[go: up one dir, main page]

US20190096621A1 - Pptc device having low melting temperature polymer body - Google Patents

Pptc device having low melting temperature polymer body Download PDF

Info

Publication number
US20190096621A1
US20190096621A1 US16/138,611 US201816138611A US2019096621A1 US 20190096621 A1 US20190096621 A1 US 20190096621A1 US 201816138611 A US201816138611 A US 201816138611A US 2019096621 A1 US2019096621 A1 US 2019096621A1
Authority
US
United States
Prior art keywords
pptc
fuse device
pptc body
polymer matrix
conductive filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US16/138,611
Other languages
English (en)
Inventor
Jianhua Chen
Chun Kwan Tsang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Littelfuse Inc
Original Assignee
Littelfuse Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Littelfuse Inc filed Critical Littelfuse Inc
Priority to US16/138,611 priority Critical patent/US20190096621A1/en
Publication of US20190096621A1 publication Critical patent/US20190096621A1/en
Assigned to LITTELFUSE, INC. reassignment LITTELFUSE, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, JIANHUA, TSANG, CHUN KWAN
Assigned to LITTELFUSE, INC. reassignment LITTELFUSE, INC. CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR'S EXECUTION DATES OF 10/29/2019 PREVIOUSLY RECORDED ON REEL 050889 FRAME 0367. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Assignors: CHEN, JIANHUA, TSANG, CHUN KWAN
Priority to US17/349,065 priority patent/US11984285B2/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05—Component parts thereof
    • H01H85/055—Fusible members
    • H01H85/06—Fusible members characterised by the fusible material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C08K3/14—Carbides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/06—Polyethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/16—Ethene-propene or ethene-propene-diene copolymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H9/00—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
    • H02H9/02—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess current
    • H02H9/026—Current limitation using PTC resistors, i.e. resistors with a large positive temperature coefficient
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives

Definitions

  • Embodiments relate to the field of circuit protection devices, including fuse devices.
  • Embodiments relate to the field of circuit protection devices, including fuse devices.
  • Polymer positive temperature coefficient (PPTC) devices may be used as overcurrent or over-temperature protection device, as well as current or temperature sensors, among various applications.
  • the PPTC device may be considered a resettable fuse, designed to exhibit low resistance when operating under designed conditions, such as low current.
  • the resistance of the PPTC device may be altered by direct heating due to temperature increase in the environment of the circuit protection element, or via resistive heating generated by electrical current passing through the circuit protection element.
  • a PPTC device may include a polymer material and a conductive filler that provides a mixture that transitions from a low resistance state to a high resistance state, due to changes in the polymer material, such as a melting transition or a glass transition.
  • the polymer matrix may expand and disrupt the electrically conductive network, rendering the composite much less electrically conductive.
  • This change in resistance imparts a fuse-like character to the PPTC materials, which resistance may be reversible when the PPTC material cools back to room temperature.
  • PPTC devices may be tailored to satisfy various criteria, including robust performance, as well as operation temperature.
  • known fluoropolymer-based PPTC devices may provide reliable trip temperatures in the range of 160° C. or greater. This performance may not be suitable for all applications. With respect to this and other considerations the present disclosure is provided.
  • a fuse device may include a PPTC body; a first electrode, disposed on a first side of the PPTC body; and a second electrode, disposed on a second side of the PPTC body.
  • the PPTC body may include a polymer matrix and a conductive filler, wherein the polymer matrix comprises a polymer having a melting temperature of less than 150° C.
  • a fuse device may include a PPTC body; a first electrode, disposed on a first side of the PPTC body; and a second electrode, disposed on a second side of the PPTC body.
  • the PPTC body may include a polymer matrix and a conductive filler, wherein the polymer matrix comprises a low temperature PVDF material having a melting temperature in a range between 90° C. and 110° C.
  • a fuse device may include a PPTC body; a first electrode, disposed on a first side of the PPTC body; and a second electrode, disposed on a second side of the PPTC body.
  • the PPTC body may include a polymer matrix and a conductive filler, wherein the polymer matrix comprises a linear low-density polyethylene material, having a melting temperature is a range of 100° C.
  • FIG. 1A and FIG. 1B illustrate a PPTC device according to embodiments of the disclosure
  • FIG. 2 and FIG. 3 illustrate exemplary resistance behavior for two different PPTC formulations, according to different embodiments of the disclosure
  • FIG. 4 shows a PPTC device according to various embodiments of the disclosure
  • FIG. 5 shows a PPTC device according to various other embodiments of the disclosure.
  • FIG. 6 show a PPTC device according to various additional embodiments of the disclosure.
  • the terms “on,” “overlying,” “disposed on” and “over” may be used in the following description and claims. “On,” “overlying,” “disposed on” and “over” may be used to indicate that two or more elements are in direct physical contact with one another. Also, the term “on,”, “overlying,” “disposed on,” and “over”, may mean that two or more elements are not in direct contact with one another. For example, “over” may mean that one element is above another element while not contacting one another and may have another element or elements in between the two elements.
  • novel device structures and materials are provided for forming a PPTC device, where the PPTC device is configured to operate as a fuse device at relatively low temperatures.
  • a low trip-temperature PPTC is formed using a select combination of a fluoropolymer and conductive filler.
  • a PPTC device may exhibit a trip temperature of less than 150° C.
  • a PPTC device may be constructed as shown in FIG. 1A and FIG. 1B .
  • FIG. 1A illustrates a side cross-sectional view of a PPTC device 100 , where a PPTC body 104 is disposed between a first electrode 102 and a second electrode 106 , arranged on a first side and a second side, respectively.
  • FIG. 1B illustrates a configuration of the PPTC device 100 after a first terminal 108 is joined to the first electrode 102 and a second terminal 110 is joined to the second electrode 106 .
  • the PPTC body 104 may be formed from a relatively low melting temperature polymer as detailed below.
  • the first electrode 102 and second electrode 106 may be formed of known metals, such as a copper foil.
  • the copper foil may be nickel plated.
  • the first terminal 108 and second terminal 110 may also be formed of known materials, such a copper or brass.
  • the first terminal 108 and the second terminal 110 may form a first interface 112 and second interface 114 with the first terminal 108 and second terminal 110 , such as by welding.
  • the embodiments are not limited in this context.
  • the PPTC body may be formed using a polymer matrix such as a low melting point polyvinylidene fluoride (PVDF) polymer, an ethylene vinyl acetate (EVA) polymer, a high-density polyethylene (HDPE), a low-density polyethylene (LDPE), a linear low density polyethylene (LLDPE), or an ethylene butyl acrylate (EBA) polymer.
  • PVDF low melting point polyvinylidene fluoride
  • EVA ethylene vinyl acetate
  • HDPE high-density polyethylene
  • LDPE low-density polyethylene
  • LLDPE linear low density polyethylene
  • EBA ethylene butyl acrylate
  • the polymer matrix may be any crystalline polyolefin polymer, olefin copolymer, or combination of the two.
  • the polymer matrix may comprise a PVDF material having a melting temperature below 150 C, where the volume fraction of polymer in the PPTC body 35 to 75%, wherein the conductive filler comprises a volume fraction of 25 to 65%, and wherein the volume resistivity of the conductive filler is less than 500 ⁇ -cm.
  • the polymer matrix may comprise a polyolefin polymer, olefin copolymer, or combination of the two, where the polymer matrix has a melting temperature of 120° C. or less, where the volume fraction of polymer in the PPTC body 35 to 75%, wherein the conductive filler comprises a volume fraction of 25 to 65%, and wherein the volume resistivity of the conductive filler is less than 500 ⁇ -cm.
  • the hold current density of the PPTC body at 25 C may range from 0.05 to 0.4 A/mm 2 .
  • the embodiments are not limited in this context.
  • the conductive filler of the PPTC body 104 may be formed from conductive particles having a particle size in the range of 0.1 ⁇ m to 50 ⁇ m.
  • the particles may be a conductive ceramic, metal boride, metal nitride, or metal carbide (e.g., Tungsten carbide, titanium carbide, titanium diboride, vanadium carbide, zirconium carbide).
  • the conductive particles may be a metal, such as nickel, tungsten or copper.
  • the conductive particles may be a metal alloy such as a nickel-copper alloy, copper-tin alloy, or other alloy.
  • the conductive filler particles may be a carbon material, such as carbon black, graphite.
  • FIG. 2 there is shown a graph plotting the resistance behavior as a function of temperature of a PPTC device, arranged according to embodiments of the disclosure.
  • the PPTC body is formed using a special low melting point PVDF polymer material, where the melting temperature is in the range of 100° C., such as between 90° C. and 110° C.
  • the PVDF polymer material used in this example contrasts with conventional PVDF that exhibits a melting temperature of approximately 175° C.
  • the conductive filler used for the example of FIG. 2 is a tungsten carbide filler, at approximately 44% by volume fraction of the PPTC body.
  • a gradual and modest increase in resistance takes place above 60° C., while an abrupt increase in resistance takes place at 120° C. Accordingly, the PPTC material of FIG. 2 may be deemed to exhibit a trip temperature of 120° C.
  • FIG. 3 there is shown a graph plotting the resistance behavior as a function of temperature of a PPTC device, arranged according to other embodiments of the disclosure.
  • the PPTC body is formed using a special low melting temperature LLDPE material, where the melting temperature is in the range of 100° C.
  • the LLDPE material used in this example contrasts with conventional PVDF that exhibits a melting temperature of approximately 175° C.
  • the conductive filler used for the example of FIG. 3 is a tungsten carbide filler, at approximately 44% by volume fraction of the PPTC body.
  • a gradual and modest increase in resistance takes place above 40° C., while an abrupt increase in resistance takes place at approximately 80-100° C. Accordingly, the PPTC material of FIG. 3 may be deemed to exhibit a trip temperature of 90° C.
  • the hold current density (the ratio of the hold current of the low tripping temperature PTC materials layer at 25° C. to the area of PPTC through which current travels between opposing electrodes) of the above examples of FIG. 2 and FIG. 3 may be designed to exhibit a value between 0.05 to 0.4 A/mm 2 by appropriate choice of volume fraction of conductive filler and type of conductive filler, as discussed above.
  • FIG. 4 presents a top plan view of a PPTC device 400 , shown as radial lead PPTC, including bottom lead 404 and top lead 406 , attached to opposite surfaces of a PPTC body 402 .
  • the PPTC body 402 may have first and second electrodes (not separately shown) attached to the top surface and bottom surface, respectively, as generally described above.
  • the PPTC device 400 may be encapsulated by an encapsulant layer 410 , such as an epoxy.
  • the PPTC body 402 may be formulated generally as described above, for operation at a low trip temperature, such as below 150 C.
  • FIG. 5 and FIG. 6 depict side cross-sectional views of embodiments of a single layer surface mount PPTC device 500 and a double layer surface mount PPTC device 600 , according to different embodiments of the disclosure.
  • the PPTC body may be formulated generally as described above, for operation at a low trip temperature, such as below 150 C.
  • the PPTC body may be formulated generally as described above, for operation at a low trip temperature, such as below 150° C.
  • the PPTC device 500 and PPTC device 520 each have similar components, including metal electrodes 504 , metal structures 506 , metal foil electrode 508 , PTC layer 502 , insulation layer 510 , and solder mask 514 .

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Fuses (AREA)
  • Thermistors And Varistors (AREA)
US16/138,611 2017-09-22 2018-09-21 Pptc device having low melting temperature polymer body Abandoned US20190096621A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US16/138,611 US20190096621A1 (en) 2017-09-22 2018-09-21 Pptc device having low melting temperature polymer body
US17/349,065 US11984285B2 (en) 2017-09-22 2021-06-16 PPTC device having low melting temperature polymer body

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762561793P 2017-09-22 2017-09-22
US16/138,611 US20190096621A1 (en) 2017-09-22 2018-09-21 Pptc device having low melting temperature polymer body

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US17/349,065 Division US11984285B2 (en) 2017-09-22 2021-06-16 PPTC device having low melting temperature polymer body

Publications (1)

Publication Number Publication Date
US20190096621A1 true US20190096621A1 (en) 2019-03-28

Family

ID=65638667

Family Applications (2)

Application Number Title Priority Date Filing Date
US16/138,611 Abandoned US20190096621A1 (en) 2017-09-22 2018-09-21 Pptc device having low melting temperature polymer body
US17/349,065 Active US11984285B2 (en) 2017-09-22 2021-06-16 PPTC device having low melting temperature polymer body

Family Applications After (1)

Application Number Title Priority Date Filing Date
US17/349,065 Active US11984285B2 (en) 2017-09-22 2021-06-16 PPTC device having low melting temperature polymer body

Country Status (4)

Country Link
US (2) US20190096621A1 (zh)
CN (1) CN109545484A (zh)
DE (1) DE102018123376A1 (zh)
TW (1) TWI685011B (zh)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021168656A1 (en) * 2020-02-25 2021-09-02 Littelfuse, Inc. Pptc heater and material having stable power and self-limiting behavior
US20220208420A1 (en) * 2020-12-28 2022-06-30 Littelfuse, Inc. Pptc tank heater
US20220375658A1 (en) * 2021-05-21 2022-11-24 Polytronics Technology Corp. Over-current protection device
US20240425004A1 (en) * 2023-06-23 2024-12-26 Mtd Products Inc Power distribution module
US12406782B2 (en) * 2022-06-07 2025-09-02 Polytronics Technology Corp. Over-current protection device
US12488916B2 (en) * 2022-10-28 2025-12-02 Polytronics Technology Corp. Over-current protection device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11037708B2 (en) * 2019-07-01 2021-06-15 Littelfuse, Inc. PPTC device having resistive component
TWI814547B (zh) * 2022-08-24 2023-09-01 聚鼎科技股份有限公司 電路保護元件

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070146112A1 (en) * 2005-12-27 2007-06-28 Wang Shau C Surface-mounted over-current protection device
US20080074232A1 (en) * 2006-09-22 2008-03-27 Fuzetec Technology Co., Ltd. Conductive positive temperature coefficient polymer composition and circuit protection device made therefrom
US8653932B2 (en) * 2010-07-08 2014-02-18 Shanghai Changyuan Wayon Circuit Protection Co., Ltd. Conductive composite material with positive temperature coefficient of resistance and overcurrent protection component
US20140306605A1 (en) * 2013-04-12 2014-10-16 Polytronics Technology Corp. Ptc composition and resistive device and led illumination apparatus using the same

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5793276A (en) * 1995-07-25 1998-08-11 Tdk Corporation Organic PTC thermistor
FR2816626A1 (fr) 2000-11-13 2002-05-17 Atofina Materiau composite polymerique conducteur a resistance auto-controlee par la temperature
US6620343B1 (en) 2002-03-19 2003-09-16 Therm-O-Disc Incorporated PTC conductive composition containing a low molecular weight polyethylene processing aid
JP3749504B2 (ja) * 2002-05-29 2006-03-01 Ｔｄｋ株式会社 Ｐｔｃ組成物、サーミスタ素子およびこれらの製造方法
US7920045B2 (en) * 2004-03-15 2011-04-05 Tyco Electronics Corporation Surface mountable PPTC device with integral weld plate
TWM308484U (en) * 2006-06-16 2007-03-21 Inpaq Technology Co Ltd Temperature control protection device
TWI310955B (en) * 2006-09-26 2009-06-11 Polytronics Technology Corp Over-current protection device
TWI464755B (zh) * 2012-11-29 2014-12-11 Polytronics Technology Corp 表面黏著型過電流保護元件
JP6179850B2 (ja) * 2013-03-19 2017-08-16 Ｌｉｔｔｅｌｆｕｓｅジャパン合同会社 Ｐｔｃ組成物
US9573438B2 (en) * 2013-04-10 2017-02-21 E I Du Pont De Nemours And Company Polymer thick film positive temperature coefficient carbon composition
CN103762012B (zh) * 2014-01-08 2016-08-17 深圳市慧瑞电子材料有限公司 低温ptc导电组合物、ptc过流保护器件及其制造方法
CN104319042A (zh) * 2014-10-24 2015-01-28 深圳市慧瑞电子材料有限公司 一种表面贴装型过电流保护元件及其制备方法
CN106317544B (zh) * 2015-06-30 2018-12-21 上海利韬电子有限公司 导电聚合物组合物、导电聚合物片材、电气器件以及它们的制备方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070146112A1 (en) * 2005-12-27 2007-06-28 Wang Shau C Surface-mounted over-current protection device
US20080074232A1 (en) * 2006-09-22 2008-03-27 Fuzetec Technology Co., Ltd. Conductive positive temperature coefficient polymer composition and circuit protection device made therefrom
US8653932B2 (en) * 2010-07-08 2014-02-18 Shanghai Changyuan Wayon Circuit Protection Co., Ltd. Conductive composite material with positive temperature coefficient of resistance and overcurrent protection component
US20140306605A1 (en) * 2013-04-12 2014-10-16 Polytronics Technology Corp. Ptc composition and resistive device and led illumination apparatus using the same

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021168656A1 (en) * 2020-02-25 2021-09-02 Littelfuse, Inc. Pptc heater and material having stable power and self-limiting behavior
EP4111475A4 (en) * 2020-02-25 2023-04-12 Littelfuse, Inc. PPTC HEATER AND MATERIAL WITH STABLE PERFORMANCE AND SELF-LIMITING BEHAVIOR
US11621108B2 (en) * 2020-12-28 2023-04-04 Littelfuse, Inc. PPTC tank heater
US20220208420A1 (en) * 2020-12-28 2022-06-30 Littelfuse, Inc. Pptc tank heater
US11488749B2 (en) * 2020-12-28 2022-11-01 Littelfuse, Inc. PPTC actuator heater
JP7739681B2 (ja) 2020-12-28 2025-09-17 リテルフューズ、インコーポレイテッド Ｐｐｔｃアクチュエータヒータ
US20220375660A1 (en) * 2020-12-28 2022-11-24 Littelfuse, Inc. Pptc actuator heater
JP2024508705A (ja) * 2020-12-28 2024-02-28 リテルフューズ、インコーポレイテッド Ｐｐｔｃアクチュエータヒータ
US20220262549A1 (en) * 2020-12-28 2022-08-18 Littelfuse, Inc. Pptc actuator heater
WO2022177937A1 (en) * 2020-12-28 2022-08-25 Littelfuse, Inc Pptc actuator heater
US11670440B2 (en) * 2020-12-28 2023-06-06 Littelfuse, Inc. PPTC actuator heater
CN116918005A (zh) * 2020-12-28 2023-10-20 力特保险丝公司 Pptc致动器加热器
US11574750B2 (en) * 2021-05-21 2023-02-07 Polytronics Technology Corp. Over-current protection device
US20220375658A1 (en) * 2021-05-21 2022-11-24 Polytronics Technology Corp. Over-current protection device
US12406782B2 (en) * 2022-06-07 2025-09-02 Polytronics Technology Corp. Over-current protection device
US12488916B2 (en) * 2022-10-28 2025-12-02 Polytronics Technology Corp. Over-current protection device
US20240425004A1 (en) * 2023-06-23 2024-12-26 Mtd Products Inc Power distribution module

Also Published As

Publication number Publication date
CN109545484A (zh) 2019-03-29
TW201921400A (zh) 2019-06-01
TWI685011B (zh) 2020-02-11
US20210313135A1 (en) 2021-10-07
DE102018123376A1 (de) 2019-03-28
US11984285B2 (en) 2024-05-14

Similar Documents

Publication Publication Date Title
US11984285B2 (en) PPTC device having low melting temperature polymer body
US10056176B2 (en) Over-current protection device
TWI449060B (zh) 過電流保護元件
CN112185634B (zh) 具有电阻元件的pptc器件
TWI480900B (zh) 插件式過電流保護元件
US10777340B2 (en) PPTC material with mixed conductive filler composition
US11763968B2 (en) PPTC material with low percolation threshold for conductive filler
US8937525B2 (en) Surface mountable over-current protection device
US10950372B2 (en) Surface mounted fuse device having positive temperature coefficient body
US10971321B2 (en) Protection device and battery pack
US9000881B2 (en) Surface mountable over-current protection device
TWI684188B (zh) 包含負溫度係數/正溫度係數裝置的混合裝置結構
TWI853541B (zh) 聚合物正溫度係數（ｐｐｔｃ）裝置、組成物、形成聚合物正溫度係數（ｐｐｔｃ）裝置的ｐｐｔｃ主體的方法
TWI687943B (zh) 正溫度係數電路保護裝置及其製法
US20200411270A1 (en) Overcurrent protection device and method of forming an overcurrent protection device
CN108630834B (zh) 复合式保护元件以及电池组
TW200823933A (en) Passive element with inrush current durability

Legal Events

Date Code Title Description
STPP Information on status: patent application and granting procedure in general

Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION

AS Assignment

Owner name: LITTELFUSE, INC., ILLINOIS

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHEN, JIANHUA;TSANG, CHUN KWAN;REEL/FRAME:050889/0367

Effective date: 20191029

AS Assignment

Owner name: LITTELFUSE, INC., ILLINOIS

Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR'S EXECUTION DATES OF 10/29/2019 PREVIOUSLY RECORDED ON REEL 050889 FRAME 0367. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT;ASSIGNORS:CHEN, JIANHUA;TSANG, CHUN KWAN;REEL/FRAME:050924/0873

Effective date: 20181029

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER

STPP Information on status: patent application and granting procedure in general

Free format text: FINAL REJECTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: RESPONSE AFTER FINAL ACTION FORWARDED TO EXAMINER

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER

STPP Information on status: patent application and granting procedure in general

Free format text: FINAL REJECTION MAILED

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION