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TWI864781B - Dressing apparatus, dressing tool, and dressing method - Google Patents

Dressing apparatus, dressing tool, and dressing method Download PDF

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Publication number
TWI864781B
TWI864781B TW112119654A TW112119654A TWI864781B TW I864781 B TWI864781 B TW I864781B TW 112119654 A TW112119654 A TW 112119654A TW 112119654 A TW112119654 A TW 112119654A TW I864781 B TWI864781 B TW I864781B
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TW
Taiwan
Prior art keywords
blade
trimming
workpiece
blade holder
platform
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TW112119654A
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Chinese (zh)
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TW202438220A (en
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陳舫儀
蔡沛耕
黃惠琪
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台灣積體電路製造股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B3/00Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
    • B24B3/36Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
    • B24B3/46Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades of disc blades

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

An apparatus includes a first platen configured to hold a first workpiece; a first dressing board; and blade holder including arms extending from a central axis, wherein the blade holder is configured to hold a blade at an end of each respective arm, wherein the blade holder is operable to rotate around the central axis, wherein the blade holder is configured to trim the first workpiece using at least one blade, wherein the blade holder is configured to dress at least one blade on the first dressing board.

Description

修整設備、修整工具及修整方法 Dressing equipment, dressing tools and dressing methods

本揭露關於一種用於形成半導體裝置的方法。 The present disclosure relates to a method for forming a semiconductor device.

半導體器件製造是用於生產存在於日常電子器件中的積體電路的製程。製造製程是微影和化學處理步驟的多步驟序列,在此期間在由半導體材料構成的晶圓上逐漸產生電子電路。在製造期間,晶圓的邊緣可能變得受損或以其它方式不適合與電子電路一起使用。因此,可在製造期間修整晶圓的邊緣。 Semiconductor device manufacturing is the process used to produce the integrated circuits found in everyday electronic devices. The manufacturing process is a multi-step sequence of lithography and chemical processing steps during which electronic circuits are gradually created on a wafer composed of semiconductor materials. During manufacturing, the edges of the wafer may become damaged or otherwise unsuitable for use with electronic circuits. Therefore, the edges of the wafer may be trimmed during manufacturing.

根據本揭露的一些實施例,一種修整設備包含第一平台、第一修整板以及刀片架。第一平台配置用以支撐第一工件。刀片架包含從中心軸延伸的多個臂。刀片架配置為在每個相應臂的端部固定刀片。刀片架可操作以繞中心軸旋轉。刀片架配置為使用至少一個刀片修整第一工件。刀片架配置為將至少一個刀片在第一修整板上修整。 According to some embodiments of the present disclosure, a trimming device includes a first platform, a first trimming plate, and a blade holder. The first platform is configured to support a first workpiece. The blade holder includes a plurality of arms extending from a central axis. The blade holder is configured to fix a blade at an end of each corresponding arm. The blade holder is operable to rotate around the central axis. The blade holder is configured to trim the first workpiece using at least one blade. The blade holder is configured to trim at least one blade on the first trimming plate.

根據本揭露的一些實施例,一種修整工具包含刀片架、複數個平台以及複數個修整板。刀片架包含複數個臂,其中刀片架支撐複數個刀片,各臂支撐對應的刀片。各平台配置為支撐對應晶圓。複數個平台與複數個臂中的第一組臂對齊。複數個修整板與複數個臂中的第二組臂對齊。 According to some embodiments of the present disclosure, a trimming tool includes a blade holder, a plurality of platforms, and a plurality of trimming plates. The blade holder includes a plurality of arms, wherein the blade holder supports a plurality of blades, and each arm supports a corresponding blade. Each platform is configured to support a corresponding wafer. The plurality of platforms are aligned with a first set of arms in the plurality of arms. The plurality of trimming plates are aligned with a second set of arms in the plurality of arms.

根據本揭露的一些實施例,一種修整方法包含以下步驟。旋轉刀片架以使刀片架的第一刀片與第一平台對齊,並使刀片架的第二刀片與第一修整板對齊。使用第一刀片修剪在第一平台上的第一工件。使用第一修整板修整第二刀片。旋轉刀片架以使刀片架的第二刀片與第一平台對準。使用第二刀片修剪在第一平台上的第二工件。 According to some embodiments of the present disclosure, a trimming method includes the following steps. Rotate the blade holder to align the first blade of the blade holder with the first platform, and align the second blade of the blade holder with the first trimming plate. Trim the first workpiece on the first platform using the first blade. Trim the second blade using the first trimming plate. Rotate the blade holder to align the second blade of the blade holder with the first platform. Trim the second workpiece on the first platform using the second blade.

10:晶圓 10: Wafer

20:晶圓 20: Wafer

45:區域 45: Region

50:工件 50: Workpiece

50A:工件 50A: Workpiece

50B:工件 50B: Workpiece

50C:工件 50C: Workpiece

50D:工件 50D: Workpiece

50E:工件 50E: Workpiece

60:機械臂 60:Robotic arm

100:修整工具 100: Dressing tools

102:修整站 102: Repair station

104A:平台 104A: Platform

104B:平台 104B: Platform

106:感測臂 106:Sensing arm

110:刀片架 110: Blade holder

111:輪轂 111: wheel hub

112:臂 112: Arm

112A:臂 112A: Arm

112B:臂 112B: Arm

112C:臂 112C: Arm

112D:臂 112D: Arm

113:中心軸 113:Center axis

120:刀片 120: Blade

120A:刀片 120A: Blade

120B:刀片 120B: Blade

120C:刀片 120C: Blade

120D:刀片 120D: Blade

120E:刀片 120E: Blade

120F:刀片 120F: Blade

122:致動器 122: Actuator

124:軸 124: Axis

130:修整板 130: Trimming plate

130A:修整板 130A: Trimming plate

130B:修整板 130B: Trimming plate

131A:區域 131A: Area

131B:區域 131B: Area

132:修整站 132: Repair station

132A:修整站 132A: Repair station

132B:修整站 132B: Repair station

133A:粒度區域 133A: Granularity area

133B:粒度區域 133B: Granularity area

133C:粒度區域 133C: Granularity area

140:感測器 140:Sensor

200:流程 200: Process

202:步驟 202: Steps

204:步驟 204: Steps

206:步驟 206: Steps

208:步驟 208: Steps

210:步驟 210: Steps

212:步驟 212: Steps

214:步驟 214: Steps

216:步驟 216: Steps

300:修整工具 300: Dressing tools

400:修整工具 400: Dressing tools

410:蓋子 410: lid

A1:角度 A1: Angle

H1:高度 H1: Height

T1:閾值 T1: Threshold value

R1:變化 R1: Changes

當結合隨附圖式閱讀時,自以下詳細描述中可最好地理解本揭示案之態樣。應注意,根據行業之標準作法,各種特徵並未按比例繪製。事實上,為了論述之清楚起見,可任意地增加或減小各種特徵之尺寸。 The present disclosure is best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that, in accordance with standard practice in the industry, the various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

第1A圖、第1B圖及第1C圖係根據一些實施例之包含修剪步驟的工件處理中的中間階段的剖面圖。 Figures 1A, 1B, and 1C are cross-sectional views of intermediate stages in workpiece processing including a trimming step according to some embodiments.

第2A圖、第2B圖及第2C圖係根據一些實施例之包含修剪步驟的工件處理中的中間階段的剖面圖。 Figures 2A, 2B, and 2C are cross-sectional views of intermediate stages in workpiece processing including a trimming step according to some embodiments.

第3圖係根據一些實施例之修整工具的示意性平面圖。 FIG. 3 is a schematic plan view of a trimming tool according to some embodiments.

第4圖係根據一些實施例之修整工具的示意性透視圖。 FIG. 4 is a schematic perspective view of a trimming tool according to some embodiments.

第5圖係根據一些實施例之附接至刀片架的臂的端部的 刀片的示意性透視圖。 FIG. 5 is a schematic perspective view of a blade attached to the end of an arm of a blade holder according to some embodiments.

第6A圖、第6B圖、第6C圖、第6D圖和第6E圖係根據一些實施例之利用修整工具於修整過程的中間步驟。 Figures 6A, 6B, 6C, 6D and 6E are intermediate steps of the trimming process using a trimming tool according to some embodiments.

第7圖係根據一些實施例之修剪過程的流程圖。 Figure 7 is a flow chart of the pruning process according to some embodiments.

第8A圖及第8B圖繪示根據一些實施例之使用修整板修整刀片的過程。 Figures 8A and 8B illustrate the process of trimming a blade using a trimming plate according to some embodiments.

第9A圖及第9B圖繪示根據一些實施例之修整板的示意圖。 Figures 9A and 9B show schematic diagrams of trimming plates according to some embodiments.

第10A圖、第10B圖及第10C圖繪示根據一些實施例之用於刀片的感測器和示例性的刀片測量。 Figures 10A, 10B, and 10C illustrate sensors for blades and exemplary blade measurements according to some embodiments.

第11圖繪示根據一些實施例之修整工具的示意性平面圖。 FIG. 11 shows a schematic plan view of a trimming tool according to some embodiments.

第12圖繪示根據一些實施例之修整工具的一部分的示意性剖視圖。 FIG. 12 shows a schematic cross-sectional view of a portion of a trimming tool according to some embodiments.

以下揭示內容提供了許多不同的實施例或實例,用於實現所提供主題之不同特徵。下文描述了元件、值、操作、材料、佈置或類似者之具體實例以簡化本揭示案。當然這些實例僅為例示性的且並不意欲為限制性的。考慮了其他元件、值、操作、材料、佈置及類似者。舉例而言,在下面的描述中在第二特徵上方或之上形成第一特徵可包含第一特徵及第二特徵係以直接接觸而形成的實施例,且 亦可包含可在第一特徵與第二特徵之間形成額外特徵,使得第一特徵及第二特徵可不直接接觸的實施例。另外,本揭示案可在各種實例中重複元件符號及/或字母。這種重複是出於簡單及清楚之目的,且其本身並不規定所論述之各種實施例與/或組態之間的關係。 The following disclosure provides many different embodiments or examples for implementing different features of the provided subject matter. Specific examples of components, values, operations, materials, arrangements, or the like are described below to simplify the disclosure. Of course, these examples are merely illustrative and are not intended to be limiting. Other components, values, operations, materials, arrangements, and the like are contemplated. For example, in the following description, forming a first feature above or on a second feature may include embodiments in which the first feature and the second feature are formed in direct contact, and may also include embodiments in which additional features may be formed between the first feature and the second feature so that the first feature and the second feature may not be in direct contact. In addition, the disclosure may repeat component symbols and/or letters in various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate the relationship between the various embodiments and/or configurations discussed.

此外,本文中可使用空間相對術語,諸如「下方」、「在...之下」、「下」、「上方」、「上」及類似術語,以便於描述,以描述一個零件或特徵與另一(些)零件或特徵之關係,如圖中所示。除圖中所描繪的定向之外,空間相對術語亦意欲涵蓋裝置在使用或操作中之不同定向。系統可以其他方式定向(旋轉90度或在其他定向上),且可同樣相應地解釋本文所使用之空間相對描述符。 Additionally, spatially relative terms such as "below," "under," "beneath," "above," "upper," and the like may be used herein for ease of description to describe the relationship of one part or feature to another part or features as illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The system may be otherwise oriented (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein may be interpreted accordingly.

根據各種實施例,本文描述了用於修整晶片的修整工具。本文所述的修整工具包含刀片架,所述刀片架配置為支撐和操作多個修整刀片,使得多個工件(例如,晶圓)可以被刀片架上的不同刀片修整。此外,刀片架配置為可以旋轉,使得一些刀片可以被「修整」(例如,使用一個或多個修整板清潔)而其他刀片用於修整工件。以這種方式,可以增加修整工件的速率,同時仍允許根據需要修整刀片。這可以減少處理時間並提高效率。刀片架還可以包含監測刀片位置或刀片狀況的感測器,這可以允許更有效和更具成本效益的刀片修整。 According to various embodiments, a trimming tool for trimming wafers is described herein. The trimming tool described herein includes a blade holder configured to support and operate multiple trimming blades so that multiple workpieces (e.g., wafers) can be trimmed by different blades on the blade holder. In addition, the blade holder is configured to rotate so that some blades can be "trimmed" (e.g., cleaned using one or more trimming plates) while other blades are used to trim the workpiece. In this way, the rate at which the workpiece is trimmed can be increased while still allowing the blades to be trimmed as needed. This can reduce processing time and increase efficiency. The blade holder can also include sensors that monitor blade position or blade condition, which can allow for more efficient and cost-effective blade trimming.

第1A圖至第1C圖和第2A圖至第2C圖繪示出了根據一些實施例之包含修整步驟之工件處理中的中間階 段的剖面示意圖。第1A圖至第1C圖和第2A圖至第2C圖中所示的過程是說明性示例,並且包含修整步驟的任何其他合適的過程可以與本公開的實施例一起使用。在第1A圖至第1C圖和第2A圖至第2C圖中,第一晶圓10結合到第二晶圓20以形成工件50。在一些情況下,工件50也可稱為「晶圓」、「重構晶圓」、「鍵合結構」、「堆疊晶圓結構」等。然後在修整過程中去除工件50的邊緣部分,這可以使用本文描述的實施例來執行。在一些情況下,修整工件50可以減少翹曲、開裂或剝離。 FIGS. 1A to 1C and FIGS. 2A to 2C illustrate schematic cross-sectional views of intermediate stages in workpiece processing including a trimming step according to some embodiments. The processes shown in FIGS. 1A to 1C and FIGS. 2A to 2C are illustrative examples, and any other suitable processes including a trimming step may be used with embodiments of the present disclosure. In FIGS. 1A to 1C and FIGS. 2A to 2C, a first wafer 10 is bonded to a second wafer 20 to form a workpiece 50. In some cases, the workpiece 50 may also be referred to as a "wafer," a "reconstructed wafer," a "bonded structure," a "stacked wafer structure," etc. An edge portion of the workpiece 50 is then removed in a trimming process, which may be performed using the embodiments described herein. In some cases, trimming the workpiece 50 can reduce warping, cracking, or peeling.

在第1A圖中,第一晶圓10鍵合或以其他方式附著到第二晶圓20以形成工件50。在一些實施例中,第一晶圓10和/或第二晶圓20可以是半導體晶圓,例如矽體晶圓(silicon bulk wafer)或砷化鎵晶圓(gallium arsenide wafer)。在一些實施例中,第一晶圓10和/或第二晶圓包括例如矽、應變矽(strained silicon)、矽合金、碳化矽、矽-鍺、矽-鍺碳化物、鍺、鍺合金、鍺-砷、銦-砷、III-V族半導體、它們的組合或類似物。在一些實施例中,第一晶圓10和/或第二晶圓20是掩埋氧化物(buried oxide,BOX)晶圓、器件晶圓、中介層、有機核心基板、它們的組合或類似物。第一晶圓10和第二晶圓20可以具有相似或不同的材料或尺寸。可以使用直接鍵合(例如,電介質到電介質接合和/或金屬到金屬接合)、使用黏著劑或使用另一種合適的技術將第一晶圓10鍵合到第二晶圓20。在一些情況下,第二晶圓20可被認為是「載 體」、「載體襯底」或「載體晶圓」。 In FIG. 1A , a first wafer 10 is bonded or otherwise attached to a second wafer 20 to form a workpiece 50. In some embodiments, the first wafer 10 and/or the second wafer 20 may be a semiconductor wafer, such as a silicon bulk wafer or a gallium arsenide wafer. In some embodiments, the first wafer 10 and/or the second wafer include, for example, silicon, strained silicon, silicon alloy, silicon carbide, silicon-germanium, silicon-germanium carbide, germanium, germanium alloy, germanium-arsenic, indium-arsenic, III-V semiconductors, combinations thereof, or the like. In some embodiments, the first wafer 10 and/or the second wafer 20 is a buried oxide (BOX) wafer, a device wafer, an interposer, an organic core substrate, a combination thereof, or the like. The first wafer 10 and the second wafer 20 may have similar or different materials or sizes. The first wafer 10 may be bonded to the second wafer 20 using direct bonding (e.g., dielectric-to-dielectric bonding and/or metal-to-metal bonding), using an adhesive, or using another suitable technique. In some cases, the second wafer 20 may be considered a "carrier", "carrier substrate", or "carrier wafer".

在第1B圖中,根據一些實施例,工件50被修整。在修整過程中,去除工件50邊緣周圍的區域45。例如,可以從第一晶圓10朝向第二晶圓20垂直向下去除修整區域45。修剪區域45可以部分或完全延伸通過第一晶圓10並且可以部分或完全延伸通過第二晶圓20。例如,第1B圖中所示的修整區域45完全延伸穿過第一晶圓10並且部分延伸穿過第二晶圓20。在第1C圖中,第一晶圓10使用合適的製程減薄,例如化學機械拋光(chemical mechanical polish,CMP)製程、研磨製程、蝕刻製程、它們的組合或類似的製程。減薄製程減小了第一晶圓10的厚度。 In FIG. 1B , according to some embodiments, the workpiece 50 is trimmed. During the trimming process, a region 45 around the edge of the workpiece 50 is removed. For example, the trimming region 45 may be removed vertically downward from the first wafer 10 toward the second wafer 20. The trimming region 45 may extend partially or completely through the first wafer 10 and may extend partially or completely through the second wafer 20. For example, the trimming region 45 shown in FIG. 1B extends completely through the first wafer 10 and partially through the second wafer 20. In FIG. 1C , the first wafer 10 is thinned using a suitable process, such as a chemical mechanical polish (CMP) process, a grinding process, an etching process, a combination thereof, or a similar process. The thinning process reduces the thickness of the first wafer 10.

第2A圖至第2C圖所示的過程類似於第1A圖至第1C圖所示的過程,不同之處在於工件50在修整工件50之前被減薄。第2A圖顯示了類似於第1A圖的工件。在第2B圖中,工件50被減薄以減小第一晶圓10的厚度。在第2C圖中,執行修整製程以去除工件50邊緣周圍的區域45,類似於針對第1C圖描述的修整製程。 The process shown in FIGS. 2A to 2C is similar to the process shown in FIGS. 1A to 1C, except that the workpiece 50 is thinned before trimming the workpiece 50. FIG. 2A shows a workpiece similar to FIG. 1A. In FIG. 2B, the workpiece 50 is thinned to reduce the thickness of the first wafer 10. In FIG. 2C, a trimming process is performed to remove a region 45 around the edge of the workpiece 50, similar to the trimming process described for FIG. 1C.

第3圖和第4圖繪示出了根據一些實施例的修整工具100。第3圖繪示了修整工具100的示意性平面圖,第4圖繪示了修整工具100的示意性透視圖。為清楚起見,可能不會顯示某些功能或細節。修整工具100可用於修整一個或多個工件50,其可類似於上文針對第1A圖至第2C圖描述的工件50,但其他工件50也是可能的。在一些實 施例中,修整工具100包括配置成支撐和操作多個修整刀片120的刀片架110。以此方式,刀片架110可被認為是「多刀片架」。刀片架110包括多個臂112,其在中心軸113處從輪轂111延伸,刀片120附接到每個臂112的端部。例如,第3圖至第4圖所示的刀片架110具有四個臂112A至112D和四個相應的刀片120A至120D。在其他實施例中,刀片架110具有不同數量的臂112,例如兩個、三個或多於四個的臂112。在一些實施例中,刀片架110可操作以圍繞中心軸113旋轉以重新定位臂112和對應的刀片120。根據一些實施例,第3圖還顯示了可用於將工件50轉移到修整工具100中或從修整工具100中移出的機械臂60。 FIGS. 3 and 4 illustrate a dressing tool 100 according to some embodiments. FIG. 3 illustrates a schematic plan view of the dressing tool 100, and FIG. 4 illustrates a schematic perspective view of the dressing tool 100. For clarity, certain features or details may not be shown. The dressing tool 100 may be used to dress one or more workpieces 50, which may be similar to the workpieces 50 described above with respect to FIGS. 1A to 2C, but other workpieces 50 are possible. In some embodiments, the dressing tool 100 includes a blade holder 110 configured to support and operate a plurality of dressing blades 120. In this manner, the blade holder 110 may be considered a "multi-blade holder." The blade holder 110 includes a plurality of arms 112 extending from a hub 111 at a central axis 113, with a blade 120 attached to the end of each arm 112. For example, the blade holder 110 shown in FIGS. 3-4 has four arms 112A-112D and four corresponding blades 120A-120D. In other embodiments, the blade holder 110 has a different number of arms 112, such as two, three, or more than four arms 112. In some embodiments, the blade holder 110 is operable to rotate about a central axis 113 to reposition the arms 112 and the corresponding blades 120. According to some embodiments, FIG. 3 also shows a robotic arm 60 that can be used to transfer a workpiece 50 into or out of the dressing tool 100.

第5圖繪示出了根據一些實施例之附接到臂112的端部的刀片120的示意性透視圖。在一些實施例中,刀片120通過軸124附接到臂112內的致動器122。致動器122可包括馬達、液壓致動器、氣動致動器、機械臂、另一種類型的致動器或機構、它們的組合或類似物。在一些實施例中,致動器122可被配置成旋轉刀片120(例如,順時針和/或逆時針,例如在修剪或修整期間)或橫向平移(例如,伸出或縮回)刀片120。作為說明性示例,第5圖顯示了在由致動器122平移之後處於兩個不同橫向位置的刀片120。在一些實施例中,致動器122可以在從大約1mm到大約50mm的範圍內橫向平移刀片120,但是其他平移範圍也是可能的。例如,致動器122可以平移刀片 120以在修整過程期間適當地將刀片120與工件50對齊或者在修整過程期間適當地將刀片120與修整板130對齊。在一些實施例中,臂112、致動器122和/或軸124可包括彈簧或阻尼器(未示出)以減少刀片120在操作期間的振動。 FIG. 5 depicts a schematic perspective view of a blade 120 attached to the end of an arm 112 according to some embodiments. In some embodiments, the blade 120 is attached to an actuator 122 within the arm 112 via a shaft 124. The actuator 122 may include a motor, a hydraulic actuator, a pneumatic actuator, a robotic arm, another type of actuator or mechanism, a combination thereof, or the like. In some embodiments, the actuator 122 may be configured to rotate the blade 120 (e.g., clockwise and/or counterclockwise, such as during trimming or trimming) or to translate the blade 120 laterally (e.g., to extend or retract). As an illustrative example, FIG. 5 shows the blade 120 in two different lateral positions after being translated by the actuator 122. In some embodiments, the actuator 122 can translate the blade 120 laterally within a range from about 1 mm to about 50 mm, but other translation ranges are possible. For example, the actuator 122 can translate the blade 120 to properly align the blade 120 with the workpiece 50 during a trimming process or to properly align the blade 120 with the trimming plate 130 during a trimming process. In some embodiments, the arm 112, the actuator 122, and/or the shaft 124 can include a spring or damper (not shown) to reduce vibration of the blade 120 during operation.

在一些實施例中,附接至臂112的刀片120的直徑可在約10mm至約300mm的範圍內,但其他直徑也是可能的。刀片120可由任何合適的材料形成或具有任何合適的特性。例如,刀片120可包括陶瓷、樹脂、橡膠、氧化氯(例如,氯氧化物)、鎳等或其組合的結合材料。刀片120可具有#100至#7000範圍內的粒度(grit size),但其他粒度也是可能的。在一些實施例中,刀片120可具有包括金剛石(diamond)、立方氮化硼(cubic boron nitride,CBN)、碳化矽(silicon carbide)、氧化鋁(aluminum oxide)、氧化鋯氧化鋁(zirconia alumina)、二氧化鋯(zirconium dioxide)、陶瓷(ceramic)、石榴石(garnet)等或其組合的砂礫。在一些實施例中,刀片120可具有包含鎳(nickel)、鎳鉻(nickel chrome)、鎳鋁(nickel aluminum)、鋁青銅(aluminum bronze)、氧化鋁(aluminum oxide)、氧化鉻(chrome oxide)、氧化鋯(zirconium oxide)、碳化鉻鎳鉻(chrome carbide nickel chrome)、鎳石墨(nickel graphite)、鋁(aluminum)、銅(copper)、鉬(molybdenum)、碳化鎢鈷(tungsten carbide cobalt)、氧化鈦(titanium oxideor)、類似物或其組合。其他材料也是可能的。 In some embodiments, the diameter of the blade 120 attached to the arm 112 can be in the range of about 10 mm to about 300 mm, although other diameters are possible. The blade 120 can be formed of any suitable material or have any suitable properties. For example, the blade 120 can include a bonding material of ceramic, resin, rubber, chlorine oxide (e.g., oxychloride), nickel, etc. or a combination thereof. The blade 120 can have a grit size in the range of #100 to #7000, although other grit sizes are possible. In some embodiments, the blade 120 may have a grit including diamond, cubic boron nitride (CBN), silicon carbide, aluminum oxide, zirconia alumina, zirconium dioxide, ceramic, garnet, etc. or a combination thereof. In some embodiments, the blade 120 may have a material including nickel, nickel chrome, nickel aluminum, aluminum bronze, aluminum oxide, chrome oxide, zirconium oxide, chrome carbide nickel chrome, nickel graphite, aluminum, copper, molybdenum, tungsten carbide cobalt, titanium oxide, the like, or combinations thereof. Other materials are also possible.

附接到刀片架110的臂112的各種刀片120可具有相似或不同的特性。例如,返回到第3圖和第4圖,分別附接到臂112A和112C的刀片120A和120C具有相對粗糙的粒度,而分別附接到臂112B和112D的刀片120B和120D具有相對細的粒度。刀片和刀片特性的其他組合是可能的。在一些實施例中,工件50的修整過程可以包括用粗刀片120(例如,刀片120A或120C)修整工件50,然後用細刀片120(例如,刀片120B或120D)修整工件50。因此,刀片120A和120C在本文中可稱為「粗刀片」,而刀片120B和120D在本文中可稱為「精細刀片」。本文所述的多臂刀片支架110允許在修整過程中用多個刀片120修整單一工件50。 The various blades 120 attached to the arms 112 of the blade holder 110 may have similar or different properties. For example, returning to FIGS. 3 and 4 , blades 120A and 120C attached to arms 112A and 112C, respectively, have a relatively coarse grit, while blades 120B and 120D attached to arms 112B and 112D, respectively, have a relatively fine grit. Other combinations of blades and blade properties are possible. In some embodiments, the trimming process of the workpiece 50 may include trimming the workpiece 50 with a coarse blade 120 (e.g., blade 120A or 120C) and then trimming the workpiece 50 with a fine blade 120 (e.g., blade 120B or 120D). Therefore, blades 120A and 120C may be referred to herein as "coarse blades," while blades 120B and 120D may be referred to herein as "fine blades." The multi-arm blade holder 110 described herein allows a single workpiece 50 to be trimmed with multiple blades 120 during the trimming process.

仍然參照第3圖和第4圖,根據一些實施例,修整工具100包括修整站102,其在修整過程中支撐和旋轉工件50。修整站102包括第一平台104A和第二平台104B,每個平台均被配置為支撐工件50。例如,第3圖志第4圖繪示出了支撐第一工件50A的第一平台104A和支撐第二工件50B的第二平台104B。在其他實施例中,修整站102可以包括不同數量的平台104。平台104可以使用例如金屬固定工件50。在一些實施例中,真空抽吸或另一種合適的技術,並且可以在修整過程中旋轉工件50(例如,順時針或逆時針)。 Still referring to FIGS. 3 and 4, according to some embodiments, the dressing tool 100 includes a dressing station 102 that supports and rotates the workpiece 50 during the dressing process. The dressing station 102 includes a first platform 104A and a second platform 104B, each of which is configured to support the workpiece 50. For example, FIGS. 3 to 4 illustrate the first platform 104A supporting the first workpiece 50A and the second platform 104B supporting the second workpiece 50B. In other embodiments, the dressing station 102 may include a different number of platforms 104. The platform 104 may use, for example, metal to fix the workpiece 50. In some embodiments, vacuum suction or another suitable technique, and the workpiece 50 may be rotated during the dressing process (e.g., clockwise or counterclockwise).

