US20190339022A1 - Loop vapor chamber - Google Patents
Loop vapor chamber Download PDFInfo
- Publication number
- US20190339022A1 US20190339022A1 US16/051,916 US201816051916A US2019339022A1 US 20190339022 A1 US20190339022 A1 US 20190339022A1 US 201816051916 A US201816051916 A US 201816051916A US 2019339022 A1 US2019339022 A1 US 2019339022A1
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- Prior art keywords
- channel
- wick
- chamber
- space
- evaporation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000001704 evaporation Methods 0.000 claims abstract description 63
- 230000008020 evaporation Effects 0.000 claims abstract description 63
- 239000007788 liquid Substances 0.000 claims abstract description 51
- 239000012530 fluid Substances 0.000 claims abstract description 35
- 238000009833 condensation Methods 0.000 claims abstract description 30
- 230000005494 condensation Effects 0.000 claims abstract description 30
- 238000005192 partition Methods 0.000 claims abstract description 30
- 238000004891 communication Methods 0.000 claims abstract description 8
- 238000007789 sealing Methods 0.000 claims abstract description 3
- 230000003319 supportive effect Effects 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 10
- 241000237858 Gastropoda Species 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000007792 gaseous phase Substances 0.000 description 3
- 239000007791 liquid phase Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/025—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having non-capillary condensate return means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
Definitions
- the present disclosure relates to vapor chambers and, more particularly, to a loop vapor chamber.
- Taiwan patent 1592623 discloses a vapor chamber, comprising two vertically aligned metal boards, two layers of wick structure disposed therebetween, a working fluid for filling a space defined therebetween, and a supportive structure (supportive post).
- the aforesaid technology enables the vapor chamber to function efficiently.
- Taiwan patent 1598554 discloses a thin vapor chamber, comprising two vertically aligned metal boards and one layer of wick structure disposed therebetween, wherein the wick structure has a plurality of through holes penetrable by hollow-core protruding posts. Since its internal space is of little height, the thin vapor chamber has only one layer of wick structure. The single layer of wick structure not only adsorbs a working liquid but also takes up less height of the internal space; hence, the vapor chamber is of little thickness and thus thin.
- the vapor chambers disclosed in the aforesaid prior art must comprise a layer of wick structure and thus cannot be made thinner. Therefore, it is important to provide a vapor chamber, comprising two vertically aligned metal boards without any wick layer therebetween, in part, so as to further reduce the thickness of the vapor chamber.
- the return path is free of any wick layer to further reduce the thickness of the vapor chamber.
- a loop vapor chamber comprising: a base board having therein a space; a lid for covering the base board and hermetically sealing the space to allow the space to have an evaporation chamber, a vapor channel, a condensation channel and a liquid channel, the vapor channel having an end in communication with the evaporation chamber and another end in connection with the condensation channel, the condensation channel being connected to the liquid channel, and the liquid channel being connected to the evaporation chamber; a wick disposed in the evaporation chamber without occupying the evaporation chamber fully such that an evaporation space is defined in the evaporation chamber, the evaporation space being in communication with the vapor channel, wherein a portion of the wick corresponds in position to a terminal end of the liquid channel; a space partition element disposed in the evaporation chamber to separate the evaporation space and the liquid channel; and a working fluid filling the evaporation chamber.
- a return path composed of a vapor channel, a condensation channel and a liquid channel is integrally formed between a base board and a lid.
- the return path is free of any wick layer but still allows the working fluid to transit from a gaseous phase to a liquid phase and return to the evaporation chamber. With a wick layer being dispensed with, the return path further reduces the thickness requirement of the vapor chamber.
- FIG. 1 is a perspective view of a loop vapor chamber according to the first preferred embodiment of the present disclosure
- FIG. 2 is an exploded view of the loop vapor chamber according to the first preferred embodiment of the present disclosure
- FIG. 3 is a top view of the loop vapor chamber according to the first preferred embodiment of the present disclosure, showing mainly a base board of the loop vapor chamber;
- FIG. 4 is a cross-sectional view of the loop vapor chamber taken along line 4 - 4 of FIG. 1 ;
- FIG. 5 is a schematic view of operation of the loop vapor chamber according to the first preferred embodiment of the present disclosure, showing how to form fluid slugs;
- FIG. 6 is an exploded view of the loop vapor chamber according to the second preferred embodiment of the present disclosure.
- FIG. 7 is a top view of according to the second preferred embodiment of the present disclosure, showing mainly the base board of the loop vapor chamber;
- FIG. 8 is an exploded view of the loop vapor chamber according to the third preferred embodiment of the present disclosure.
- FIG. 9 is a top view of according to the third preferred embodiment of the present disclosure, showing mainly the base board of the loop vapor chamber.
- a loop vapor chamber 10 provided according to the first preferred embodiment of the present disclosure essentially comprises a base board 11 , a lid 21 , a wick 26 , a space partition element 27 and a working fluid.
- the base board 11 has therein a space 12 .
- the lid 21 covers the base board 11 and hermetically seals the space 12 to allow the space 12 to have an evaporation chamber 121 , a vapor channel 122 , a condensation channel 123 and a liquid channel 124 .
- the vapor channel 122 has one end in communication with the evaporation chamber 121 and the other end in connection with the condensation channel 123 .
- the condensation channel 123 is connected to the liquid channel 124 .
- the liquid channel 124 is connected to the evaporation chamber 121 . Therefore, the vapor channel 122 , the condensation channel 123 and the liquid channel 124 together form a loop relative to the evaporation chamber 121 .
- the wick 26 is disposed in the evaporation chamber 121 but does not fully occupy the evaporation chamber 121 such that an evaporation space 128 is defined in the evaporation chamber 121 .
- the evaporation space 128 is in communication with the vapor channel 122 .
- a portion of the wick corresponds in position to and thus adjoins the terminal end of the liquid channel 124 .
- the wick 26 is selectively a wick structure made of sintered copper powder, is panel-shaped, is sintered-coupled to the base board 11 , and is disposed at the bottom of the evaporation chamber 121 .
- the evaporation space 128 is disposed between the wick 26 and the lid 21 .
- the wick 26 has a plurality of supportive blocks 261 in contact with the wick 26 and the lid 21 .
- the plurality of supportive blocks 261 is made of the same material as the wick 26 and integrally sintered.
- the supportive blocks 261 are solid metal blocks (such as copper blocks). This embodiment is exemplified by the supportive blocks 261 being made of the same material (i.e., copper powder) and integrally sintered.
- the supportive blocks 261 are optional in some situations, for example, where there is no need for support and no difficulty in the return of the working fluid within the wick 26 .
- the space partition element 27 is disposed in the evaporation chamber 121 to separate the evaporation space 128 and the liquid channel 124 .
- the space partition element 27 is made of a wick material and thus integrally formed with the wick 26 .
- the space partition element 27 extends from the wick 26 toward the lid 21 and thus abuts against the lid 21 .
- the space partition element 27 extends into the liquid channel 124 by a predetermined length. Therefore, the evaporation space 128 and the liquid channel 124 are completely separated.
- the working fluid fills the evaporation chamber 121 and adsorbs on the wick 26 .
- the working fluid can be pure water.
- the working fluid is not shown in the diagrams for two reasons: adsorbed liquid is difficult to depict; and working fluids are well-known to persons skilled in the art.
- the structure of the loop vapor chamber in the first preferred embodiment is described above.
- the operation of the loop vapor chamber in the first preferred embodiment is described below.
- a user adheres the base board 11 of the loop vapor chamber 10 to a target for heat dissipation (for example, a CPU (not shown) of a computer) such that the evaporation chamber 121 corresponds in position to the target for heat dissipation.
- a heat-dissipating unit 100 is disposed on the base board 11 and corresponds in position to the condensation channel 123 .
- the heat-dissipating unit 100 comprises a plurality of fins.
- the heat-dissipating unit 100 allows the heat to be dissipated by air such that the condensation channel 123 has a lower temperature than the evaporation chamber 121 ; hence, the gaseous working fluid in the condensation channel 123 cools down and condenses into droplets of a liquid working fluid.
- the droplets of the liquid working fluid attach to the inner wall of the condensation channel 123 .
- the resultant liquid working fluid in droplets becomes massive enough to occupy the condensation channel 123 fully to form fluid slugs 29 defined by the cross sections of the condensation channel 123 .
- the gaseous working fluid exits the vapor channel 122 and enters the condensation channel 123 continuously and thus spontaneously generates a pressure difference.
- the fluid slugs 29 move from the condensation channel 123 to the liquid channel 124 before arriving at the evaporation chamber 121 where the fluid slugs 29 adsorb on the space partition element 27 and then return to the wick 26 .
- the aforesaid process recurs and thus guides heat out of the target for heat dissipation continuously, thereby performing heat dissipation well.
- the evaporation chamber 121 and the return path are integrally formed and disposed within the space hermetically sealed by the lid 21 and the base board 11 ; hence, the evaporation chamber 121 and the return path are collectively equivalent to an integral structure.
- the return path is free of any wick layer but still allows the working fluid to transit from a gaseous phase to a liquid phase and return to the evaporation chamber 121 . With a wick layer being dispensed with, the return path further reduces the thickness requirement of the vapor chamber.
- a loop vapor chamber 30 in the second preferred embodiment of the present disclosure is substantially identical to its counterpart in the first preferred embodiment of the present disclosure except for its distinguishing technical features described below.
- the base board 31 has two channel partition elements 34 (partition boards for exemplary purposes) disposed in the liquid channel 324 .
- the two channel partition elements 34 extend from the liquid channel 324 into the condensation channel 323 . Therefore, the two channel partition elements 34 partition the liquid channel 324 and the condensation channel 323 into three fluid slug channels 341 penetrating the liquid channel 324 and the condensation channel 323 .
- the fluid slug channels 341 are of a smaller caliber than the vapor channel 322 .
- the channel partition elements 34 are designed in such a manner that the fluid slug channels 341 are of a small caliber; hence, the working fluid droplets adsorbing on the condensation channel 323 are likely to merge and form fluid slugs 49 (shown in FIG. 7 ) defined by the cross sections of the fluid slug channels 341 , respectively.
- the space partition element 47 (by contrast, in the first preferred embodiment, the space partition element 27 extends into the liquid channel 324 ) is made of solid metal, abuts against the wick 46 and the lid 41 from below and above, respectively, and separates the evaporation space 328 from the liquid channel 324 .
- the channel partition elements 34 are not necessarily in the number of two, but can be in the number of one or more than two in a variant embodiment. Hence, the number of the channel partition elements 34 is subject to changes as needed.
- a loop vapor chamber 50 in the third preferred embodiment of the present disclosure is substantially identical to its counterpart in the second preferred embodiment of the present disclosure except for its distinguishing technical features described below.
- the wick 66 extends into the liquid channel 524 by a predetermined length.
- the space partition element 67 is disposed in the liquid channel and above a segment of the wick 66 (the segment of the wick 66 is located in the liquid channel 524 because of the extension of the wick 66 ).
- the space partition element 67 occupies the liquid channel 524 fully in terms of its cross section without blocking the segment of the wick 66 (the segment of the wick 66 is located in the liquid channel 524 because of the extension of the wick 66 ).
- the two channel partition elements 54 extend into the vapor channel 522 .
- the gaseous working fluid exits the evaporation space 528 and enters the vapor channel 522 smoothly.
- the space partition element 67 separates the evaporation space 528 and the liquid channel 524 effectively, whereas the liquid working fluid adsorbs on the segment of the wick 66 (the segment of the wick 66 is located in the liquid channel 524 because of the extension of the wick 66 ).
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A loop vapor chamber includes: a base board having therein a space; a lid for covering the base board and sealing the space to form therein an evaporation chamber, vapor channel, condensation channel and liquid channel, the vapor channel having an end in communication with the evaporation chamber and another end in connection with the condensation channel, the condensation channel connecting to the liquid channel, and the liquid channel connecting to the evaporation chamber; a wick disposed in the evaporation chamber without occupying the evaporation chamber fully such that an evaporation space is defined in the evaporation chamber, the evaporation space being in communication with the vapor channel, wherein a portion of the wick corresponds in position to one end of the liquid channel; a space partition element disposed in the evaporation chamber to separate the evaporation space and liquid channel; and a working fluid filling the evaporation chamber.
Description
- The present disclosure relates to vapor chambers and, more particularly, to a loop vapor chamber.
- Regarding existing vapor chamber technology, for example, Taiwan patent 1592623 discloses a vapor chamber, comprising two vertically aligned metal boards, two layers of wick structure disposed therebetween, a working fluid for filling a space defined therebetween, and a supportive structure (supportive post). The aforesaid technology enables the vapor chamber to function efficiently.
- To reduce the thickness of a vapor chamber, Taiwan patent 1598554 discloses a thin vapor chamber, comprising two vertically aligned metal boards and one layer of wick structure disposed therebetween, wherein the wick structure has a plurality of through holes penetrable by hollow-core protruding posts. Since its internal space is of little height, the thin vapor chamber has only one layer of wick structure. The single layer of wick structure not only adsorbs a working liquid but also takes up less height of the internal space; hence, the vapor chamber is of little thickness and thus thin.
- Like their conventional counterparts, the vapor chambers disclosed in the aforesaid prior art must comprise a layer of wick structure and thus cannot be made thinner. Therefore, it is important to provide a vapor chamber, comprising two vertically aligned metal boards without any wick layer therebetween, in part, so as to further reduce the thickness of the vapor chamber.
- It is an objective of the present disclosure to provide a loop vapor chamber which has therein a return path conducive to a working fluid's transition from a gaseous phase to a liquid phase. The return path is free of any wick layer to further reduce the thickness of the vapor chamber.
- In order to achieve the above and other objectives, the present disclosure provides a loop vapor chamber, comprising: a base board having therein a space; a lid for covering the base board and hermetically sealing the space to allow the space to have an evaporation chamber, a vapor channel, a condensation channel and a liquid channel, the vapor channel having an end in communication with the evaporation chamber and another end in connection with the condensation channel, the condensation channel being connected to the liquid channel, and the liquid channel being connected to the evaporation chamber; a wick disposed in the evaporation chamber without occupying the evaporation chamber fully such that an evaporation space is defined in the evaporation chamber, the evaporation space being in communication with the vapor channel, wherein a portion of the wick corresponds in position to a terminal end of the liquid channel; a space partition element disposed in the evaporation chamber to separate the evaporation space and the liquid channel; and a working fluid filling the evaporation chamber.
- Therefore, according to the present disclosure, a return path composed of a vapor channel, a condensation channel and a liquid channel is integrally formed between a base board and a lid. The return path is free of any wick layer but still allows the working fluid to transit from a gaseous phase to a liquid phase and return to the evaporation chamber. With a wick layer being dispensed with, the return path further reduces the thickness requirement of the vapor chamber.
-
FIG. 1 is a perspective view of a loop vapor chamber according to the first preferred embodiment of the present disclosure; -
FIG. 2 is an exploded view of the loop vapor chamber according to the first preferred embodiment of the present disclosure; -
FIG. 3 is a top view of the loop vapor chamber according to the first preferred embodiment of the present disclosure, showing mainly a base board of the loop vapor chamber; -
FIG. 4 is a cross-sectional view of the loop vapor chamber taken along line 4-4 ofFIG. 1 ; -
FIG. 5 is a schematic view of operation of the loop vapor chamber according to the first preferred embodiment of the present disclosure, showing how to form fluid slugs; -
FIG. 6 is an exploded view of the loop vapor chamber according to the second preferred embodiment of the present disclosure; -
FIG. 7 is a top view of according to the second preferred embodiment of the present disclosure, showing mainly the base board of the loop vapor chamber; -
FIG. 8 is an exploded view of the loop vapor chamber according to the third preferred embodiment of the present disclosure; and -
FIG. 9 is a top view of according to the third preferred embodiment of the present disclosure, showing mainly the base board of the loop vapor chamber. - Technical features of the present disclosure are illustrated by preferred embodiments, depicted by drawings, and described below.
- Referring to
FIG. 1 throughFIG. 4 , aloop vapor chamber 10 provided according to the first preferred embodiment of the present disclosure essentially comprises abase board 11, alid 21, awick 26, aspace partition element 27 and a working fluid. - The
base board 11 has therein aspace 12. - The
lid 21 covers thebase board 11 and hermetically seals thespace 12 to allow thespace 12 to have anevaporation chamber 121, avapor channel 122, acondensation channel 123 and aliquid channel 124. Thevapor channel 122 has one end in communication with theevaporation chamber 121 and the other end in connection with thecondensation channel 123. Thecondensation channel 123 is connected to theliquid channel 124. Theliquid channel 124 is connected to theevaporation chamber 121. Therefore, thevapor channel 122, thecondensation channel 123 and theliquid channel 124 together form a loop relative to theevaporation chamber 121. - The
wick 26 is disposed in theevaporation chamber 121 but does not fully occupy theevaporation chamber 121 such that anevaporation space 128 is defined in theevaporation chamber 121. Theevaporation space 128 is in communication with thevapor channel 122. A portion of the wick corresponds in position to and thus adjoins the terminal end of theliquid channel 124. In this embodiment, thewick 26 is selectively a wick structure made of sintered copper powder, is panel-shaped, is sintered-coupled to thebase board 11, and is disposed at the bottom of theevaporation chamber 121. Theevaporation space 128 is disposed between thewick 26 and thelid 21. Thewick 26 has a plurality ofsupportive blocks 261 in contact with thewick 26 and thelid 21. The plurality ofsupportive blocks 261 is made of the same material as thewick 26 and integrally sintered. Thesupportive blocks 261 are solid metal blocks (such as copper blocks). This embodiment is exemplified by thesupportive blocks 261 being made of the same material (i.e., copper powder) and integrally sintered. In a preferred embodiment of the present disclosure, thesupportive blocks 261 are optional in some situations, for example, where there is no need for support and no difficulty in the return of the working fluid within thewick 26. - The
space partition element 27 is disposed in theevaporation chamber 121 to separate theevaporation space 128 and theliquid channel 124. In this embodiment, thespace partition element 27 is made of a wick material and thus integrally formed with thewick 26. Thespace partition element 27 extends from thewick 26 toward thelid 21 and thus abuts against thelid 21. Thespace partition element 27 extends into theliquid channel 124 by a predetermined length. Therefore, theevaporation space 128 and theliquid channel 124 are completely separated. - The working fluid fills the
evaporation chamber 121 and adsorbs on thewick 26. In practice, the working fluid can be pure water. The working fluid is not shown in the diagrams for two reasons: adsorbed liquid is difficult to depict; and working fluids are well-known to persons skilled in the art. - The structure of the loop vapor chamber in the first preferred embodiment is described above. The operation of the loop vapor chamber in the first preferred embodiment is described below.
- As shown in
FIG. 5 , before using the loop vapor chamber, a user adheres thebase board 11 of theloop vapor chamber 10 to a target for heat dissipation (for example, a CPU (not shown) of a computer) such that theevaporation chamber 121 corresponds in position to the target for heat dissipation. A heat-dissipating unit 100 is disposed on thebase board 11 and corresponds in position to thecondensation channel 123. In this embodiment, the heat-dissipating unit 100 comprises a plurality of fins. - As shown in
FIG. 5 , during the usage of the loop vapor chamber, heat generated from the target for heat dissipation is transferred to theevaporation chamber 121, and thus the working fluid which adsorbs on thewick 26 in theevaporation chamber 121 evaporates into a gaseous working fluid which then spreads throughout the evaporation space. Afterward, the gaseous working fluid reaches thecondensation channel 123 via thevapor channel 122. Then, the heat-dissipatingunit 100 allows the heat to be dissipated by air such that thecondensation channel 123 has a lower temperature than theevaporation chamber 121; hence, the gaseous working fluid in thecondensation channel 123 cools down and condenses into droplets of a liquid working fluid. As a result, the droplets of the liquid working fluid attach to the inner wall of thecondensation channel 123. As time passed, the resultant liquid working fluid in droplets becomes massive enough to occupy thecondensation channel 123 fully to formfluid slugs 29 defined by the cross sections of thecondensation channel 123. The gaseous working fluid exits thevapor channel 122 and enters thecondensation channel 123 continuously and thus spontaneously generates a pressure difference. Under the pressure difference, the fluid slugs 29 move from thecondensation channel 123 to theliquid channel 124 before arriving at theevaporation chamber 121 where the fluid slugs 29 adsorb on thespace partition element 27 and then return to thewick 26. The aforesaid process recurs and thus guides heat out of the target for heat dissipation continuously, thereby performing heat dissipation well. - In the first preferred embodiment, the
evaporation chamber 121 and the return path (composed of thevapor channel 122, thecondensation channel 123 and the liquid channel 124) are integrally formed and disposed within the space hermetically sealed by thelid 21 and thebase board 11; hence, theevaporation chamber 121 and the return path are collectively equivalent to an integral structure. The return path is free of any wick layer but still allows the working fluid to transit from a gaseous phase to a liquid phase and return to theevaporation chamber 121. With a wick layer being dispensed with, the return path further reduces the thickness requirement of the vapor chamber. - Referring to
FIG. 6 andFIG. 7 , aloop vapor chamber 30 in the second preferred embodiment of the present disclosure is substantially identical to its counterpart in the first preferred embodiment of the present disclosure except for its distinguishing technical features described below. - The
base board 31 has two channel partition elements 34 (partition boards for exemplary purposes) disposed in theliquid channel 324. The twochannel partition elements 34 extend from theliquid channel 324 into thecondensation channel 323. Therefore, the twochannel partition elements 34 partition theliquid channel 324 and thecondensation channel 323 into threefluid slug channels 341 penetrating theliquid channel 324 and thecondensation channel 323. Thefluid slug channels 341 are of a smaller caliber than thevapor channel 322. Thechannel partition elements 34 are designed in such a manner that thefluid slug channels 341 are of a small caliber; hence, the working fluid droplets adsorbing on thecondensation channel 323 are likely to merge and form fluid slugs 49 (shown inFIG. 7 ) defined by the cross sections of thefluid slug channels 341, respectively. - In the second preferred embodiment, the space partition element 47 (by contrast, in the first preferred embodiment, the
space partition element 27 extends into the liquid channel 324) is made of solid metal, abuts against thewick 46 and thelid 41 from below and above, respectively, and separates theevaporation space 328 from theliquid channel 324. - The
channel partition elements 34 are not necessarily in the number of two, but can be in the number of one or more than two in a variant embodiment. Hence, the number of thechannel partition elements 34 is subject to changes as needed. - The other structures and achievable advantages in the second preferred embodiment are substantially identical to their counterparts in the first preferred embodiment and thus, for the sake of brevity, are not described again.
