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US20190339022A1 - Loop vapor chamber - Google Patents

Loop vapor chamber Download PDF

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Publication number
US20190339022A1
US20190339022A1 US16/051,916 US201816051916A US2019339022A1 US 20190339022 A1 US20190339022 A1 US 20190339022A1 US 201816051916 A US201816051916 A US 201816051916A US 2019339022 A1 US2019339022 A1 US 2019339022A1
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United States
Prior art keywords
channel
wick
chamber
space
evaporation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US16/051,916
Inventor
Chuan-Chi TSENG
Wen-Ching Liao
Ming-Quan CUI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tai Sol Electronics Co Ltd
Original Assignee
Tai Sol Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tai Sol Electronics Co Ltd filed Critical Tai Sol Electronics Co Ltd
Assigned to TAI-SOL ELECTRONICS CO., LTD. reassignment TAI-SOL ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CUI, Ming-quan, LIAO, WEN-CHING, TSENG, CHUAN-CHI
Publication of US20190339022A1 publication Critical patent/US20190339022A1/en
Abandoned legal-status Critical Current

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/043Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/025Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having non-capillary condensate return means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure

Definitions

  • the present disclosure relates to vapor chambers and, more particularly, to a loop vapor chamber.
  • Taiwan patent 1592623 discloses a vapor chamber, comprising two vertically aligned metal boards, two layers of wick structure disposed therebetween, a working fluid for filling a space defined therebetween, and a supportive structure (supportive post).
  • the aforesaid technology enables the vapor chamber to function efficiently.
  • Taiwan patent 1598554 discloses a thin vapor chamber, comprising two vertically aligned metal boards and one layer of wick structure disposed therebetween, wherein the wick structure has a plurality of through holes penetrable by hollow-core protruding posts. Since its internal space is of little height, the thin vapor chamber has only one layer of wick structure. The single layer of wick structure not only adsorbs a working liquid but also takes up less height of the internal space; hence, the vapor chamber is of little thickness and thus thin.
  • the vapor chambers disclosed in the aforesaid prior art must comprise a layer of wick structure and thus cannot be made thinner. Therefore, it is important to provide a vapor chamber, comprising two vertically aligned metal boards without any wick layer therebetween, in part, so as to further reduce the thickness of the vapor chamber.
  • the return path is free of any wick layer to further reduce the thickness of the vapor chamber.
  • a loop vapor chamber comprising: a base board having therein a space; a lid for covering the base board and hermetically sealing the space to allow the space to have an evaporation chamber, a vapor channel, a condensation channel and a liquid channel, the vapor channel having an end in communication with the evaporation chamber and another end in connection with the condensation channel, the condensation channel being connected to the liquid channel, and the liquid channel being connected to the evaporation chamber; a wick disposed in the evaporation chamber without occupying the evaporation chamber fully such that an evaporation space is defined in the evaporation chamber, the evaporation space being in communication with the vapor channel, wherein a portion of the wick corresponds in position to a terminal end of the liquid channel; a space partition element disposed in the evaporation chamber to separate the evaporation space and the liquid channel; and a working fluid filling the evaporation chamber.
  • a return path composed of a vapor channel, a condensation channel and a liquid channel is integrally formed between a base board and a lid.
  • the return path is free of any wick layer but still allows the working fluid to transit from a gaseous phase to a liquid phase and return to the evaporation chamber. With a wick layer being dispensed with, the return path further reduces the thickness requirement of the vapor chamber.
  • FIG. 1 is a perspective view of a loop vapor chamber according to the first preferred embodiment of the present disclosure
  • FIG. 2 is an exploded view of the loop vapor chamber according to the first preferred embodiment of the present disclosure
  • FIG. 3 is a top view of the loop vapor chamber according to the first preferred embodiment of the present disclosure, showing mainly a base board of the loop vapor chamber;
  • FIG. 4 is a cross-sectional view of the loop vapor chamber taken along line 4 - 4 of FIG. 1 ;
  • FIG. 5 is a schematic view of operation of the loop vapor chamber according to the first preferred embodiment of the present disclosure, showing how to form fluid slugs;
  • FIG. 6 is an exploded view of the loop vapor chamber according to the second preferred embodiment of the present disclosure.
  • FIG. 7 is a top view of according to the second preferred embodiment of the present disclosure, showing mainly the base board of the loop vapor chamber;
  • FIG. 8 is an exploded view of the loop vapor chamber according to the third preferred embodiment of the present disclosure.
  • FIG. 9 is a top view of according to the third preferred embodiment of the present disclosure, showing mainly the base board of the loop vapor chamber.
  • a loop vapor chamber 10 provided according to the first preferred embodiment of the present disclosure essentially comprises a base board 11 , a lid 21 , a wick 26 , a space partition element 27 and a working fluid.
  • the base board 11 has therein a space 12 .
  • the lid 21 covers the base board 11 and hermetically seals the space 12 to allow the space 12 to have an evaporation chamber 121 , a vapor channel 122 , a condensation channel 123 and a liquid channel 124 .
  • the vapor channel 122 has one end in communication with the evaporation chamber 121 and the other end in connection with the condensation channel 123 .
  • the condensation channel 123 is connected to the liquid channel 124 .
  • the liquid channel 124 is connected to the evaporation chamber 121 . Therefore, the vapor channel 122 , the condensation channel 123 and the liquid channel 124 together form a loop relative to the evaporation chamber 121 .
  • the wick 26 is disposed in the evaporation chamber 121 but does not fully occupy the evaporation chamber 121 such that an evaporation space 128 is defined in the evaporation chamber 121 .
  • the evaporation space 128 is in communication with the vapor channel 122 .
  • a portion of the wick corresponds in position to and thus adjoins the terminal end of the liquid channel 124 .
  • the wick 26 is selectively a wick structure made of sintered copper powder, is panel-shaped, is sintered-coupled to the base board 11 , and is disposed at the bottom of the evaporation chamber 121 .
  • the evaporation space 128 is disposed between the wick 26 and the lid 21 .
  • the wick 26 has a plurality of supportive blocks 261 in contact with the wick 26 and the lid 21 .
  • the plurality of supportive blocks 261 is made of the same material as the wick 26 and integrally sintered.
  • the supportive blocks 261 are solid metal blocks (such as copper blocks). This embodiment is exemplified by the supportive blocks 261 being made of the same material (i.e., copper powder) and integrally sintered.
  • the supportive blocks 261 are optional in some situations, for example, where there is no need for support and no difficulty in the return of the working fluid within the wick 26 .
  • the space partition element 27 is disposed in the evaporation chamber 121 to separate the evaporation space 128 and the liquid channel 124 .
  • the space partition element 27 is made of a wick material and thus integrally formed with the wick 26 .
  • the space partition element 27 extends from the wick 26 toward the lid 21 and thus abuts against the lid 21 .
  • the space partition element 27 extends into the liquid channel 124 by a predetermined length. Therefore, the evaporation space 128 and the liquid channel 124 are completely separated.
  • the working fluid fills the evaporation chamber 121 and adsorbs on the wick 26 .
  • the working fluid can be pure water.
  • the working fluid is not shown in the diagrams for two reasons: adsorbed liquid is difficult to depict; and working fluids are well-known to persons skilled in the art.
  • the structure of the loop vapor chamber in the first preferred embodiment is described above.
  • the operation of the loop vapor chamber in the first preferred embodiment is described below.
  • a user adheres the base board 11 of the loop vapor chamber 10 to a target for heat dissipation (for example, a CPU (not shown) of a computer) such that the evaporation chamber 121 corresponds in position to the target for heat dissipation.
  • a heat-dissipating unit 100 is disposed on the base board 11 and corresponds in position to the condensation channel 123 .
  • the heat-dissipating unit 100 comprises a plurality of fins.
  • the heat-dissipating unit 100 allows the heat to be dissipated by air such that the condensation channel 123 has a lower temperature than the evaporation chamber 121 ; hence, the gaseous working fluid in the condensation channel 123 cools down and condenses into droplets of a liquid working fluid.
  • the droplets of the liquid working fluid attach to the inner wall of the condensation channel 123 .
  • the resultant liquid working fluid in droplets becomes massive enough to occupy the condensation channel 123 fully to form fluid slugs 29 defined by the cross sections of the condensation channel 123 .
  • the gaseous working fluid exits the vapor channel 122 and enters the condensation channel 123 continuously and thus spontaneously generates a pressure difference.
  • the fluid slugs 29 move from the condensation channel 123 to the liquid channel 124 before arriving at the evaporation chamber 121 where the fluid slugs 29 adsorb on the space partition element 27 and then return to the wick 26 .
  • the aforesaid process recurs and thus guides heat out of the target for heat dissipation continuously, thereby performing heat dissipation well.
  • the evaporation chamber 121 and the return path are integrally formed and disposed within the space hermetically sealed by the lid 21 and the base board 11 ; hence, the evaporation chamber 121 and the return path are collectively equivalent to an integral structure.
  • the return path is free of any wick layer but still allows the working fluid to transit from a gaseous phase to a liquid phase and return to the evaporation chamber 121 . With a wick layer being dispensed with, the return path further reduces the thickness requirement of the vapor chamber.
  • a loop vapor chamber 30 in the second preferred embodiment of the present disclosure is substantially identical to its counterpart in the first preferred embodiment of the present disclosure except for its distinguishing technical features described below.
  • the base board 31 has two channel partition elements 34 (partition boards for exemplary purposes) disposed in the liquid channel 324 .
  • the two channel partition elements 34 extend from the liquid channel 324 into the condensation channel 323 . Therefore, the two channel partition elements 34 partition the liquid channel 324 and the condensation channel 323 into three fluid slug channels 341 penetrating the liquid channel 324 and the condensation channel 323 .
  • the fluid slug channels 341 are of a smaller caliber than the vapor channel 322 .
  • the channel partition elements 34 are designed in such a manner that the fluid slug channels 341 are of a small caliber; hence, the working fluid droplets adsorbing on the condensation channel 323 are likely to merge and form fluid slugs 49 (shown in FIG. 7 ) defined by the cross sections of the fluid slug channels 341 , respectively.
  • the space partition element 47 (by contrast, in the first preferred embodiment, the space partition element 27 extends into the liquid channel 324 ) is made of solid metal, abuts against the wick 46 and the lid 41 from below and above, respectively, and separates the evaporation space 328 from the liquid channel 324 .
  • the channel partition elements 34 are not necessarily in the number of two, but can be in the number of one or more than two in a variant embodiment. Hence, the number of the channel partition elements 34 is subject to changes as needed.
  • a loop vapor chamber 50 in the third preferred embodiment of the present disclosure is substantially identical to its counterpart in the second preferred embodiment of the present disclosure except for its distinguishing technical features described below.
  • the wick 66 extends into the liquid channel 524 by a predetermined length.
  • the space partition element 67 is disposed in the liquid channel and above a segment of the wick 66 (the segment of the wick 66 is located in the liquid channel 524 because of the extension of the wick 66 ).
  • the space partition element 67 occupies the liquid channel 524 fully in terms of its cross section without blocking the segment of the wick 66 (the segment of the wick 66 is located in the liquid channel 524 because of the extension of the wick 66 ).
  • the two channel partition elements 54 extend into the vapor channel 522 .
  • the gaseous working fluid exits the evaporation space 528 and enters the vapor channel 522 smoothly.
  • the space partition element 67 separates the evaporation space 528 and the liquid channel 524 effectively, whereas the liquid working fluid adsorbs on the segment of the wick 66 (the segment of the wick 66 is located in the liquid channel 524 because of the extension of the wick 66 ).

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A loop vapor chamber includes: a base board having therein a space; a lid for covering the base board and sealing the space to form therein an evaporation chamber, vapor channel, condensation channel and liquid channel, the vapor channel having an end in communication with the evaporation chamber and another end in connection with the condensation channel, the condensation channel connecting to the liquid channel, and the liquid channel connecting to the evaporation chamber; a wick disposed in the evaporation chamber without occupying the evaporation chamber fully such that an evaporation space is defined in the evaporation chamber, the evaporation space being in communication with the vapor channel, wherein a portion of the wick corresponds in position to one end of the liquid channel; a space partition element disposed in the evaporation chamber to separate the evaporation space and liquid channel; and a working fluid filling the evaporation chamber.

Description

    BACKGROUND OF THE INVENTION 1. Technical Field
  • The present disclosure relates to vapor chambers and, more particularly, to a loop vapor chamber.
  • 2. Description of Related Art
  • Regarding existing vapor chamber technology, for example, Taiwan patent 1592623 discloses a vapor chamber, comprising two vertically aligned metal boards, two layers of wick structure disposed therebetween, a working fluid for filling a space defined therebetween, and a supportive structure (supportive post). The aforesaid technology enables the vapor chamber to function efficiently.
  • To reduce the thickness of a vapor chamber, Taiwan patent 1598554 discloses a thin vapor chamber, comprising two vertically aligned metal boards and one layer of wick structure disposed therebetween, wherein the wick structure has a plurality of through holes penetrable by hollow-core protruding posts. Since its internal space is of little height, the thin vapor chamber has only one layer of wick structure. The single layer of wick structure not only adsorbs a working liquid but also takes up less height of the internal space; hence, the vapor chamber is of little thickness and thus thin.
  • Like their conventional counterparts, the vapor chambers disclosed in the aforesaid prior art must comprise a layer of wick structure and thus cannot be made thinner. Therefore, it is important to provide a vapor chamber, comprising two vertically aligned metal boards without any wick layer therebetween, in part, so as to further reduce the thickness of the vapor chamber.
  • BRIEF SUMMARY OF THE INVENTION
  • It is an objective of the present disclosure to provide a loop vapor chamber which has therein a return path conducive to a working fluid's transition from a gaseous phase to a liquid phase. The return path is free of any wick layer to further reduce the thickness of the vapor chamber.
  • In order to achieve the above and other objectives, the present disclosure provides a loop vapor chamber, comprising: a base board having therein a space; a lid for covering the base board and hermetically sealing the space to allow the space to have an evaporation chamber, a vapor channel, a condensation channel and a liquid channel, the vapor channel having an end in communication with the evaporation chamber and another end in connection with the condensation channel, the condensation channel being connected to the liquid channel, and the liquid channel being connected to the evaporation chamber; a wick disposed in the evaporation chamber without occupying the evaporation chamber fully such that an evaporation space is defined in the evaporation chamber, the evaporation space being in communication with the vapor channel, wherein a portion of the wick corresponds in position to a terminal end of the liquid channel; a space partition element disposed in the evaporation chamber to separate the evaporation space and the liquid channel; and a working fluid filling the evaporation chamber.
  • Therefore, according to the present disclosure, a return path composed of a vapor channel, a condensation channel and a liquid channel is integrally formed between a base board and a lid. The return path is free of any wick layer but still allows the working fluid to transit from a gaseous phase to a liquid phase and return to the evaporation chamber. With a wick layer being dispensed with, the return path further reduces the thickness requirement of the vapor chamber.
  • BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS
  • FIG. 1 is a perspective view of a loop vapor chamber according to the first preferred embodiment of the present disclosure;
  • FIG. 2 is an exploded view of the loop vapor chamber according to the first preferred embodiment of the present disclosure;
  • FIG. 3 is a top view of the loop vapor chamber according to the first preferred embodiment of the present disclosure, showing mainly a base board of the loop vapor chamber;
  • FIG. 4 is a cross-sectional view of the loop vapor chamber taken along line 4-4 of FIG. 1;
  • FIG. 5 is a schematic view of operation of the loop vapor chamber according to the first preferred embodiment of the present disclosure, showing how to form fluid slugs;
  • FIG. 6 is an exploded view of the loop vapor chamber according to the second preferred embodiment of the present disclosure;
  • FIG. 7 is a top view of according to the second preferred embodiment of the present disclosure, showing mainly the base board of the loop vapor chamber;
  • FIG. 8 is an exploded view of the loop vapor chamber according to the third preferred embodiment of the present disclosure; and
  • FIG. 9 is a top view of according to the third preferred embodiment of the present disclosure, showing mainly the base board of the loop vapor chamber.
  • DETAILED DESCRIPTION OF THE INVENTION
  • Technical features of the present disclosure are illustrated by preferred embodiments, depicted by drawings, and described below.
  • Referring to FIG. 1 through FIG. 4, a loop vapor chamber 10 provided according to the first preferred embodiment of the present disclosure essentially comprises a base board 11, a lid 21, a wick 26, a space partition element 27 and a working fluid.
  • The base board 11 has therein a space 12.
  • The lid 21 covers the base board 11 and hermetically seals the space 12 to allow the space 12 to have an evaporation chamber 121, a vapor channel 122, a condensation channel 123 and a liquid channel 124. The vapor channel 122 has one end in communication with the evaporation chamber 121 and the other end in connection with the condensation channel 123. The condensation channel 123 is connected to the liquid channel 124. The liquid channel 124 is connected to the evaporation chamber 121. Therefore, the vapor channel 122, the condensation channel 123 and the liquid channel 124 together form a loop relative to the evaporation chamber 121.
  • The wick 26 is disposed in the evaporation chamber 121 but does not fully occupy the evaporation chamber 121 such that an evaporation space 128 is defined in the evaporation chamber 121. The evaporation space 128 is in communication with the vapor channel 122. A portion of the wick corresponds in position to and thus adjoins the terminal end of the liquid channel 124. In this embodiment, the wick 26 is selectively a wick structure made of sintered copper powder, is panel-shaped, is sintered-coupled to the base board 11, and is disposed at the bottom of the evaporation chamber 121. The evaporation space 128 is disposed between the wick 26 and the lid 21. The wick 26 has a plurality of supportive blocks 261 in contact with the wick 26 and the lid 21. The plurality of supportive blocks 261 is made of the same material as the wick 26 and integrally sintered. The supportive blocks 261 are solid metal blocks (such as copper blocks). This embodiment is exemplified by the supportive blocks 261 being made of the same material (i.e., copper powder) and integrally sintered. In a preferred embodiment of the present disclosure, the supportive blocks 261 are optional in some situations, for example, where there is no need for support and no difficulty in the return of the working fluid within the wick 26.
  • The space partition element 27 is disposed in the evaporation chamber 121 to separate the evaporation space 128 and the liquid channel 124. In this embodiment, the space partition element 27 is made of a wick material and thus integrally formed with the wick 26. The space partition element 27 extends from the wick 26 toward the lid 21 and thus abuts against the lid 21. The space partition element 27 extends into the liquid channel 124 by a predetermined length. Therefore, the evaporation space 128 and the liquid channel 124 are completely separated.
  • The working fluid fills the evaporation chamber 121 and adsorbs on the wick 26. In practice, the working fluid can be pure water. The working fluid is not shown in the diagrams for two reasons: adsorbed liquid is difficult to depict; and working fluids are well-known to persons skilled in the art.
  • The structure of the loop vapor chamber in the first preferred embodiment is described above. The operation of the loop vapor chamber in the first preferred embodiment is described below.
  • As shown in FIG. 5, before using the loop vapor chamber, a user adheres the base board 11 of the loop vapor chamber 10 to a target for heat dissipation (for example, a CPU (not shown) of a computer) such that the evaporation chamber 121 corresponds in position to the target for heat dissipation. A heat-dissipating unit 100 is disposed on the base board 11 and corresponds in position to the condensation channel 123. In this embodiment, the heat-dissipating unit 100 comprises a plurality of fins.
  • As shown in FIG. 5, during the usage of the loop vapor chamber, heat generated from the target for heat dissipation is transferred to the evaporation chamber 121, and thus the working fluid which adsorbs on the wick 26 in the evaporation chamber 121 evaporates into a gaseous working fluid which then spreads throughout the evaporation space. Afterward, the gaseous working fluid reaches the condensation channel 123 via the vapor channel 122. Then, the heat-dissipating unit 100 allows the heat to be dissipated by air such that the condensation channel 123 has a lower temperature than the evaporation chamber 121; hence, the gaseous working fluid in the condensation channel 123 cools down and condenses into droplets of a liquid working fluid. As a result, the droplets of the liquid working fluid attach to the inner wall of the condensation channel 123. As time passed, the resultant liquid working fluid in droplets becomes massive enough to occupy the condensation channel 123 fully to form fluid slugs 29 defined by the cross sections of the condensation channel 123. The gaseous working fluid exits the vapor channel 122 and enters the condensation channel 123 continuously and thus spontaneously generates a pressure difference. Under the pressure difference, the fluid slugs 29 move from the condensation channel 123 to the liquid channel 124 before arriving at the evaporation chamber 121 where the fluid slugs 29 adsorb on the space partition element 27 and then return to the wick 26. The aforesaid process recurs and thus guides heat out of the target for heat dissipation continuously, thereby performing heat dissipation well.
  • In the first preferred embodiment, the evaporation chamber 121 and the return path (composed of the vapor channel 122, the condensation channel 123 and the liquid channel 124) are integrally formed and disposed within the space hermetically sealed by the lid 21 and the base board 11; hence, the evaporation chamber 121 and the return path are collectively equivalent to an integral structure. The return path is free of any wick layer but still allows the working fluid to transit from a gaseous phase to a liquid phase and return to the evaporation chamber 121. With a wick layer being dispensed with, the return path further reduces the thickness requirement of the vapor chamber.
  • Referring to FIG. 6 and FIG. 7, a loop vapor chamber 30 in the second preferred embodiment of the present disclosure is substantially identical to its counterpart in the first preferred embodiment of the present disclosure except for its distinguishing technical features described below.
  • The base board 31 has two channel partition elements 34 (partition boards for exemplary purposes) disposed in the liquid channel 324. The two channel partition elements 34 extend from the liquid channel 324 into the condensation channel 323. Therefore, the two channel partition elements 34 partition the liquid channel 324 and the condensation channel 323 into three fluid slug channels 341 penetrating the liquid channel 324 and the condensation channel 323. The fluid slug channels 341 are of a smaller caliber than the vapor channel 322. The channel partition elements 34 are designed in such a manner that the fluid slug channels 341 are of a small caliber; hence, the working fluid droplets adsorbing on the condensation channel 323 are likely to merge and form fluid slugs 49 (shown in FIG. 7) defined by the cross sections of the fluid slug channels 341, respectively.
  • In the second preferred embodiment, the space partition element 47 (by contrast, in the first preferred embodiment, the space partition element 27 extends into the liquid channel 324) is made of solid metal, abuts against the wick 46 and the lid 41 from below and above, respectively, and separates the evaporation space 328 from the liquid channel 324.
  • The channel partition elements 34 are not necessarily in the number of two, but can be in the number of one or more than two in a variant embodiment. Hence, the number of the channel partition elements 34 is subject to changes as needed.
  • The other structures and achievable advantages in the second preferred embodiment are substantially identical to their counterparts in the first preferred embodiment and thus, for the sake of brevity, are not described again.
  • Referring to FIG. 8 and FIG. 9, a loop vapor chamber 50 in the third preferred embodiment of the present disclosure is substantially identical to its counterpart in the second preferred embodiment of the present disclosure except for its distinguishing technical features described below.
  • The wick 66 extends into the liquid channel 524 by a predetermined length. The space partition element 67 is disposed in the liquid channel and above a segment of the wick 66 (the segment of the wick 66 is located in the liquid channel 524 because of the extension of the wick 66). The space partition element 67 occupies the liquid channel 524 fully in terms of its cross section without blocking the segment of the wick 66 (the segment of the wick 66 is located in the liquid channel 524 because of the extension of the wick 66).
  • The two channel partition elements 54 extend into the vapor channel 522. The gaseous working fluid exits the evaporation space 528 and enters the vapor channel 522 smoothly.
  • Therefore, the space partition element 67 separates the evaporation space 528 and the liquid channel 524 effectively, whereas the liquid working fluid adsorbs on the segment of the wick 66 (the segment of the wick 66 is located in the liquid channel 524 because of the extension of the wick 66).
  • The other structural features and achievable advantages of the third embodiment are substantially identical to their counterparts in the second embodiment and thus, for the sake of brevity, are not described herein.

Claims (11)

What is claimed is:
1. A loop vapor chamber, comprising:
a base board having therein a space;
a lid for covering the base board and hermetically sealing the space to allow the space to have an evaporation chamber, a vapor channel, a condensation channel and a liquid channel, the vapor channel having an end in communication with the evaporation chamber and another end in connection with the condensation channel, the condensation channel being connected to the liquid channel, and the liquid channel being connected to the evaporation chamber;
a wick disposed in the evaporation chamber without occupying the evaporation chamber fully such that an evaporation space is defined in the evaporation chamber, the evaporation space being in communication with the vapor channel, wherein a portion of the wick corresponds in position to a terminal end of the liquid channel;
a space partition element disposed in the evaporation chamber to separate the evaporation space and the liquid channel; and
a working fluid filling the evaporation chamber.
2. The loop vapor chamber of claim 1, wherein the base board has at least one channel partition element disposed in the liquid channel to partition the liquid channel into a plurality of fluid slug channels.
3. The loop vapor chamber of claim 2, wherein the at least one channel partition element extends from the liquid channel into the condensation channel.
4. The loop vapor chamber of claim 3, wherein the at least one channel partition element extends from the liquid channel into the condensation channel and the vapor channel.
5. The loop vapor chamber of claim 2, wherein the fluid slug channels are of a smaller caliber than the vapor channel.
6. The loop vapor chamber of claim 1, wherein the space partition element is made of a wick material and thus integrally formed with the wick, with the space partition element extending from the wick toward the lid to abut against the lid and extend into the liquid channel by a predetermined length.
7. The loop vapor chamber of claim 1, wherein the wick is sintered-coupled to the base board and disposed at a bottom of the evaporation chamber, with evaporation space disposed between the wick and the lid, and the wick having a plurality of supportive blocks in contact with the wick and the lid.
8. The loop vapor chamber of claim 7, wherein the plurality of supportive blocks is made of the same material as the wick and integrally formed with the wick.
9. The loop vapor chamber of claim 7, wherein the plurality of supportive blocks is each a solid metal block.
10. The loop vapor chamber of claim 1, wherein the space partition element is made of solid metal and abuts against the wick and the lid from below and above, respectively.
11. The loop vapor chamber of claim 1, wherein the wick extends into the liquid channel by a predetermined length.
US16/051,916 2018-05-04 2018-08-01 Loop vapor chamber Abandoned US20190339022A1 (en)

Applications Claiming Priority (2)

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TW107115224 2018-05-04
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200149823A1 (en) * 2018-11-09 2020-05-14 Furukawa Electric Co., Ltd. Heat pipe

Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4492266A (en) * 1981-10-22 1985-01-08 Lockheed Missiles & Space Company, Inc. Manifolded evaporator for pump-assisted heat pipe
US20040069459A1 (en) * 2002-07-05 2004-04-15 Sony Corporation Cooling device, electronic apparatus and acoustic apparatus, and method for producing the cooling device
JP2004353902A (en) * 2003-05-27 2004-12-16 Sony Corp Cooling system
US20060144567A1 (en) * 2004-12-31 2006-07-06 Foxconn Technology Co., Ltd. Pulsating heat transfer apparatus
US20060173344A1 (en) * 2005-01-19 2006-08-03 Siemens Medical Solutions Usa, Inc. Method for using a refrigeration system to remove waste heat from an ultrasound transducer
US20060185827A1 (en) * 2005-02-18 2006-08-24 Bin-Juine Huang Heat pipe cooling system and thermal connector thereof
US20060262505A1 (en) * 2005-05-19 2006-11-23 Cooler Master Co. Ltd. Water-cooling heat dissipator
US7352580B2 (en) * 2006-02-14 2008-04-01 Hua-Hsin Tsai CPU cooler
US20080164010A1 (en) * 2007-01-09 2008-07-10 Shung-Wen Kang Loop heat pipe with flat evaportor
US20090056911A1 (en) * 2007-08-30 2009-03-05 Kabushiki Kaisha Toshiba Electronic apparatus
US20110088875A1 (en) * 2009-10-16 2011-04-21 Foxconn Technology Co., Ltd. Loop heat pipe
US20120043059A1 (en) * 2010-08-20 2012-02-23 Foxconn Technology Co., Ltd. Loop heat pipe
US20120043060A1 (en) * 2010-08-20 2012-02-23 Foxconn Technology Co., Ltd. Loop heat pipe
US20140165638A1 (en) * 2011-08-01 2014-06-19 Nec Corporation Cooling device and electronic device made therewith
US20160047605A1 (en) * 2014-08-14 2016-02-18 Ibérica Del Espacio, S.A. Advanced control two phase heat transfer loop
US20160259383A1 (en) * 2013-12-13 2016-09-08 Fujitsu Limited Loop heat pipe, method of manufacturing the same, and electronic device
US20160330874A1 (en) * 2014-01-28 2016-11-10 Panasonic Intellectual Property Management Co., Ltd. Cooling device and data center provided with same
US20180063994A1 (en) * 2016-08-24 2018-03-01 Delta Electronics, Inc. Heat dissipation assembly
US20180177077A1 (en) * 2015-09-03 2018-06-21 Fujitsu Limited Loop heat pipe and fabrication method therefor, and electronic device
US20180216895A1 (en) * 2015-10-22 2018-08-02 Marusan Electronics Co., Ltd. Pipe member, heat pipe, and cooling device
US20180292145A1 (en) * 2017-04-11 2018-10-11 Cooler Master Co., Ltd. Communication-type thermal conduction device
US20190090386A1 (en) * 2016-05-23 2019-03-21 Fujitsu Limited Loop heat pipe and manufacturing method for loop heat pipe and electronic device
US20190227607A1 (en) * 2018-01-22 2019-07-25 Shinko Electric Industries Co., Ltd. Heat pipe with support post

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH063354B2 (en) * 1987-06-23 1994-01-12 アクトロニクス株式会社 Loop type thin tube heat pipe
US4883116A (en) * 1989-01-31 1989-11-28 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Ceramic heat pipe wick
KR100338810B1 (en) * 1999-11-08 2002-05-31 윤종용 cooling device
KR100438825B1 (en) * 2001-10-29 2004-07-05 삼성전자주식회사 Heat transferring device having adiabatic means
US7184265B2 (en) * 2003-05-29 2007-02-27 Lg Electronics Inc. Cooling system for a portable computer
CN101762194B (en) * 2008-12-24 2012-09-19 富准精密工业(深圳)有限公司 Evaporator and loop type heat pipe applying same
TWI366656B (en) * 2009-06-05 2012-06-21 Young Green Energy Co Loop heat pipe and manufacturing method thereof
JP5720338B2 (en) * 2011-03-17 2015-05-20 富士通株式会社 Loop type heat pipe
CN102984916B (en) * 2011-09-07 2017-06-16 技嘉科技股份有限公司 circulating radiator
CN203811001U (en) * 2014-04-18 2014-09-03 双鸿科技股份有限公司 Loop vapor chamber
JP2016090080A (en) * 2014-10-30 2016-05-23 富士通株式会社 Cooling device and electronic device
JP6485075B2 (en) * 2015-01-29 2019-03-20 富士通株式会社 Loop heat pipe and method of manufacturing loop heat pipe
CN106998641A (en) * 2016-01-25 2017-08-01 昆山巨仲电子有限公司 A kind of temperature-uniforming plate with loop
CN205580271U (en) * 2016-04-21 2016-09-14 广州华钻电子科技有限公司 Gas -liquid separation formula temperature -uniforming plate
TWM532046U (en) * 2016-06-02 2016-11-11 泰碩電子股份有限公司 Temperature equalization plate with liquid-vapor separation structure
US10012445B2 (en) * 2016-09-08 2018-07-03 Taiwan Microloops Corp. Vapor chamber and heat pipe combined structure
US10288356B2 (en) * 2016-10-14 2019-05-14 Taiwan Microloops Corp. Vapor chamber and heat pipe combined structure and combining method thereof
CN107702574A (en) * 2017-09-25 2018-02-16 华中科技大学 A kind of longitudinal liquid-supply evaporator
CN107764117A (en) * 2017-10-27 2018-03-06 南京航空航天大学 A kind of liquid-sucking core support column integrative-structure flat-plate heat pipe based on carbon nano pipe array

Patent Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4492266A (en) * 1981-10-22 1985-01-08 Lockheed Missiles & Space Company, Inc. Manifolded evaporator for pump-assisted heat pipe
US20040069459A1 (en) * 2002-07-05 2004-04-15 Sony Corporation Cooling device, electronic apparatus and acoustic apparatus, and method for producing the cooling device
JP2004353902A (en) * 2003-05-27 2004-12-16 Sony Corp Cooling system
US20060144567A1 (en) * 2004-12-31 2006-07-06 Foxconn Technology Co., Ltd. Pulsating heat transfer apparatus
US20060173344A1 (en) * 2005-01-19 2006-08-03 Siemens Medical Solutions Usa, Inc. Method for using a refrigeration system to remove waste heat from an ultrasound transducer
US20060185827A1 (en) * 2005-02-18 2006-08-24 Bin-Juine Huang Heat pipe cooling system and thermal connector thereof
US20060262505A1 (en) * 2005-05-19 2006-11-23 Cooler Master Co. Ltd. Water-cooling heat dissipator
US7352580B2 (en) * 2006-02-14 2008-04-01 Hua-Hsin Tsai CPU cooler
US20080164010A1 (en) * 2007-01-09 2008-07-10 Shung-Wen Kang Loop heat pipe with flat evaportor
US20090056911A1 (en) * 2007-08-30 2009-03-05 Kabushiki Kaisha Toshiba Electronic apparatus
US20110088875A1 (en) * 2009-10-16 2011-04-21 Foxconn Technology Co., Ltd. Loop heat pipe
US20120043059A1 (en) * 2010-08-20 2012-02-23 Foxconn Technology Co., Ltd. Loop heat pipe
US20120043060A1 (en) * 2010-08-20 2012-02-23 Foxconn Technology Co., Ltd. Loop heat pipe
US20140165638A1 (en) * 2011-08-01 2014-06-19 Nec Corporation Cooling device and electronic device made therewith
US20160259383A1 (en) * 2013-12-13 2016-09-08 Fujitsu Limited Loop heat pipe, method of manufacturing the same, and electronic device
US20160330874A1 (en) * 2014-01-28 2016-11-10 Panasonic Intellectual Property Management Co., Ltd. Cooling device and data center provided with same
US20160047605A1 (en) * 2014-08-14 2016-02-18 Ibérica Del Espacio, S.A. Advanced control two phase heat transfer loop
US20180177077A1 (en) * 2015-09-03 2018-06-21 Fujitsu Limited Loop heat pipe and fabrication method therefor, and electronic device
US20180216895A1 (en) * 2015-10-22 2018-08-02 Marusan Electronics Co., Ltd. Pipe member, heat pipe, and cooling device
US20190090386A1 (en) * 2016-05-23 2019-03-21 Fujitsu Limited Loop heat pipe and manufacturing method for loop heat pipe and electronic device
US20180063994A1 (en) * 2016-08-24 2018-03-01 Delta Electronics, Inc. Heat dissipation assembly
US20180292145A1 (en) * 2017-04-11 2018-10-11 Cooler Master Co., Ltd. Communication-type thermal conduction device
US20190227607A1 (en) * 2018-01-22 2019-07-25 Shinko Electric Industries Co., Ltd. Heat pipe with support post

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200149823A1 (en) * 2018-11-09 2020-05-14 Furukawa Electric Co., Ltd. Heat pipe
US10976112B2 (en) * 2018-11-09 2021-04-13 Furukawa Electric Co., Ltd. Heat pipe

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