根據一些實施例,修整工具100還包括一個或多個修整板130。修整板130用於在執行修整過程之後清潔、重塑和更新刀片120。修整板130由修整站132支撐,並且在一些實施例中,每個修整板130可以具有其自己的修整站132。例如,第3圖至第4圖顯示了第一修整站132A上的第一修整板130A以及第二修整站132B上的第二修整板130B。在其他實施例中,第一修整板130A和第二修整板130B可由相同的修整站132支撐。在一些實施例中,修整板130可由修整站132旋轉、平移或定位。 According to some embodiments, the dressing tool 100 also includes one or more dressing plates 130. The dressing plates 130 are used to clean, reshape, and refresh the blades 120 after performing the dressing process. The dressing plates 130 are supported by the dressing stations 132, and in some embodiments, each dressing plate 130 may have its own dressing station 132. For example, FIGS. 3-4 show a first dressing plate 130A on a first dressing station 132A and a second dressing plate 130B on a second dressing station 132B. In other embodiments, the first dressing plate 130A and the second dressing plate 130B may be supported by the same dressing station 132. In some embodiments, the dressing plates 130 may be rotated, translated, or positioned by the dressing stations 132.

在修整工具100具有兩個或更多個修整板130的一些實施例中,各種修整板130可具有相似或不同的特性。例如,參照第3圖至第4圖,第一修整板130A可適用於具有相對粗粒度的刀片120(例如,刀片120A或120C),而第二修整板130B可適用於具有相對細粒度的刀片120(例如,刀片120B或120D)。以這種方式,在此,修整板130可以被稱為「粗修整板(course dressing board)」或「細修整板(fine dressing board)」。修整板和修整板特性的其他組合也是可能的。 In some embodiments where the dressing tool 100 has two or more dressing boards 130, the various dressing boards 130 may have similar or different properties. For example, referring to FIGS. 3-4, the first dressing board 130A may be suitable for a blade 120 having a relatively coarse grain size (e.g., blade 120A or 120C), while the second dressing board 130B may be suitable for a blade 120 having a relatively fine grain size (e.g., blade 120B or 120D). In this manner, the dressing board 130 may be referred to herein as a "course dressing board" or a "fine dressing board." Other combinations of dressing boards and dressing board properties are also possible.

在一些實施例中,修整工具100包括感測臂106,其在執行修整過程期間或之後測量工件50的特性。感測臂106可以監視、檢測或測量工件50的修剪區域(例如,第1B圖至第1C圖或第2B圖至第2C圖的修剪區域45)的特性,例如深度、寬度、粗糙度、位置等。感測臂106可包括一個或多個感測器,其可為基於雷射的感測器、光學 感測器(例如,OCD感測器、CCD感測器等)或其他類型的感測器。在一些實施例中,感測臂106可操作以在第一位置以測量第一工件50(例如,第3圖中的第一工件50A)和第二位置以測量第二工件50(例如,第3圖中的第二工件50B)。在其他實施例中,每個平台104具有相關聯的感測臂106。 In some embodiments, the trimming tool 100 includes a sensing arm 106 that measures characteristics of the workpiece 50 during or after performing a trimming process. The sensing arm 106 can monitor, detect, or measure characteristics of a trimmed area of the workpiece 50 (e.g., the trimmed area 45 of FIGS. 1B to 1C or 2B to 2C), such as depth, width, roughness, position, etc. The sensing arm 106 can include one or more sensors, which can be laser-based sensors, optical sensors (e.g., OCD sensors, CCD sensors, etc.), or other types of sensors. In some embodiments, the sensing arm 106 can be operated to measure a first workpiece 50 (e.g., the first workpiece 50A in FIG. 3 ) at a first position and a second position to measure a second workpiece 50 (e.g., the second workpiece 50B in FIG. 3 ). In other embodiments, each platform 104 has an associated sensing arm 106.

包括多刀片架的修整工具可具有與第3圖至第4圖所示的修整工具100不同的構造。作為另一個非限制性示例,第11圖繪示了根據一些實施例的修整工具300。修整工具300具有配置為持有六個刀片120A至120F的刀片架110,這些刀片可以是相似的刀片或不同類型的刀片。修整工具300還包括五個平台(未單獨示出)以支撐五個工件50A至50E並且包括在修整站132上的一個修整板130。修整工具300被配置為使得可以同時修整五個工件50A至50E並由五個刀片120(例如,刀片120A至120E)進行修整,而其餘刀片120(例如,刀片120F)在修整板130處進行修整。刀片架110可以旋轉,以便將不同的刀片120A至120F與不同的平台或與修整板130一起。在其他實施例中,刀片120、工件50、修整板130或其他特徵的其他數量或佈置是可能的。 A dressing tool including multiple blade holders may have a different configuration than the dressing tool 100 shown in FIGS. 3-4. As another non-limiting example, FIG. 11 illustrates a dressing tool 300 according to some embodiments. The dressing tool 300 has a blade holder 110 configured to hold six blades 120A-120F, which may be similar blades or blades of different types. The dressing tool 300 also includes five platforms (not shown separately) to support five workpieces 50A-50E and includes a dressing plate 130 on a dressing station 132. The dressing tool 300 is configured so that five workpieces 50A-50E can be dressed simultaneously and are dressed by five blades 120 (e.g., blades 120A-120E), while the remaining blades 120 (e.g., blade 120F) are dressed at the dressing plate 130. The blade holder 110 can be rotated to allow different blades 120A to 120F to be attached to different platforms or to the trimming plate 130. In other embodiments, other numbers or arrangements of blades 120, workpieces 50, trimming plates 130, or other features are possible.

根據一些實施例,來到第6A圖至第6E圖,其繪示出了利用修整工具100的示例修整過程的中間步驟。第6A圖至第6E圖中所示的修整過程是示例性的示例,並且在其他實施例中可以使用具有不同步驟或不同步驟順序的 其他修整過程。下面針對一個步驟描述的一些動作可以順序地執行,並且下面針對一個步驟描述的一些動作可以同時執行。下面針對某個步驟描述的一些動作可能會按照與描述不同的順序執行。使用諸如針對第6A圖至第6E圖所描述的合適的修整過程,如本文所描述的修整工具100允許有效修整工件50,包括以改進的「每小時晶圓(wafer-per-hour)」速率修整刀片120。此外,第6A圖至第6E圖中描述的修整過程允許每個工件50用粗刀片修整,然後用細刀片修整,這可以提高修整區域的平滑度和再現性,並降低工件50的開裂或翹曲的風險。 According to some embodiments, coming to FIGS. 6A-6E, intermediate steps of an example trimming process utilizing the trimming tool 100 are depicted. The trimming processes illustrated in FIGS. 6A-6E are illustrative examples, and other trimming processes having different steps or different synchronous sequences may be used in other embodiments. Some actions described below for a step may be performed sequentially, and some actions described below for a step may be performed simultaneously. Some actions described below for a step may be performed in a different order than described. Using appropriate trimming processes such as described with respect to FIGS. 6A-6E, the trimming tool 100 as described herein allows for efficient trimming of the workpiece 50, including trimming the blade 120 at an improved "wafer-per-hour" rate. In addition, the trimming process described in FIGS. 6A to 6E allows each workpiece 50 to be trimmed with a coarse blade and then with a fine blade, which can improve the smoothness and reproducibility of the trimmed area and reduce the risk of cracking or warping of the workpiece 50.

在第6A圖中,刀片架110處於這樣的位置,使得第一平台104A上的工件50可以使用精細刀片120B進行修整並且第二平台104B上的工件50可以使用粗刀片120A進行修整。在某些情況下,第6A圖中刀片架110的位置可被認為是「初始位置」或「第一位置」。使用精細刀片120B修整第一平台104A上的工件50A,然後將其從第一平台104A移除(例如,通過機械臂60)。例如,工件50A可以從第一平台104A移除並且轉移到清潔站等。工件50B被裝載到第二平台104B上(例如,通過機械臂60),然後使用粗刀片120A修整。 In FIG. 6A, the blade holder 110 is in such a position that the workpiece 50 on the first platform 104A can be trimmed using the fine blade 120B and the workpiece 50 on the second platform 104B can be trimmed using the coarse blade 120A. In some cases, the position of the blade holder 110 in FIG. 6A can be considered an "initial position" or "first position". The workpiece 50A on the first platform 104A is trimmed using the fine blade 120B and then removed from the first platform 104A (e.g., by the robot 60). For example, the workpiece 50A can be removed from the first platform 104A and transferred to a cleaning station, etc. The workpiece 50B is loaded onto the second platform 104B (e.g., by the robot 60) and then trimmed using the coarse blade 120A.

仍然參照第6A圖,刀片架110也處於使得粗刀片120C可以使用粗修整板130A修整並且細刀片120D可以使用細修整板130B修整的位置。在一些實施例中,刀片120C至120D可以被修整,同時工件50A至50B 被刀片120A至120B修整。當刀片架110處於第一位置時,刀片120C和/或120D的修整是可選擇的,並且可以修整刀片120C至120D中的一個、兩個或都不修整。在一些實施例中,可以監測或測量刀片120的狀況,並且可以根據刀片120的狀況確定刀片120是否被修整。在一些情況下,自上次修整刀片120以來,可在修整預定數量的工件50之後修整刀片120。 Still referring to FIG. 6A , the blade holder 110 is also in a position such that the coarse blade 120C can be trimmed using the coarse trimming plate 130A and the fine blade 120D can be trimmed using the fine trimming plate 130B. In some embodiments, the blades 120C to 120D can be trimmed while the workpieces 50A to 50B are being trimmed by the blades 120A to 120B. When the blade holder 110 is in the first position, the trimming of the blades 120C and/or 120D is optional, and one, both, or none of the blades 120C to 120D can be trimmed. In some embodiments, the condition of the blade 120 can be monitored or measured, and whether the blade 120 is trimmed can be determined based on the condition of the blade 120. In some cases, the blade 120 may be trimmed after a predetermined number of workpieces 50 have been trimmed since the blade 120 was last trimmed.

在第6B圖中,刀片架110旋轉到可以使用粗刀片120C修整第一平台104A上的工件50並且可以使用精刀片120B修整第二平台104B上的工件50的位置。例如,刀架110可以如圖6B所示繞中心軸113旋轉90°,或者可以旋轉另一個合適的角度。在某些情況下,第6B圖中刀片架110的位置可被認為是「第二位置」。工件50C被裝載到第一平台104A上(例如,通過機械臂60),然後使用粗刀片120C修整。使用精細刀片120B修整第二平台104B上的工件50B,然後將其從第二平台104B移除(例如,通過機械臂60)。仍然參照第6B圖,刀片架110也處於使得粗刀片120A與精細修整板130B對齊並且精細刀片120D與粗修整板130A對齊的位置。因此,在一些實施例中,當刀片架110處於第二位置時沒有刀片120被修整。 In FIG. 6B , the blade holder 110 is rotated to a position where the workpiece 50 on the first platform 104A can be trimmed using a rough blade 120C and the workpiece 50 on the second platform 104B can be trimmed using a fine blade 120B. For example, the blade holder 110 can be rotated 90° around the central axis 113 as shown in FIG. 6B , or can be rotated by another suitable angle. In some cases, the position of the blade holder 110 in FIG. 6B can be considered a "second position." The workpiece 50C is loaded onto the first platform 104A (e.g., by the robot arm 60) and then trimmed using the rough blade 120C. The workpiece 50B on the second platform 104B is trimmed using the fine blade 120B and then removed from the second platform 104B (e.g., by the robot arm 60). Still referring to FIG. 6B , the blade holder 110 is also in a position such that the coarse blade 120A is aligned with the fine trimming plate 130B and the fine blade 120D is aligned with the coarse trimming plate 130A. Therefore, in some embodiments, no blade 120 is trimmed when the blade holder 110 is in the second position.

在第6C圖中,刀片架110旋轉到這樣的位置,使得第一平台104A上的工件50可以使用精細刀片120D進行修整並且第二平台104B上的工件50可以使用粗刀 片120C進行修整。例如,刀片架110可以如第6C圖所示圍繞中心軸113進一步旋轉90°,或者可以旋轉另一個合適的角度。在某些情況下,第6C圖中刀片架110的位置可被認為是「第三位置」。使用精細刀片120D修整第一平台104A上的工件50C,然後將其從第一平台104A移除(例如,通過機械臂60)。工件50D被裝載到第二平台104B上(例如,通過機械臂60),然後使用粗刀片120C修整。仍然參照第6C圖,刀片支架110也處於使得粗刀片120A與粗修整板130A對齊並且精細刀片120B與精細修整板130B對齊的位置。以此方式,當刀片架110處於第三位置時,刀片120A和/或刀片120B可以選擇性地修整。 In FIG. 6C , the blade holder 110 is rotated to such a position that the workpiece 50 on the first platform 104A can be trimmed using the fine blade 120D and the workpiece 50 on the second platform 104B can be trimmed using the coarse blade 120C. For example, the blade holder 110 can be further rotated 90° about the central axis 113 as shown in FIG. 6C , or can be rotated by another suitable angle. In some cases, the position of the blade holder 110 in FIG. 6C can be considered a "third position". The workpiece 50C on the first platform 104A is trimmed using the fine blade 120D and then removed from the first platform 104A (e.g., by the robot arm 60). The workpiece 50D is loaded onto the second platform 104B (e.g., by the robot arm 60) and then trimmed using the coarse blade 120C. Still referring to FIG. 6C , the blade holder 110 is also in a position such that the coarse blade 120A is aligned with the coarse trimming plate 130A and the fine blade 120B is aligned with the fine trimming plate 130B. In this way, when the blade holder 110 is in the third position, the blade 120A and/or the blade 120B can be selectively trimmed.

在第6D圖中,刀片架110旋轉到這樣的位置,使得第一平台104A上的工件50可以使用粗刀片120A修整並且第二平台104B上的工件50可以使用精細刀片120D修整。例如,如第6D圖所示,刀片架110可以圍繞中心軸113進一步旋轉90°,或者可以旋轉另一個合適的角度。在某些情況下,第6D圖中刀片架110的位置可被認為是「第四位置」。工件50E被裝載到第一平台104A上(例如,通過機械臂60),然後使用粗刀片120A修整。使用精細刀片120D修整第二平台104B上的工件50D,然後將其從第二平台104B移除(例如,通過機械臂60)。仍然參照第6D圖,刀片架110也處於使得粗刀片120C與細修整板130B對齊並且精細刀片120B與粗修整板 130A對齊的位置。因此,在一些實施例中,當刀片架110處於第四位置時沒有刀片120被修整。 In FIG. 6D , the blade holder 110 is rotated to such a position that the workpiece 50 on the first platform 104A can be trimmed using the coarse blade 120A and the workpiece 50 on the second platform 104B can be trimmed using the fine blade 120D. For example, as shown in FIG. 6D , the blade holder 110 can be further rotated 90° around the central axis 113, or can be rotated by another suitable angle. In some cases, the position of the blade holder 110 in FIG. 6D can be considered a "fourth position." The workpiece 50E is loaded onto the first platform 104A (e.g., by the robot arm 60) and then trimmed using the coarse blade 120A. The workpiece 50D on the second platform 104B is trimmed using the fine blade 120D and then removed from the second platform 104B (e.g., by the robot arm 60). Still referring to FIG. 6D , the blade holder 110 is also in a position such that the coarse blade 120C is aligned with the fine trimming plate 130B and the fine blade 120B is aligned with the coarse trimming plate 130A. Therefore, in some embodiments, no blade 120 is trimmed when the blade holder 110 is in the fourth position.

在第6E圖中,刀片架110旋轉回到第一位置。例如,刀片架110可以如第6D圖所示繞中心軸113反向旋轉270°,或者旋轉其他合適的角度。使用精細刀片120B修整第一平台104A上的工件50E,然後將其從第一平台104A移除(例如,通過機械臂60)。工件50F被裝載到第二平台104B上(例如,通過機械臂60),然後使用粗刀120A修整。類似於第6A圖,當刀片架110處於第一位置時,刀片120C和/或刀片120D可以選擇性地被修整。以此方式,可以重複第6A圖至第6E圖中描述的步驟以有效地修整工件50和修整刀片120。 In FIG. 6E, the blade holder 110 is rotated back to the first position. For example, the blade holder 110 can be rotated 270° around the central axis 113 in the opposite direction as shown in FIG. 6D, or rotated at other suitable angles. The workpiece 50E on the first platform 104A is trimmed using the fine blade 120B and then removed from the first platform 104A (e.g., by the robot arm 60). The workpiece 50F is loaded onto the second platform 104B (e.g., by the robot arm 60) and then trimmed using the rough blade 120A. Similar to FIG. 6A, when the blade holder 110 is in the first position, the blade 120C and/or the blade 120D can be selectively trimmed. In this way, the steps described in FIG. 6A to FIG. 6E can be repeated to effectively trim the workpiece 50 and the trimming blade 120.

第7圖繪示了根據一些實施例的修整過程的流程200。第7圖的處理流程200所描述的修整過程類似於之前在第6A圖至第6E圖中描述的修整過程。在步驟202,使用精細刀片修整第一平台上的工件,然後將其從第一平台上移除。在步驟202,工件也被裝載到第二平台上,然後使用粗刀片修整。此外,一個或多個刀片可任選地在步驟202被修整。步驟202類似於第6A圖中所示的中間步驟或第6E圖中所示的中間步驟。 FIG. 7 illustrates a process 200 of a trimming process according to some embodiments. The trimming process described in the process flow 200 of FIG. 7 is similar to the trimming process described previously in FIGS. 6A to 6E. In step 202, the workpiece on the first platform is trimmed using a fine blade and then removed from the first platform. In step 202, the workpiece is also loaded onto the second platform and then trimmed using a coarse blade. In addition, one or more blades may optionally be trimmed in step 202. Step 202 is similar to the intermediate step shown in FIG. 6A or the intermediate step shown in FIG. 6E.

在步驟204,刀片架旋轉到第二位置。在步驟206,工件被裝載在第一平台上,然後使用粗刀片修整。在步驟206,第二平台上的工件也使用精細刀片修整,然後從第二台板上移除。步驟204和206類似於第6B圖所示的中 間步驟。 In step 204, the blade holder is rotated to the second position. In step 206, the workpiece is loaded on the first platform and then trimmed using the coarse blade. In step 206, the workpiece on the second platform is also trimmed using the fine blade and then removed from the second platform. Steps 204 and 206 are similar to the intermediate step shown in Figure 6B.

在步驟208,刀支架旋轉到第三位置。在步驟210,使用細刀片修整第一平台上的工件,然後將其從第一台板上移除。在步驟210,工件也被裝載到第二平台上,然後使用粗刀片修整。此外,一個或多個刀片可任選地在步驟210被修整。步驟208和210類似於第6C圖所示的中間步驟。 In step 208, the knife support is rotated to the third position. In step 210, the workpiece on the first platform is trimmed using the fine blade and then removed from the first platform. In step 210, the workpiece is also loaded onto the second platform and then trimmed using the coarse blade. In addition, one or more blades may optionally be trimmed in step 210. Steps 208 and 210 are similar to the intermediate step shown in FIG. 6C.

在步驟212,刀片架旋轉到第四位置。在步驟214,工件被裝載在第一平台上,然後使用粗刀片修整。在步驟214,第二平台上的工件也使用細刀片修整,然後從第二台板上移除。步驟212和214類似於第6D圖所示的中間步驟。 In step 212, the blade holder is rotated to the fourth position. In step 214, the workpiece is loaded on the first platform and then trimmed using the coarse blade. In step 214, the workpiece on the second platform is also trimmed using the fine blade and then removed from the second platform. Steps 212 and 214 are similar to the intermediate step shown in FIG. 6D.

在步驟216,刀片架旋轉回到第一位置,這類似於第6E圖所示的中間步驟。然後修整過程可以從步驟202繼續修整額外的工件。 At step 216, the blade holder is rotated back to the first position, which is similar to the intermediate step shown in Figure 6E. The dressing process can then continue from step 202 to dress additional workpieces.

第8A圖和第8B圖繪示了根據一些實施例的修整板130的重新定位。在一些實施例中,修整板130可以重新定位以提供未使用的表面用於修整刀片120。修整板130可以重新定位,例如,通過修整站132內的致動器旋轉或平移修整板130。第8A圖和第8B圖的示意性平面圖中顯示了一個說明性示例,其中修整板130在修整刀片120之後旋轉。第8A圖說明修整刀片120之後的修整板130,並且第8B圖繪示出了在刀片120的後續修整之前的修整板130。在第8A圖中,由於修整過程,刀片120 的修整產生了修整板130的使用區域131A。在第8B圖中,修整板130旋轉合適的角度A1以在修整期間將已使用區域131A從刀片120下方的位置移開並且在修整期間將未使用區域131B移動到刀片120下方的位置。這樣,修整板130可以根據需要旋轉,為刀片120的修整提供未使用的區域,可以提高刀片120的修整質量,從而提高使用該刀片120進行修整的質量。 FIGS. 8A and 8B illustrate repositioning of the trimming plate 130 according to some embodiments. In some embodiments, the trimming plate 130 can be repositioned to provide an unused surface for trimming the blade 120. The trimming plate 130 can be repositioned, for example, by rotating or translating the trimming plate 130 via an actuator within the trimming station 132. An illustrative example is shown in the schematic plan views of FIGS. 8A and 8B, where the trimming plate 130 is rotated after trimming the blade 120. FIG. 8A illustrates the trimming plate 130 after trimming the blade 120, and FIG. 8B illustrates the trimming plate 130 prior to subsequent trimming of the blade 120. In FIG. 8A, the trimming of the blade 120 creates a used area 131A of the trimming plate 130 as a result of the trimming process. In FIG. 8B , the trimming plate 130 is rotated at an appropriate angle A1 to move the used area 131A away from the position under the blade 120 during trimming and to move the unused area 131B to the position under the blade 120 during trimming. In this way, the trimming plate 130 can be rotated as needed to provide an unused area for the trimming of the blade 120, which can improve the trimming quality of the blade 120, thereby improving the quality of trimming using the blade 120.

在一些實施例中,修整板130可具有適合於具有不同粒度的刀片120的不同區域。以這種方式,單一修整板130可用於修整不同類型的刀片120。第9A圖和第9B圖繪示出了修整板130的兩個說明性示例,其具有適用於具有不同粒度的刀片120的不同粒度區域133。例如,第9A圖顯示了具有對應於不同粒度的粒度區域133A至133C的修整板130,並且第9B圖顯示了具有對應於不同粒度的粒度區域133A至133B的修整板。在第9A圖中,不同的粒度區域133A至133C佈置在同心環或環狀物中。在第9B圖中,不同的粒度區域133A至133B被佈置為修整板130的相鄰部分(例如,兩半)。這些是說明性示例,並且具有其他數量、佈置、形狀或粒度區域133的組合的其他修整板130是可能的。 In some embodiments, the trimming plate 130 may have different regions suitable for blades 120 having different grit sizes. In this way, a single trimming plate 130 can be used to trim different types of blades 120. FIGS. 9A and 9B depict two illustrative examples of a trimming plate 130 having different grit size regions 133 suitable for blades 120 having different grit sizes. For example, FIG. 9A shows a trimming plate 130 having grit size regions 133A to 133C corresponding to different grit sizes, and FIG. 9B shows a trimming plate having grit size regions 133A to 133B corresponding to different grit sizes. In FIG. 9A, the different grit size regions 133A to 133C are arranged in concentric rings or annuli. In FIG. 9B , the different grain size regions 133A-133B are arranged as adjacent portions (e.g., two halves) of the trimming plate 130. These are illustrative examples, and other trimming plates 130 having other numbers, arrangements, shapes, or combinations of grain size regions 133 are possible.

在一些實施例中,可以旋轉修整板130以對齊修整板130的未使用區域和/或在修整刀片120之前將不同的粒度區域133與刀片120對齊。通過為修整板130提供不同的粒度區域133,可以修整不同類型的刀片120, 而無需為每種類型的刀片120使用單獨的修整板130。在一些實施例中,刀片120可以定位在修整板130的特定區域上,例如在未使用的區域或對應於不同粒度的區域。例如,刀片120的位置可以通過調整刀片架110的旋轉角度或通過使用致動器122調整刀片120從臂112的突出來控制(參見第5圖)。刀片120位置的調整可以與本文描述的任何修整板130結合。以此方式,可以減小修整工具100的尺寸,可以減少使用多個刀片120時修整所需的時間,並且可以提高修剪質量。 In some embodiments, the trimming plate 130 can be rotated to align unused areas of the trimming plate 130 and/or to align different grit areas 133 with the blade 120 before trimming the blade 120. By providing the trimming plate 130 with different grit areas 133, different types of blades 120 can be trimmed without using a separate trimming plate 130 for each type of blade 120. In some embodiments, the blade 120 can be positioned on a specific area of the trimming plate 130, such as in an unused area or an area corresponding to a different grit size. For example, the position of the blade 120 can be controlled by adjusting the rotation angle of the blade holder 110 or by adjusting the protrusion of the blade 120 from the arm 112 using the actuator 122 (see Figure 5). The adjustment of the position of the blade 120 can be combined with any of the trimming plates 130 described herein. In this way, the size of the trimming tool 100 can be reduced, the time required for trimming when using multiple blades 120 can be reduced, and the trimming quality can be improved.

在一些實施例中,刀架110可包括一個或多個感測器,用於監測或測量刀片120的特性。根據一些實施例,在第10A圖的示意性剖面圖中繪示出了說明性示例,其顯示出了包括部分的輪轂111和臂112的刀片架110的一部分。如第10A圖所示,一個或多個感測器140可以位於輪轂111中,儘管在其他實施例中感測器140可以具有不同的位置。在一些實施例中,附接至刀片架110的每個刀片120可具有位於刀片架110中的對應的感測器140或感測器組140。例如,持有四個刀片120的刀片架110可具有四組感測器140。感測器140可配置成測量相應刀片120的特性,例如位置、粗糙度、直徑、均勻性、平面度或其他特性。在一些情況下,一個感測器140可以測量刀片120的不止一種特性。在一些實施例中,感測器140可在刀片120旋轉時測量刀片120的特性,這可能是在修剪期間、修整期間或當刀片120未使用時。例如,在一些 實施例中,當刀片120位於不合適的修整板130上時,感測器140可以測量刀片120的特性,如第6B圖中的刀片120A或120D。在一些實施例中,感測器140可以是基於雷射的感測器、光學感測器或其他類型的感測器。第10A圖中所示的示例感測器140是基於雷射的感測器。在一些實施例中,感測器140提供的測量值可以指示應該修整或更換刀片120。 In some embodiments, the blade holder 110 may include one or more sensors for monitoring or measuring characteristics of the blade 120. According to some embodiments, an illustrative example is shown in the schematic cross-sectional view of FIG. 10A, which shows a portion of the blade holder 110 including a portion of the hub 111 and the arm 112. As shown in FIG. 10A, one or more sensors 140 can be located in the hub 111, although in other embodiments the sensors 140 can have different locations. In some embodiments, each blade 120 attached to the blade holder 110 can have a corresponding sensor 140 or sensor group 140 located in the blade holder 110. For example, a blade holder 110 holding four blades 120 can have four groups of sensors 140. The sensor 140 may be configured to measure a characteristic of a corresponding blade 120, such as position, roughness, diameter, uniformity, flatness, or other characteristic. In some cases, a sensor 140 may measure more than one characteristic of a blade 120. In some embodiments, the sensor 140 may measure a characteristic of a blade 120 while the blade 120 is rotating, which may be during trimming, during dressing, or when the blade 120 is not in use. For example, in some embodiments, the sensor 140 may measure a characteristic of a blade 120 when the blade 120 is located on an unsuitable trimming plate 130, such as blades 120A or 120D in FIG. 6B. In some embodiments, the sensor 140 may be a laser-based sensor, an optical sensor, or other type of sensor. The example sensor 140 shown in FIG. 10A is a laser-based sensor. In some embodiments, the measurements provided by sensor 140 may indicate that blade 120 should be trimmed or replaced.

在一些實施例中,感測器140可以測量相應刀片120相對於感測器140的位置。例如,感測器140可以使用雷射來測量刀片120從臂112的一端突出的距離。以這種方式,可以更精確地確定刀片120的位置。在一些情況下,感測器140可與致動器122一起使用以更精確地或準確地調整刀片120的位置。 In some embodiments, the sensor 140 can measure the position of the corresponding blade 120 relative to the sensor 140. For example, the sensor 140 can use a laser to measure the distance that the blade 120 protrudes from one end of the arm 112. In this way, the position of the blade 120 can be more accurately determined. In some cases, the sensor 140 can be used with the actuator 122 to more precisely or accurately adjust the position of the blade 120.

在一些實施例中,感測器140可以測量相應刀片120的粗糙度。作為說明性示例,第10B圖繪示出了刀片120的邊緣的放大圖。感測器140可以被配置為測量刀片120的邊緣的表面變化,例如刀片120的最大變化,在第10B圖中表示為R1。在一些實施例中,刀片120的粗糙度測量值可以指示刀片120需要修整或更換。例如,如果粗糙度、最大高度變化、平均高度變化等超過特定閾值,則可以修整刀片120。 In some embodiments, the sensor 140 can measure the roughness of the corresponding blade 120. As an illustrative example, FIG. 10B depicts an enlarged view of the edge of the blade 120. The sensor 140 can be configured to measure the surface variation of the edge of the blade 120, such as the maximum variation of the blade 120, represented as R1 in FIG. 10B. In some embodiments, the roughness measurement of the blade 120 can indicate that the blade 120 needs to be trimmed or replaced. For example, if the roughness, maximum height variation, average height variation, etc. exceed a certain threshold value, the blade 120 can be trimmed.

在一些實施例中,感測器140可測量相應葉片120的絕對高度或直徑。作為說明性示例,第10C圖繪示出刀片120的邊緣的放大圖。感測器140可被配置為測量 刀片120的高度,例如刀片120的最小高度,在第10C圖中表示為H1。在一些實施例中,刀片120的高度測量值可以指示刀片120需要修整或更換。例如,如果刀片的最小高度H1小於某個閾值(例如,第10C圖中指示的閾值T1),則可以修整或更換刀片120。 In some embodiments, the sensor 140 may measure the absolute height or diameter of the corresponding blade 120. As an illustrative example, FIG. 10C shows an enlarged view of the edge of the blade 120. The sensor 140 may be configured to measure the height of the blade 120, such as the minimum height of the blade 120, which is indicated as H1 in FIG. 10C. In some embodiments, the height measurement of the blade 120 may indicate that the blade 120 needs to be trimmed or replaced. For example, if the minimum height H1 of the blade is less than a certain threshold (e.g., the threshold T1 indicated in FIG. 10C), the blade 120 may be trimmed or replaced.

第12圖繪示出了根據一些實施例的修整工具400的一部分的示意性剖面圖。修整工具400可類似於本文所述的其他修整工具,除了單一刀片120被配置以用於兩個工件50A至50B。例如,修整工具400包括將工件50A支撐在刀片120上方的上平台104A和將工件50B支撐在刀片120下方的下平台104B。以這種方式,刀片120可以同時修整工件50A至50B。在一些情況下,刀片120可以依次修整工件50A至50B。修整工具400還包括位於工件50A至50B之間的蓋子410,其防止顆粒或碎屑積聚在下工件50B上。修整工具400的使用允許增加修整工件的速率。 FIG. 12 depicts a schematic cross-sectional view of a portion of a dressing tool 400 according to some embodiments. The dressing tool 400 may be similar to other dressing tools described herein, except that a single blade 120 is configured for use with two workpieces 50A-50B. For example, the dressing tool 400 includes an upper platform 104A that supports the workpiece 50A above the blade 120 and a lower platform 104B that supports the workpiece 50B below the blade 120. In this manner, the blade 120 may dress the workpieces 50A-50B simultaneously. In some cases, the blade 120 may dress the workpieces 50A-50B sequentially. The dressing tool 400 also includes a cover 410 located between the workpieces 50A-50B that prevents particles or debris from accumulating on the lower workpiece 50B. The use of the dressing tool 400 allows for an increased rate of dressing the workpieces.

本文描述的實施例具有優點。本文所述的修整工具允許同時進行多刀片修整和多工件修整。這可以減少修整刀片所花費的時間並提高工件修整的速度。感測器等檢查工具也用於監控刀片、工件和修整板的狀況,以實現更高的產量、更高效的修整和更輕鬆的維護。本文所述的修整工具允許根據需要自動修整刀片。 The embodiments described herein have advantages. The dressing tools described herein allow for simultaneous multi-blade dressing and multi-workpiece dressing. This can reduce the time spent dressing blades and increase the speed of workpiece dressing. Inspection tools such as sensors are also used to monitor the condition of blades, workpieces, and dressing plates to achieve higher throughput, more efficient dressing, and easier maintenance. The dressing tools described herein allow for automatic dressing of blades as needed.

根據本公開的一些實施例,一種設備包括配置用以支撐第一工件的第一平台;第一修整板;以及刀片架,其 包括從中心軸延伸的多個臂,其中刀片架配置為在每個相應臂的端部固定刀片,其中刀片架可操作以繞中心軸旋轉,其中刀片架配置為使用至少一個刀片修整第一工件,其中刀片架配置為將至少一個刀片在第一修整板上修整。在一個實施例中,該設備包括配置用以支撐第二工件的第二台板,其中刀片架配置為使用一刀片修整第一工件並同時使用另一刀片修整第二工件。在一個實施例中,該設備包括第二修整板,其中刀片架配置為將一刀片在第一修整板上修整,並同時將另一刀片在第二修整板上修整。在一個實施例中,其中刀片架具有四個臂。在一個實施例中,該設備包括感應臂配置用以量測第一工件的修剪區域的狀況。在一個實施例中,刀片支架包括感測器,感測器配置用以測量被刀片架支撐的刀片的狀況。在一個實施例中,刀片支架的每個臂包括致動器,其中每個致動器配置為在相應臂的端部延伸或縮回刀片。在一個實施例中,第一修整板包括對應於第一刀片粒度的第一區域和對應於第二刀片粒度的第二區域。 According to some embodiments of the present disclosure, an apparatus includes a first platform configured to support a first workpiece; a first trimming plate; and a blade holder, which includes a plurality of arms extending from a central axis, wherein the blade holder is configured to fix a blade at the end of each corresponding arm, wherein the blade holder is operable to rotate about the central axis, wherein the blade holder is configured to trim the first workpiece using at least one blade, wherein the blade holder is configured to trim the at least one blade on the first trimming plate. In one embodiment, the apparatus includes a second platform configured to support a second workpiece, wherein the blade holder is configured to trim the first workpiece using one blade and simultaneously trim the second workpiece using another blade. In one embodiment, the apparatus includes a second trimming plate, wherein the blade holder is configured to trim one blade on the first trimming plate and simultaneously trim another blade on the second trimming plate. In one embodiment, the blade holder has four arms. In one embodiment, the apparatus includes a sensing arm configured to measure a condition of a trimmed area of a first workpiece. In one embodiment, a blade holder includes a sensor configured to measure a condition of a blade supported by the blade holder. In one embodiment, each arm of the blade holder includes an actuator, wherein each actuator is configured to extend or retract a blade at an end of the corresponding arm. In one embodiment, a first trimming plate includes a first region corresponding to a first blade size and a second region corresponding to a second blade size.

根據本公開的一些實施例,一種修整工具包括具有複數個臂的刀片架,其中刀片架支撐複數個刀片,其中每個臂支撐相應的刀片;複數個平台,其中各平台配置為支撐一對應晶圓,其中複數個平台與複數個臂中的第一組臂對齊;以及複數個修整板,其中複數個修整板與複數個臂中的第二組臂對齊。在一個實施例中,複數個刀片呈十字形排列。在一個實施例中,複數個刀片包含至少兩種不同 類型的刀片。在一個實施例中,複數個修整板包含至少兩種不同類型的修整板。在一個實施例中,刀片架可操作旋轉以將複數個平台與第二組臂對齊並且將複數個修整板與第一組臂對齊。在一個實施例中,複數個平台包含位於複數個平台之第二平台上方的複數個平台的第一平台。在一個實施例中,複數個修整板中的各修整板配置為獨立旋轉。 According to some embodiments of the present disclosure, a trimming tool includes a blade holder having a plurality of arms, wherein the blade holder supports a plurality of blades, wherein each arm supports a corresponding blade; a plurality of platforms, wherein each platform is configured to support a corresponding wafer, wherein the plurality of platforms are aligned with a first set of arms in the plurality of arms; and a plurality of trimming plates, wherein the plurality of trimming plates are aligned with a second set of arms in the plurality of arms. In one embodiment, the plurality of blades are arranged in a cross shape. In one embodiment, the plurality of blades include at least two different types of blades. In one embodiment, the plurality of trimming plates include at least two different types of trimming plates. In one embodiment, the blade holder is operable to rotate to align the plurality of platforms with the second set of arms and to align the plurality of trimming plates with the first set of arms. In one embodiment, the plurality of platforms includes a first platform of the plurality of platforms located above a second platform of the plurality of platforms. In one embodiment, each trimming plate of the plurality of trimming plates is configured to rotate independently.

根據本公開的一些實施例,一種方法包括旋轉刀片架以使刀片架的第一刀片與第一平台對齊,並使刀片架的第二刀片與第一修整板對齊;使用第一刀片修剪在第一平台上的第一工件;使用第一修整板修整第二刀片;旋轉刀片架以使刀片架的第二刀片與第一平台對準;以及使用第二刀片修剪在第一平台上的第二工件。在一個實施例中,該方法包括在修整第二刀片之後旋轉第一修整板。在一個實施例中,旋轉刀片架以使第一刀片與第一工件對齊也將第三刀片與第三工件對齊。在一個實施例中,該方法包括使用第一刀片修剪第一工件的同時,使用第三刀片修剪第三工件。在一個實施例中,第一刀片具有粗粒度,且第二刀片具有細粒度。 According to some embodiments of the present disclosure, a method includes rotating a blade holder to align a first blade of the blade holder with a first platform and aligning a second blade of the blade holder with a first trimming plate; trimming a first workpiece on the first platform using the first blade; trimming the second blade using the first trimming plate; rotating the blade holder to align the second blade of the blade holder with the first platform; and trimming the second workpiece on the first platform using the second blade. In one embodiment, the method includes rotating the first trimming plate after trimming the second blade. In one embodiment, rotating the blade holder to align the first blade with the first workpiece also aligns the third blade with the third workpiece. In one embodiment, the method includes trimming the first workpiece using the first blade while trimming the third workpiece using the third blade. In one embodiment, the first blade has a coarse grain size and the second blade has a fine grain size.

以上概述了幾個實施例之特徵,以便熟習此項技術者可更好地理解本揭示案之態樣。熟習此項技術者應理解,他們可容易地使用本揭示案作為設計或修改其他製程及結構的基礎,以實現與本文所介紹的實施例相同的目的及/或實現相同的優點。熟習此項技術者亦應認識到,此類等同 構造並不脫離本揭示案之精神及範圍,並且在本文中可在不脫離本揭示案之精神及範圍的情況下對其進行各種更改、替換及更改。 The features of several embodiments are summarized above so that those skilled in the art can better understand the state of the present disclosure. Those skilled in the art should understand that they can easily use the present disclosure as a basis for designing or modifying other processes and structures to achieve the same purpose and/or achieve the same advantages as the embodiments described herein. Those skilled in the art should also recognize that such equivalent structures do not depart from the spirit and scope of the present disclosure, and that various changes, substitutions and modifications may be made to them herein without departing from the spirit and scope of the present disclosure.

50A:工件 50A: Workpiece

50B:工件 50B: Workpiece

60:機械臂 60:Robotic arm

100:修整工具 100: Dressing tools

102:修整站 102: Repair station

104A:平台 104A: Platform

104B:平台 104B: Platform

106:感測臂 106:Sensing arm

110:刀片架 110: Blade holder

111:輪轂 111: wheel hub

112A:臂 112A: Arm

112B:臂 112B: Arm

112C:臂 112C: Arm

112D:臂 112D: Arm

113:中心軸 113:Center axis

120A:刀片 120A: Blade

120B:刀片 120B: Blade

120C:刀片 120C: Blade

120D:刀片 120D: Blade

130A:修整板 130A: Trimming plate

130B:修整板 130B: Trimming plate

132A:修整站 132A: Repair station

132B:修整站 132B: Repair station

Claims (10)

一種修整設備,包含:一第一平台,配置用以支撐一第一工件;一第一修整板;一刀片架,包含從一中心軸延伸的多個臂,其中該刀片架配置為在每個相應臂的一端部固定一刀片,其中該刀片架可操作以繞該中心軸旋轉,其中該刀片架配置為使用至少一個刀片修整該第一工件,其中該刀片架配置為將至少一個刀片在該第一修整板上修整;以及一第二平台,配置用以支撐一第二工件,其中該刀片架配置為使用一刀片修整該第一工件並同時使用另一刀片修整該第二工件。 A trimming device comprises: a first platform configured to support a first workpiece; a first trimming plate; a blade holder comprising a plurality of arms extending from a central axis, wherein the blade holder is configured to fix a blade at an end of each corresponding arm, wherein the blade holder is operable to rotate around the central axis, wherein the blade holder is configured to trim the first workpiece using at least one blade, wherein the blade holder is configured to trim at least one blade on the first trimming plate; and a second platform configured to support a second workpiece, wherein the blade holder is configured to trim the first workpiece using one blade and simultaneously trim the second workpiece using another blade. 如請求項1所述之修整設備,其中該刀片架具有四個臂。 A trimming device as described in claim 1, wherein the blade holder has four arms. 如請求項1所述之修整設備,更包含一第二修整板,其中該刀片架配置為將一刀片在該第一修整板上修整,並同時將另一刀片在該第二修整板上修整。 The trimming device as described in claim 1 further comprises a second trimming plate, wherein the blade holder is configured to trim a blade on the first trimming plate and trim another blade on the second trimming plate at the same time. 如請求項1所述之修整設備,更包含一感應 臂配置用以量測該第一工件的一修剪區域的一狀況。 The trimming device as described in claim 1 further comprises a sensor arm configured to measure a condition of a trimming area of the first workpiece. 如請求項1所述之修整設備,其中該刀片架更包含一感測器,該感測器配置用以測量被該刀片架支撐的一刀片的一狀況。 The trimming device as described in claim 1, wherein the blade holder further comprises a sensor, the sensor being configured to measure a condition of a blade supported by the blade holder. 如請求項1所述之修整設備,其中該刀片架的每個臂包含一致動器,其中每個致動器配置為在相應該臂的該端部延伸或縮回該刀片。 A trimming device as described in claim 1, wherein each arm of the blade holder includes an actuator, wherein each actuator is configured to extend or retract the blade at the end of the corresponding arm. 如請求項1所述之修整設備,其中該第一修整板包含對應於一第一刀片粒度的一第一區域和對應於一第二刀片粒度的一第二區域。 The trimming device as described in claim 1, wherein the first trimming plate includes a first area corresponding to a first blade particle size and a second area corresponding to a second blade particle size. 一種修整工具,包含:一刀片架;包含複數個臂,其中該刀片架支撐複數個刀片,其中各該臂支撐對應的一刀片;複數個平台,其中各該平台配置為支撐一對應晶圓,其中該複數個平台與該複數個臂中的一第一組臂對齊;以及複數個修整板,其中該複數個修整板與該複數個臂中的一第二組臂對齊。 A trimming tool comprises: a blade holder; a plurality of arms, wherein the blade holder supports a plurality of blades, wherein each arm supports a corresponding blade; a plurality of platforms, wherein each platform is configured to support a corresponding wafer, wherein the plurality of platforms are aligned with a first set of arms among the plurality of arms; and a plurality of trimming plates, wherein the plurality of trimming plates are aligned with a second set of arms among the plurality of arms. 如請求項8所述之修整工具,其中該複數個平台包含位於該複數個平台之一第二平台上方的該複數個 平台的一第一平台。 A trimming tool as described in claim 8, wherein the plurality of platforms includes a first platform of the plurality of platforms located above a second platform of the plurality of platforms. 一種修整方法,包含:旋轉一刀片架以使該刀片架的一第一刀片與一第一平台對齊,使該刀片架的一第二刀片與一第一修整板對齊,並使一第三刀片與一第三工件對齊;使用該第一刀片修剪在該第一平台上的一第一工件,且同時使用該第三刀片修剪該第三工件;使用該第一修整板修整該第二刀片;旋轉該刀片架以使該刀片架的該第二刀片與該第一平台對準;以及使用該第二刀片修剪在該第一平台上的一第二工件。 A trimming method includes: rotating a blade holder to align a first blade of the blade holder with a first platform, aligning a second blade of the blade holder with a first trimming plate, and aligning a third blade with a third workpiece; trimming a first workpiece on the first platform using the first blade, and trimming the third workpiece using the third blade at the same time; trimming the second blade using the first trimming plate; rotating the blade holder to align the second blade of the blade holder with the first platform; and trimming a second workpiece on the first platform using the second blade.
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TW201408430A (en) * 2012-08-16 2014-03-01 Taiwan Semiconductor Mfg Grinding wheel for wafer edge trimming and method of wafer edge trimming
JP2014054713A (en) * 2012-09-13 2014-03-27 Disco Abrasive Syst Ltd Method of processing wafer
TW201611946A (en) * 2014-07-18 2016-04-01 Applied Materials Inc Modifying substrate thickness profiles
TW202010599A (en) * 2018-09-12 2020-03-16 日商迪思科股份有限公司 Edge trimming device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201408430A (en) * 2012-08-16 2014-03-01 Taiwan Semiconductor Mfg Grinding wheel for wafer edge trimming and method of wafer edge trimming
JP2014054713A (en) * 2012-09-13 2014-03-27 Disco Abrasive Syst Ltd Method of processing wafer
TW201611946A (en) * 2014-07-18 2016-04-01 Applied Materials Inc Modifying substrate thickness profiles
TW202010599A (en) * 2018-09-12 2020-03-16 日商迪思科股份有限公司 Edge trimming device

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