CN203811001U - Loop vapor chamber - Google Patents

Abstract

The utility model relates to a loop type temperature-uniforming plate, which comprises two plate bodies and a ring groove formed between the two plate bodies, wherein a separating part is arranged in the ring groove, the ring grooves at two ends of the separating part are only communicated through a fine channel on the separating part, and a working fluid is arranged in the ring groove; when the plate body is used, the heat source corresponds to one end of the separating part of each annular groove, so that the working fluid at the end is evaporated into gas, and the working fluid at the other end is still liquid, so that the two ends of the separating part have temperature difference and pressure difference, the gas moves circularly along the annular grooves for one circle, the gas moves circularly and simultaneously radiates heat to the parts of the plate body, the gas is cooled into liquid to reach the other end of the separating part, and finally the liquid returns to the starting end through the fine channel; the speed of heat movement of the working fluid is far faster than the heat conduction of the material, so that the heat conduction speed can be effectively improved.

Description

Loop vapor chamber

technical field

The utility model relates to a heat conduction device for electronic products, in particular to a loop-type uniform temperature plate for computers and communication products.

Background technique

In the electronic products of the prior art, in order to prevent the heat emitted by various components such as the processor from being concentrated in one place and make the user feel uncomfortable when touching it, a vapor chamber is often installed to dissipate the heat. Spread evenly; the vapor chamber in the prior art is a thin metal sheet, one side of which is in contact with the heat source, and transfers the heat from the heat source to the entire vapor chamber through the thermal conductivity of its own material, so as to achieve the purpose of dissipating the heat source for the purpose of uniform heat transfer.

However, with the rapid development of science and technology, more and more heat is dissipated by components such as processors in electronic products, and the heat conduction speed of the existing technology is not enough to cope with the new type Components such as high-power processors need to be improved.

Utility model content

In view of the aforementioned shortcomings and deficiencies of the prior art, the utility model provides a circuit-type vapor chamber, which can effectively increase the speed of heat conduction.

In order to achieve the above-mentioned purpose, the technical means adopted in the utility model is to provide a loop-type vapor chamber, which includes:

The two boards are fixed up and down, and each board includes an inner surface and an outer surface, and the inner surfaces of the two boards are bonded together;

At least one ring groove, which is formed between the two plates, a partition is provided in each ring groove, at least one fine channel runs through the partition, and the ring grooves at both ends of the partition communicate only through these fine channels; each ring Working fluid is provided in the tank.

When the utility model is used, the position of the heat source corresponds to one end of the partition of each annular groove, so that the working fluid at this end will be heated and evaporated into gas, while the working fluid at the other end of the partition is not directly heated However, it is still a liquid, so the two ends of the partition cause a temperature difference to produce different saturated vapor pressures, and the pressure difference drives the gas to move to the liquid, but due to the capillary pressure generated by the micro channels of the partition, the gas does not It will enter the micro-channel, and will go around the ring groove to reach the other end of the partition. The gas will dissipate heat to all parts of the plate while moving around, and thus cool into liquid and come to the partition. At the other end, at this time, the micro-channel of the partition generates capillary pressure again, so that the liquid passes through the micro-channel and backfills to the beginning of the partition to be heated and evaporated; the utility model uses this to move the heat through the circulating flow of the working fluid and make the heat uniform The speed of heat transfer by the working fluid is much faster than the heat conduction of the material itself, so the purpose of increasing the heat conduction speed can be achieved.

Furthermore, in the said loop-type temperature chamber, the bottom surface of each annular groove protrudes from the outer surface of the corresponding plate body. Thereby, the ring groove has a larger space, or the parts of the plate body except the ring groove can be thinned.

Description of drawings

Fig. 1 is the three-dimensional appearance schematic diagram of the first embodiment of the present utility model;

Fig. 2 is an exploded schematic view of components of the first embodiment of the present invention;

Fig. 3 is the schematic diagram of the front view of the first embodiment of the utility model;

Fig. 4 is the front cross-sectional schematic diagram of the second embodiment of the present utility model;

Fig. 5 is a front view cross-sectional schematic diagram of a third embodiment of the present invention;

Fig. 6 is a schematic cross-sectional front view of a fourth embodiment of the present invention;

FIG. 7 is a schematic perspective view of a fifth embodiment of the present invention;

Fig. 8 is a schematic top view of the annular groove of the sixth embodiment of the present invention;

Fig. 9 is a schematic top view of the annular groove of the seventh embodiment of the present invention;

Fig. 10 is a schematic top view of the ring groove of the eighth embodiment of the present invention;

FIG. 11 is a schematic top view of the ring groove of the ninth embodiment of the present invention.

Symbol Description:

10 plate body 11 perforation

20 ring grooves 30 partitions

31 Micro Road

10A board body 20A ring groove

10B board body 20B ring groove

10C plate body 20C ring groove

10D board body

10E plate body 20E ring groove

21E curved section

10F plate body 20F ring groove

30F Partition 40F Connecting Room

20G ring groove

10H plate body 20H ring groove

22H shared section 30H partition

Detailed ways

The technical means adopted by the utility model to achieve the predetermined purpose are further described below in conjunction with the drawings and preferred embodiments of the utility model.

Please refer to FIG. 1 to FIG. 3 , the following is the first embodiment of the loop type vapor chamber of the present invention, which includes two plate bodies 10 and a ring groove 20 .

The aforementioned two boards 10 are fixed up and down, each board 10 includes an inner side and an outer side, and the inner sides of the two boards 10 are attached; each board 10 is rectangular, but not limited thereto.

The aforementioned annular groove 20 is formed between the two plates 10, and the annular groove 20 is concavely formed on the inner surfaces of the two plates 10, and the bottom surface of the annular groove 20 protrudes from the outer surfaces of the two plates 10, so that the annular groove 20 There is more space, or the plate body 10 can be thinned except for the ring groove 20, but the shape of the ring groove 20 is not limited to this; for example, please refer to Figure 4, which is the first embodiment of the present invention Second embodiment, wherein the bottom surface of the annular groove 20A does not protrude from the outer surfaces of the two plates 10A; or, please refer to Figure 5, which is the third embodiment of the present utility model, wherein the annular groove 20B is only concave Formed on the inner surface of one of the plate bodies 10B, and the bottom surface of the ring groove 20B protrudes from the outer surface of the plate body 10B; or, please refer to Figure 6, which is the fourth embodiment of the present utility model, wherein The ring groove 20C is only concavely formed on the inner surface of one of the plate bodies 10C, and the bottom surface of the ring groove 20C does not protrude from the outer surface of the plate body 10C.

Please refer to Figures 1 to 3, returning to the first embodiment, the ring groove 20 surrounds the outer contour of the rectangular plate body 10, and is also rectangular, but it is not limited thereto, the ring groove 20 can also be regardless of the plate The outer shape of the body 10 is other shapes.

A divider 30 is provided in the ring groove 20, and a plurality of fine channels 31 run through the divider 30, and the ring groove 20 located at both ends of the divider 30 communicates only through these fine channels 31; in this embodiment, the divider 30 is Low thermal conductivity material, and furthermore, the partition 30 is a material with a thermal conductivity lower than 100, but not limited thereto; in addition, in this embodiment, the partition 30 is a capillary structure, specifically the partition 30 can be A block that runs through a plurality of linear passages, as shown in Figure 2, or, the partition 30 can also be a block made of porous material, and its irregular holes can also be used as micro-channels, so the same It has the function of capillary structure, or the metal with low thermal conductivity can be directly welded between the two plates 10, so it can also be used as the partition 30, and the holes formed after the metal welding are fine, so it also has The function of the capillary structure; each annular groove 20 is provided with a working fluid, and the working fluid can be water or refrigerant.

When the utility model is used, the position of the heat source corresponds to one end of the partition 30 of the ring groove 20, for example, make this end lean against the heat source, so that the working fluid at the end will be heated and evaporated into gas, and the partition The working fluid at the other end of 30 is not directly heated and is still a liquid, so the two ends of the partition 30 cause a temperature difference to generate different saturated vapor pressures, and the pressure difference drives the gaseous working fluid to move to the liquid working fluid, However, due to the effect of capillary pressure generated by the micro-channel 31 of the partition 30, the high-temperature and high-pressure gaseous working fluid cannot enter the micro-channel 31, but will circle around the ring groove 20, and the gaseous working fluid will be simultaneously in the process of moving around. The heat is dissipated to all parts of the plate body 10, and thus cooled into a liquid to come to the other end of the partition 30. At this time, the micro channel 31 of the partition 30 generates capillary pressure again, so that the liquid working fluid passes through the micro channel 31 to Backfill to the starting end of the partition 30 to be heated and evaporated again; the utility model uses this to move heat through the circulating flow of the working fluid and transfer the heat evenly, and the speed of the working fluid moving heat is much faster than that of the plate body 10 through its own material heat conduction It comes quickly, so it can achieve the purpose of improving the heat conduction speed.

In addition, in this embodiment, a perforation 11 runs through the center of the two plates 10 up and down, so that the two plates 10 become ring-shaped, the shape and size of the two perforations 11 are the same, and the positions of the two perforations 11 are also corresponding; As a result, the space occupied by the utility model can be effectively reduced, and other various components in the electronic product can be arranged in the through hole 11; but please refer to FIG. 7, which is the fifth embodiment of the utility model, the board body 10D itself also has a certain heat conduction function, so if there is no need to avoid the position, the through hole may not be provided, so that the heat from the heat source can also be transferred to the center of the plate body 10D.

