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US20150209812A1 - Device and method for repairing pattern on array substrate - Google Patents

Device and method for repairing pattern on array substrate Download PDF

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Publication number
US20150209812A1
US20150209812A1 US13/695,622 US201213695622A US2015209812A1 US 20150209812 A1 US20150209812 A1 US 20150209812A1 US 201213695622 A US201213695622 A US 201213695622A US 2015209812 A1 US2015209812 A1 US 2015209812A1
Authority
US
United States
Prior art keywords
coating
layer
exposed pattern
unit
etched
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/695,622
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English (en)
Inventor
Yung-Yu Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL China Star Optoelectronics Technology Co Ltd
Original Assignee
Shenzhen China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen China Star Optoelectronics Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Technology Co Ltd
Assigned to SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. reassignment SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LIN, YUNG-YU
Publication of US20150209812A1 publication Critical patent/US20150209812A1/en
Abandoned legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B05B12/084—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to condition of liquid or other fluent material already sprayed on the target, e.g. coating thickness, weight or pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136259—Repairing; Defects
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/13625—Patterning using multi-mask exposure

Definitions

  • the present invention relates to a liquid crystal manufacture field, and more particularly, relates to a device and method for repairing a pattern on an array substrate.
  • a mask is an inevitable element.
  • TFT thin-film-transistor
  • CF color filter
  • FIG. 1 is a schematic structural diagram showing a mask used in conventional skills.
  • the mask 10 comprises a transparent glass 11 , a photoresist layer 12 superposed over the transparent glass 11 , and a light transmitting area 13 located in a layer as the same as the photoresist layer 12 .
  • the light transmitting area 13 is formed between the photoresist layers 12 .
  • the photoresist layer 12 is not transparent.
  • the photoresist layer 12 together with the light transmitting area 13 form a masking layout.
  • the TFT substrate manufacture after a layer to be etched is exposed to light via the mask 10 , an exposed pattern will be formed on the layer to be etched. At the time, it needs to check the exposed pattern.
  • the results include two situations. The first situation is that a redundant photoresist exists in the exposed pattern. The second situation is that a broken-line defect exists in the exposed pattern. The broken-line defect may be caused by collapse of photoresist bubbles in the layer to be etched.
  • the first situation it can remove the redundant photoresist in the exposed pattern by using a repairing machine.
  • the second situation it needs to perform a new mask process onto the substrate having the exposed pattern. Or else, it has to abandon the mask. This is not only a waste, but also affects the liquid crystal production efficiency.
  • An objective of the present invention is to provide a device for repairing a pattern on an array substrate, for solving the technical problems occurred in conventional skills, including a high cost in tackling with a broken-line defect when a broken line exists in an exposed pattern on a layer to be etched, and a low liquid crystal production efficiency.
  • the present invention provides a device for repairing a pattern on an array substrate, said device comprising: an illuminating unit, for illuminating a mask after the mask is disposed above a substrate so as to expose a layer on the substrate that is to be etched to light to form an exposed pattern on that layer; a checking unit, for checking the exposed pattern on the layer to be etched for determining whether a defect of a broken line is occurred in the exposed pattern; a coating unit, for coating a protection layer at where the broken line is located when the defect is determined to be existed in the exposed pattern; and an etching unit, for etching the layer to be etched, having the protection layer formed thereon.
  • the checking unit comprises: an image capturing unit, for capturing an image of the exposed pattern; and a display unit, for showing the image captured by the image capturing unit to operating personnel, the operating personnel judging whether a coating defect is occurred in the exposed pattern.
  • the coating unit comprises a nozzle.
  • An objective of the present invention is to provide a device for repairing a pattern on an array substrate, for solving the technical problems occurred in conventional skills, including a high cost in tackling with a broken-line defect when a broken line exists in an exposed pattern on a layer to be etched, and a low liquid crystal production efficiency.
  • the present invention provides a device for repairing a pattern on an array substrate, said device comprising: an illuminating unit, for illuminating a mask after the mask is disposed above a substrate so as to expose a layer on the substrate that is to be etched to light to form an exposed pattern on that layer; a checking unit, for checking the exposed pattern on the layer to be etched for determining whether a coating defect is occurred in the exposed pattern; and a coating unit, for coating a protection layer at where the coating defect is located when the coating defect is determined to be existed in the exposed pattern.
  • the checking unit comprises: an image capturing unit, for capturing an image of the exposed pattern; and a display unit, for showing the image captured by the image capturing unit to operating personnel, the operating personnel judging whether the coating defect exists in the exposed pattern.
  • the device further comprising: an etching unit, for etching the layer to be etched, having the protection layer formed thereon.
  • the coating unit comprises a nozzle.
  • the coating defect is a broken line.
  • Another objective of the present invention is to provide a method for repairing a pattern on an array substrate, for solving the technical problems occurred in conventional skills, including a high cost in tackling with a broken-line defect when a broken line exists in an exposed pattern on a layer to be etched, and a low liquid crystal production efficiency.
  • the present invention provides a method for repairing a pattern on an array substrate, said method comprising: illuminating a mask after the mask is disposed above a substrate so as to expose a layer on the substrate that is to be etched to light to form an exposed pattern on that layer; checking the exposed pattern on the layer to be etched for determining whether a coating defect is occurred in the exposed pattern; and coating a protection layer at where the coating defect is located if the coating defect exists in the exposed pattern.
  • the step of checking the exposed pattern on the layer to be etched comprises: capturing an image of the exposed pattern; and showing the captured image, operating personnel judging whether the coating defect exists in the exposed pattern.
