US20180354095A1 - Grinding Tool and Method of Fabricating the Same - Google Patents
Grinding Tool and Method of Fabricating the Same Download PDFInfo
- Publication number
- US20180354095A1 US20180354095A1 US16/003,264 US201816003264A US2018354095A1 US 20180354095 A1 US20180354095 A1 US 20180354095A1 US 201816003264 A US201816003264 A US 201816003264A US 2018354095 A1 US2018354095 A1 US 2018354095A1
- Authority
- US
- United States
- Prior art keywords
- substrate
- holes
- abrasive particles
- grinding tool
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000000227 grinding Methods 0.000 title claims abstract description 62
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 119
- 239000002245 particle Substances 0.000 claims abstract description 93
- 239000000853 adhesive Substances 0.000 claims abstract description 32
- 230000001070 adhesive effect Effects 0.000 claims abstract description 32
- 230000000717 retained effect Effects 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 12
- 238000005553 drilling Methods 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 229920001568 phenolic resin Polymers 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 claims description 3
- 229920006122 polyamide resin Polymers 0.000 claims description 3
- 229920005668 polycarbonate resin Polymers 0.000 claims description 3
- 239000004431 polycarbonate resin Substances 0.000 claims description 3
- 229920001225 polyester resin Polymers 0.000 claims description 3
- 239000004645 polyester resin Substances 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 239000009719 polyimide resin Substances 0.000 claims description 3
- 229910052582 BN Inorganic materials 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- 229910003460 diamond Inorganic materials 0.000 claims description 2
- 239000010432 diamond Substances 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- 238000005498 polishing Methods 0.000 description 9
- 238000010276 construction Methods 0.000 description 6
- 239000003292 glue Substances 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 239000002002 slurry Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 230000004075 alteration Effects 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 238000007792 addition Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0072—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using adhesives for bonding abrasive particles or grinding elements to a support, e.g. by gluing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/14—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D2203/00—Tool surfaces formed with a pattern
Definitions
- FIG. 1 is a schematic view illustrating a conventional technique for fabricating a conditioner 1 .
- a mesh plate 13 can be used to position and control the height of a abrasive elements 11 placed in a mold 14 .
- a glue or resin 12 can be applied over the abrasive elements 11 inside the mold 14 .
- Pressure and vacuum can be applied so as to reduce the formation of air voids in the glue or resin 12 .
- the glue or resin 12 solidifies, it can be removed from the mold 14 to obtain the conditioner 1 shown in FIG. 2 comprised of the abrasive elements 11 adhered to the solidified glue or resin 12 .
- FIG. 6 is a cross-sectional view illustrating another variant construction of a grinding tool
- the abrasive particles 22 can be made of any suitable materials having high hardness. Examples of suitable materials for the abrasive particles 22 may include, without limitation, diamond, cubic boron nitride, aluminum oxide, and silicon carbide. The abrasive particles 22 are not limited in shape, and may exemplary have a hexoctahedron crystalline form. Moreover, the abrasive particles 22 may have any suitable size in accordance with the requisite functions of the grinding tool 2 .
- each hole 213 can include two hole sections 215 and 214 connected with each other that have different sizes and shapes.
- the hole section 215 can exemplary have a cylindrical shape, and the other hole section 214 can be exemplary shaped as a truncated cone.
- the hole section 215 can open on the surface 212 through the opening 212 A, and can have an inner sidewall that can be substantially perpendicular to the surface 212 .
- the hole section 214 can open on the surface 211 through the opening 211 A, and can have a tapered shape that narrows toward the surface 211 .
- a material angle between an inner sidewall of the hole section 214 and the surface 211 can be between about 70 and about 89 degrees.
- FIG. 5 is a cross-sectional view illustrating a variant construction of a grinding tool 3 .
- the grinding tool 3 can include the substrate 21 , the abrasive particles 22 attached to the substrate 21 , and a base substrate 31 .
- the base substrate 31 can be provided to further increase the rigidity of the grinding tool 3 .
- the substrate 21 may have the same structure described previously, and the abrasive particles 22 may be attached to the substrate 21 in a similar way. More specifically, the same holes 213 described previously may be provided in the substrate 21 and extend through the two opposite surfaces 211 and 212 of the substrate 21 .
- the abrasive particles 22 can be respectively disposed in the holes 213 , and can be respectively attached to the substrate 21 via the adhesive portions 216 .
- the opening 412 A can have a diameter between 1 mm and 2 mm, such as 2 mm, and the opening 411 A can have a diameter between 0.4 mm and 0.75 mm, such as 750 ⁇ m.
- the smaller opening 411 A can block passage of the abrasive particle 22 and thereby retain the abrasive particle 22 in the hole 413 .
- the abrasive particle 22 can be prevented from falling out of the grinding tool 4 during use.
- the abrasive particle 22 can partially protrude outward from the opening 411 A on the surface 411 of the substrate 41 .
- the abrasive particles 22 in step S 120 can be respectively introduced through the openings 212 A and placed in the holes 213 of the substrate 21 . Because the openings 211 A are smaller than the abrasive particles 22 , the abrasive particles 22 can be respectively retained in the hole sections 214 of the holes 213 .
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106119428A TWI636854B (zh) | 2017-06-12 | 2017-06-12 | 研磨工具及其製造方法 |
| TW106119428 | 2017-06-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20180354095A1 true US20180354095A1 (en) | 2018-12-13 |
Family
ID=64562083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US16/003,264 Abandoned US20180354095A1 (en) | 2017-06-12 | 2018-06-08 | Grinding Tool and Method of Fabricating the Same |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20180354095A1 (ja) |
| JP (1) | JP2019000978A (ja) |
| CN (1) | CN109015339B (ja) |
| TW (1) | TWI636854B (ja) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109822452B (zh) * | 2019-03-29 | 2020-04-03 | 深圳市宏通新材料有限公司 | 多孔金属基金刚石研磨抛光板 |
| CN110465898A (zh) * | 2019-07-24 | 2019-11-19 | 广州市三研磨材有限公司 | 一种金刚石减薄片的制造方法 |
| CN111687224A (zh) * | 2020-06-24 | 2020-09-22 | 瓯锟科技温州有限公司 | 一种大辊径多辊复合轧机的传动机构 |
| TWI780883B (zh) * | 2021-08-31 | 2022-10-11 | 中國砂輪企業股份有限公司 | 化學機械研磨墊修整器及其製法 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6769975B2 (en) * | 2001-03-02 | 2004-08-03 | Asahi Diamond Industrial Co., Ltd. | Super abrasive tool and process for producing the same |
| US7467989B2 (en) * | 2005-08-24 | 2008-12-23 | Kinik Company | Ceramic polishing pad dresser and method for fabricating the same |
| WO2009091140A2 (en) * | 2008-01-15 | 2009-07-23 | Ehwa Diamond Industrial Co., Ltd. | Conditioner for chemical mechanical planarization pad |
| KR20130004776A (ko) * | 2011-07-04 | 2013-01-14 | 주식회사 계산이엔씨 | 저압 오존용해수를 이용한 악취 제거장치 |
| US20130244552A1 (en) * | 2012-03-14 | 2013-09-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Manufacture and method of making the same |
| US20150231759A1 (en) * | 2014-02-18 | 2015-08-20 | Kinik Company | Chemical mechanical polishing conditioner with high performance |
| US20160176017A1 (en) * | 2014-12-17 | 2016-06-23 | Kinik Company | Grinding Tool and Method of Manufacturing the Same |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6669745B2 (en) * | 2001-02-21 | 2003-12-30 | 3M Innovative Properties Company | Abrasive article with optimally oriented abrasive particles and method of making the same |
| JP2003168814A (ja) * | 2001-09-18 | 2003-06-13 | Dainippon Printing Co Ltd | 太陽電池モジュ−ル用裏面保護シ−トおよびそれを使用した太陽電池モジュ−ル |
| JP4463084B2 (ja) * | 2003-11-27 | 2010-05-12 | 株式会社オクテック | ドレッシング工具 |
| JP2005219152A (ja) * | 2004-02-04 | 2005-08-18 | Ebara Corp | ドレッサおよびその製造方法 |
| JP4854445B2 (ja) * | 2006-09-25 | 2012-01-18 | 三菱マテリアル株式会社 | Ｃｍｐコンディショナおよびその製造方法 |
| JP2008114334A (ja) * | 2006-11-06 | 2008-05-22 | Mezoteku Dia Kk | Ｃｍｐコンディショナ及びその製造方法 |
| JP2010149221A (ja) * | 2008-12-25 | 2010-07-08 | Kyocera Corp | ドレッシング工具およびドレッシング方法 |
| CN101927457A (zh) * | 2009-06-26 | 2010-12-29 | 宋健民 | 组合式修整器 |
| CN201516579U (zh) * | 2009-07-29 | 2010-06-30 | 钻面奈米科技股份有限公司 | 精密研磨工具 |
| JP5809880B2 (ja) * | 2011-08-25 | 2015-11-11 | 新日鉄住金マテリアルズ株式会社 | 研磨布用ドレッサー |
| JP5972032B2 (ja) * | 2012-05-01 | 2016-08-17 | 新技術開発株式会社 | 高効率精密加工用研磨工具及びその製法 |
| CN203390712U (zh) * | 2013-04-08 | 2014-01-15 | 宋健民 | 化学机械研磨修整器 |
| TWI542444B (zh) * | 2014-09-11 | 2016-07-21 | China Grinding Wheel Corp | A polishing pad dresser with a brush holder |
-
2017
- 2017-06-12 TW TW106119428A patent/TWI636854B/zh active
-
2018
- 2018-06-06 CN CN201810587256.5A patent/CN109015339B/zh active Active
- 2018-06-08 US US16/003,264 patent/US20180354095A1/en not_active Abandoned
- 2018-06-11 JP JP2018111017A patent/JP2019000978A/ja active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6769975B2 (en) * | 2001-03-02 | 2004-08-03 | Asahi Diamond Industrial Co., Ltd. | Super abrasive tool and process for producing the same |
| US7467989B2 (en) * | 2005-08-24 | 2008-12-23 | Kinik Company | Ceramic polishing pad dresser and method for fabricating the same |
| WO2009091140A2 (en) * | 2008-01-15 | 2009-07-23 | Ehwa Diamond Industrial Co., Ltd. | Conditioner for chemical mechanical planarization pad |
| KR20130004776A (ko) * | 2011-07-04 | 2013-01-14 | 주식회사 계산이엔씨 | 저압 오존용해수를 이용한 악취 제거장치 |
| US20130244552A1 (en) * | 2012-03-14 | 2013-09-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Manufacture and method of making the same |
| US20150231759A1 (en) * | 2014-02-18 | 2015-08-20 | Kinik Company | Chemical mechanical polishing conditioner with high performance |
| US20160176017A1 (en) * | 2014-12-17 | 2016-06-23 | Kinik Company | Grinding Tool and Method of Manufacturing the Same |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI636854B (zh) | 2018-10-01 |
| CN109015339B (zh) | 2020-09-18 |
| CN109015339A (zh) | 2018-12-18 |
| JP2019000978A (ja) | 2019-01-10 |
| TW201902624A (zh) | 2019-01-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: KINIK COMPANY, TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHOU, JUI-LIN;LIAO, I-TSAO;YANG, TSUNG-YU;SIGNING DATES FROM 20180517 TO 20180518;REEL/FRAME:046126/0953 |
|
| STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
| STPP | Information on status: patent application and granting procedure in general |
Free format text: FINAL REJECTION MAILED |
|
| STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |