments of the present disclosure. InFIGS. 1A-1C and 2A-2C , afirst wafer 10 is bonded to asecond wafer 20 to form aworkpiece 50. In some cases, theworkpiece 50 may also be referred to as a “wafer,” a “reconstituted wafer,” a “bonded structure,” a “stacked wafer structure,” or the like. Edge portions of theworkpiece 50 are then removed in a trimming process, which may be performed using embodiments described herein. In some cases, trimming aworkpiece 50 may reduce warping, cracking, or debonding. - In
FIG. 1A , thefirst wafer 10 is bonded or otherwise attached to thesecond wafer 20 to form theworkpiece 50. In some embodiments, thefirst wafer 10 and/or thesecond wafer 20 may be a semiconductor wafer such as a silicon bulk wafer or a gallium arsenide wafer. In some embodiments, thefirst wafer 10 and/or the second wafer comprises, for example, silicon, strained silicon, silicon alloy, silicon carbide, silicon-germanium, silicon-germanium carbide, germanium, a germanium alloy, germanium-arsenic, indium-arsenic, group III-V semiconductors, a combination thereof, or the like. In some embodiments, thefirst wafer 10 and/or thesecond wafer 20 is a buried oxide (BOX) wafer, a device wafer, an interposer, an organic core substrate, a combination thereof, or the like. Thefirst wafer 10 and thesecond wafer 20 may have similar or different materials or dimensions. Thefirst wafer 10 may be bonded to thesecond wafer 20 using direct bonding (e.g., dielectric-to-dielectric bonding and/or metal-to-metal bonding), using an adhesive, or using another suitable technique. In some cases, thesecond wafer 20 may be considered a “carrier,” a “carrier substrate,” or a “carrier wafer.” - In
FIG. 1B , theworkpiece 50 is trimmed, in accordance with some embodiments. During the trimming process, aregion 45 around the edge of theworkpiece 50 is removed. For example, thetrimmed region 45 may be removed vertically downward from thefirst wafer 10 toward thesecond wafer 20. The trimmedregion 45 may extend partially or fully through thefirst wafer 10 and may extend partially or fully through thesecond wafer 20. For example, the trimmedregion 45 shown inFIG. 1B extends fully through thefirst wafer 10 and partially through thesecond wafer 20. InFIG. 1C , thefirst wafer 10 is thinned using a suitable process, such as a chemical mechanical polish (CMP) process, a grinding process, an etching process, a combination thereof, or the like. The thinning process reduces the thickness of thefirst wafer 10. - The process shown in
FIGS. 2A-2C is similar to the process shown inFIGS. 1A-1C , except that theworkpiece 50 is thinned before theworkpiece 50 is trimmed.FIG. 2A shows a workpiece similar to that ofFIG. 1A . InFIG. 2B , theworkpiece 50 is thinned to reduce the thickness of thefirst wafer 10. InFIG. 2C , a trimming process is performed to remove aregion 45 around the edge of theworkpiece 50, similar to the trimming process described forFIG. 1C . -
FIGS. 3 and 4 illustrate atrimming tool 100, in accordance with some embodiments.FIG. 3 illustrates a schematic plan view of thetrimming tool 100, andFIG. 4 illustrates a schematic perspective view of thetrimming tool 100. Some features or details may be not be shown for clarity reasons. Thetrimming tool 100 may be used to trim one ormore workpieces 50, which may be similar to theworkpieces 50 described above forFIGS. 1A-2C , thoughother workpieces 50 are possible. In some embodiments, thetrimming tool 100 comprises ablade holder 110 configured to hold and operatemultiple trimming blades 120. In this manner, theblade holder 110 may be considered a “multi-blade holder.” Theblade holder 110 comprisesmultiple arms 112 that extend from ahub 111 at acentral axis 113, with ablade 120 attached to the end of eacharm 112. For example, theblade holder 110 shown inFIGS. 3-4 has fourarms 112A-D with fourcorresponding blades 120A-D. In other embodiments, theblade holder 110 has a different number ofarms 112, such as two, three, or more than fourarms 112. In some embodiments, theblade holder 110 is operable to rotate around thecentral axis 113 to reposition thearms 112 and thecorresponding blades 120.FIG. 3 also showsrobotic arms 60 that may be used to transferworkpieces 50 into or out of thetrimming tool 100, in accordance with some embodiments. -
FIG. 5 shows schematic perspective views of ablade 120 attached to the end of anarm 112, in accordance with some embodiments. In some embodiments, theblade 120 is attached to anactuator 122 within thearm 112 by aspindle 124. Theactuator 122 may comprise a motor, a hydraulic actuator, a pneumatic actuator, a robotic arm, another type of actuator or mechanism, a combination thereof, or the like. In some embodiments, theactuator 122 may be configured to rotate the blade 120 (e.g., clockwise and/or counterclockwise, such as during trimming or dressing) or laterally translate (e.g., extend or retract) theblade 120. As an illustrative example,FIG. 5 shows theblade 120 in two different lateral positions after translation by theactuator 122. In some embodiments, theactuator 122 may laterally translate theblade 120 within a range from about 1 mm to about 50 mm, but other ranges of translation are possible. Theactuator 122 may translate theblade 120 to suitably align theblade 120 with aworkpiece 50 during a trimming process or to suitably align theblade 120 with a dressingboard 130 during a dressing process, for example. In some embodiments, thearm 112, theactuator 122, and/or thespindle 124 may comprise a spring or damper (not shown) that reduces vibrations of theblade 120 during operation. - In some embodiments, a
blade 120 attached to anarm 112 may have a diameter in the range of about 10 mm to about 300 mm, though other diameters are possible. Theblade 120 may be formed of any suitable materials or have any suitable characteristics. For example, theblade 120 may comprise a bonding material of ceramic, resin, rubber, chlorine oxide (e.g., oxychloride), nickel, the like, or a combination thereof. Theblade 120 may have a grit size in the range of #100 to #7000, though other grit sizes are possible. In some embodiments, theblade 120 may have grit comprising diamond, cubic boron nitride (CBN), silicon carbide, aluminum oxide, zirconia alumina, zirconium dioxide, ceramic, garnet, the like, or a combination thereof. In some embodiments, theblade 120 may have a grit coating comprising nickel, nickel chrome, nickel aluminum, aluminum bronze, aluminum oxide, chrome oxide, zirconium oxide, chrome carbide nickel chrome, nickel graphite, aluminum, copper, molybdenum, tungsten carbide cobalt, titanium oxide, the like, or a combination thereof. Other materials are possible. - The
various blades 120 attached to thearms 112 of ablade holder 110 may have similar or different characteristics. For example, returning toFIGS. 3 and 4 , the 120A and 120C respectively attached toblades 112A and 112C have a relatively course grit, and thearms 120B and 120D respectively attached toblades 112B and 112D have a relatively fine grit. Other combinations of blades and blade characteristics are possible. In some embodiments, a trimming process for aarms workpiece 50 may comprise trimming theworkpiece 50 with a course blade 120 (e.g., 120A or 120C) and then trimming theblade workpiece 50 with a fine blade 120 (e.g., 120B or 120D). Accordingly,blade 120A and 120C may be referred to as “course blades” herein, andblades 120B and 120D may be referred to as “fine blades” herein. Theblades multi-armed blade holder 110 described herein allows for asingle workpiece 50 to be trimmed withmultiple blades 120 during a trimming process. - Still referring to
FIGS. 3 and 4 , thetrimming tool 100 comprises a trimmingstation 102 that supports and rotatesworkpieces 50 during a trimming process, in accordance with some embodiments. The trimmingstation 102 comprises afirst platen 104A and asecond platen 104B that are each configured to hold aworkpiece 50. For example,FIGS. 3-4 show thefirst platen 104A holding afirst workpiece 50A and thesecond platen 104B holding asecond workpiece 50B. A trimmingstation 102 may comprise a different number of platens 104 in other embodiments. A platen 104 may secure aworkpiece 50 using, e.g. vacuum suction or another suitable technique, and may rotate the workpiece 50 (e.g., clockwise or counterclockwise) during a trimming process, in some embodiments. - The
trimming tool 100 also comprises one ormore dressing boards 130, in accordance with some embodiments. The dressingboards 130 are used to clean, reshape, and refreshblades 120 after performing a trimming process. The dressingboards 130 are supported by adressing station 132, and in some embodiments, each dressingboard 130 may have itsown dressing station 132. For example,FIGS. 3-4 show afirst dressing board 130A on afirst dressing station 132A and asecond dressing board 130B on asecond dressing station 132B. In other embodiments, both thefirst dressing board 130A and thesecond dressing board 130B may be supported by thesame dressing station 132. In some embodiments, a dressingboard 130 may be rotated, translated, or positioned by thedressing station 132. - In some embodiments in which the
trimming tool 100 has two ormore dressing boards 130, thevarious dressing boards 130 may have similar or different characteristics. For example, referring toFIGS. 3-4 , thefirst dressing board 130A may be suited for ablade 120 having relatively course grit (e.g., 120A or 120C), and theblade second dressing board 130B may be suited for ablade 120 having relatively fine grit (e.g., 120B or 120D). In this manner, a dressingblade board 130 may be referred to as a “course dressing board” or a “fine dressing board” herein. Other combinations of dressing boards and dressing board characteristics are possible. - In some embodiments, the
trimming tool 100 comprises asensor arm 106 that measures characteristics of aworkpiece 50 during or after performing a trimming process. Thesensor arm 106 may monitor, detect, or measure characteristics of a trimmed region (e.g., trimmedregion 45 ofFIGS. 1B-1C or 2B-2C ) of aworkpiece 50, such as depth, width, roughness, location, or the like. Thesensor arm 106 may comprise one or more sensors, which may be laser-based sensors, optical sensors (e.g., OCD sensors, CCD sensors, or the like) or other types of sensors. In some embodiments, thesensor arm 106 may be operable to rotate or translate between a first position to measure a first workpiece 50 (e.g.,first workpiece 50A inFIG. 3 ) and a second position to measure a second workpiece 50 (e.g.,second workpiece 50B inFIG. 3 ). In other embodiments, each platen 104 has an associatedsensor arm 106. - A trimming tool comprising a multi-blade holder may have a different configuration than the
trimming tool 100 shown inFIGS. 3-4 . As another non-limiting example,FIG. 11 illustrates atrimming tool 300, in accordance with some embodiments. Thetrimming tool 300 has ablade holder 110 configured to hold sixblades 120A-F, which may be similar blades or blades of different types. Thetrimming tool 300 also includes five platens (not separately shown) to hold fiveworkpieces 50A-E and includes onedressing board 130 on adressing station 132. Thetrimming tool 300 is configured such that the fiveworkpieces 50A-E may be trimmed simultaneously by five of the blades 120 (e.g.,blades 120A-E) while the remaining blade 120 (e.g.,blades 120F) is dressed at the dressingboard 130. Theblade holder 110 may rotate in order to aligndifferent blades 120A-F with different platens or with the dressingboard 130. Another number or arrangement ofblades 120,workpieces 50, dressingboards 130, or other features is possible in other embodiments. - Turning to
FIGS. 6A through 6E , intermediate steps of an example trimming process utilizing thetrimming tool 100 are shown, in accordance with some embodiments. The trimming process shown inFIGS. 6A-6E is an illustrative example, and other trimming processes with different steps or different sequences of steps may be used in other embodiments. Some of the actions described below for a step may be performed sequentially, and some of the actions described below for a step may be performed simultaneously. Some of the actions described below for a step may be performed in a different order than described. Using a suitable trimming process such as that described forFIGS. 6A-6E , thetrimming tool 100 as described herein allows for the efficient trimming ofworkpieces 50 including the dressing ofblades 120 with an improved “wafer-per-hour” rate. Additionally, the trimming process described inFIGS. 6A-6E allow for each workpiece 50 to be trimmed with a course blade and then a fine blade, which can improve the smoothness and reproducibility of the trimmed region and reduce the risk of cracking or warping of theworkpiece 50. - In
FIG. 6A , theblade holder 110 is in a position such that aworkpiece 50 on thefirst platen 104A can be trimmed using thefine blade 120B and aworkpiece 50 on thesecond platen 104B can be trimmed using thecourse blade 120A. In some cases, the position of theblade holder 110 inFIG. 6A may be considered an “initial position” or a “first position.” Theworkpiece 50A on thefirst platen 104A is trimmed using thefine blade 120B and then removed from thefirst platen 104A (e.g., by a robotic arm 60). Theworkpiece 50A may be removed from thefirst platen 104A and transferred to a cleaning station or the like, for example. Theworkpiece 50B is loaded onto thesecond platen 104B (e.g., by a robotic arm 60) and then trimmed using thecourse blade 120A. - Still referring to
FIG. 6A , theblade holder 110 is also in a position such that thecourse blade 120C may be dressed using thecourse dressing board 130A and thefine blade 120D may be dressed using thefine dressing board 130B. In some embodiments, theblades 120C-D may be dressed while theworkpieces 50A-B are trimmed by theblades 120A-B. The dressing of theblades 120C and/or 120D when theblade holder 110 is in the first position is optional, and one, both, or neither of theblades 120C-D may be dressed. In some embodiments, the condition of ablade 120 may be monitored or measured, and whether or not theblade 120 is dressed may be determined from the condition of theblade 120. In some cases, ablade 120 may be dressed after trimming a predetermined number ofworkpieces 50 since the previous dressing of theblade 120. - In
FIG. 6B , theblade holder 110 is rotated to a position such that aworkpiece 50 on thefirst platen 104A can be trimmed using thecourse blade 120C and aworkpiece 50 on thesecond platen 104B can be trimmed using thefine blade 120B. For example, theblade holder 110 may be rotated 90° around thecentral axis 113 as shown inFIG. 6B , or may be rotated another appropriate angle. In some cases, the position of theblade holder 110 inFIG. 6B may be considered a “second position.” Aworkpiece 50C is loaded onto thefirst platen 104A (e.g., by a robotic arm 60) and then trimmed using thecourse blade 120C. Theworkpiece 50B on thesecond platen 104B is trimmed using thefine blade 120B and then removed from thesecond platen 104B (e.g., by a robotic arm 60). Still referring toFIG. 6B , theblade holder 110 is also in a position such that thecourse blade 120A is aligned with thefine dressing board 130B and thefine blade 120D is aligned with thecourse dressing board 130A. Thus, in some embodiments, noblades 120 are dressed when theblade holder 110 is in the second position. - In
FIG. 6C , theblade holder 110 is rotated to a position such that aworkpiece 50 on thefirst platen 104A can be trimmed using thefine blade 120D and aworkpiece 50 on thesecond platen 104B can be trimmed using thecourse blade 120C. For example, theblade holder 110 may be rotated a further 90° around thecentral axis 113 as shown inFIG. 6C , or may be rotated another appropriate angle. In some cases, the position of theblade holder 110 inFIG. 6C may be considered a “third position.” Theworkpiece 50C on thefirst platen 104A is trimmed using thefine blade 120D and then removed from thefirst platen 104A (e.g., by a robotic arm 60). Aworkpiece 50D is loaded onto thesecond platen 104B (e.g., by a robotic arm 60) and then trimmed using thecourse blade 120C. Still referring toFIG. 6C , theblade holder 110 is also in a position such that thecourse blade 120A is aligned with thecourse dressing board 130A and thefine blade 120B is aligned with thefine dressing board 130B. In this manner, theblade 120A and/or theblade 120B may optionally be dressed when theblade holder 110 is in the third position. - In
FIG. 6D , theblade holder 110 is rotated to a position such that aworkpiece 50 on thefirst platen 104A can be trimmed using thecourse blade 120A and aworkpiece 50 on thesecond platen 104B can be trimmed using thefine blade 120D. For example, theblade holder 110 may be rotated a further 90° around thecentral axis 113 as shown inFIG. 6D , or may be rotated another appropriate angle. In some cases, the position of theblade holder 110 inFIG. 6D may be considered a “fourth position.” Aworkpiece 50E is loaded onto thefirst platen 104A (e.g., by a robotic arm 60) and then trimmed using thecourse blade 120A. Theworkpiece 50D on thesecond platen 104B is trimmed using thefine blade 120D and then removed from thesecond platen 104B (e.g., by a robotic arm 60). Still referring toFIG. 6D , theblade holder 110 is also in a position such that thecourse blade 120C is aligned with thefine dressing board 130B and thefine blade 120B is aligned with thecourse dressing board 130A. Thus, in some embodiments, noblades 120 are dressed when theblade holder 110 is in the fourth position. - In
FIG. 6E , theblade holder 110 is rotated back to the first position. For example, theblade holder 110 may be rotated 270° around thecentral axis 113 in a reverse direction, as shown inFIG. 6D , or may be rotated another appropriate angle. Theworkpiece 50E on thefirst platen 104A is trimmed using thefine blade 120B and then removed from thefirst platen 104A (e.g., by a robotic arm 60). Aworkpiece 50F is loaded onto thesecond platen 104B (e.g., by a robotic arm 60) and then trimmed using thecourse blade 120A. Similar toFIG. 6A , theblade 120C and/or theblade 120D may optionally be dressed when theblade holder 110 is in the first position. In this manner, the steps described inFIGS. 6A through 6E may be repeated to efficiently trimworkpieces 50 anddress blades 120. -
FIG. 7 illustratesprocess flow 200 for a trimming process, in accordance with some embodiments. The trimming process described by theprocess flow 200 ofFIG. 7 is similar to the trimming process described previously inFIGS. 6A-6E . Atstep 202, a workpiece on a first platen is trimmed using a fine blade and then removed from the first platen. Atstep 202, a workpiece is also loaded on a second platen and then trimmed using a course blade. Additionally, one or more blades may optionally be trimmed atstep 202. Step 202 is similar to the intermediate step shown inFIG. 6A or the intermediate step shown inFIG. 6E . - At
step 204, the blade holder is rotated to a second position. Atstep 206, a workpiece is loaded on the first platen and then trimmed using a course blade. Atstep 206, the workpiece on the second platen is also trimmed using the fine blade and then removed from the second platen. 204 and 206 are similar to the intermediate step shown inSteps FIG. 6B . - At
step 208, the blade holder is rotated to a third position. Atstep 210, the workpiece on the first platen is trimmed using a fine blade and then removed from the first platen. Atstep 210, a workpiece is also loaded on the second platen and then trimmed using the course blade. Additionally, one or more blades may optionally be trimmed atstep 210. 208 and 210 are similar to the intermediate step shown inSteps FIG. 6C . - At
step 212, the blade holder is rotated to a fourth position. Atstep 214, a workpiece is loaded on the first platen and then trimmed using a course blade. Atstep 214, the workpiece on the second platen is also trimmed using the fine blade and then removed from the second platen. 212 and 214 are similar to the intermediate step shown inSteps FIG. 6D . - At
step 216, the blade holder is rotated back to the first position, which is similar to the intermediate step shown inFIG. 6E . The trimming process may then continue fromstep 202 to trim additional workpieces. -
FIGS. 8A and 8B illustrate the repositioning of a dressingboard 130, in accordance with some embodiments. In some embodiments, a dressingboard 130 may be repositioned to provide an unused surface for the dressing of ablade 120. The dressingboard 130 may be repositioned, for example, by an actuator within thedressing station 132 that rotates or translates the dressingboard 130. An illustrative example is shown in the schematic plan views ofFIGS. 8A and 8B , in which adressing board 130 is rotated after the dressing of ablade 120.FIG. 8A illustrates the dressingboard 130 after dressing ablade 120, andFIG. 8B illustrates the dressingboard 130 prior to a subsequent dressing of ablade 120. InFIG. 8A , the dressing of theblade 120 results in a usedregion 131A of the dressingboard 130 due to the dressing process. InFIG. 8B , the dressingboard 130 is rotated by a suitable angle A1 to move the usedregion 131A away from the location under ablade 120 during dressing and move anunused region 131B into the location under ablade 120 during dressing. In this manner, the dressingboard 130 may be rotated as needed to provide an unused region for the dressing of ablade 120, which can improve the quality of the dressing of theblade 120 and thus improve the quality of the trimming using thatblade 120. - In some embodiments, a dressing
board 130 may have different regions that are suitable forblades 120 having different grit sizes. In this manner, asingle dressing board 130 may be used for dressing different types ofblades 120.FIGS. 9A and 9B show two illustrative examples of dressingboards 130 having different grit regions 133 that are suitable forblades 120 having different grit sizes. For example,FIG. 9A shows a dressingboard 130 havinggrit regions 133A-C corresponding to different grit sizes, andFIG. 9B shows a dressing board havinggrit regions 133A-B corresponding to different grit sizes. InFIG. 9A , thedifferent grit regions 133A-C are arranged in concentric rings or annuli. InFIG. 9B , thedifferent grit regions 133A-B are arranged as adjacent sections (e.g., two halves) of the dressingboard 130. These are illustrative examples, andother dressing boards 130 having other numbers, arrangements, shapes, or combinations of grit regions 133 are possible. - In some embodiments, a dressing
board 130 may be rotated to align an unused region of the dressingboard 130 and/or to align a different grit region 133 with ablade 120 prior to the dressing of theblade 120. By providingdressing boards 130 with different grit regions 133,blades 120 of different types can be dressed without using aseparate dressing board 130 for each type ofblade 120. In some embodiments, ablade 120 may be positioned over a particular region of a dressingboard 130, such as over an unused region or a region corresponding to a different grit. For example, the position of theblade 120 may be controlled by adjusting the rotation angle of theblade holder 110 or by adjusting the protrusion of theblade 120 from thearm 112 using the actuator 122 (seeFIG. 5 ). The adjustment of theblade 120 position may be combined with any of the dressingboards 130 described herein. In this manner, the size of thetrimming tool 100 may be reduced, the time needed for dressing whenmultiple blades 120 are used may be reduced, and trimming quality may be improved. - In some embodiments, the
blade holder 110 may include one or more sensors that allow for monitoring or measuring ofblade 120 characteristics. An illustrative example is shown in the schematic cross-section ofFIG. 10A , which shows a portion of ablade holder 110 including a portion of thehub 111 and anarm 112, in accordance with some embodiments. As shown inFIG. 10A , one ormore sensors 140 may be located in thehub 111, though thesensors 140 may have different locations in other embodiments. In some embodiments, eachblade 120 attached to theblade holder 110 may have acorresponding sensor 140 or set ofsensors 140 located in theblade holder 110. For example, ablade holder 110 that holds fourblades 120 may have four sets ofsensors 140. Thesensors 140 may be configured to measure characteristics of thecorresponding blade 120 such as position, roughness, diameter, uniformity, planarity, or other characteristics. Onesensor 140 may measure more than one characteristic of ablade 120, in some cases. In some embodiments, thesensors 140 may measureblade 120 characteristics as theblade 120 spins, which may be during trimming, during dressing, or when theblade 120 is not in use. For example, in some embodiments, asensor 140 may measure the characteristics of ablade 120 when theblade 120 is positioned over anunsuitable dressing board 130, such as 120A or 120D inblades FIG. 6B . In some embodiments, thesensors 140 may be laser-based sensors, optical sensors, or other types of sensors. Theexample sensor 140 shown inFIG. 10A is a laser-based sensor. In some embodiments, the measurements provided by asensor 140 may indicate that ablade 120 should be dressed or replaced. - In some embodiments, a
sensor 140 may measure a position of thecorresponding blade 120 relative to thesensor 140. For example, thesensor 140 may use a laser to measure the distance that theblade 120 protrudes from an end of thearm 112. In this manner, the position of theblade 120 may be more precisely determined. In some cases, thesensor 140 may be used with theactuator 122 to more precisely or accurately adjust the position of theblade 120. - In some embodiments, a
sensor 140 may measure a roughness of thecorresponding blade 120. As an illustrative example,FIG. 10B shows a magnified view of an edge of ablade 120. Thesensor 140 may be configured to measure surface variation of the edge of theblade 120, such as a maximum variation of theblade 120, indicated inFIG. 10B as R1. In some embodiments, a roughness measurement of theblade 120 may indicate that theblade 120 is in need of dressing or replacement. For example, ablade 120 may be dressed if a roughness, maximum height variation, average height variation, or the like exceeds a certain threshold. - In some embodiments, a
sensor 140 may measure the absolute height or diameter of thecorresponding blade 120. As an illustrative example,FIG. 10C shows a magnified view of an edge of ablade 120. Thesensor 140 may be configured to measure a height of theblade 120, such as the minimum height of theblade 120, indicated inFIG. 10C as H1. In some embodiments, a height measurement of theblade 120 may indicate that theblade 120 is in need of dressing or replacement. For example, ablade 120 may be dressed or replaced if a minimum height H1 of the blade is less than a certain threshold (e.g., threshold Tl indicated inFIG. 10C ). -
FIG. 12 illustrates a schematic cross-sectional view of a portion of atrimming tool 400, in accordance with some embodiments. Thetrimming tool 400 may be similar to other trimming tools described herein, except that asingle blade 120 is configured to twoworkpieces 50A-B. For example, thetrimming tool 400 comprises anupper platen 104A that holds aworkpiece 50A above theblade 120, and alower platen 104B that holds aworkpiece 50B below theblade 120. In this manner, theblade 120 may trim theworkpieces 50A-B simultaneously. In some cases, theblade 120 may trim theworkpieces 50A-B sequentially. Thetrimming tool 400 also comprises acover 410 between theworkpieces 50A-B that prevents particles or debris from accumulating on thelower workpiece 50B. The use of thetrimming tool 400 allows for the rate that workpieces are trimmed to be increased. - Embodiments described herein have advantages. The trimming tools described herein allow for multi-blade dressing and multi-workpiece trimming at the same time. This can reduce time spent dressing blades and increase the rate at which workpieces are trimmed. Inspection tools, such as sensors, are also used to monitor blade, workpiece, and dressing board conditions to achieve higher yield, more efficient dressing, and easier maintenance. The trimming tools described herein allow for blades to be automatically dressed as needed.
- In accordance with some embodiments of the present disclosure, an apparatus includes a first platen configured to hold a first workpiece; a first dressing board; and blade holder including arms extending from a central axis, wherein the blade holder is configured to hold a blade at an end of each respective arm, wherein the blade holder is operable to rotate around the central axis, wherein the blade holder is configured to trim the first workpiece using at least one blade, wherein the blade holder is configured to dress at least one blade on the first dressing board. In an embodiments, the apparatus includes a second platen configured to hold a second workpiece, wherein the blade holder is configured to simultaneously trim the first workpiece using one blade and trim the second workpiece using another blade. In an embodiment, the apparatus includes a second dressing board, wherein the blade holder is configured to simultaneously dress one blade on the first dressing board and another blade on the second dressing board. In an embodiment, wherein the blade holder has four arms. In an embodiment, the apparatus includes a sensor arm configured to measure a condition of a trimmed region of the first workpiece. In an embodiment, the blade holder includes a sensor configured to measure a condition of a blade held by the blade holder. In an embodiment, each arm of the blade holder includes an actuator, wherein each actuator is configured to extend or retract the blade at the end of the respective arm. In an embodiment, the first dressing board includes a first region corresponding to a first blade grit size and a second region corresponding to a second blade grit size.
- In accordance with some embodiments of the present disclosure, a trimming tool includes a blade holder comprising arms, wherein the blade holder holds blades, wherein each arm holds a respective blade; platens, wherein each platen is configured to hold a respective wafer, wherein the platens are aligned with a first set of arms; and dressing boards, wherein the dressing boards are aligned with a second set of arms. In an embodiment, the blades are in a cross-shaped arrangement. In an embodiment, the blades include at least two different types of blades. In an embodiment, the dressing boards include at least two different types of dressing boards. In an embodiment, the blade holder is operable to rotate to align the plurality of platens with the second set of arms and the plurality of dressing boards with the first set of arms. In an embodiment, the platens include a first platen that is located above a second platen. In an embodiment, each dressing board is configured to rotate independently.
- In accordance with some embodiments of the present disclosure, a method includes rotating a blade holder to align a first blade of the blade holder with a first platen and a second blade of the blade holder with a first dressing board; trimming a first workpiece on the first platen using the first blade; dressing the second blade using the dressing board; rotating the blade holder to align the second blade of the blade holder with the first platen; and trimming a second workpiece on the first platen using the second blade. In an embodiment, the method includes rotating the dressing board after dressing the second blade. In an embodiment, rotating the blade holder to align the first blade with the first workpiece also aligns a third blade with a third workpiece. In an embodiment, the method includes trimming the third workpiece using the third blade while the first workpiece is trimmed using the first blade. In an embodiment, the first blade has a course grit size and the second blade has a fine grit size.
- The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.
Claims (20)
1. An apparatus comprising:
a first platen configured to hold a first workpiece;
a first dressing board; and
blade holder comprising a plurality of arms extending from a central axis, wherein the blade holder is configured to hold a blade at an end of each respective arm, wherein the blade holder is operable to rotate around the central axis, wherein the blade holder is configured to trim the first workpiece using at least one blade, wherein the blade holder is configured to dress at least one blade on the first dressing board.
2. The apparatus of claim 1 further comprising a second platen configured to hold a second workpiece, wherein the blade holder is configured to simultaneously trim the first workpiece using one blade and trim the second workpiece using another blade.
3. The apparatus of claim 1 further comprising a second dressing board, wherein the blade holder is configured to simultaneously dress one blade on the first dressing board and another blade on the second dressing board.
4. The apparatus of claim 1 , wherein the blade holder has four arms.
5. The apparatus of claim 1 further comprising a sensor arm configured to measure a condition of a trimmed region of the first workpiece.
6. The apparatus of claim 1 , wherein the blade holder further comprises a sensor configured to measure a condition of a blade held by the blade holder.
7. The apparatus of claim 1 , wherein each arm of the blade holder comprises an actuator, wherein each actuator is configured to extend or retract the blade at the end of the respective arm.
8. The apparatus of claim 1 , wherein the first dressing board comprises a first region corresponding to a first blade grit size and a second region corresponding to a second blade grit size.
9. A trimming tool comprising:
a blade holder comprising a plurality of arms, wherein the blade holder holds a plurality of blades, wherein each arm holds a respective blade;
a plurality of platens, wherein each platen is configured to hold a respective wafer, wherein the plurality of platens is aligned with a first set of arms of the plurality of arms; and
a plurality of dressing boards, wherein the plurality of dressing boards is aligned with a second set of arms of the plurality of arms.
10. The trimming tool of claim 9 , wherein the plurality of blades are in a cross-shaped arrangement.
11. The trimming tool of claim 9 , wherein the plurality of blades comprises at least two different types of blades.
12. The trimming tool of claim 9 , wherein the plurality of dressing boards comprises at least two different types of dressing boards.
13. The trimming tool of claim 9 , wherein the blade holder is operable to rotate to align the plurality of platens with the second set of arms and the plurality of dressing boards with the first set of arms.
14. The trimming tool of claim 9 , wherein the plurality of platens comprises a first platen of the plurality of platens that is located above a second platen of the plurality of platens.
15. The trimming tool of claim 9 , wherein each dressing board of the plurality of dressing boards is configured to rotate independently.
16. A method comprising:
rotating a blade holder to align a first blade of the blade holder with a first platen and a second blade of the blade holder with a first dressing board;
trimming a first workpiece on the first platen using the first blade;
dressing the second blade using the dressing board;
rotating the blade holder to align the second blade of the blade holder with the first platen; and
trimming a second workpiece on the first platen using the second blade.
17. The method of claim 16 further comprising rotating the dressing board after dressing the second blade.
18. The method of claim 16 , wherein rotating the blade holder to align the first blade with the first workpiece also aligns a third blade with a third workpiece.
19. The method of claim 18 further comprising trimming the third workpiece using the third blade while the first workpiece is trimmed using the first blade.
20. The method of claim 16 , wherein the first blade has a course grit size and the second blade has a fine grit size.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US18/193,405 US20240326195A1 (en) | 2023-03-30 | 2023-03-30 | Multi-Blade Trimming and Dressing Tool |
| TW112119654A TWI864781B (en) | 2023-03-30 | 2023-05-26 | Dressing apparatus, dressing tool, and dressing method |
| CN202420441826.0U CN221947105U (en) | 2023-03-30 | 2024-03-07 | Dressing equipment and dressing tools |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US18/193,405 US20240326195A1 (en) | 2023-03-30 | 2023-03-30 | Multi-Blade Trimming and Dressing Tool |
Publications (1)
| Publication Number | Publication Date |
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| US20240326195A1 true US20240326195A1 (en) | 2024-10-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US18/193,405 Pending US20240326195A1 (en) | 2023-03-30 | 2023-03-30 | Multi-Blade Trimming and Dressing Tool |
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| Country | Link |
|---|---|
| US (1) | US20240326195A1 (en) |
| CN (1) | CN221947105U (en) |
| TW (1) | TWI864781B (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9527188B2 (en) * | 2012-08-16 | 2016-12-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Grinding wheel for wafer edge trimming |
| JP2014054713A (en) * | 2012-09-13 | 2014-03-27 | Disco Abrasive Syst Ltd | Method of processing wafer |
| CN106463384B (en) * | 2014-07-18 | 2020-03-17 | 应用材料公司 | Modifying a substrate thickness profile |
| JP7222636B2 (en) * | 2018-09-12 | 2023-02-15 | 株式会社ディスコ | Edge trimming device |
-
2023
- 2023-03-30 US US18/193,405 patent/US20240326195A1/en active Pending
- 2023-05-26 TW TW112119654A patent/TWI864781B/en active
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| Publication number | Publication date |
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| TWI864781B (en) | 2024-12-01 |
| TW202438220A (en) | 2024-10-01 |
| CN221947105U (en) | 2024-11-01 |
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