- Referring to
FIG. 8 andFIG. 9 , aloop vapor chamber 50 in the third preferred embodiment of the present disclosure is substantially identical to its counterpart in the second preferred embodiment of the present disclosure except for its distinguishing technical features described below. - The
wick 66 extends into theliquid channel 524 by a predetermined length. Thespace partition element 67 is disposed in the liquid channel and above a segment of the wick 66 (the segment of thewick 66 is located in theliquid channel 524 because of the extension of the wick 66). Thespace partition element 67 occupies theliquid channel 524 fully in terms of its cross section without blocking the segment of the wick 66 (the segment of thewick 66 is located in theliquid channel 524 because of the extension of the wick 66). - The two
channel partition elements 54 extend into thevapor channel 522. The gaseous working fluid exits theevaporation space 528 and enters thevapor channel 522 smoothly. - Therefore, the
space partition element 67 separates theevaporation space 528 and theliquid channel 524 effectively, whereas the liquid working fluid adsorbs on the segment of the wick 66 (the segment of thewick 66 is located in theliquid channel 524 because of the extension of the wick 66). - The other structural features and achievable advantages of the third embodiment are substantially identical to their counterparts in the second embodiment and thus, for the sake of brevity, are not described herein.
Claims (11)
1. A loop vapor chamber, comprising:
a base board having therein a space;
a lid for covering the base board and hermetically sealing the space to allow the space to have an evaporation chamber, a vapor channel, a condensation channel and a liquid channel, the vapor channel having an end in communication with the evaporation chamber and another end in connection with the condensation channel, the condensation channel being connected to the liquid channel, and the liquid channel being connected to the evaporation chamber;
a wick disposed in the evaporation chamber without occupying the evaporation chamber fully such that an evaporation space is defined in the evaporation chamber, the evaporation space being in communication with the vapor channel, wherein a portion of the wick corresponds in position to a terminal end of the liquid channel;
a space partition element disposed in the evaporation chamber to separate the evaporation space and the liquid channel; and
a working fluid filling the evaporation chamber.
2. The loop vapor chamber of claim 1 , wherein the base board has at least one channel partition element disposed in the liquid channel to partition the liquid channel into a plurality of fluid slug channels.
3. The loop vapor chamber of claim 2 , wherein the at least one channel partition element extends from the liquid channel into the condensation channel.
4. The loop vapor chamber of claim 3 , wherein the at least one channel partition element extends from the liquid channel into the condensation channel and the vapor channel.
5. The loop vapor chamber of claim 2 , wherein the fluid slug channels are of a smaller caliber than the vapor channel.
6. The loop vapor chamber of claim 1 , wherein the space partition element is made of a wick material and thus integrally formed with the wick, with the space partition element extending from the wick toward the lid to abut against the lid and extend into the liquid channel by a predetermined length.
7. The loop vapor chamber of claim 1 , wherein the wick is sintered-coupled to the base board and disposed at a bottom of the evaporation chamber, with evaporation space disposed between the wick and the lid, and the wick having a plurality of supportive blocks in contact with the wick and the lid.
8. The loop vapor chamber of claim 7 , wherein the plurality of supportive blocks is made of the same material as the wick and integrally formed with the wick.
9. The loop vapor chamber of claim 7 , wherein the plurality of supportive blocks is each a solid metal block.
10. The loop vapor chamber of claim 1 , wherein the space partition element is made of solid metal and abuts against the wick and the lid from below and above, respectively.
11. The loop vapor chamber of claim 1 , wherein the wick extends into the liquid channel by a predetermined length.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107115224 | 2018-05-04 | ||
| TW107115224A TWI672478B (en) | 2018-05-04 | 2018-05-04 | Loop type uniform temperature plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20190339022A1 true US20190339022A1 (en) | 2019-11-07 |
Family
ID=68383847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US16/051,916 Abandoned US20190339022A1 (en) | 2018-05-04 | 2018-08-01 | Loop vapor chamber |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20190339022A1 (en) |
| JP (1) | JP2019194515A (en) |
| TW (1) | TWI672478B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200149823A1 (en) * | 2018-11-09 | 2020-05-14 | Furukawa Electric Co., Ltd. | Heat pipe |
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| US10976112B2 (en) * | 2018-11-09 | 2021-04-13 | Furukawa Electric Co., Ltd. | Heat pipe |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2019194515A (en) | 2019-11-07 |
| TW201947179A (en) | 2019-12-16 |
| TWI672478B (en) | 2019-09-21 |
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