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US20240326195A1 - Multi-Blade Trimming and Dressing Tool - Google Patents

Multi-Blade Trimming and Dressing Tool Download PDF

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Publication number
US20240326195A1
US20240326195A1 US18/193,405 US202318193405A US2024326195A1 US 20240326195 A1 US20240326195 A1 US 20240326195A1 US 202318193405 A US202318193405 A US 202318193405A US 2024326195 A1 US2024326195 A1 US 2024326195A1
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US
United States
Prior art keywords
blade
dressing
workpiece
blade holder
platen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
US18/193,405
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English (en)
Inventor
Fang-I Chen
Pei-Keng Tsai
Hui-Chi Huang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiwan Semiconductor Manufacturing Co TSMC Ltd
Original Assignee
Taiwan Semiconductor Manufacturing Co TSMC Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Manufacturing Co TSMC Ltd filed Critical Taiwan Semiconductor Manufacturing Co TSMC Ltd
Priority to US18/193,405 priority Critical patent/US20240326195A1/en
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. reassignment TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HUANG, HUI-CHI, CHEN, FANG-I, TSAI, PEI-KENG
Priority to TW112119654A priority patent/TWI864781B/zh
Priority to CN202420441826.0U priority patent/CN221947105U/zh
Publication of US20240326195A1 publication Critical patent/US20240326195A1/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
    • B24B3/36—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
    • B24B3/46—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades of disc blades

Definitions

  • Semiconductor device fabrication is a process used to create integrated circuits that are present in everyday electronic devices.
  • the fabrication process is a multiple-step sequence of photolithographic and chemical processing steps during which electronic circuits are gradually created on a wafer composed of a semiconducting material.
  • the edge of the wafer may become warped, damaged, or otherwise unsuitable for use with electronic circuits. Hence, the edge of the wafer may be trimmed during fabrication.
  • FIGS. 1 A, 1 B, and 1 C illustrate cross-sections of intermediate stages in the processing of workpieces including a trimming step, in accordance with some embodiments.
  • FIGS. 2 A, 2 B, and 2 C illustrate cross-sections of intermediate stages in the processing of workpieces including a trimming step, in accordance with some embodiments.
  • FIG. 3 illustrates a schematic plan view of a trimming tool, in accordance with some embodiments.
  • FIG. 4 illustrates a schematic perspective view of a trimming tool, in accordance with some embodiments.
  • FIG. 5 shows schematic perspective views of a blade attached to the end of an arm of a blade holder, in accordance with some embodiments.
  • FIGS. 6 A, 6 B, 6 C, 6 D, and 6 E intermediate steps of a trimming process utilizing a trimming tool are shown, in accordance with some embodiments.
  • FIG. 7 illustrates process flow for a trimming process, in accordance with some embodiments.
  • FIGS. 8 A and 8 B illustrate a process for dressing a blade with a dressing board, in accordance with some embodiments.
  • FIGS. 9 A and 9 B illustrate dressing boards, in accordance with some embodiments.
  • FIGS. 10 A, 10 B, and 10 C illustrate a sensor for a blade and example blade measurements, in accordance with some embodiments.
  • FIG. 11 illustrates a schematic plan view of a trimming tool, in accordance with some embodiments.
  • FIG. 12 illustrates a schematic cross-sectional view of a portion of a trimming tool, in accordance with some embodiments.
  • first and second features are formed in direct contact
  • additional features may be formed between the first and second features, such that the first and second features may not be in direct contact
  • present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
  • spatially relative terms such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures.
  • the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures.
  • the apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.
  • the trimming tool described herein includes a blade holder configured to hold and operate multiple trimming blades such that multiple workpieces (e.g., wafers) can be trimmed by different blades on the blade holder. Additionally, the blade holder is configured to rotate such that some blades can be “dressed” (e.g., cleaned using one or more dressing boards) while other blades are used to trim workpieces. In this manner, the rate at which workpieces are trimmed may be increased while still allowing blades to be dressed as needed. This can reduce processing time and improve efficiency.
  • the blade holder may also include sensors that monitor blade position or blade conditions, which can allow for more efficient and cost-effective blade dressing.
  • FIGS. 1 A through 1 C and FIGS. 2 A through 2 C illustrate cross-sections of intermediate stages in the processing of workpieces including a trimming step, in accordance with some embodiments.
  • the processes shown in FIGS. 1 A- 1 C and 2 A- 2 C are illustrative examples, and any other suitable processes including trimming step may be used with the embodiments of the present disclosure.
  • a first wafer 10 is bonded to a second wafer 20 to form a workpiece 50 .
  • the workpiece 50 may also be referred to as a “wafer,” a “reconstituted wafer,” a “bonded structure,” a “stacked wafer structure,” or the like.
  • Edge portions of the workpiece 50 are then removed in a trimming process, which may be performed using embodiments described herein. In some cases, trimming a workpiece 50 may reduce warping, cracking, or debonding.
  • the first wafer 10 is bonded or otherwise attached to the second wafer 20 to form the workpiece 50 .
  • the first wafer 10 and/or the second wafer 20 may be a semiconductor wafer such as a silicon bulk wafer or a gallium arsenide wafer.
  • the first wafer 10 and/or the second wafer comprises, for example, silicon, strained silicon, silicon alloy, silicon carbide, silicon-germanium, silicon-germanium carbide, germanium, a germanium alloy, germanium-arsenic, indium-arsenic, group III-V semiconductors, a combination thereof, or the like.
  • the first wafer 10 and/or the second wafer 20 is a buried oxide (BOX) wafer, a device wafer, an interposer, an organic core substrate, a combination thereof, or the like.
  • the first wafer 10 and the second wafer 20 may have similar or different materials or dimensions.
  • the first wafer 10 may be bonded to the second wafer 20 using direct bonding (e.g., dielectric-to-dielectric bonding and/or metal-to-metal bonding), using an adhesive, or using another suitable technique.
  • the second wafer 20 may be considered a “carrier,” a “carrier substrate,” or a “carrier wafer.”
  • the workpiece 50 is trimmed, in accordance with some embodiments.
  • a region 45 around the edge of the workpiece 50 is removed.
  • the trimmed region 45 may be removed vertically downward from the first wafer 10 toward the second wafer 20 .
  • the trimmed region 45 may extend partially or fully through the first wafer 10 and may extend partially or fully through the second wafer 20 .
  • the trimmed region 45 shown in FIG. 1 B extends fully through the first wafer 10 and partially through the second wafer 20 .
  • the first wafer 10 is thinned using a suitable process, such as a chemical mechanical polish (CMP) process, a grinding process, an etching process, a combination thereof, or the like.
  • CMP chemical mechanical polish
  • the thinning process reduces the thickness of the first wafer 10 .
  • FIGS. 2 A- 2 C The process shown in FIGS. 2 A- 2 C is similar to the process shown in FIGS. 1 A- 1 C , except that the workpiece 50 is thinned before the workpiece 50 is trimmed.
  • FIG. 2 A shows a workpiece similar to that of FIG. 1 A .
  • FIG. 2 B the workpiece 50 is thinned to reduce the thickness of the first wafer 10 .
  • FIG. 2 C a trimming process is performed to remove a region 45 around the edge of the workpiece 50 , similar to the trimming process described for FIG. 1 C .
  • FIGS. 3 and 4 illustrate a trimming tool 100 , in accordance with some embodiments.
  • FIG. 3 illustrates a schematic plan view of the trimming tool 100
  • FIG. 4 illustrates a schematic perspective view of the trimming tool 100 .
  • the trimming tool 100 may be used to trim one or more workpieces 50 , which may be similar to the workpieces 50 described above for FIGS. 1 A- 2 C , though other workpieces 50 are possible.
  • the trimming tool 100 comprises a blade holder 110 configured to hold and operate multiple trimming blades 120 .
  • FIG. 5 shows schematic perspective views of a blade 120 attached to the end of an arm 112 , in accordance with some embodiments.
  • the blade 120 is attached to an actuator 122 within the arm 112 by a spindle 124 .
  • the actuator 122 may comprise a motor, a hydraulic actuator, a pneumatic actuator, a robotic arm, another type of actuator or mechanism, a combination thereof, or the like.
  • the actuator 122 may be configured to rotate the blade 120 (e.g., clockwise and/or counterclockwise, such as during trimming or dressing) or laterally translate (e.g., extend or retract) the blade 120 .
  • FIG. 5 shows the blade 120 in two different lateral positions after translation by the actuator 122 .
  • the actuator 122 may laterally translate the blade 120 within a range from about 1 mm to about 50 mm, but other ranges of translation are possible.
  • the actuator 122 may translate the blade 120 to suitably align the blade 120 with a workpiece 50 during a trimming process or to suitably align the blade 120 with a dressing board 130 during a dressing process, for example.
  • the arm 112 , the actuator 122 , and/or the spindle 124 may comprise a spring or damper (not shown) that reduces vibrations of the blade 120 during operation.
  • a blade 120 attached to an arm 112 may have a diameter in the range of about 10 mm to about 300 mm, though other diameters are possible.
  • the blade 120 may be formed of any suitable materials or have any suitable characteristics.
  • the blade 120 may comprise a bonding material of ceramic, resin, rubber, chlorine oxide (e.g., oxychloride), nickel, the like, or a combination thereof.
  • the blade 120 may have a grit size in the range of #100 to #7000, though other grit sizes are possible.
  • the blade 120 may have grit comprising diamond, cubic boron nitride (CBN), silicon carbide, aluminum oxide, zirconia alumina, zirconium dioxide, ceramic, garnet, the like, or a combination thereof.
  • the blade 120 may have a grit coating comprising nickel, nickel chrome, nickel aluminum, aluminum bronze, aluminum oxide, chrome oxide, zirconium oxide, chrome carbide nickel chrome, nickel graphite, aluminum, copper, molybdenum, tungsten carbide cobalt, titanium oxide, the like, or a combination thereof. Other materials are possible.
  • the various blades 120 attached to the arms 112 of a blade holder 110 may have similar or different characteristics. For example, returning to FIGS. 3 and 4 , the blades 120 A and 120 C respectively attached to arms 112 A and 112 C have a relatively course grit, and the blades 120 B and 120 D respectively attached to arms 112 B and 112 D have a relatively fine grit. Other combinations of blades and blade characteristics are possible.
  • a trimming process for a workpiece 50 may comprise trimming the workpiece 50 with a course blade 120 (e.g., blade 120 A or 120 C) and then trimming the workpiece 50 with a fine blade 120 (e.g., blade 120 B or 120 D).
  • blades 120 A and 120 C may be referred to as “course blades” herein, and blades 120 B and 120 D may be referred to as “fine blades” herein.
  • the multi-armed blade holder 110 described herein allows for a single workpiece 50 to be trimmed with multiple blades 120 during a trimming process.
  • the trimming tool 100 comprises a trimming station 102 that supports and rotates workpieces 50 during a trimming process, in accordance with some embodiments.
  • the trimming station 102 comprises a first platen 104 A and a second platen 104 B that are each configured to hold a workpiece 50 .
  • FIGS. 3 - 4 show the first platen 104 A holding a first workpiece 50 A and the second platen 104 B holding a second workpiece 50 B.
  • a trimming station 102 may comprise a different number of platens 104 in other embodiments.
  • a platen 104 may secure a workpiece 50 using, e.g. vacuum suction or another suitable technique, and may rotate the workpiece 50 (e.g., clockwise or counterclockwise) during a trimming process, in some embodiments.
  • the trimming tool 100 also comprises one or more dressing boards 130 , in accordance with some embodiments.
  • the dressing boards 130 are used to clean, reshape, and refresh blades 120 after performing a trimming process.
  • the dressing boards 130 are supported by a dressing station 132 , and in some embodiments, each dressing board 130 may have its own dressing station 132 .
  • FIGS. 3 - 4 show a first dressing board 130 A on a first dressing station 132 A and a second dressing board 130 B on a second dressing station 132 B. In other embodiments, both the first dressing board 130 A and the second dressing board 130 B may be supported by the same dressing station 132 .
  • a dressing board 130 may be rotated, translated, or positioned by the dressing station 132 .
  • the various dressing boards 130 may have similar or different characteristics.
  • the first dressing board 130 A may be suited for a blade 120 having relatively course grit (e.g., blade 120 A or 120 C)
  • the second dressing board 130 B may be suited for a blade 120 having relatively fine grit (e.g., blade 120 B or 120 D).
  • a dressing board 130 may be referred to as a “course dressing board” or a “fine dressing board” herein.
  • Other combinations of dressing boards and dressing board characteristics are possible.
  • the trimming tool 100 comprises a sensor arm 106 that measures characteristics of a workpiece 50 during or after performing a trimming process.
  • the sensor arm 106 may monitor, detect, or measure characteristics of a trimmed region (e.g., trimmed region 45 of FIGS. 1 B- 1 C or 2 B- 2 C ) of a workpiece 50 , such as depth, width, roughness, location, or the like.
  • the sensor arm 106 may comprise one or more sensors, which may be laser-based sensors, optical sensors (e.g., OCD sensors, CCD sensors, or the like) or other types of sensors.
  • the sensor arm 106 may be operable to rotate or translate between a first position to measure a first workpiece 50 (e.g., first workpiece 50 A in FIG. 3 ) and a second position to measure a second workpiece 50 (e.g., second workpiece 50 B in FIG. 3 ).
  • each platen 104 has an associated sensor arm 106 .
  • a trimming tool comprising a multi-blade holder may have a different configuration than the trimming tool 100 shown in FIGS. 3 - 4 .
  • FIG. 11 illustrates a trimming tool 300 , in accordance with some embodiments.
  • the trimming tool 300 has a blade holder 110 configured to hold six blades 120 A-F, which may be similar blades or blades of different types.
  • the trimming tool 300 also includes five platens (not separately shown) to hold five workpieces 50 A-E and includes one dressing board 130 on a dressing station 132 .
  • the trimming tool 300 is configured such that the five workpieces 50 A-E may be trimmed simultaneously by five of the blades 120 (e.g., blades 120 A-E) while the remaining blade 120 (e.g., blades 120 F) is dressed at the dressing board 130 .
  • the blade holder 110 may rotate in order to align different blades 120 A-F with different platens or with the dressing board 130 .
  • Another number or arrangement of blades 120 , workpieces 50 , dressing boards 130 , or other features is possible in other embodiments.
  • FIGS. 6 A through 6 E intermediate steps of an example trimming process utilizing the trimming tool 100 are shown, in accordance with some embodiments.
  • the trimming process shown in FIGS. 6 A- 6 E is an illustrative example, and other trimming processes with different steps or different sequences of steps may be used in other embodiments. Some of the actions described below for a step may be performed sequentially, and some of the actions described below for a step may be performed simultaneously. Some of the actions described below for a step may be performed in a different order than described. Using a suitable trimming process such as that described for FIGS.
  • the trimming tool 100 as described herein allows for the efficient trimming of workpieces 50 including the dressing of blades 120 with an improved “wafer-per-hour” rate. Additionally, the trimming process described in FIGS. 6 A- 6 E allow for each workpiece 50 to be trimmed with a course blade and then a fine blade, which can improve the smoothness and reproducibility of the trimmed region and reduce the risk of cracking or warping of the workpiece 50 .
  • the blade holder 110 is in a position such that a workpiece 50 on the first platen 104 A can be trimmed using the fine blade 120 B and a workpiece 50 on the second platen 104 B can be trimmed using the course blade 120 A.
  • the position of the blade holder 110 in FIG. 6 A may be considered an “initial position” or a “first position.”
  • the workpiece 50 A on the first platen 104 A is trimmed using the fine blade 120 B and then removed from the first platen 104 A (e.g., by a robotic arm 60 ).
  • the workpiece 50 A may be removed from the first platen 104 A and transferred to a cleaning station or the like, for example.
  • the workpiece 50 B is loaded onto the second platen 104 B (e.g., by a robotic arm 60 ) and then trimmed using the course blade 120 A.
  • the blade holder 110 is also in a position such that the course blade 120 C may be dressed using the course dressing board 130 A and the fine blade 120 D may be dressed using the fine dressing board 130 B.
  • the blades 120 C-D may be dressed while the workpieces 50 A-B are trimmed by the blades 120 A-B.
  • the dressing of the blades 120 C and/or 120 D when the blade holder 110 is in the first position is optional, and one, both, or neither of the blades 120 C-D may be dressed.
  • the condition of a blade 120 may be monitored or measured, and whether or not the blade 120 is dressed may be determined from the condition of the blade 120 .
  • a blade 120 may be dressed after trimming a predetermined number of workpieces 50 since the previous dressing of the blade 120 .
  • the blade holder 110 is rotated to a position such that a workpiece 50 on the first platen 104 A can be trimmed using the course blade 120 C and a workpiece 50 on the second platen 104 B can be trimmed using the fine blade 120 B.
  • the blade holder 110 may be rotated 90° around the central axis 113 as shown in FIG. 6 B , or may be rotated another appropriate angle.
  • the position of the blade holder 110 in FIG. 6 B may be considered a “second position.”
  • a workpiece 50 C is loaded onto the first platen 104 A (e.g., by a robotic arm 60 ) and then trimmed using the course blade 120 C.
  • the workpiece 50 B on the second platen 104 B is trimmed using the fine blade 120 B and then removed from the second platen 104 B (e.g., by a robotic arm 60 ).
  • the blade holder 110 is also in a position such that the course blade 120 A is aligned with the fine dressing board 130 B and the fine blade 120 D is aligned with the course dressing board 130 A.
  • no blades 120 are dressed when the blade holder 110 is in the second position.
  • the blade holder 110 is rotated to a position such that a workpiece 50 on the first platen 104 A can be trimmed using the fine blade 120 D and a workpiece 50 on the second platen 104 B can be trimmed using the course blade 120 C.
  • the blade holder 110 may be rotated a further 90° around the central axis 113 as shown in FIG. 6 C , or may be rotated another appropriate angle.
  • the position of the blade holder 110 in FIG. 6 C may be considered a “third position.”
  • the workpiece 50 C on the first platen 104 A is trimmed using the fine blade 120 D and then removed from the first platen 104 A (e.g., by a robotic arm 60 ).
  • a workpiece 50 D is loaded onto the second platen 104 B (e.g., by a robotic arm 60 ) and then trimmed using the course blade 120 C.
  • the blade holder 110 is also in a position such that the course blade 120 A is aligned with the course dressing board 130 A and the fine blade 120 B is aligned with the fine dressing board 130 B. In this manner, the blade 120 A and/or the blade 120 B may optionally be dressed when the blade holder 110 is in the third position.
  • the blade holder 110 is rotated to a position such that a workpiece 50 on the first platen 104 A can be trimmed using the course blade 120 A and a workpiece 50 on the second platen 104 B can be trimmed using the fine blade 120 D.
  • the blade holder 110 may be rotated a further 90° around the central axis 113 as shown in FIG. 6 D , or may be rotated another appropriate angle.
  • the position of the blade holder 110 in FIG. 6 D may be considered a “fourth position.”
  • a workpiece 50 E is loaded onto the first platen 104 A (e.g., by a robotic arm 60 ) and then trimmed using the course blade 120 A.
  • the workpiece 50 D on the second platen 104 B is trimmed using the fine blade 120 D and then removed from the second platen 104 B (e.g., by a robotic arm 60 ). Still referring to FIG. 6 D , the blade holder 110 is also in a position such that the course blade 120 C is aligned with the fine dressing board 130 B and the fine blade 120 B is aligned with the course dressing board 130 A. Thus, in some embodiments, no blades 120 are dressed when the blade holder 110 is in the fourth position.
  • the blade holder 110 is rotated back to the first position.
  • the blade holder 110 may be rotated 270° around the central axis 113 in a reverse direction, as shown in FIG. 6 D , or may be rotated another appropriate angle.
  • the workpiece 50 E on the first platen 104 A is trimmed using the fine blade 120 B and then removed from the first platen 104 A (e.g., by a robotic arm 60 ).
  • a workpiece 50 F is loaded onto the second platen 104 B (e.g., by a robotic arm 60 ) and then trimmed using the course blade 120 A.
  • the blade 120 C and/or the blade 120 D may optionally be dressed when the blade holder 110 is in the first position. In this manner, the steps described in FIGS. 6 A through 6 E may be repeated to efficiently trim workpieces 50 and dress blades 120 .
  • FIG. 7 illustrates process flow 200 for a trimming process, in accordance with some embodiments.
  • the trimming process described by the process flow 200 of FIG. 7 is similar to the trimming process described previously in FIGS. 6 A- 6 E .
  • a workpiece on a first platen is trimmed using a fine blade and then removed from the first platen.
  • a workpiece is also loaded on a second platen and then trimmed using a course blade. Additionally, one or more blades may optionally be trimmed at step 202 .
  • Step 202 is similar to the intermediate step shown in FIG. 6 A or the intermediate step shown in FIG. 6 E .
  • Step 204 the blade holder is rotated to a second position.
  • a workpiece is loaded on the first platen and then trimmed using a course blade.
  • the workpiece on the second platen is also trimmed using the fine blade and then removed from the second platen. Steps 204 and 206 are similar to the intermediate step shown in FIG. 6 B .
  • the blade holder is rotated to a third position.
  • the workpiece on the first platen is trimmed using a fine blade and then removed from the first platen.
  • a workpiece is also loaded on the second platen and then trimmed using the course blade. Additionally, one or more blades may optionally be trimmed at step 210 .
  • Steps 208 and 210 are similar to the intermediate step shown in FIG. 6 C .
  • Step 212 the blade holder is rotated to a fourth position.
  • a workpiece is loaded on the first platen and then trimmed using a course blade.
  • the workpiece on the second platen is also trimmed using the fine blade and then removed from the second platen. Steps 212 and 214 are similar to the intermediate step shown in FIG. 6 D .
  • step 216 the blade holder is rotated back to the first position, which is similar to the intermediate step shown in FIG. 6 E .
  • the trimming process may then continue from step 202 to trim additional workpieces.
  • FIGS. 8 A and 8 B illustrate the repositioning of a dressing board 130 , in accordance with some embodiments.
  • a dressing board 130 may be repositioned to provide an unused surface for the dressing of a blade 120 .
  • the dressing board 130 may be repositioned, for example, by an actuator within the dressing station 132 that rotates or translates the dressing board 130 .
  • An illustrative example is shown in the schematic plan views of FIGS. 8 A and 8 B , in which a dressing board 130 is rotated after the dressing of a blade 120 .
  • FIG. 8 A illustrates the dressing board 130 after dressing a blade 120
  • FIG. 8 B illustrates the dressing board 130 prior to a subsequent dressing of a blade 120 .
  • FIG. 8 A illustrates the dressing board 130 after dressing a blade 120
  • FIG. 8 B illustrates the dressing board 130 prior to a subsequent dressing of a blade 120 .
  • the dressing of the blade 120 results in a used region 131 A of the dressing board 130 due to the dressing process.
  • the dressing board 130 is rotated by a suitable angle A 1 to move the used region 131 A away from the location under a blade 120 during dressing and move an unused region 131 B into the location under a blade 120 during dressing.
  • the dressing board 130 may be rotated as needed to provide an unused region for the dressing of a blade 120 , which can improve the quality of the dressing of the blade 120 and thus improve the quality of the trimming using that blade 120 .
  • a dressing board 130 may have different regions that are suitable for blades 120 having different grit sizes. In this manner, a single dressing board 130 may be used for dressing different types of blades 120 .
  • FIGS. 9 A and 9 B show two illustrative examples of dressing boards 130 having different grit regions 133 that are suitable for blades 120 having different grit sizes.
  • FIG. 9 A shows a dressing board 130 having grit regions 133 A-C corresponding to different grit sizes
  • FIG. 9 B shows a dressing board having grit regions 133 A-B corresponding to different grit sizes.
  • the different grit regions 133 A-C are arranged in concentric rings or annuli.
  • the different grit regions 133 A-B are arranged as adjacent sections (e.g., two halves) of the dressing board 130 .
  • adjacent sections e.g., two halves
  • dressing boards 130 having other numbers, arrangements, shapes, or combinations of grit regions 133 are possible.
  • a dressing board 130 may be rotated to align an unused region of the dressing board 130 and/or to align a different grit region 133 with a blade 120 prior to the dressing of the blade 120 .
  • a blade 120 may be positioned over a particular region of a dressing board 130 , such as over an unused region or a region corresponding to a different grit.
  • the position of the blade 120 may be controlled by adjusting the rotation angle of the blade holder 110 or by adjusting the protrusion of the blade 120 from the arm 112 using the actuator 122 (see FIG. 5 ).
  • the adjustment of the blade 120 position may be combined with any of the dressing boards 130 described herein. In this manner, the size of the trimming tool 100 may be reduced, the time needed for dressing when multiple blades 120 are used may be reduced, and trimming quality may be improved.
  • the blade holder 110 may include one or more sensors that allow for monitoring or measuring of blade 120 characteristics.
  • An illustrative example is shown in the schematic cross-section of FIG. 10 A , which shows a portion of a blade holder 110 including a portion of the hub 111 and an arm 112 , in accordance with some embodiments.
  • one or more sensors 140 may be located in the hub 111 , though the sensors 140 may have different locations in other embodiments.
  • each blade 120 attached to the blade holder 110 may have a corresponding sensor 140 or set of sensors 140 located in the blade holder 110 .
  • a blade holder 110 that holds four blades 120 may have four sets of sensors 140 .
  • the sensors 140 may be configured to measure characteristics of the corresponding blade 120 such as position, roughness, diameter, uniformity, planarity, or other characteristics. One sensor 140 may measure more than one characteristic of a blade 120 , in some cases. In some embodiments, the sensors 140 may measure blade 120 characteristics as the blade 120 spins, which may be during trimming, during dressing, or when the blade 120 is not in use. For example, in some embodiments, a sensor 140 may measure the characteristics of a blade 120 when the blade 120 is positioned over an unsuitable dressing board 130 , such as blades 120 A or 120 D in FIG. 6 B . In some embodiments, the sensors 140 may be laser-based sensors, optical sensors, or other types of sensors. The example sensor 140 shown in FIG. 10 A is a laser-based sensor. In some embodiments, the measurements provided by a sensor 140 may indicate that a blade 120 should be dressed or replaced.
  • a sensor 140 may measure a position of the corresponding blade 120 relative to the sensor 140 .
  • the sensor 140 may use a laser to measure the distance that the blade 120 protrudes from an end of the arm 112 . In this manner, the position of the blade 120 may be more precisely determined.
  • the sensor 140 may be used with the actuator 122 to more precisely or accurately adjust the position of the blade 120 .
  • a sensor 140 may measure a roughness of the corresponding blade 120 .
  • FIG. 10 B shows a magnified view of an edge of a blade 120 .
  • the sensor 140 may be configured to measure surface variation of the edge of the blade 120 , such as a maximum variation of the blade 120 , indicated in FIG. 10 B as R 1 .
  • a roughness measurement of the blade 120 may indicate that the blade 120 is in need of dressing or replacement. For example, a blade 120 may be dressed if a roughness, maximum height variation, average height variation, or the like exceeds a certain threshold.
  • a sensor 140 may measure the absolute height or diameter of the corresponding blade 120 .
  • FIG. 10 C shows a magnified view of an edge of a blade 120 .
  • the sensor 140 may be configured to measure a height of the blade 120 , such as the minimum height of the blade 120 , indicated in FIG. 10 C as H 1 .
  • a height measurement of the blade 120 may indicate that the blade 120 is in need of dressing or replacement.
  • a blade 120 may be dressed or replaced if a minimum height H 1 of the blade is less than a certain threshold (e.g., threshold Tl indicated in FIG. 10 C ).
  • FIG. 12 illustrates a schematic cross-sectional view of a portion of a trimming tool 400 , in accordance with some embodiments.
  • the trimming tool 400 may be similar to other trimming tools described herein, except that a single blade 120 is configured to two workpieces 50 A-B.
  • the trimming tool 400 comprises an upper platen 104 A that holds a workpiece 50 A above the blade 120 , and a lower platen 104 B that holds a workpiece 50 B below the blade 120 .
  • the blade 120 may trim the workpieces 50 A-B simultaneously.
  • the blade 120 may trim the workpieces 50 A-B sequentially.
  • the trimming tool 400 also comprises a cover 410 between the workpieces 50 A-B that prevents particles or debris from accumulating on the lower workpiece 50 B. The use of the trimming tool 400 allows for the rate that workpieces are trimmed to be increased.
  • Embodiments described herein have advantages.
  • the trimming tools described herein allow for multi-blade dressing and multi-workpiece trimming at the same time. This can reduce time spent dressing blades and increase the rate at which workpieces are trimmed.
  • Inspection tools such as sensors, are also used to monitor blade, workpiece, and dressing board conditions to achieve higher yield, more efficient dressing, and easier maintenance.
  • the trimming tools described herein allow for blades to be automatically dressed as needed.
  • an apparatus includes a first platen configured to hold a first workpiece; a first dressing board; and blade holder including arms extending from a central axis, wherein the blade holder is configured to hold a blade at an end of each respective arm, wherein the blade holder is operable to rotate around the central axis, wherein the blade holder is configured to trim the first workpiece using at least one blade, wherein the blade holder is configured to dress at least one blade on the first dressing board.
  • the apparatus includes a second platen configured to hold a second workpiece, wherein the blade holder is configured to simultaneously trim the first workpiece using one blade and trim the second workpiece using another blade.
  • the apparatus includes a second dressing board, wherein the blade holder is configured to simultaneously dress one blade on the first dressing board and another blade on the second dressing board. In an embodiment, wherein the blade holder has four arms. In an embodiment, the apparatus includes a sensor arm configured to measure a condition of a trimmed region of the first workpiece. In an embodiment, the blade holder includes a sensor configured to measure a condition of a blade held by the blade holder. In an embodiment, each arm of the blade holder includes an actuator, wherein each actuator is configured to extend or retract the blade at the end of the respective arm. In an embodiment, the first dressing board includes a first region corresponding to a first blade grit size and a second region corresponding to a second blade grit size.
  • a trimming tool includes a blade holder comprising arms, wherein the blade holder holds blades, wherein each arm holds a respective blade; platens, wherein each platen is configured to hold a respective wafer, wherein the platens are aligned with a first set of arms; and dressing boards, wherein the dressing boards are aligned with a second set of arms.
  • the blades are in a cross-shaped arrangement.
  • the blades include at least two different types of blades.
  • the dressing boards include at least two different types of dressing boards.
  • the blade holder is operable to rotate to align the plurality of platens with the second set of arms and the plurality of dressing boards with the first set of arms.
  • the platens include a first platen that is located above a second platen.
  • each dressing board is configured to rotate independently.
  • a method includes rotating a blade holder to align a first blade of the blade holder with a first platen and a second blade of the blade holder with a first dressing board; trimming a first workpiece on the first platen using the first blade; dressing the second blade using the dressing board; rotating the blade holder to align the second blade of the blade holder with the first platen; and trimming a second workpiece on the first platen using the second blade.
  • the method includes rotating the dressing board after dressing the second blade.
  • rotating the blade holder to align the first blade with the first workpiece also aligns a third blade with a third workpiece.
  • the method includes trimming the third workpiece using the third blade while the first workpiece is trimmed using the first blade.
  • the first blade has a course grit size and the second blade has a fine grit size.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
US18/193,405 2023-03-30 2023-03-30 Multi-Blade Trimming and Dressing Tool Pending US20240326195A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US18/193,405 US20240326195A1 (en) 2023-03-30 2023-03-30 Multi-Blade Trimming and Dressing Tool
TW112119654A TWI864781B (zh) 2023-03-30 2023-05-26 修整設備、修整工具及修整方法
CN202420441826.0U CN221947105U (zh) 2023-03-30 2024-03-07 修整设备及修整工具

Applications Claiming Priority (1)

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US18/193,405 US20240326195A1 (en) 2023-03-30 2023-03-30 Multi-Blade Trimming and Dressing Tool

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9527188B2 (en) * 2012-08-16 2016-12-27 Taiwan Semiconductor Manufacturing Company, Ltd. Grinding wheel for wafer edge trimming
JP2014054713A (ja) * 2012-09-13 2014-03-27 Disco Abrasive Syst Ltd ウェーハの加工方法
CN106463384B (zh) * 2014-07-18 2020-03-17 应用材料公司 修改基板厚度轮廓
JP7222636B2 (ja) * 2018-09-12 2023-02-15 株式会社ディスコ エッジトリミング装置

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TW202438220A (zh) 2024-10-01
TWI864781B (zh) 2024-12-01

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