Furthermore, if you want to effectively transfer heat to the center of the plate body, please refer to Figure 8, which is the sixth embodiment of the present utility model, wherein the ring groove 20E is still substantially rectangular, but the ring groove 20E contains There are a plurality of curved sections 21E, and these curved sections 21E are connected to each other. Each curved section 21E bends and extends into the place surrounded by the ring groove 20E, then bends and extends out, and connects the next curved section 21E, thereby removing the effective In addition to extending the length of the path to accommodate more working fluid, the heat from the heat source can be quickly transferred to the center of the plate body 10E through the working fluid, thereby making the heat conduction more uniform.

In addition to transferring heat to the center of the plate body in the form of a curved section, multiple annular grooves can also be provided to achieve a similar effect. For example, the seventh embodiment below, please refer to FIG. 9, which includes three A ring groove 20F, and further includes two communication chambers 40F; these ring grooves 20F are mutually nested in a concentric manner; each communication chamber 40F is connected between two adjacent ring grooves 20F, and is connected to the adjacent two ring grooves. 20F; and the partitions 30F of each annular groove 20F extend into the communication chamber 40F, so that the partitions 30F of each annular groove 20F can be connected to each other; in this way, the heat of the heat source will also pass through the communication chamber 40F and move to Different annular grooves 20F, and then can be transferred to the plate body 10F everywhere, so as to achieve the purpose of uniform heat transfer.

In addition, if the connecting chamber of the seventh embodiment is removed, please refer to Figure 10, which is the eighth embodiment of the present utility model, so that the three annular grooves 20G can be used for three heat sources respectively, and respectively The heat from the three heat sources is evenly transferred out.

Finally, when the heat source is located at the center of the plate body 10, please refer to Figure 11, which is the ninth embodiment of the present utility model, which has two ring grooves 20H, which are connected and communicated, and have A shared section 22H located in the center, the shared section 22H is used jointly by the two annular grooves 20H; the two annular grooves 20H have a partition 30H in total, the partition 30H is located in the shared section 22H and is used jointly by the two annular grooves 20H, In this way, the heat at the center of the plate body 10H can be transferred to the outside.

The above descriptions are only preferred embodiments of the present utility model, and do not limit the utility model in any form. Although the utility model has been disclosed as above with preferred embodiments, it is not used to limit the utility model. Those who have ordinary knowledge in the technical field, without departing from the scope of the technical solution of the present utility model, can use the technical content disclosed above to make some changes or modify equivalent embodiments with equivalent changes, but all without departing from the technical solutions of the present utility model For the content of the technical solution, any simple modifications, equivalent changes and modifications made to the above embodiments according to the technical essence of the present utility model still belong to the scope of the technical solution of the present utility model.

Claims (10)

1. a loop-type temperature-uniforming plate, is characterized in that, described loop-type temperature-uniforming plate comprises:

Two plate bodys, it fits fixing up and down, and each plate body includes a medial surface and a lateral surface, and the medial surface of two plate bodys fits;

At least one annular groove, it forms between two plate bodys, is provided with a separating part in each annular groove, is penetrated with at least one fine road on this separating part, and the annular groove that is positioned at these separating part two ends only communicates by described fine road; In each annular groove, be provided with working fluid.

2. loop-type temperature-uniforming plate as claimed in claim 1, is characterized in that, each annular groove indent forms in the medial surface of two plate bodys.

3. loop-type temperature-uniforming plate as claimed in claim 1, is characterized in that, each annular groove only indent forms in the wherein medial surface of a plate body.

4. loop-type temperature-uniforming plate as claimed any one in claims 1 to 3, is characterized in that, the bottom surface of each annular groove protrudes from the lateral surface of corresponding plate body.

5. loop-type temperature-uniforming plate as claimed any one in claims 1 to 3, is characterized in that, described loop-type temperature-uniforming plate includes multiple annular grooves, and described multiple annular grooves become concentric manner ground mutually sheathed.

6. loop-type temperature-uniforming plate as claimed in claim 5, is characterized in that, described loop-type temperature-uniforming plate further includes at least one communication chamber, and each communication chamber is connected between two adjacent annular grooves, and is connected with two adjacent annular grooves; The separating part of each annular groove extends into communication chamber, and the separating part of each annular groove interconnects.

7. loop-type temperature-uniforming plate as claimed any one in claims 1 to 3, is characterized in that, described loop-type temperature-uniforming plate includes two annular grooves, this two annular groove is connected and communicates, and thering is a common sections, this two annular groove has a separating part altogether, and this separating part having is altogether positioned at this common sections.

8. loop-type temperature-uniforming plate as claimed any one in claims 1 to 3, is characterized in that, described annular groove includes multiple bending sections, and described bending section interconnects, and each bending section bending extends into annular groove and surrounds part, and then bending extends out again.

9. loop-type temperature-uniforming plate as claimed any one in claims 1 to 3, is characterized in that, the center of described two plate bodys is penetrated with a perforation up and down.

10. loop-type temperature-uniforming plate as claimed any one in claims 1 to 3, is characterized in that, described separating part is capillary structure.