  • said method further comprises: etching the layer to be etched, having the protection layer formed thereon.
  • the step of coating the protection layer at where the coating defect is located comprises: utilizing a nozzle to coat the protection layer at where the coating defect is located.
  • the coating defect is a broken line.
  • the present invention adds the coating unit (e.g., a nozzle) on a basis of a conventional repairing machine.
  • the coating unit e.g., a nozzle
  • the protection layer is directly coated at where the coating defect is located by using the coating unit.
  • the present invention does not have to abandon the array substrate having the coating defect. Instead, it is to coat the protection layer directly at where the coating defect is located.
  • the present invention not only has high efficiency, but also low cost.
  • FIG. 1 is a schematic structural diagram showing a mask in conventional skills.
  • FIG. 2 is a schematic structural diagram showing a device for repairing a pattern on an array substrate according to a preferred embodiment provided in the present invention.
  • FIGS. 3A to 3C are schematic structural diagrams illustrating exposed patterns in respective operational stages of repairing a pattern on an array substrate according to the present invention.
  • FIG. 4 is a flow chart of a method for repairing a pattern on an array substrate according to the present invention.
  • FIG. 2 is a schematic structural diagram showing a device for repairing a pattern on an array substrate according to a preferred embodiment provided in the present invention.
  • the pattern repairing device for the array substrate comprises an illustrating unit 21 , a checking unit 22 , a coating unit 23 , an erasing unit 24 , and an etching unit 25 .
  • the checking unit 22 comprises an image capturing unit 221 and a display unit 222 .
  • the illuminating unit 21 is utilized to illuminate a mask after the mask is disposed above a substrate so as to expose a layer on the substrate that is to be etched to light to form an exposed pattern on that layer.
  • the checking unit 22 is utilized to check the exposed pattern on the layer to be etched. The results may include the following two situations. The first is that a coating defect (e.g., a broken line) is occurred in the exposed pattern. The second is that the exposed pattern may have a photoresist that is to be erased or need to be erased, for example, a redundant photoresist.
  • the image capturing unit 221 of the checking unit 22 is utilized to capture an image of the exposed pattern.
  • the display unit 222 of the checking unit 22 is utilized to show the image captured by the image capturing unit 221 to operating personnel. Whether the coating defect or the photoresist that is to be erased exists in the exposed pattern is judged by the operating personnel.
  • the coating unit 23 coats a protection layer at where the coating defect is located.
  • the protection layer can protect a photoresist located corresponding to the coating defect from being etched in subsequent processes.
  • the etching unit 25 etches the layer to be etched, having the protection layer formed thereon. If the exposed pattern has the photoresist that is to be erased, the erasing unit 24 erases or removes the photoresist to be erased. After that, the etching unit 25 etches the layer that is to be etched.
  • the coating defect of the exposed pattern can be a defect of a broken line, or any other type of defect.
  • the coating unit 23 comprises a nozzle.
  • FIG. 3A to FIG. 3C The operations of the pattern repairing device for the array substrate provided in the present invention are illustrated in accompany with FIG. 3A to FIG. 3C .
  • a mask 30 is provided as shown in FIG. 3A .
  • the mask 30 has a masking layout.
  • the masking layout has a light blocking section 31 and a light transmitting section 32 .
  • the light blocking section 31 is made by coating a photoresist material and is utilized to block light rays.
  • the mask 30 is disposed above a substrate 40 . Please further refer to FIG. 3B .
  • a layer to be etched (not labeled) is coated on the substrate 40 .
  • the illuminating unit 21 is operated to illuminate the mask 30 so as to form an exposed pattern on the layer to be etched on the substrate 40 .
  • the checking unit 22 is operated to check the exposed pattern. Specifically, an image of the exposed pattern is obtained by using the image capturing unit 221 . The obtained image of the exposed pattern is presented to operating personnel by using the display unit 222 . On the substrate 40 shown in FIG. 3B , a broken-line defect exists in the exposed pattern.
  • the substrate 40 is arranged on a flat stand.
  • the coating unit 23 is operated to coat a protection layer 42 at where the broken-line defect is located.
  • the protection layer 42 can be made of a photoresist material.
  • the protection layer 42 is utilized to protect a corresponding layer from being etched.
  • the present invention adds the coating unit 23 (e.g., a nozzle) on a basis of a conventional repairing machine.
  • the coating unit 23 e.g., a nozzle
  • the protection layer 42 is directly coated at where the broken-line defect 41 is located by using the coating unit 23 . It does not have to abandon the substrate 40 having the broken-line defect 42 or start a new mask process.
  • the present invention not only has high efficiency, but also low cost.
  • FIG. 4 is a flow chart of a method for repairing a pattern on an array substrate according to the present invention.
  • Step S 401 after a mask is disposed above a substrate, the mask is illuminated so as to expose a layer on the substrate that is to be etched to light to form an exposed pattern on that layer.
  • the step of checking the exposed pattern comprises: capturing an image of the exposed pattern; and showing the captured image to operating personnel.
  • the operating personnel judges whether defects are existed in the exposed pattern.
  • the results may include two situations. One situation is that the coating defect (e.g., a broken-line defect) is occurred in the exposed pattern. The other situation is that the exposed pattern has a photoresist that is to be erased or need to be erased.
  • Step S 403 a protection layer is coated at where the coating defect is located.
  • Step S 404 the photoresist that is to be erased is removed or erased.
  • Step S 405 the layer that is to be etched is etched.
  • a nozzle is utilized to coat the protection layer at where the coating defect is located.
  • the present invention adds the coating unit (e.g., a nozzle) on a basis of a conventional repairing machine.
  • the coating unit e.g., a nozzle
  • the protection layer is directly coated at where the coating defect is located by using the coating unit.
  • the present invention does not have to abandon the array substrate having the coating defect. Instead, it is to coat the protection layer directly at where the coating defect is located.
  • the present invention not only has high efficiency, but also low cost.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Liquid Crystal (AREA)
US13/695,622 2012-08-31 2012-09-03 Device and method for repairing pattern on array substrate Abandoned US20150209812A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201210319176.4 2012-08-31
CN2012103191764A CN102809839A (zh) 2012-08-31 2012-08-31 阵列基板的图形修补装置及方法
PCT/CN2012/080938 WO2014032312A1 (zh) 2012-08-31 2012-09-03 阵列基板的图形修补装置及方法

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US20150209812A1 true US20150209812A1 (en) 2015-07-30

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CN (1) CN102809839A (zh)
WO (1) WO2014032312A1 (zh)

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CN103048815B (zh) * 2013-01-15 2015-09-09 深圳市华星光电技术有限公司 阵列基板修复装置及方法
CN104834140B (zh) * 2015-05-26 2019-03-15 深圳市华星光电技术有限公司 一种检测tft阵列基板的缺陷的方法
US9589820B2 (en) * 2015-05-29 2017-03-07 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor apparatus and adjustment method
CN108231793B (zh) * 2018-01-02 2021-01-26 京东方科技集团股份有限公司 对导电膜层进行构图的方法、显示基板及制作方法、显示装置
CN108417587A (zh) * 2018-03-16 2018-08-17 中华映管股份有限公司 制作半导体元件及显示器的阵列基板的方法
CN109119375A (zh) * 2018-07-30 2019-01-01 惠科股份有限公司 阵列面板的检测修复方法和光阻修补装置
CN110034035B (zh) * 2019-03-06 2021-06-15 重庆慧聚成江信息技术合伙企业(有限合伙) 一种晶圆生产集质检与修复一体的光刻胶涂敷检测装置

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WO2014032312A1 (zh) 2014-03-06
CN102809839A (zh) 2012-12-05

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AS Assignment

Owner name: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO.

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LIN, YUNG-YU;REEL/FRAME:029222/0864

Effective date: 20121029

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION